JP5547864B2 - 放電表面処理方法及び装置 - Google Patents

放電表面処理方法及び装置 Download PDF

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Publication number
JP5547864B2
JP5547864B2 JP2000600798A JP2000600798A JP5547864B2 JP 5547864 B2 JP5547864 B2 JP 5547864B2 JP 2000600798 A JP2000600798 A JP 2000600798A JP 2000600798 A JP2000600798 A JP 2000600798A JP 5547864 B2 JP5547864 B2 JP 5547864B2
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Japan
Prior art keywords
workpiece
electrode
surface treatment
discharge
electric discharge
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Expired - Lifetime
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JP2000600798A
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English (en)
Japanese (ja)
Inventor
尚武 毛利
学 吉田
昭弘 後藤
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
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Publication of JP5547864B2 publication Critical patent/JP5547864B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H9/00—Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
JP2000600798A 1999-02-24 1999-02-24 放電表面処理方法及び装置 Expired - Lifetime JP5547864B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1999/000822 WO2000050194A1 (fr) 1999-02-24 1999-02-24 Procede et dispositif de traitement de surface par decharge

Publications (1)

Publication Number Publication Date
JP5547864B2 true JP5547864B2 (ja) 2014-07-16

Family

ID=14235002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000600798A Expired - Lifetime JP5547864B2 (ja) 1999-02-24 1999-02-24 放電表面処理方法及び装置

Country Status (6)

Country Link
JP (1) JP5547864B2 (de)
CN (1) CN1126628C (de)
CH (1) CH694246A5 (de)
DE (1) DE19983777T1 (de)
TW (1) TW475005B (de)
WO (1) WO2000050194A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4137886B2 (ja) 2002-07-30 2008-08-20 三菱電機株式会社 放電表面処理用電極および放電表面処理方法並びに放電表面処理装置
CA2528739C (en) * 2003-06-11 2011-06-07 Mitsubishi Denki Kabushiki Kaisha Electrical-discharge surface-treatment method
US20110300311A1 (en) * 2009-02-18 2011-12-08 Ihi Corporation Production method of electrode and discharge surface treatment therewith
CN106086879A (zh) * 2013-12-16 2016-11-09 湖北工业大学 旋转体表面电火花熔敷改性工艺及装置
TWI696544B (zh) * 2016-03-22 2020-06-21 國立中興大學 積層製造加工機
KR101874519B1 (ko) 2016-04-26 2018-07-04 연세대학교 산학협력단 전해방전가공장치 및 이를 이용한 전해방전가공방법
CN106312205B (zh) * 2016-10-08 2018-01-16 大连理工大学 大气压冷等离子体射流中电火花加工方法
CN115233215B (zh) * 2022-07-25 2024-02-13 江苏大学 用于大深径比弯孔的瞬态加热熔覆装置及方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5542708A (en) * 1978-09-13 1980-03-26 Tdk Corp Electrode for electrolytic lapping
JPH05261624A (ja) * 1992-03-19 1993-10-12 Toshiba Tungaloy Co Ltd 放電加工装置
JPH06246542A (ja) * 1993-03-01 1994-09-06 Nitto Denko Corp 有機材料の加工方法
JPH08300227A (ja) * 1995-04-14 1996-11-19 Res Dev Corp Of Japan 放電加工用電極および放電による金属表面処理方法
JPH10512A (ja) * 1996-06-12 1998-01-06 Res Dev Corp Of Japan 放電加工による表面処理方法及びその装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2883581B2 (ja) * 1996-06-17 1999-04-19 東亜機工株式会社 サニタリー製品製造設備

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5542708A (en) * 1978-09-13 1980-03-26 Tdk Corp Electrode for electrolytic lapping
JPH05261624A (ja) * 1992-03-19 1993-10-12 Toshiba Tungaloy Co Ltd 放電加工装置
JPH06246542A (ja) * 1993-03-01 1994-09-06 Nitto Denko Corp 有機材料の加工方法
JPH08300227A (ja) * 1995-04-14 1996-11-19 Res Dev Corp Of Japan 放電加工用電極および放電による金属表面処理方法
JPH10512A (ja) * 1996-06-12 1998-01-06 Res Dev Corp Of Japan 放電加工による表面処理方法及びその装置

Also Published As

Publication number Publication date
DE19983777T1 (de) 2002-01-31
CH694246A5 (de) 2004-10-15
TW475005B (en) 2002-02-01
CN1329531A (zh) 2002-01-02
WO2000050194A1 (fr) 2000-08-31
CN1126628C (zh) 2003-11-05

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