JP5543463B2 - スリットバルブ制御 - Google Patents
スリットバルブ制御 Download PDFInfo
- Publication number
- JP5543463B2 JP5543463B2 JP2011525103A JP2011525103A JP5543463B2 JP 5543463 B2 JP5543463 B2 JP 5543463B2 JP 2011525103 A JP2011525103 A JP 2011525103A JP 2011525103 A JP2011525103 A JP 2011525103A JP 5543463 B2 JP5543463 B2 JP 5543463B2
- Authority
- JP
- Japan
- Prior art keywords
- slit valve
- valve door
- door
- rings
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 27
- 238000007789 sealing Methods 0.000 claims description 25
- 230000006835 compression Effects 0.000 claims description 12
- 238000007906 compression Methods 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims 2
- 239000007789 gas Substances 0.000 description 21
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- 239000002245 particle Substances 0.000 description 6
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K3/00—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
- F16K3/02—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor
- F16K3/16—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with special arrangements for separating the sealing faces or for pressing them together
- F16K3/18—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with special arrangements for separating the sealing faces or for pressing them together by movement of the closure members
- F16K3/188—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with special arrangements for separating the sealing faces or for pressing them together by movement of the closure members by means of hydraulic forces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
- F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0391—Affecting flow by the addition of material or energy
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Sliding Valves (AREA)
- Details Of Valves (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
Description
本発明の実施形態は、概して、スリットバルブドア及びスリットバルブドアでチャンバを密閉するための方法に関する。
半導体、フラットパネルディスプレイ、光起電性/ソーラーパネル、及び他の基板処理システムにおいて、基板を処理するために、クラスタ配置、インライン配置、又はクラスタ/インライン配置の組み合わせで真空チャンバ(すなわち、ロードロックチャンバ、搬送チャンバ、プロセスチャンバ)を配置するのは一般的である。これらのシステムは、シングル又はバッチ基板方式で基板を処理するかもしれない。処理の間、真空を維持又は確立しなければならないチャンバへ及びチャンバから基板を搬送するかもしれない。チャンバの内部へのアクセスを可能にするために、及び真空運転を可能にするために、チャンバ壁を貫通するスリット形の開口がしばしば提供され、これによって処理される基板が収容される。
Claims (18)
- スリットバルブアセンブリに結合されるチャンバを密閉する方法であって、前記チャンバは、基板が通過可能な大きさに作られる開口を有し、前記方法は、
スリットバルブドアをスリットバルブアセンブリ本体内で、前記基板が移動する方向に実質的に垂直な第1方向に、前記開口からより遠くに位置する第1位置から、前記開口により近くに位置する第2位置まで作動させるステップを含み、前記スリットバルブドアは、1以上のOリングが結合され、前記スリットバルブアセンブリ本体は、壁によって画定される内部容積を有し、前記スリットバルブアセンブリ本体は、前記チャンバの前記開口と整列する前記スリットバルブアセンブリ本体を通って延びる開口を有し、
前記方法は、前記スリットバルブドアの少なくとも第1部分を、前記基板が移動し前記第1方向と実質的に垂直な第2方向に、第1時間間隔、第1距離、及び約12mm/秒から約18mm/秒の間の第1速度で作動させるステップと、
前記1以上のOリングが、前記壁の内面に接触する時間を検出するステップと、
前記検出に応じて、前記スリットバルブドアの前記第1部分を、前記第2方向に、第2時間間隔、第2距離、及び第2速度で作動させるステップを更に含み、ここで前記第2距離は前記第1距離未満であり、前記第2速度は約0.5mm/秒と約0.7mm/秒の間であり、前記第2時間間隔は前記第1時間間隔未満である方法。 - 前記第2方向への前記作動の間、前記スリットバルブドアの内部容積を増加させるステップを更に含む請求項1記載の方法。
- 前記1以上のOリングは、前記第2時間間隔の間、前記壁の内面に対して圧縮する請求項1記載の方法。
