JP5467702B2 - Multilayer capacitor - Google Patents

Description

  The present invention relates to a multilayer capacitor.

  Small-sized multilayer capacitors such as the 1608 size, 1005 size, and 0603 size have inferior bending strength compared to large-sized multilayer capacitors, and therefore the force applied to the capacitor body when mounted on a circuit board or after mounting, etc. There is a high risk of cracking and cracking. The “bending strength” as used herein is a numerical value obtained by a test method in which the center of the multilayer capacitor in the lengthwise direction is supported with a pressure jig while supporting the external electrode of the multilayer capacitor, and cracking occurs. Is expressed in units of gf, N, Pa, or the like.

  In order to improve the bending strength of a multilayer capacitor belonging to a small size, a reinforcing layer may be disposed in the capacitor body, and there are two ways of thinking about the reinforcing layer. One is an idea of adding a metal layer different from the internal electrode layer as a reinforcing layer, and the other is an idea of using the internal electrode layer as a reinforcing layer.

  Incidentally, the structure that can be used for the former concept is disclosed in Patent Documents 2 and 3 below, but the structure that can be used for the latter concept is disclosed in Patent Documents 1 and 4 described below. And 5.

  The structures disclosed in Patent Documents 2 and 3 are obtained by adding a metal layer to the upper and lower margin portions (portions where the internal electrode layer does not exist) of the capacitor body, but the added metal layer is not connected to the external electrode. Therefore, the bending strength is not improved so much.

  The structure disclosed in Patent Document 4 is a structure in which two adjacent internal electrode layers in a capacitor body are connected to the same external electrode. Although this structure can improve the bending strength as compared with the structures disclosed in Patent Documents 2 and 3, since the two internal electrode layers are provided only on one of the external electrodes, the other external part of the capacitor body is provided. The mechanical strength on the electrode side is inferior to the mechanical strength on the one external electrode side. Moreover, since the thickness of the dielectric layer existing between two internal electrode layers connected to the same external electrode is equal to or greater than the thickness of the dielectric layer existing between two internal electrode layers connected to different external electrodes, The height dimension of the multilayer capacitor increases, and if the increase in the height dimension is to be avoided, the number of internal conductor layers that contribute to the capacity formation decreases, and the overall capacity of the multilayer capacitor decreases.

  The structures disclosed in Patent Documents 1 and 5 are different internal electrode layers connected to the one external electrode so as to face the uppermost internal electrode layer among the internal electrode layers connected to the one external electrode. And another internal electrode layer connected to the other external electrode so as to face the lowermost internal electrode layer of the internal electrode layers connected to the other external electrode. . Although this structure can improve the bending strength as compared with the structure disclosed in Patent Document 4, a dielectric layer existing between another internal electrode layer and an internal electrode layer facing the internal electrode layer (a dielectric material that does not contribute to capacitance formation) Since the thickness of each of the layers is the same as the thickness of the dielectric layer between the two internal electrode layers connected to different external electrodes (dielectric layer contributing to capacity formation), the height of the multilayer capacitor If the size is increased, and if it is attempted to avoid the increase in the height, the number of internal conductor layers contributing to the capacity formation is reduced, and the overall capacity of the multilayer capacitor is reduced.

JP 07-335473 A Japanese Patent Laid-Open No. 08-181032 Japanese Patent Laid-Open No. 08-316086 Japanese Patent Laid-Open No. 10-270281 Japanese Unexamined Patent Publication No. 2009-224569

  An object of the present invention is to provide a multilayer capacitor capable of improving the bending strength while suppressing an increase in height dimension.

  In order to achieve the above object, according to the present invention, a plurality of first internal electrode layers and a plurality of second internal electrode layers are opposed to each other via a first dielectric layer that contributes to capacitance formation, and are alternately arranged. Edges of the plurality of first internal electrode layers are connected to a first external electrode that is stacked and used as one polarity, and edges of the plurality of second internal electrode layers are connected to a second external electrode that is used as the other polarity In the multilayer capacitor connected to each other, a first internal electrode layer is positioned on one side in the stacking direction among the plurality of first internal electrode layers and the plurality of second internal electrode layers, and on the other side in the stacking direction. A second internal electrode layer is located, and an additional first internal electrode is disposed on the outside of the first internal electrode layer located on one side in the stacking direction so as to face each other via a second dielectric layer that does not contribute to capacitance formation. Layers are stacked, and the edge of the additional first internal electrode layer is the first An additional second internal electrode layer is laminated and arranged outside the second internal electrode layer on the other side in the stacking direction so as to face each other via a third dielectric layer that does not contribute to capacitance formation. The edge of the additional second internal electrode layer is connected to the second external electrode, and the thickness of the second dielectric layer and the thickness of the third dielectric layer are the same as those of the first dielectric layer. Thinner than thickness.

