JP5447351B2 - Component mounting apparatus and component mounting method - Google Patents

Description

  The present invention relates to a component mounting apparatus and a component mounting method for mounting a component picked up by a mounting head on a substrate held by a substrate holding unit.

  A component mounting apparatus such as a flip chip bonder used in a semiconductor assembly process is provided with a substrate holding portion that holds a substrate in a substrate holding region, and a substrate that is movable relative to the substrate held in the substrate holding portion. A mounting head for mounting a component (electronic component) picked up by being attracted to the lower end to a component mounting site on the substrate held by the substrate holding unit is provided.

  In such a component mounting apparatus, positioning of the component and the component mounting site is performed before mounting the component, but the positioning before mounting the component is free to move forward and backward in the board holding region, The component mounting part on the substrate is imaged from above the component mounting part using the imaging means for imaging the lower and upper sides in the state where the substrate holding area is advanced, and the component picked up by the mounting head is imaged from below the component. Then, the component (the mounting head) is moved relative to the substrate based on the positional deviation between the component and the component mounting part in the both captured images obtained.

  Here, the position of the component and the component mounting portion in the image captured by the imaging camera includes an error (hereinafter referred to as an apparatus error) based on the deviation of the optical axis of the imaging camera and the assembly accuracy of each part of the apparatus. The apparatus error data is obtained by picking up an image of the jig component placed on the jig component placement portion provided outside the substrate holding area in the substrate holding portion from above the jig component. At the same time, the jig part picked up from the jig part placement part by the mounting head is imaged by the imaging means from below the jig part, and the positional deviation amount of the jig part in the both captured images is detected. (For example, Patent Document 1).

  Such device error data changes when the component mounting operation by the component mounting device progresses and thermal distortion or the like occurs between components of the component mounting device. In addition, it is necessary to update the data by performing an operation for detecting the apparatus error (hereinafter referred to as an apparatus error detection operation) at any time during the execution of the component mounting operation.

  In addition, when a component is mounted on the board, the component is heated by a heater built in the mounting head, and is mounted and fixed on the board in a state where the adhesive at the joint with the board is cured. In order to raise the temperature of the bonded portion, the substrate held by the substrate holding portion is preheated to an appropriate temperature corresponding to the type of substrate by a substrate heater.

JP-A-11-168299

  By the way, conventionally, the jig component placement portion on which the jig component is placed is a substrate viewed from the direction of advancement above the substrate holding region of the imaging means in the region outside the substrate holding region of the substrate holding portion. Provided in one area on the near side or the back side of the holding area, the imaging means that has advanced above the board holding area when the jig component is imaged is heated by the board heater (from the board heater). The area exposed to the radiant heat is different between the case where the jig component placement part is provided on the front side of the board holding area and the case where the jig part placement part is provided on the back side. It is small when it is provided in the area on the near side of the area, and is large when the jig component placement portion is provided in the area on the back side of the substrate holding area. On the other hand, the area where the imaging means that has advanced above the board holding area at the time of alignment before component mounting is heated by the board heater is the position of the part (part mounting part) on the board on which the part is mounted. Therefore, the situation in which the imaging means is heated by the substrate heater does not always match between the positioning before mounting the component and the mounting of the component, and the degree of thermal deformation of the imaging means is different. There was a problem that the mounting accuracy may be lowered.

  Therefore, the present invention is capable of improving the mounting accuracy of the component by making the situation in which the imaging means is heated by the substrate heater substantially coincide with the alignment before mounting the component and when mounting the component. An object is to provide a component mounting apparatus and a component mounting method.

