JP5455674B2 - Materials for electrical and electronic fuses - Google Patents
Materials for electrical and electronic fuses Download PDFInfo
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- JP5455674B2 JP5455674B2 JP2010012430A JP2010012430A JP5455674B2 JP 5455674 B2 JP5455674 B2 JP 5455674B2 JP 2010012430 A JP2010012430 A JP 2010012430A JP 2010012430 A JP2010012430 A JP 2010012430A JP 5455674 B2 JP5455674 B2 JP 5455674B2
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- 239000000463 material Substances 0.000 title claims description 25
- 229910052738 indium Inorganic materials 0.000 claims description 24
- 229910052733 gallium Inorganic materials 0.000 claims description 21
- 238000010587 phase diagram Methods 0.000 claims description 9
- 229910002058 ternary alloy Inorganic materials 0.000 claims description 5
- 238000002844 melting Methods 0.000 description 16
- 230000008018 melting Effects 0.000 description 16
- 239000000203 mixture Substances 0.000 description 11
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910000846 In alloy Inorganic materials 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- 229910000676 Si alloy Inorganic materials 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005491 wire drawing Methods 0.000 description 2
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
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Description
本発明は、コンデンサー等の電気・電子部品に内蔵されるヒューズのエレメントを構成する材料に関する。詳しくは、その融点がヒューズ用途において好ましい範囲内にあり、更に溶断特性や加工性に優れたものに関する。 The present invention relates to a material constituting an element of a fuse built in an electric / electronic component such as a capacitor. More specifically, the present invention relates to a material having a melting point within a preferable range for fuse applications and having excellent fusing characteristics and workability.
コンデンサー等の電気・電子部品に内蔵されるヒューズは、過電流が流れた際にそのエレメントがジュール熱により溶断することで通電を遮断するようになっている。そして、このような機能を考慮して、エレメントを構成する材料には適切な範囲、具体的には融点が３００〜３６０℃付近の範囲内にあることが求められる。エレメントの融点が高い場合、ヒューズの作動温度も高温となるが、それでは電子部品が実装された回路基板を損傷させることとなるため、ヒューズ本来の保護装置として作用が期待できなくなるからである。 When an overcurrent flows, a fuse built in an electric / electronic component such as a capacitor is cut off from energization by the element being blown by Joule heat. In consideration of such functions, the material constituting the element is required to have an appropriate range, specifically, a melting point in the range of about 300 to 360 ° C. This is because when the melting point of the element is high, the operating temperature of the fuse also becomes high, but this damages the circuit board on which the electronic component is mounted, so that it cannot be expected to function as the original protective device of the fuse.
従来、ヒューズ用の材料としては、Ｓｎ−Ｐｂ系合金が広く使用されてきたが、近年になってＰｂフリーの材料の適用が求められており、この要求に応える材料として、Ａｕ−２０質量％Ｓｎ合金、Ａｕ−３．１５質量％Ｓｉ合金等の適用が検討されている。 Conventionally, Sn—Pb-based alloys have been widely used as materials for fuses, but in recent years, application of Pb-free materials has been demanded. Application of Sn alloy, Au-3.15 mass% Si alloy, etc. is being studied.
しかしながら、Ａｕ−２０質量％Ｓｎ合金は、融点については上記範囲内よりも低く、加工性に乏しいという問題がある。ヒューズのエレメントは、細線形状、薄板形状等の微小サイズへ加工することが必要となり、加工性に乏しい材料では断線、割れが生じ易く歩留まりが低下する。特に、最近の電子部材においては、小型化の要求が強く、これに追従するために実装されるヒューズについても細線化、薄肉化が必要であることから、加工性の良好な材料が望まれる。 However, the Au-20 mass% Sn alloy has a problem that the melting point is lower than the above range and the workability is poor. The fuse element needs to be processed into a fine size such as a thin wire shape or a thin plate shape, and a material with poor workability is liable to be disconnected or cracked, resulting in a decrease in yield. Particularly, in recent electronic members, there is a strong demand for downsizing, and a fuse mounted to follow this needs to be thinned and thinned. Therefore, a material with good workability is desired.