  According to the present invention, since the additional first internal electrode layer is used as the reinforcing layer and the additional second internal electrode layer is used as the reinforcing layer, the presence of these reinforcing layers results in the multilayer capacitor. The bending strength can be improved. In addition, since the additional first internal electrode layer is connected to the first external electrode and the additional second internal electrode layer is connected to the second external electrode, the capacitor body has a structure on the first external electrode side. The balance between the mechanical strength and the mechanical strength on the second external electrode side can be secured, and the bending strength of the multilayer capacitor can be improved more accurately.

  The thickness of the second dielectric layer (dielectric layer that does not contribute to capacitance formation) and the thickness of the third dielectric layer (dielectric layer that does not contribute to capacitance formation) are determined by the first internal dielectric layer (capacitor formation). Since the thickness of the contributing dielectric layer) is thinner, an increase in the height dimension of the multilayer capacitor can be suppressed as much as possible.

  The above object and other objects, structural features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.

FIG. 1 is an external perspective view of a multilayer capacitor (first embodiment) to which the present invention is applied. FIG. 2 is an enlarged sectional view taken along line S1-S1 of FIG. FIG. 3 is an enlarged cross-sectional view taken along line S2-S2 of FIG. FIG. 4 is a partially enlarged view of FIG. FIG. 5 is a cross-sectional view corresponding to FIG. 2 (a cross-sectional view enlarging 1/2 in the length direction) showing a structural modification of the multilayer capacitor shown in FIGS. FIG. 6 is a cross-sectional view corresponding to FIG. 2 of a multilayer capacitor to which the present invention is applied (second embodiment). 7 is a cross-sectional view corresponding to FIG. 5 showing a structural modification of the multilayer capacitor shown in FIG. FIG. 8 is a cross-sectional view corresponding to FIG. 2 of a multilayer capacitor to which the present invention is applied (third embodiment). 9 is a cross-sectional view corresponding to FIG. 5 showing a structural modification of the multilayer capacitor shown in FIG.

<< First Embodiment >>
1 to 4 show a multilayer capacitor 10 (first embodiment) to which the present invention is applied.

<Structure of multilayer capacitor 10>
First, the structure of the multilayer capacitor 10 will be described. For convenience of explanation, the left, right, front, back, top, and bottom of FIG. 2 are front, back, left, right, top, and bottom, respectively. The directions corresponding to these in other drawings are also referred to.

  The multilayer capacitor 10 has a substantially rectangular parallelepiped shape having a relationship of length dimension L> width dimension W> height dimension H. The specific length dimension L is 1.0 mm, the width dimension W is 0.5 mm, The height dimension H is 0.15 mm.

  The multilayer capacitor 10 includes a substantially rectangular parallelepiped capacitor body 11 having the same dimensional relationship, a first external electrode 12 that continuously covers the front surface, the left and right surfaces, and the front portion of the top and bottom surfaces of the capacitor body 11, and the capacitor body. 11 and a second external electrode 13 that continuously covers the left and right surfaces and the rear portions of the upper and lower surfaces. The first external electrode 12 is used as one polarity, and the second external electrode 13 is used as the other polarity.

  The capacitor body 11 includes a dielectric part 14 made of ceramic, a total of six first internal electrode layers 15 made of metal and disposed in the dielectric part 14, and a dielectric made of the same material as the first internal electrode layer 15. A total of six second internal electrode layers 16 disposed in the portion 14. A specific material name of the dielectric portion 14 is barium titanate, and a specific material name of the first internal electrode layer 15 and the second internal electrode layer 16 is nickel.

  Incidentally, although the number of the first internal electrode layers 15 and the number of the second internal electrode layers 16 are actually larger than 6, the number of the first internal electrode layers 15 and the number of the second internal electrode layers 16 are set to 6 for convenience of illustration. The capacitor body 11 will be described together with the number.

  Each first internal electrode layer 15 has a rectangular shape having a length dimension and a width dimension smaller than the length dimension and the width dimension of the capacitor body 11, and each second internal electrode layer 16 includes the first internal electrode layer 15 and the first internal electrode layer 15. It has a rectangular shape having substantially the same length and width. The thickness of each 1st internal electrode layer 15 and the thickness of each 2nd internal electrode layer 16 are the same, for example, are 0.5-3.0 micrometers.

