JP5482214B2 - 接合構造体の製造方法及び接合構造体 - Google Patents
接合構造体の製造方法及び接合構造体 Download PDFInfo
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- JP5482214B2 JP5482214B2 JP2010008754A JP2010008754A JP5482214B2 JP 5482214 B2 JP5482214 B2 JP 5482214B2 JP 2010008754 A JP2010008754 A JP 2010008754A JP 2010008754 A JP2010008754 A JP 2010008754A JP 5482214 B2 JP5482214 B2 JP 5482214B2
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Description
図1は、本発明の実施の形態1における接合構造体の製造方法により形成される接合構造体の断面図である。図1(a)は、パワー半導体モジュールが基板に実装された模式図であり、図1(b)は、図1(a)の点線で囲まれた領域Aを拡大した接合構造体の図である。
101 基板
102 半導体素子
103 電極
104 接合部
105 Bi系金属間化合物
106 表面処理層
107 接合構造体
200 はんだボール
201 Bi
202 Niめっき
203 ツール
601 電極
602 接合材料
603 半導体素子
604 パワー半導体モジュール
605 表面処理層
Claims (1)
- 直径Dが1mmのBi球の周囲に厚みLのNiめっきによりコーティングしたはんだボールを加熱された電極上に載置し、
前記はんだボールのDとLは、0.035≦L/D≦0.039の関係を有し、
前記電極と前記はんだボールの接触部で、前記はんだボールのNiめっきの一部に亀裂が生じ、内部より溶融状態のBiが溶出するように前記はんだボールを押圧し、
押圧された前記はんだボールが前記電極上に濡れ拡がることにより接合部が形成された後、
前記接合部の上に半導体素子を載置し、
前記電極と接合させたことを特徴とする接合構造体の製造方法。
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JP2010008754A JP5482214B2 (ja) | 2010-01-19 | 2010-01-19 | 接合構造体の製造方法及び接合構造体 |
US13/007,693 US8268718B2 (en) | 2010-01-19 | 2011-01-17 | Bonded structure and manufacturing method for bonded structure |
CN201110026480.5A CN102163564B (zh) | 2010-01-19 | 2011-01-18 | 接合结构体及接合结构体的制造方法 |
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US5476726A (en) * | 1992-01-22 | 1995-12-19 | Hitachi, Ltd. | Circuit board with metal layer for solder bonding and electronic circuit device employing the same |
JP4479577B2 (ja) * | 2005-04-28 | 2010-06-09 | 株式会社日立製作所 | 半導体装置 |
JP5224430B2 (ja) | 2006-03-17 | 2013-07-03 | 株式会社豊田中央研究所 | パワー半導体モジュール |
EP2036656B1 (en) * | 2006-05-24 | 2015-07-22 | Panasonic Intellectual Property Management Co., Ltd. | Bonding material, electronic component, bonding structure and electronic device |
JP2009072816A (ja) * | 2007-09-21 | 2009-04-09 | Nippon Steel Materials Co Ltd | はんだボール、電子部品及び回路基板 |
JP5058766B2 (ja) * | 2007-12-07 | 2012-10-24 | 山陽特殊製鋼株式会社 | 鉛フリー接合用材料を用いてはんだ付けしてなる電子機器 |
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