また、Ａｕ−３．１５質量％Ｓｉ合金は、実際には融点が上記範囲より若干高く、３６０℃をやや超えるものであり、積極的に使用できるものではない。更に、この合金は、電気抵抗が低いため、過電流が流れた際において溶断が遅れる傾向があり、ヒューズとしての機能に問題がある。 Further, the Au-3.15 mass% Si alloy actually has a slightly higher melting point than the above range and slightly exceeds 360 ° C., and cannot be used actively. Furthermore, since this alloy has low electric resistance, there is a tendency for fusing to be delayed when an overcurrent flows, and there is a problem in the function as a fuse.
以上のように、従来のヒューズ用の材料は、使用できない程の大きな問題はないものの、今後のニーズ等を考慮すれば改善が望まれている。そこで、本発明は、加工性、電気抵抗が改善され、特に溶断特性に優れるものであり、且つ、好適範囲（具体的には３００〜３６０℃付近）の融点を有するヒューズ用の材料を提供する。 As described above, the conventional fuse material does not have such a serious problem that it cannot be used, but improvement is desired in consideration of future needs and the like. Accordingly, the present invention provides a material for a fuse that has improved workability and electrical resistance, is particularly excellent in fusing characteristics, and has a melting point in a suitable range (specifically, around 300 to 360 ° C.). .
本発明者等は、上記課題を解決すべく検討を行った。まず、Ａｕを基本とし、種々の金属を添加したＡｕ合金についての物性を評価したところ、Ａｕ、Ｇａ、Ｉｎを含む三元系合金において、加工性や電気抵抗が、従来のものより改善されることがわかった。そして、Ａｕ−Ｇａ−Ｉｎ合金のうち、所定の組成範囲を有する合金であれば、溶断特性に優れることを見出し、更に組成範囲を限定すれば、良好な溶断特性を維持しつつ、融点が低下することを見出し、本発明に想到した。 The present inventors have studied to solve the above problems. First, physical properties of an Au alloy based on Au and added with various metals were evaluated, and in a ternary alloy containing Au, Ga and In, workability and electrical resistance were improved as compared with the conventional one. I understood it. And if it is an alloy which has a predetermined composition range among Au-Ga-In alloys, it will discover that it is excellent in a fusing characteristic, and if a composition range is further limited, melting | fusing point will fall, maintaining a favorable fusing characteristic. As a result, the present invention has been conceived.
即ち、本発明は、Ａｕ−Ｇａ−Ｉｎ三元系合金からなり、これらの元素の質量濃度は、三元系状態図におけるＡ点（Ａｕ：８５％、Ｇａ：１４％、Ｉｎ：１％）、Ｂ点（Ａｕ：７４％、Ｇａ：１１％、Ｉｎ：１５％）、Ｃ点（Ａｕ：７４％、Ｇａ：６％、Ｉｎ：２０％）、Ｄ点（Ａｕ：７８％、Ｇａ：２％、Ｉｎ：２０％）、Ｅ点（Ａｕ：８６％、Ｇａ：２％、Ｉｎ：１２％）を頂点とする多角形の領域内にあるヒューズ用の材料である。 That is, the present invention is made of an Au-Ga-In ternary alloy, and the mass concentration of these elements is point A in the ternary phase diagram (Au: 85%, Ga: 14%, In: 1%). , B point (Au: 74%, Ga: 11%, In: 15%), C point (Au: 74%, Ga: 6%, In: 20%), D point (Au: 78%, Ga: 2) %, In: 20%), and a material for a fuse in a polygonal region having apex at point E (Au: 86%, Ga: 2%, In: 12%).