  The front end edge of each first internal electrode layer 15 is electrically connected to the first external electrode 12, and the rear end edge of each second internal electrode layer 16 is electrically connected to the second external electrode 13. That is, each first internal electrode layer 15 is used as one polarity, and each second internal electrode layer 16 is used as the other polarity.

  The five first internal electrode layers 15 of the six first internal electrode layers 15 and the five second internal electrode layers 16 of the six second internal electrode layers 16 are basically the first The first internal electrode layer 15 and the second internal electrode layer 16 are disposed so as to face each other via the first dielectric layer DL1 that contributes to the capacitance formation, and are alternately arranged via the first dielectric layer DL1. . The thickness td1 of each first dielectric layer DL1 is, for example, 2.0 to 6.0 μm.

  In addition, one additional first internal electrode layer 15 is disposed on the first internal electrode layer 15 that is third from the top so as to face each other via the second dielectric layer DL2 that does not contribute to capacitance formation. In addition, one additional second internal electrode layer 16 is arranged on the second internal electrode layer 16 that is third from the top so as to face each other via the third dielectric layer DL3 that does not contribute to capacitance formation. That is, one additional first internal electrode layer 15 and one additional second internal electrode layer 16 are disposed on the first internal electrode layer 15 and the second internal electrode layer 16 that are adjacent to each other at the center of the capacitor body 11, respectively. ing.

  The thickness td2 of the second dielectric layer DL2 and the thickness td3 of the third dielectric layer DL3 are substantially the same and are thinner than the thickness td1 of the first dielectric layer DL1. Preferably, the relationship between the thickness td2 of the second dielectric layer DL2, the thickness td3 of the third dielectric layer DL3, and the thickness td1 of the first dielectric layer DL1 is td2≈td3 <2 / 3td1. The thickness td2 of the second dielectric layer DL2 and the thickness td3 of the third dielectric layer DL3 are, for example, 0.5 to 3.0 μm, and each first internal electrode layer is larger than the thickness td1 of the first dielectric layer DL1. 15 and close to the thickness of each second internal electrode layer 16.

  Incidentally, since the thickness td2 of the second dielectric layer DL2 and the thickness td3 of the third dielectric layer DL3 are thinner than the thickness td1 of the first dielectric layer DL1, in the baking process of the heat treatment in the description of the manufacturing method to be described later The firing of the second dielectric layer DL2 sandwiched between the two first internal electrode layers 15 and the firing of the third dielectric layer DL3 sandwiched between the two second internal electrode layers 16 are the first internal electrode layer 15 And the thickness td1 of the first dielectric layer DL1 existing between the second internal electrode layer 16 and the second dielectric layer DL2 are increased in strength and the third dielectric layer due to the difference in the firing amount. It is assumed that the strength of DL3 is higher than that of the first dielectric layer DL1.

  Although not shown, the first external electrode 12 and the second external electrode 13 have a multilayer structure of a base film and a surface film covering the base film. The specific material name of the base film is nickel, the thickness is, for example, 1.0 to 3.0 μm, the specific material name of the surface film is tin, and the thickness is, for example, 0.5 to 1.5 μm. It is.

  The capacitance of the multilayer capacitor 10 is such that the first internal conductors facing each other through the first dielectric layer DL1 that contributes to capacitance formation among the six first internal electrode layers 15 and the six second internal electrode layers 16 in total. It is formed between the layer 15 and the second conductor layer 16.

<Method for Manufacturing Multilayer Capacitor 10>
Next, a manufacturing method of the multilayer capacitor 10 will be described. However, the manufacturing method described here is merely an example. Even if the composition of the dielectric slurry and the composition of the conductor paste are changed, the unfired chip and the postscript are described later. It goes without saying that the multilayer capacitor 10 can be manufactured even if the base film coating paste is heat-treated at the same time.

  In production, a dielectric slurry containing barium titanate powder, polyvinyl butyral (binder), ethanol, water (solvent), and phosphate ester (dispersant) in a predetermined weight ratio is prepared. In addition, a conductor paste containing nickel powder, barium titanate powder, polyvinyl butyral (binder), ethanol (solvent), and phosphate ester (dispersant) in a predetermined weight ratio is prepared.

  Then, using a coating machine such as a doctor blade, a dielectric slurry is applied to a predetermined thickness on a base film such as PET and dried to produce a first dielectric sheet. A second dielectric sheet having a thickness smaller than that of the first dielectric sheet is produced.