  The component mounting apparatus according to claim 1, wherein a substrate holding unit that holds the substrate in the substrate holding region, a substrate heating unit that heats the substrate held by the substrate holding unit, and a component picked up by being attracted to the lower end of the tool The mounting head for mounting the component on the component mounting part on the substrate held by the substrate holding unit, and the upward and backward movement of the substrate holding region can be freely performed. Imaging means for performing the imaging, a plurality of jig component placement portions provided on the front side and the back side of the substrate holding area as seen from the direction in which the substrate holding area of the imaging means is advanced, and a plurality of jigs, respectively. The jig part placed on the jig part placement part and the jig part placed on one jig part placement part selected from the plurality of jig part placement parts above the jig part The first picked-up image is obtained by picking up an image from the image pickup means Both the pre-mounting image acquisition means for acquiring the second captured image by picking up the jig component picked up from the jig component placement portion by the mounting head from the lower side of the jig component, and before mounting the component From the amount of positional deviation between the jig component in the first captured image and the jig component in the second captured image acquired by the image acquisition means, the apparatus error (the optical axis shift of the lower imaging camera and the upper imaging camera, An error based on the assembly accuracy of each part of the apparatus) and a component mounting site on the board on which the component picked up by the mounting head is mounted by imaging from above the component mounting site. And a component mounting image acquisition means for acquiring a fourth captured image by acquiring a captured image of 3 and capturing a component picked up by the mounting head from below the component by an imaging means; Pick-up on the mounting head based on the amount of positional deviation between the component mounting site in the third captured image acquired by the product mounting image acquisition means and the component in the fourth captured image, and the apparatus error detected by the apparatus error detection means And a mounting head actuating unit that lowers the mounting head and mounts the component on the component mounting site. The pre-component mounting image acquisition unit includes a first captured image, The situation in which the imaging means is heated by the substrate heating means when acquiring the second captured image is that when the third captured image and the fourth captured image are acquired by the component mounting image acquisition means, The jig component placement portion is selected when acquiring the first captured image and the second captured image so as to be close to the state of being heated by the substrate heating means. .

  The component mounting method according to claim 2, wherein the substrate holding unit that holds the substrate in the substrate holding region, the substrate heating unit that heats the substrate held by the substrate holding unit, and the component picked up by being attracted to the lower end of the tool The mounting head for mounting the component on the component mounting part on the substrate held by the substrate holding unit, and the upward and backward movement of the substrate holding region can be freely performed. Imaging means for performing the imaging, a plurality of jig component placement portions provided on the front side and the back side of the substrate holding area as seen from the direction in which the substrate holding area of the imaging means is advanced, and a plurality of jigs, respectively. A component mounting method using a component mounting apparatus including a jig component placed on a tool component placement unit, wherein the jig component placement unit is selected from a plurality of jig component placement units. Place the mounted jig part from above the jig part. The first picked-up image is obtained by picking up the image by the image means, and the second picked-up image is obtained by picking up the jig component picked up from the jig component placement portion by the mounting head from below the jig component. A step of detecting a device error from a positional deviation amount between the jig component in the acquired first captured image and the jig component in the second captured image, and a component picked up by the mounting head A third picked-up image is obtained by picking up an image of the component mounting site on the substrate to be mounted from above the component mounting site to obtain a third captured image, and the component picked up by the mounting head is imaged from below the component by the imaging device. The acquired image, and the amount of misalignment between the component mounting site in the acquired third captured image and the component in the fourth captured image and the detected device error. A step of positioning the component picked up by the head with respect to the component mounting site and then lowering the mounting head to mount the component on the component mounting site, and acquiring the first captured image and the second captured image The first imaging is performed such that the situation in which the imaging means is heated by the substrate heating means is close to the situation in which the imaging means is heated by the substrate heating means when acquiring the third captured image and the fourth captured image. The jig component placement unit for obtaining the image and the second captured image is selected.

  In the present invention, the jig component is placed on a plurality of jig component placement portions provided on the front side and the rear side of the substrate holding region as viewed from the direction in which the image pickup means moves upward of the substrate holding region. The situation where the imaging means is heated by the substrate heating means when the jig component is imaged (when the first captured image and the second captured image are acquired) is Jig when imaging jig components so that the imaging means is close to the situation where the imaging means is heated by the substrate heating means when mounted (when the third and fourth captured images are acquired) Since the component placement unit is selected, the situation in which the imaging unit is heated by the substrate heating unit almost coincides between the alignment before component mounting and the component mounting. Accuracy can be improved.

