JP5533769B2 - マスクとワークの位置合せ方法 - Google Patents
マスクとワークの位置合せ方法 Download PDFInfo
- Publication number
- JP5533769B2 JP5533769B2 JP2011089992A JP2011089992A JP5533769B2 JP 5533769 B2 JP5533769 B2 JP 5533769B2 JP 2011089992 A JP2011089992 A JP 2011089992A JP 2011089992 A JP2011089992 A JP 2011089992A JP 5533769 B2 JP5533769 B2 JP 5533769B2
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- JP
- Japan
- Prior art keywords
- mask
- workpiece
- work
- mark
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims description 43
- 229910000679 solder Inorganic materials 0.000 claims description 51
- 238000007639 printing Methods 0.000 claims description 10
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 description 36
- 230000008602 contraction Effects 0.000 description 20
- 101150016293 SAM4 gene Proteins 0.000 description 18
- 101100364827 Prochlorococcus marinus (strain SARG / CCMP1375 / SS120) ahcY gene Proteins 0.000 description 16
- 101150081953 SAM1 gene Proteins 0.000 description 16
- 239000000758 substrate Substances 0.000 description 15
- 101100455988 Schizosaccharomyces pombe (strain 972 / ATCC 24843) mam4 gene Proteins 0.000 description 13
- 101100455985 Arabidopsis thaliana MAM3 gene Proteins 0.000 description 12
- 101150108881 MAM1 gene Proteins 0.000 description 12
- 102100025129 Mastermind-like protein 1 Human genes 0.000 description 12
- 238000003860 storage Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101001005667 Homo sapiens Mastermind-like protein 2 Proteins 0.000 description 1
- 101001005668 Homo sapiens Mastermind-like protein 3 Proteins 0.000 description 1
- 102100027237 MAM domain-containing protein 2 Human genes 0.000 description 1
- 101710116166 MAM domain-containing protein 2 Proteins 0.000 description 1
- 102100025130 Mastermind-like protein 2 Human genes 0.000 description 1
- 102100025134 Mastermind-like protein 3 Human genes 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011089992A JP5533769B2 (ja) | 2011-04-14 | 2011-04-14 | マスクとワークの位置合せ方法 |
TW101107484A TWI452447B (zh) | 2011-04-14 | 2012-03-06 | The method of aligning the mask with the workpiece |
KR1020120038534A KR101445914B1 (ko) | 2011-04-14 | 2012-04-13 | 마스크와 워크의 위치 맞춤 방법 |
CN201210109339.6A CN102736445B (zh) | 2011-04-14 | 2012-04-13 | 掩模与工件的对齐方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011089992A JP5533769B2 (ja) | 2011-04-14 | 2011-04-14 | マスクとワークの位置合せ方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012220923A JP2012220923A (ja) | 2012-11-12 |
JP5533769B2 true JP5533769B2 (ja) | 2014-06-25 |
Family
ID=46992167
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011089992A Active JP5533769B2 (ja) | 2011-04-14 | 2011-04-14 | マスクとワークの位置合せ方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5533769B2 (ko) |
KR (1) | KR101445914B1 (ko) |
CN (1) | CN102736445B (ko) |
TW (1) | TWI452447B (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6142194B2 (ja) * | 2012-11-15 | 2017-06-07 | 株式会社ブイ・テクノロジー | 蒸着マスクの製造方法及び蒸着マスク |
JP5958824B2 (ja) | 2012-11-15 | 2016-08-02 | 株式会社ブイ・テクノロジー | 蒸着マスクの製造方法 |
CN104730871B (zh) * | 2013-12-18 | 2017-07-21 | 财团法人金属工业研究发展中心 | 异空间异尺寸基材对位方法 |
CN105005182B (zh) * | 2014-04-25 | 2017-06-27 | 上海微电子装备有限公司 | 多个传感器间相互位置关系校准方法 |
JP6561904B2 (ja) * | 2016-04-21 | 2019-08-21 | 三菱電機株式会社 | 電子部品装置および電子部品装置の製造方法 |
JP7029587B2 (ja) * | 2017-10-19 | 2022-03-04 | パナソニックIpマネジメント株式会社 | スクリーン印刷装置およびスクリーン印刷方法 |
CN110147002B (zh) * | 2019-04-28 | 2022-04-26 | 武汉华星光电技术有限公司 | 对位测试键、液晶显示面板及对位组立方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH082085A (ja) * | 1994-06-20 | 1996-01-09 | Fujitsu Ltd | ペーストの塗布方法 |
TW588414B (en) * | 2000-06-08 | 2004-05-21 | Toshiba Corp | Alignment method, overlap inspecting method and mask |
JP4158514B2 (ja) | 2002-12-24 | 2008-10-01 | ウシオ電機株式会社 | 両面投影露光装置 |
JP4015079B2 (ja) * | 2003-07-18 | 2007-11-28 | 株式会社東芝 | レチクル、露光装置検査システム、露光装置検査方法及びレチクルの製造方法 |
JP2005189462A (ja) * | 2003-12-25 | 2005-07-14 | Nec Toppan Circuit Solutions Inc | プリント配線板の製造方法 |
US7785526B2 (en) * | 2004-07-20 | 2010-08-31 | Molecular Imprints, Inc. | Imprint alignment method, system, and template |
JP2006047881A (ja) * | 2004-08-06 | 2006-02-16 | Sharp Corp | 露光装置および積層基板の製造方法 |
KR101130890B1 (ko) * | 2005-03-18 | 2012-03-28 | 엘지전자 주식회사 | 근접노광형 노광장치 |
KR101565277B1 (ko) * | 2006-08-31 | 2015-11-02 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법 |
WO2008120785A1 (ja) * | 2007-04-03 | 2008-10-09 | Nsk Ltd. | 露光装置及び露光方法 |
JP5133193B2 (ja) * | 2008-10-08 | 2013-01-30 | 株式会社目白プレシジョン | 投影露光装置 |
US8271919B2 (en) * | 2009-10-30 | 2012-09-18 | Ibiden Co., Ltd. | Method for correcting image rendering data, method for rendering image, method for manufacturing wiring board, and image rendering system |
JP2011221267A (ja) * | 2010-04-09 | 2011-11-04 | Fujikura Ltd | プリント配線板の製造方法及びプリント配線板の製造装置。 |
-
2011
- 2011-04-14 JP JP2011089992A patent/JP5533769B2/ja active Active
-
2012
- 2012-03-06 TW TW101107484A patent/TWI452447B/zh active
- 2012-04-13 CN CN201210109339.6A patent/CN102736445B/zh active Active
- 2012-04-13 KR KR1020120038534A patent/KR101445914B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR101445914B1 (ko) | 2014-11-03 |
JP2012220923A (ja) | 2012-11-12 |
TW201243523A (en) | 2012-11-01 |
CN102736445B (zh) | 2015-01-28 |
CN102736445A (zh) | 2012-10-17 |
KR20120117680A (ko) | 2012-10-24 |
TWI452447B (zh) | 2014-09-11 |
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