  Subsequently, using a printing machine such as a screen printing machine, the first paste for the first internal electrode layer 15 is printed by drying the conductor paste on the first dielectric sheet with a predetermined thickness, shape and arrangement and drying. A sheet is produced, and a second laminated sheet for the second internal electrode layer 16 is produced by the same method.

  In addition, using a printing machine such as a screen printing machine, a conductor paste is printed on the second dielectric sheet with a predetermined thickness, shape and arrangement, and dried to form a third for the additional first internal electrode layer 15. A laminated sheet is produced, and a fourth laminated sheet for the additional second internal electrode layer 16 is produced in the same manner.

  Subsequently, a predetermined number of first dielectric sheets are stacked, a second stacked sheet is stacked thereon, a first stacked sheet is stacked thereon, a second stacked sheet is stacked thereon, and a first stacked sheet is stacked thereon. The second laminated sheet is stacked thereon, the fourth laminated sheet is stacked thereon, the first laminated sheet is stacked thereon, the third laminated sheet is stacked thereon, and the second laminated sheet is stacked thereon. The first laminated sheet is stacked thereon, the second laminated sheet is stacked thereon, the first laminated sheet is stacked thereon, and a predetermined number of first dielectric sheets are stacked thereon, followed by hydrostatic pressure Using a press machine such as a press machine, pressure is applied to the whole to press the sheets together to produce a sheet laminate.

  Subsequently, using a cutting machine such as a dicing machine, the sheet laminate is cut into a size corresponding to the capacitor body 11 to produce an unfired chip.

  Subsequently, using a heating device such as a firing furnace, a large number of unfired chips are collectively subjected to heat treatment according to a predetermined temperature profile. This heat treatment includes a binder removal process and a baking process, and the capacitor body 11 is manufactured through these processes.

  Subsequently, the conductor paste is applied to both ends in the length direction of the capacitor body 11 by using a coating device such as a dipping device and dried. Then, by using a heating device such as a baking furnace, a heat treatment according to a predetermined temperature profile is collectively performed on a large number of capacitor bodies 11 after the conductor paste is applied to form a base film (nickel film) of the first external electrode 12 And a base film (nickel film) of the second external electrode 13.

  Subsequently, by using a plating apparatus such as an electrolytic plating apparatus, the capacitor body 11 after the base film is subjected to a plating process in a lump so that the surface film (tin film) of the first external electrode 12 and the second external electrode 13 are formed. A surface film (tin film) is prepared. Thus, the multilayer capacitor 10 is manufactured.

<Effects of multilayer capacitor 10>
Next, effects obtained by the multilayer capacitor 10 will be described.

  (1) The edge of one of the five first internal electrode layers 15 is connected to the first external electrode 12 like the first internal electrode layer 15 and the thickness of the first dielectric layer DL1. One additional first internal electrode layer 15 is disposed so as to face each other through the second dielectric layer DL2 which has a thickness td2 smaller than td1 and does not contribute to the capacitance formation, and five second internal electrodes One of the layers 16 has an edge connected to the second external electrode 13 like the second internal electrode layer 16, and a thickness td3 smaller than the thickness td1 of the first dielectric layer DL1, In addition, one additional second internal electrode layer 16 is disposed so as to face each other via the third dielectric layer DL3 that does not contribute to capacitance formation.

  That is, since one additional first internal electrode layer 15 is used as a reinforcing layer and one additional second internal electrode layer 16 is used as a reinforcing layer, the layers are laminated due to the presence of these reinforcing layers. The bending strength of the mold capacitor 10 can be improved.

  Further, since the additional first internal electrode layer 15 is connected to the first external electrode 12 and the additional second internal electrode layer 16 is connected to the second external electrode 13, The balance between the mechanical strength on the side of the first external electrode 12 and the mechanical strength on the side of the second external electrode 13 can be secured, and the bending strength of the multilayer capacitor 10 can be improved more accurately.

  Furthermore, the thickness td2 of the second dielectric layer DL2 (dielectric layer that does not contribute to capacitance formation) existing between the additional first internal electrode layer 15 and the first internal electrode layer 15 facing the additional first internal electrode layer 15, and the additional second The thickness td3 of the third dielectric layer DL3 (dielectric layer that does not contribute to capacitance formation) existing between the internal electrode layer 16 and the second internal electrode layer 16 facing the internal electrode layer 16 is determined by the first internal conductor layer 15 and the second conductor. Since the thickness is smaller than the thickness td1 of the first internal dielectric layer DL1 (dielectric layer contributing to capacitance formation) existing between the layers 16, an increase in the height dimension H of the multilayer capacitor 10 can be suppressed as much as possible.

