JP5480045B2 - 粘着テープの貼着装置及び貼着方法 - Google Patents

粘着テープの貼着装置及び貼着方法 Download PDF

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JP5480045B2
JP5480045B2 JP2010157274A JP2010157274A JP5480045B2 JP 5480045 B2 JP5480045 B2 JP 5480045B2 JP 2010157274 A JP2010157274 A JP 2010157274A JP 2010157274 A JP2010157274 A JP 2010157274A JP 5480045 B2 JP5480045 B2 JP 5480045B2
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adhesive tape
tape
release
release tape
peeling
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JP2012017204A5 (enExample
JP2012017204A (ja
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治雄 森
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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  • Adhesive Tape Dispensing Devices (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
JP2010157274A 2010-07-09 2010-07-09 粘着テープの貼着装置及び貼着方法 Active JP5480045B2 (ja)

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JP2010157274A JP5480045B2 (ja) 2010-07-09 2010-07-09 粘着テープの貼着装置及び貼着方法

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JP2010157274A JP5480045B2 (ja) 2010-07-09 2010-07-09 粘着テープの貼着装置及び貼着方法

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JP2012017204A JP2012017204A (ja) 2012-01-26
JP2012017204A5 JP2012017204A5 (enExample) 2013-08-22
JP5480045B2 true JP5480045B2 (ja) 2014-04-23

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017095208A (ja) * 2015-11-19 2017-06-01 トヤマキカイ株式会社 テープ貼着装置
JP2020100496A (ja) * 2018-12-25 2020-07-02 株式会社サンテック 両面テープの部分除去装置
CN112173829B (zh) * 2020-10-14 2022-11-29 东莞市三肯电子制造有限公司 一种双面胶粘贴装置及其粘贴方法
CN114620537B (zh) * 2022-05-07 2023-02-17 浙江麦斯威迩绝缘科技有限公司 一种具有电磁屏蔽功能的胶带及其制备装置
CN118122714A (zh) * 2024-03-22 2024-06-04 广东贝导智能科技有限公司 除尘机构、电池制备系统以及除尘方法
CN119028891B (zh) * 2024-10-28 2025-02-18 上海果纳半导体技术有限公司 轨道车

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1150016A (ja) * 1997-07-30 1999-02-23 Seiko Epson Corp 接着用テープの貼付方法及び貼付装置
JP2001199626A (ja) * 2000-01-12 2001-07-24 Seiko Epson Corp キャリアテープの剥離機構及びこれを用いた供給材の貼付装置
JP2004296944A (ja) * 2003-03-27 2004-10-21 Kyocera Corp 異方性導電膜貼付装置及び部品実装装置

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JP2012017204A (ja) 2012-01-26

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