本発明に係る材料の組成を示す三元系状態図を図１に示す。本発明で三元系合金を適用するのは、Ｇａ、Ｉｎの２つの元素をＡｕに同時添加することで、従来のＡｕ二元系合金よりも加工性や電気抵抗が改善されるからである。そして、Ｇａ、Ｉｎの添加量を上記領域内の範囲にするのは、溶断特性が向上するからである。融点を調整する手法として、合金に添加する元素の含有率を上昇させることも考えられるが、その場合、加工性に影響を及ぼすおそれがある。本発明における添加元素であるＧａ、Ｉｎは、少ない添加量で融点を制御することができ、その上で加工性を確保している。 A ternary phase diagram showing the composition of the material according to the present invention is shown in FIG. The reason why the ternary alloy is applied in the present invention is that workability and electrical resistance are improved as compared to the conventional Au binary alloy by simultaneously adding two elements of Ga and In to Au. . The reason why the addition amount of Ga and In is set within the above range is because the fusing characteristics are improved. As a method for adjusting the melting point, it is conceivable to increase the content of the element added to the alloy, but in that case, the workability may be affected. Ga and In, which are additive elements in the present invention, can control the melting point with a small amount of addition, and ensure workability.
そして、本発明においてより好ましい組成は、上記範囲内においてＧａが５〜１３質量％、Ｉｎが５〜１５質量％となる領域の組成である。具体的には、図１の三元系状態図において、Ａ１点（Ａｕ：８２％、Ｇａ：１３％、Ｉｎ：５％）、Ｂ１点（Ａｕ：７７％、Ｇａ：８％、Ｉｎ：１５％）、Ｃ１点（Ａｕ：８０％、Ｇａ：５％、Ｉｎ：１５％）、Ｄ１点（Ａｕ：８５％、Ｇａ：１０％、Ｉｎ：５％）を頂点とする多角形の領域内の組成である。かかる組成とすることで、融点が低下し、ヒューズとしての性能を向上させることができるからである。 And a more preferable composition in this invention is a composition of the area | region where Ga is 5-13 mass% and In becomes 5-15 mass% in the said range. Specifically, in the ternary phase diagram of FIG. 1, point A1 (Au: 82%, Ga: 13%, In: 5%), point B1 (Au: 77%, Ga: 8%, In: 15) %), C1 point (Au: 80%, Ga: 5%, In: 15%), D1 point (Au: 85%, Ga: 10%, In: 5%) Composition. This is because with such a composition, the melting point is lowered and the performance as a fuse can be improved.
本発明に係る合金の製造においては、特段の困難性はなく、通常の合金（Ａｕ合金）と同様に溶解鋳造法により製造可能である。また、ヒューズへの加工についても、本発明に係る材料は加工性が良好であることから、押出し加工、線引き加工により任意のサイズに加工可能である。 In the production of the alloy according to the present invention, there is no particular difficulty, and it can be produced by a melt casting method in the same manner as a normal alloy (Au alloy). Also, with regard to processing into fuses, the material according to the present invention has good workability, and can be processed into an arbitrary size by extrusion processing or wire drawing processing.
以上説明したように、本発明に係る材料は、融点の範囲が３００〜３６０℃付近にあり、ヒューズ用途の融点範囲として適正な温度範囲内にある。本発明に係る材料は加工性も良好であり、微小サイズのヒューズを製造するのにも好適である。更に、電気抵抗も適度に高く、この点もヒューズ用途として好適である。 As described above, the material according to the present invention has a melting point in the vicinity of 300 to 360 ° C., and is within an appropriate temperature range as a melting point range for fuse applications. The material according to the present invention has good processability and is suitable for manufacturing a micro fuse. Furthermore, the electrical resistance is reasonably high, and this point is also suitable for fuse applications.
以下、本発明の実施形態及び比較例について説明する。本実施形態では各種組成のＡｕ−Ｇａ−Ｉｎ合金を製造し、それぞれの特性を評価・検討した。試料の製造においては、所定の組成となるように秤量した各金属を溶解・鋳造し、伸線加工してφ０．１ｍｍの線材とした。 Hereinafter, embodiments of the present invention and comparative examples will be described. In this embodiment, Au—Ga—In alloys with various compositions were manufactured, and the characteristics of each were evaluated and studied. In the production of the sample, each metal weighed so as to have a predetermined composition was melted and cast, and the wire was drawn to obtain a wire having a diameter of 0.1 mm.