  (2) Strength of the second dielectric layer DL2 (dielectric layer that does not contribute to capacitance formation) existing between the additional first internal electrode layer 15 and the first internal electrode layer 15 facing the additional first internal electrode layer 15, and the additional second internal electrode The strength of the third dielectric layer DL3 (dielectric layer that does not contribute to capacitance formation) existing between the electrode layer 16 and the second internal electrode layer 16 facing the electrode layer 16 is such that the first internal conductor layer 15 and the second conductor layer 16 Since the strength of the first inner dielectric layer DL1 (dielectric layer contributing to capacity formation) existing between the second dielectric layer DL2 and the third dielectric layer DL3 is higher than the strength of the first inner dielectric layer DL1 (dielectric layer contributing to capacity formation). By playing a role, the bending strength of the multilayer capacitor 10 can be improved more reliably.

<Verification of bending strength of multilayer capacitor 10>
By the way, in the multilayer capacitor having the size described in <Structure of multilayer capacitor 10> (the length dimension L is 1.0 mm, the width dimension W is 0.5 mm, and the height dimension H is 0.15 mm). Regardless of the total number of internal electrode layers, the capacity of the multilayer capacitor, etc., in order to prevent cracks and cracks caused by the force applied to the capacitor body when mounted on the circuit board or after mounting, the actual measurement is 100 gf or more. Folding strength is required.

  In consideration of such circumstances, in the multilayer capacitor 10, the number of first internal electrode layers 15 (including the additional first internal electrode layer 15) is 19, and the second internal electrode layer 16 (the additional second internal electrode layer 15). The number of internal electrode layers 16 (including the internal electrode layers 16) is 19, the thickness of each first internal electrode layer 15 and the thickness of each second internal electrode layer 16 is 0.8 μm, and the thickness td1 of each first dielectric layer DL1 Is 2.3 μm, the thickness td2 of the second dielectric layer DL2 and the thickness td3 of the third dielectric layer DL3 are 0.9 μm, and the bending strength is measured. The strength was 180 gf.

  In the multilayer capacitor 10, the number of first internal electrode layers 15 (including the additional first internal electrode layers 15) is 19, and the second internal electrode layers 16 (including the additional second internal electrode layers 16) are included. ) Is 19, the thickness of each first internal electrode layer 15 and the thickness of each second internal electrode layer 16 is 0.8 μm, the thickness td1 of each first dielectric layer DL1 is 2.3 μm, A prototype with the thickness td2 of the second dielectric layer DL2 and the thickness td3 of the third dielectric layer DL3 set to 1.4 μm was measured, and the bending strength was measured. The bending strength was 140 gf. .

  On the other hand, as a multilayer capacitor for comparison, the number of first internal electrode layers 15 (there is no additional first internal electrode layer 15) is 19, and the second internal electrode layer 16 (additional second internal electrode) 19), the thickness of each first internal electrode layer 15 and the thickness of each second internal electrode layer 16 are 0.8 μm, and the thickness td1 of each first dielectric layer DL1 is 2 .3 μm, that is, a general structure having no additional first internal electrode layer 15, additional second internal electrode layer 16, second dielectric layer DL2, and third dielectric layer DL3 When the bending strength was measured, the bending strength was 95 gf.

<Structural modification of multilayer capacitor 10>
Next, a structural modification of the multilayer capacitor 10 will be described.

  (1) In FIGS. 1 to 4, the additional first internal electrode layer 15 and the second dielectric layer DL2 are one, and the additional second internal electrode layer 16 and the third dielectric layer DL3 are one. Although the multilayer capacitor 10 is shown as one, the additional first internal electrode layer 15 and the second dielectric layer DL2 are two (or three or more) like the multilayer capacitor 10 ′ shown in FIG. In addition, the same effect as described above can be obtained by using two (or three or more) additional second internal electrode layers 16 and third dielectric layers DL3.

  If the number of the additional first internal electrode layers 15 and the second dielectric layers DL2 and the number of the additional second internal electrode layers 16 and the third dielectric layers DL3 are increased, the bending strength of the multilayer capacitor 10 ′ is increased. The height dimension H of the multilayer capacitor 10 ′ also increases with the increase, but in reality, the increase in the height dimension H of the multilayer capacitor 10 ′ is taken into consideration. The number of the additional first internal electrode layer 15 and the second dielectric layer DL2 and the number of the additional second internal electrode layer 16 and the third dielectric layer DL3 are selected.

