JP5511539B2 - 切削方法 - Google Patents
切削方法 Download PDFInfo
- Publication number
- JP5511539B2 JP5511539B2 JP2010141205A JP2010141205A JP5511539B2 JP 5511539 B2 JP5511539 B2 JP 5511539B2 JP 2010141205 A JP2010141205 A JP 2010141205A JP 2010141205 A JP2010141205 A JP 2010141205A JP 5511539 B2 JP5511539 B2 JP 5511539B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- division
- wafer
- line
- device wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005520 cutting process Methods 0.000 title claims description 93
- 238000000034 method Methods 0.000 title claims description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 238000011156 evaluation Methods 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 16
- 235000012431 wafers Nutrition 0.000 description 50
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 14
- 239000000498 cooling water Substances 0.000 description 10
- 229910002092 carbon dioxide Inorganic materials 0.000 description 7
- 239000001569 carbon dioxide Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000010828 elution Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
Images
Landscapes
- Dicing (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
T ダイシングテープ
F 環状フレーム
11 デバイス
13 ボンディングパッド
15 TEG
18 チャックテーブル
24 切削手段
28 切削ブレード
Claims (2)
- ウエーハ表面に形成された複数の第1分割予定ライン及び該第1分割予定ラインに交差する複数の第2分割予定ラインと、該第1分割予定ライン上に形成された複数の特性評価用金属素子と、該第1分割予定ラインと該第2分割予定ラインによって区画された各領域に形成された複数のデバイスとを備え、該各デバイスは複数のボンディングパッドを有し、該ボンディングパッドは該特性評価用金属素子に比べてイオン化傾向が大きい金属から形成されているデバイスウエーハへ純水を含む切削水を供給しつつ該分割予定ライン上を切削ブレードで切削する切削方法であって、
該デバイスウエーハに該切削水を供給しつつ、複数の該第2分割予定ラインを切削ブレードで切削する第1切削ステップと、
該第1切削ステップを実施した後に、該デバイスウエーハに該切削水を供給しつつ、複数の該第1分割予定ラインを該特性評価用金属素子とともに切削ブレードで切削する第2切削ステップと、
を具備したことを特徴とする切削方法。 - 該デバイスウエーハは前記第2分割予定ライン上にも前記特性評価用金属素子を有しており、該特性評価用金属素子は該第2分割予定ライン上よりも該第1分割予定ライン上に多く形成されている請求項1記載の切削方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010141205A JP5511539B2 (ja) | 2010-06-22 | 2010-06-22 | 切削方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010141205A JP5511539B2 (ja) | 2010-06-22 | 2010-06-22 | 切削方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012009466A JP2012009466A (ja) | 2012-01-12 |
JP5511539B2 true JP5511539B2 (ja) | 2014-06-04 |
Family
ID=45539733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010141205A Active JP5511539B2 (ja) | 2010-06-22 | 2010-06-22 | 切削方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5511539B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014136279A (ja) * | 2013-01-17 | 2014-07-28 | Disco Abrasive Syst Ltd | 切削装置 |
-
2010
- 2010-06-22 JP JP2010141205A patent/JP5511539B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2012009466A (ja) | 2012-01-12 |
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