- 前記1以上のOリングが、前記壁の内面に最初に接触した時間を検出するステップを更に含む請求項1記載の方法。
- 前記第2方向への前記作動は、前記スリットバルブドアの内部へガスを流すステップ及び前記スリットバルブドアを拡張するステップを更に含む請求項1記載の方法。
- 前記第2方向への前記作動は、前記スリットバルブドアの前記第1部分を前記第2方向へ拡張するステップ及び同時に前記スリットバルブドアの第2部分を前記第2方向と反対の第3方向へ前記第1距離と実質的に等しい距離移動させるステップを更に含む請求項1記載の方法。
- 前記スリットバルブドアは、サポートシャフト及びコントロールパネルに結合され、前記サポートシャフト及び前記コントロールパネルは、前記第2部分が前記第3方向に移動するとき、前記第3方向へ移動する請求項6記載の方法。
- 前記壁の内面を前記第2部分と接触させるステップを更に含む請求項6記載の方法。
- 前記第2部分は、1以上の第2Oリングに結合され、
前記方法は、前記1以上の第2Oリングが前記内面に接触する時間を検出するステップを更に含む請求項8記載の方法。 - 前記第2方向への前記作動の間、前記1以上の第2Oリングを前記内面に対して圧縮するステップを更に含む請求項9記載の方法。
- 前記第2方向への前記作動と同時に、前記スリットバルブドア内の1以上のばねを圧縮するステップを更に含む請求項1記載の方法。
- 前記スリットバルブドアの内部容積内へガスを流すステップを更に含む請求項1記載の方法。
- 基板が通過可能な大きさに作られる開口を有するチャンバを密閉する方法であって、
スリットバルブドアの内部にガスを流すステップを含み、これによって前記スリットバルブドアの前記内部を第1圧力に加圧し、前記スリットバルブドアは、前記チャンバと結合されるスリットバルブアセンブリ本体内に配置され、前記スリットバルブアセンブリ本体は、貫通する開口を有し、前記開口は、前記チャンバの前記開口と整列し、前記スリットバルブドアは、内部容積を密閉する壁を有し、
前記方法は、前記スリットバルブドアに結合される1以上のOリングが前記壁の内面に接触し、前記スリットバルブドアが前記壁の前記内面から第1距離の間隔となるまで前記スリットバルブドアを拡張するステップであって、前記拡張は約12mm/秒〜約18mm/秒の間の第1速度で起こるステップと、
前記ガスを前記スリットバルブドアの前記内部へ流し、これによって前記スリットバルブドアの前記内部を第2圧力まで加圧するステップと、
前記スリットバルブドアと前記壁の前記内面の間で前記1以上のOリングを圧縮し、これによって前記スリットバルブドアが前記壁の前記内面から前記第1距離未満の第2距離の間隔にするステップであって、前記圧縮は約0.5mm/秒〜約0.7mm/秒の間の第2速度で起こるステップを含む方法。 - 前記1以上のOリングが前記壁の前記内面に接触する時間を検出するステップを更に含む請求項13記載の方法。
- 前記検出に応じて前記スリットバルブドアの前記内部への前記ガスの流れを制御するステップを更に含む請求項14記載の方法。
- 前記開口の下の位置から前記スリットバルブドアを上昇させるステップを更に含む請求項13記載の方法。
- 前記スリットバルブドアの前記内部へ前記ガスを流しながら、前記スリットバルブドア内で1以上のばねを圧縮するステップを更に含む請求項13記載の方法。
- 前記スリットバルブドアの前記内部へ前記ガスを流しながら、前記スリットバルブドア内に配置される1以上のばねを圧縮するステップを更に含む請求項13記載の方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US9328808P | 2008-08-29 | 2008-08-29 | |
US61/093,288 | 2008-08-29 | ||
US12/538,237 | 2009-08-10 | ||
US12/538,237 US8297591B2 (en) | 2008-08-29 | 2009-08-10 | Slit valve control |
PCT/US2009/054469 WO2010025081A2 (en) | 2008-08-29 | 2009-08-20 | Slit valve control |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012501421A JP2012501421A (ja) | 2012-01-19 |
JP2012501421A5 JP2012501421A5 (ja) | 2013-06-27 |
JP5543463B2 true JP5543463B2 (ja) | 2014-07-09 |
Family
ID=41722235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011525103A Expired - Fee Related JP5543463B2 (ja) | 2008-08-29 | 2009-08-20 | スリットバルブ制御 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8297591B2 (ja) |
JP (1) | JP5543463B2 (ja) |
KR (1) | KR101364010B1 (ja) |
CN (1) | CN102138199B (ja) |
TW (1) | TWI435016B (ja) |
WO (1) | WO2010025081A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101840940B1 (ko) | 2016-09-12 | 2018-03-21 | 에스케이실트론 주식회사 | 고온 상압 기상성장장치에 마련되는 챔버 간의 개폐 장치 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120042828A1 (en) * | 2010-08-17 | 2012-02-23 | Primestar Solar, Inc. | Slit valve for vacuum chamber module |
JP5044725B1 (ja) * | 2012-04-27 | 2012-10-10 | 株式会社ブイテックス | シール材のつぶし量が制御可能なゲートバルブ |
TWI484531B (zh) * | 2012-05-31 | 2015-05-11 | Archers Inc | 閥門總成以及閥門 |
EP2876341B1 (de) * | 2013-11-21 | 2015-10-21 | VAT Holding AG | Verfahren zum Betrieb eines Ventils |