  (2) In FIGS. 1 to 4, the number of first internal electrode layers 15 (including additional first internal electrode layers 15) and second internal electrode layers 16 (including additional second internal electrode layers 16). For convenience, the multilayer capacitor 10 with six is shown, but as described above, the number of the first internal electrode layers 15 and the number of the second internal electrode layers 16 are actually more than six. Even when the number is large, the same effect as described above can be obtained.

  (3) FIGS. 1 to 4 show the multilayer capacitor 10 having a length L of 1.0 mm, a width W of 0.5 mm, and a height H of 0.15 mm. The same effect can be obtained even if the width dimension W and the height dimension H are multilayer capacitors other than these values, and the multilayer capacitor having the relationship of length dimension L> width dimension W = height dimension H is obtained. However, the same effect as described above can be obtained.

  (4) In FIGS. 1-4, 0.5-3.0 micrometers is shown as an example of the thickness of each 1st internal electrode layer 15 and each 2nd internal electrode layer 16, and each 1st dielectric layer An example of the thickness td1 of DL1 is 2.0 to 6.0 μm, and an example of the thickness td2 of the second dielectric layer DL2 and the thickness td3 of the third dielectric layer DL3 is 0.5 to 3.0 μm. Although shown, it depends on the number of the first internal electrode layers 15 and the number of the second internal electrode layers 16 described above, the size of the multilayer capacitor 10 described above, the capacity required for the multilayer capacitor 10, and the like. These values can be changed as appropriate, and the same effects as described above can be obtained even if they are changed.

  (5) FIGS. 1 to 4 show barium titanate as an example of the material of the dielectric portion 14 (including the first dielectric layer DL1, the second dielectric layer DL2, and the third dielectric layer DL3). Nickel is shown as an example of the material of the first internal electrode layer 15 and the second internal electrode layer 16, and nickel is used as an example of the material of the surface film of the first external electrode 12 and the second external electrode 13. Although tin is shown, when the dielectric portion 14 is made of a dielectric other than barium titanate, the first internal electrode layer 15 and the second internal electrode layer 16 are made of a metal or alloy other than nickel, Even when the base film of the external electrode 12 and the second external electrode 13 is made of a metal or alloy other than nickel and the surface film is made of a metal or alloy other than tin, the same effect as described above can be obtained.

<< Second Embodiment >>
FIG. 6 shows a multilayer capacitor 20 (second embodiment) to which the present invention is applied.

<Structure of multilayer capacitor 20>
The multilayer capacitor 20 is structurally different from the multilayer capacitor 10 (first embodiment) as follows.
An additional first internal electrode layer 15 is arranged on the second first internal electrode layer 15 from the top so as to face each other via the second dielectric layer DL2 that does not contribute to the capacitance formation. One additional second internal electrode layer 16 is arranged on the fourth (second from the bottom) second internal electrode layer 16 so as to face each other through the third dielectric layer DL3 that does not contribute to capacitance formation. is there. Since other structures are the same as those of the multilayer capacitor 10 (first embodiment), description thereof is omitted.

  Since the manufacturing method of the multilayer capacitor 20 is the same as that of the multilayer capacitor 10 (first embodiment) except that the stacking order of the first multilayer sheet to the fourth multilayer sheet is changed, the description thereof is omitted. Further, the effect obtained by the multilayer capacitor 20 is the same as that of the multilayer capacitor 10 (first embodiment), and the description thereof is omitted.

<Structural modification of multilayer capacitor 20>
Next, a structural modification of the multilayer capacitor 20 will be described.

  (1) In FIG. 6, a stack including one additional first internal electrode layer 15 and second dielectric layer DL2 and one additional second internal electrode layer 16 and third dielectric layer DL3. Although the type capacitor 20 is shown, the additional first internal electrode layer 15 and the second dielectric layer DL2 are two (or three or more) like the multilayer capacitor 20 ′ shown in FIG. Even if the additional second internal electrode layer 16 and the third dielectric layer DL3 are two (or three or more), the same effect as described above can be obtained.

  If the number of the additional first internal electrode layers 15 and the second dielectric layers DL2 and the number of the additional second internal electrode layers 16 and the third dielectric layers DL3 are increased, the bending strength of the multilayer capacitor 20 ′ can be increased. The height dimension H of the multilayer capacitor 20 ′ increases with the increase, but in reality, the increase in the height dimension H of the multilayer capacitor 20 ′ is taken into consideration. The number of the additional first internal electrode layer 15 and the second dielectric layer DL2 and the number of the additional second internal electrode layer 16 and the third dielectric layer DL3 are selected.