各試料の評価は、融点、電気抵抗（固有抵抗）、硬度、加工性、溶断特性について行なった。加工性については、伸線加工による断線、亀裂、バリの発生の有無を実態顕微鏡（１０倍）で観察して評価した。また、溶断特性の評価は、試料線材に４Ａの電流を印加したときの溶断時間を測定し、溶断時間０．５秒未満のものを良品とした。尚、融点については熱分析（ＴＧ−ＤＴＡ）により測定し、電気抵抗はミリオムメーターにて固有抵抗を測定した。表１は、以上の評価結果を示す。 Each sample was evaluated for melting point, electrical resistance (specific resistance), hardness, workability, and fusing characteristics. About workability, the presence or absence of the generation | occurrence | production of the disconnection by a wire drawing process, a crack, and a burr | flash was observed and evaluated with the actual condition microscope (10 times). For the evaluation of the fusing characteristics, the fusing time when a current of 4 A was applied to the sample wire was measured, and those with a fusing time of less than 0.5 seconds were regarded as non-defective products. In addition, about melting | fusing point, it measured by thermal analysis (TG-DTA), and the electrical resistance measured the specific resistance with the milliohm meter. Table 1 shows the above evaluation results.
表１からわかるように、Ａｕ−Ｇａ−Ｉｎ三元系合金の元素の質量濃度が、図２に示す三元系状態図におけるＡ点〜Ｅ点を頂点とする多角形の領域内にある材料は、融点が約３００〜３６０℃の範囲にあり、また、加工性及び溶断特性も良好であった（実施例１〜５）。特に、質量濃度が、図２に示す三元系状態図におけるＡ１点〜Ｄ１点を頂点とする多角形の領域内にあれば、加工性や溶断特性に優れるだけでなく、融点も低くなるため、ヒューズ用の材料としては好適なものとなる（実施例３、４）。これに対し、材料の質量濃度が、図２に示す三元系状態図におけるＡ点〜Ｅ点を頂点とする多角形の領域から外れてしまうと、溶断特性に劣る結果となった。 As can be seen from Table 1, the material in which the mass concentration of the element of the Au—Ga—In ternary alloy is within a polygonal region having points A to E in the ternary phase diagram shown in FIG. The melting point was in the range of about 300 to 360 ° C., and the workability and fusing characteristics were also good (Examples 1 to 5). In particular, if the mass concentration is in a polygonal region having points A1 to D1 in the ternary phase diagram shown in FIG. 2, not only the workability and fusing characteristics are excellent, but also the melting point is lowered. As a material for the fuse, it becomes a suitable material (Examples 3 and 4). On the other hand, when the mass concentration of the material deviates from the polygonal region having points A to E in the ternary phase diagram shown in FIG.
本発明は、コンデンサー等の電気・電子部品に内蔵されるヒューズのエレメントを構成する材料に関するものである。本発明に係る材料を用いれば、溶断特性や加工性に優れた電流ヒューズを提供することが出来る。
The present invention relates to a material constituting a fuse element incorporated in an electric / electronic component such as a capacitor. By using the material according to the present invention, a current fuse excellent in fusing characteristics and workability can be provided.
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| JP2010012430A JP5455674B2 (en) | 2010-01-22 | 2010-01-22 | Materials for electrical and electronic fuses |
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| JP2010012430A JP5455674B2 (en) | 2010-01-22 | 2010-01-22 | Materials for electrical and electronic fuses |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS575865B2 (en) * | 1974-02-28 | 1982-02-02 | ||
| JP2001028228A (en) * | 1999-07-14 | 2001-01-30 | Uchihashi Estec Co Ltd | Current fuse element |
| JP2008156675A (en) * | 2006-12-21 | 2008-07-10 | Tanaka Kikinzoku Kogyo Kk | Material for fuse of electric/electronic component |
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