USD796562S1 (en) | 2016-04-11 | 2017-09-05 | Applied Materials, Inc. | Plasma outlet liner |
US10224224B2 (en) * | 2017-03-10 | 2019-03-05 | Micromaterials, LLC | High pressure wafer processing systems and related methods |
JP6405067B1 (ja) * | 2018-04-13 | 2018-10-17 | 株式会社ブイテックス | ゲートバルブの制御方法 |
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US4747577A (en) * | 1986-07-23 | 1988-05-31 | The Boc Group, Inc. | Gate valve with magnetic closure for use with vacuum equipment |
CH675286A5 (ja) * | 1988-02-04 | 1990-09-14 | Sulzer Ag | |
US5975492A (en) * | 1997-07-14 | 1999-11-02 | Brenes; Arthur | Bellows driver slot valve |
JPH11182699A (ja) * | 1997-12-22 | 1999-07-06 | Toshiba Corp | ゲートバルブ |
US6079693A (en) | 1998-05-20 | 2000-06-27 | Applied Komatsu Technology, Inc. | Isolation valves |
US6347918B1 (en) | 1999-01-27 | 2002-02-19 | Applied Materials, Inc. | Inflatable slit/gate valve |
JP4092028B2 (ja) * | 1999-02-08 | 2008-05-28 | 新明和工業株式会社 | 真空ゲート弁 |
JP2001021048A (ja) * | 1999-06-29 | 2001-01-26 | Varian Inc | ランプアクチュエータ機構を有するゲートバルブ |
JP3425938B2 (ja) * | 2000-12-14 | 2003-07-14 | 入江工研株式会社 | ゲート弁 |
US6854708B2 (en) * | 2002-07-22 | 2005-02-15 | Mdc Vacuum Products Corporation | High-vacuum valve with retractable valve plate to eliminate abrasion |
WO2004102055A1 (en) * | 2003-05-13 | 2004-11-25 | Applied Materials, Inc. | Methods and apparatus for sealing an opening of a processing chamber |
US7841582B2 (en) | 2004-06-02 | 2010-11-30 | Applied Materials, Inc. | Variable seal pressure slit valve doors for semiconductor manufacturing equipment |
US7422653B2 (en) | 2004-07-13 | 2008-09-09 | Applied Materials, Inc. | Single-sided inflatable vertical slit valve |
US7494107B2 (en) * | 2005-03-30 | 2009-02-24 | Supercritical Systems, Inc. | Gate valve for plus-atmospheric pressure semiconductor process vessels |
US7469715B2 (en) | 2005-07-01 | 2008-12-30 | Applied Materials, Inc. | Chamber isolation valve RF grounding |
-
2009
- 2009-08-10 US US12/538,237 patent/US8297591B2/en not_active Expired - Fee Related
- 2009-08-20 WO PCT/US2009/054469 patent/WO2010025081A2/en active Application Filing
- 2009-08-20 JP JP2011525103A patent/JP5543463B2/ja not_active Expired - Fee Related
- 2009-08-20 CN CN2009801346841A patent/CN102138199B/zh active Active
- 2009-08-20 KR KR1020117007242A patent/KR101364010B1/ko active IP Right Grant
- 2009-08-28 TW TW98129085A patent/TWI435016B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101840940B1 (ko) | 2016-09-12 | 2018-03-21 | 에스케이실트론 주식회사 | 고온 상압 기상성장장치에 마련되는 챔버 간의 개폐 장치 |
Also Published As
Publication number | Publication date |
---|---|
US8297591B2 (en) | 2012-10-30 |
WO2010025081A3 (en) | 2010-05-06 |
WO2010025081A2 (en) | 2010-03-04 |
CN102138199B (zh) | 2013-11-27 |
TWI435016B (zh) | 2014-04-21 |
KR20110063794A (ko) | 2011-06-14 |
US20100051111A1 (en) | 2010-03-04 |
JP2012501421A (ja) | 2012-01-19 |
CN102138199A (zh) | 2011-07-27 |
KR101364010B1 (ko) | 2014-02-17 |
TW201026981A (en) | 2010-07-16 |
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