  (2) FIG. 6 shows the number of first internal electrode layers 15 (including the additional first internal electrode layers 15) and the number of second internal electrode layers 16 (including the additional second internal electrode layers 16). Although six multilayer capacitors 20 are shown for convenience, as described above, the number of first internal electrode layers 15 and the number of second internal electrode layers 16 are actually larger than 6, and the number of both is large. Even in this case, the same effect as described above can be obtained.

  (3) FIG. 6 shows a multilayer capacitor 20 having a length dimension L of 1.0 mm, a width dimension W of 0.5 mm, and a height dimension H of 0.15 mm. The same effect as described above can be obtained even when the W and height dimensions H are other than these numerical values, and the multilayer capacitor has a relationship of length dimension L> width dimension W = height dimension H. The same effect as described above can be obtained.

  (4) FIG. 6 shows 0.5 to 3.0 μm as an example of the thickness of each first internal electrode layer 15 and the thickness of each second internal electrode layer 16, and the thickness of each first dielectric layer DL1. An example of the thickness td1 is 2.0 to 6.0 μm, and an example of the thickness td2 of the second dielectric layer DL2 and the thickness td3 of the third dielectric layer DL3 is 0.5 to 3.0 μm. These values depend on the number of the first internal electrode layers 15 and the number of the second internal electrode layers 16 described above, the size of the multilayer capacitor 20 described above, the capacitance required for the multilayer capacitor 20, and the like. Can be changed as appropriate, and the same effect as described above can be obtained even if it is changed.

  (5) FIG. 6 shows barium titanate as an example of the material of the dielectric portion 14 (including the first dielectric layer DL1, the second dielectric layer DL2, and the third dielectric layer DL3). Nickel is shown as an example of the material of the electrode layer 15 and the second internal electrode layer 16, nickel is shown as an example of the base film material of the first external electrode 12 and the second external electrode 13, and tin is shown as an example of the material of the surface film However, when the dielectric portion 14 is made of a dielectric other than barium titanate, the first internal electrode layer 15 and the second internal electrode layer 16 are made of a metal or alloy other than nickel, or the first external electrode 12 The same effect can be obtained even when the underlying film of the second external electrode 13 is made of a metal or alloy other than nickel and the surface film is made of a metal or alloy other than tin.

<< Third Embodiment >>
FIG. 8 shows a multilayer capacitor 30 (third embodiment) to which the present invention is applied.

<Structure of multilayer capacitor 30>
The multilayer capacitor 30 is structurally different from the multilayer capacitor 10 (first embodiment).
One additional first internal electrode layer 15 is disposed on the first internal electrode layer 15 that is the first (outermost) from the top so as to face each other via the second dielectric layer DL2 that does not contribute to capacitance formation. An additional second internal electrode layer 16 is provided on the second internal electrode layer 16 that is fifth from the top (first from the bottom, outermost) so as to face each other via the third dielectric layer DL3 that does not contribute to capacitance formation. It is at the point where one is placed. Since other structures are the same as those of the multilayer capacitor 10 (first embodiment), description thereof is omitted.

  Since the manufacturing method of the multilayer capacitor 30 is the same as that of the multilayer capacitor 10 (first embodiment) except that the stacking order of the first multilayer sheet to the fourth multilayer sheet is changed, the description thereof is omitted. Further, the effect obtained by the multilayer capacitor 30 is the same as that of the multilayer capacitor 10 (first embodiment), and the description thereof is omitted.

<Structural Modification Example of Multilayer Capacitor 30>
Next, a structural modification of the multilayer capacitor 30 will be described.

  (1) FIG. 8 shows a stack in which the additional first internal electrode layer 15 and the second dielectric layer DL2 are one, and the additional second internal electrode layer 16 and the third dielectric layer DL3 are one. Although the type capacitor 30 is shown, the additional first internal electrode layer 15 and the second dielectric layer DL2 are two (or three or more) like the multilayer capacitor 30 ′ shown in FIG. Even if the additional second internal electrode layer 16 and the third dielectric layer DL3 are two (or three or more), the same effect as described above can be obtained.

  If the number of the additional first internal electrode layers 15 and the second dielectric layers DL2 and the number of the additional second internal electrode layers 16 and the third dielectric layers DL3 are increased, the bending strength of the multilayer capacitor 30 ′ can be increased. The height dimension H of the multilayer capacitor 30 ′ also increases with the increase, but in reality, the increase in the height dimension H of the multilayer capacitor 30 ′ is taken into consideration. The number of the additional first internal electrode layer 15 and the second dielectric layer DL2 and the number of the additional second internal electrode layer 16 and the third dielectric layer DL3 are selected.

  (2) FIG. 8 shows the number of first internal electrode layers 15 (including the additional first internal electrode layers 15) and the number of second internal electrode layers 16 (including the additional second internal electrode layers 16). Although six multilayer capacitors 30 are shown for convenience, as described above, the number of first internal electrode layers 15 and the number of second internal electrode layers 16 are actually larger than six, and the number of both is large. Even in this case, the same effect as described above can be obtained.

  (3) FIG. 8 shows a multilayer capacitor 30 having a length dimension L of 1.0 mm, a width dimension W of 0.5 mm, and a height dimension H of 0.15 mm. The same effect as described above can be obtained even when the W and height dimensions H are other than these numerical values, and the multilayer capacitor has a relationship of length dimension L> width dimension W = height dimension H. The same effect as described above can be obtained.

  (4) FIG. 8 shows 0.5 to 3.0 μm as an example of the thickness of each first internal electrode layer 15 and the thickness of each second internal electrode layer 16, and the thickness of each first dielectric layer DL1. An example of the thickness td1 is 2.0 to 6.0 μm, and an example of the thickness td2 of the second dielectric layer DL2 and the thickness td3 of the third dielectric layer DL3 is 0.5 to 3.0 μm. These values depend on the number of the first internal electrode layers 15 and the number of the second internal electrode layers 16 described above, the size of the multilayer capacitor 30 described above, the capacity required for the multilayer capacitor 30, and the like. Can be changed as appropriate, and the same effect as described above can be obtained even if it is changed.

  (5) FIG. 8 shows barium titanate as an example of the material of the dielectric portion 14 (including the first dielectric layer DL1, the second dielectric layer DL2, and the third dielectric layer DL3). Nickel is shown as an example of the material of the electrode layer 15 and the second internal electrode layer 16, nickel is shown as an example of the base film material of the first external electrode 12 and the second external electrode 13, and tin is shown as an example of the material of the surface film However, when the dielectric portion 14 is made of a dielectric other than barium titanate, the first internal electrode layer 15 and the second internal electrode layer 16 are made of a metal or alloy other than nickel, or the first external electrode 12 The same effect can be obtained even when the underlying film of the second external electrode 13 is made of a metal or alloy other than nickel and the surface film is made of a metal or alloy other than tin.

  10, 10 ', 20, 20', 30, 30 '... multilayer capacitor, 11 ... capacitor body, 12 ... first external electrode, 13 ... second external electrode, 14 ... dielectric portion, 15 ... first internal electrode Layer (including an additional first internal electrode layer), 16 ... second internal electrode layer (including an additional second internal electrode layer), DL1 ... first dielectric layer, DL2 ... second dielectric layer, DL3 ... Third dielectric layer.

Claims (4)

A plurality of first internal electrode layers and a plurality of second internal electrode layers face each other via a first dielectric layer that contributes to capacitance formation, and are arranged in layers so as to be alternately arranged. In a multilayer capacitor in which the edges of the plurality of first internal electrode layers are connected to an external electrode, and the edges of the plurality of second internal electrode layers are connected to a second external electrode used as the other polarity,
Of the plurality of first internal electrode layers and the plurality of second internal electrode layers, a first internal electrode layer is positioned on one side in the stacking direction, and a second internal electrode layer is positioned on the other side in the stacking direction. And
An additional first internal electrode layer is stacked on the outside of the first internal electrode layer located on one side in the stacking direction so as to face each other via a second dielectric layer that does not contribute to capacitance formation, and the additional first The edge of the internal electrode layer is connected to the first external electrode,
An additional second internal electrode layer is laminated outside the second internal electrode layer on the other side in the stacking direction so as to face each other via a third dielectric layer that does not contribute to capacitance formation, and the additional second internal electrode The edge of the layer is connected to the second external electrode;
The thickness of the second dielectric layer and the thickness of the third dielectric layer are thinner than the thickness of the first dielectric layer,
A multilayer capacitor characterized by that. The shape of the additional first internal electrode layer is substantially the same as the shape of the first internal electrode layer located on one side in the stacking direction,
The shape of the additional second internal electrode layer is substantially the same as the shape of the second internal electrode layer located on the other side in the stacking direction.
The multilayer capacitor according to claim 1. The thickness of the second dielectric layer and the thickness of the third dielectric layer are substantially the same.
The multilayer capacitor according to claim 1 or 2, wherein The thickness of the second dielectric layer and the thickness of the third dielectric layer are less than 2/3 of the thickness of the first dielectric layer.
The multilayer capacitor according to claim 3.

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