The simplified block diagram of the component mounting apparatus in one embodiment of this invention The fragmentary perspective view of the component mounting apparatus in one embodiment of this invention The block diagram of the imaging camera with which the component mounting apparatus in one embodiment of this invention is provided (A) (b) Explanatory drawing of movement operation | movement of the imaging camera with which the component mounting apparatus in one embodiment of this invention is provided (A) (b) Explanatory drawing of movement operation | movement of the imaging camera with which the component mounting apparatus in one embodiment of this invention is provided The block diagram which shows the control system of the component mounting apparatus in one embodiment of this invention The flowchart which shows the procedure of the detection operation | work of the apparatus error which the component mounting apparatus in one embodiment of this invention performs (A) (b) (c) Operation | movement explanatory drawing of the component mounting apparatus in one embodiment of this invention An imaging image obtained by imaging a component mounting site on a substrate by an imaging camera provided in the component mounting apparatus according to the embodiment of the present invention and an imaging image obtained by imaging a component picked up by the mounting head are superimposed and displayed in the same direction. Figure The flowchart which shows the procedure of the component mounting operation which the component mounting apparatus in one embodiment of this invention performs (A) (b) (c) Operation | movement explanatory drawing of the component mounting apparatus in one embodiment of this invention The figure which shows the division | segmentation state of the board | substrate holding | maintenance area | region with which the component mounting apparatus in one embodiment of this invention is provided. (A) (b) Operation | movement explanatory drawing of the component mounting apparatus in one embodiment of this invention (A) (b) Operation | movement explanatory drawing of the component mounting apparatus in one embodiment of this invention The figure which shows the division | segmentation state of the board | substrate holding | maintenance area | region with which the component mounting apparatus in one embodiment of this invention is provided.

  Embodiments of the present invention will be described below with reference to the drawings. A component mounting apparatus 1 shown in FIG. 1 is a flip chip bonder that mounts a component (electronic component) 3 by turning it upside down (up and down) on a component mounting portion 2 a on a substrate 2, and a substrate positioning unit 12 on a base 11. , A component supply unit 13, a reversing head 14, a mounting head 15, and an imaging camera 16.

  1 and 2, the substrate positioning unit 12 includes a table-like substrate holding table 12a as a substrate holding unit that holds the substrate 2 and a substrate holding table moving mechanism 12b that moves the substrate holding table 12a in the horizontal plane direction. Then, the substrate 2 is positioned by moving the substrate holding table 12a on which the substrate 2 is placed by the substrate holding table moving mechanism 12b. The substrate holding table 12a holds the substrate 2 in a substrate holding area AR1 defined on the substrate holding table 12a, and a substrate that heats the substrate 2 held on the substrate holding table 12a below the substrate holding area AR1. A substrate heater H2 is provided as a heating means.

  In FIG. 1, the component supply unit 13 includes a pallet 13a in which a plurality of components 3 are accommodated, and a table-like pallet holding unit 13b that holds the pallet 13a.

  In FIG. 1, the reversing head 14 can move in the horizontal direction, move up and down, and rotate around the rotation axis R perpendicular to the paper surface of FIG. 1 (upside down), and the suction nozzle (reversing nozzle 14a) is directed downward. After the component 3 supplied from the component supply unit 13 is picked up by vacuum suction (see the reversing head 14 shown by a solid line in FIG. 1), the component 3 is rotated 180 degrees around the rotation axis R to reverse the front and back of the component 3 Further, by moving in that state in the horizontal direction (arrow A shown in FIG. 1), the part 3 with the front and back reversed is delivered to the mounting head 15 (see the reversing head 14 shown by the one-dot chain line in FIG. 1). .

  1 and 2, the mounting head 15 can move horizontally and includes a tool holding portion 15a that extends downward so as to be movable up and down. A tool 20 for picking up a part 3 or a jig tool 20J for picking up a jig part JG described later is detachably attached to the lower end of the tool holding portion 15a. In FIG. 2, a component tool accommodating portion 12c for accommodating the component tool 20 and a jig tool accommodating portion 12d for accommodating the jig tool 20J are provided on the outer edge portion of the substrate holding base 12a.

  In FIG. 2, a head side heater H1 is provided at the lower end of the tool holding portion 15a of the mounting head 15, and the component tool 20 or jig tool 20J attached to the tool holding portion 15a is a head side heater. Heated by H1.

  The mounting head 15 picks up the component 3 supplied by the reversing head 14 by reversing the front and back by vacuum suction through the component tool 20 attached to the lower end of the tool holding portion 15a (arrow B1 shown in FIG. 1). After moving above the substrate 2 positioned by the substrate positioning unit 12 and aligning the component mounting site 2a and the component 3 on the substrate 2 using the imaging camera 16, the tool holding unit 15a is lowered. Then, the component 3 is mounted on the component mounting portion 2a (arrow B2 shown in FIG. 1).

  That is, in the present embodiment, the mounting head 15 is provided so as to be relatively movable with respect to the substrate 2 held on the substrate holding base 12a as the substrate holding portion, and is picked up by being attracted to the lower end of the tool holding portion 15a. Is mounted on the component mounting portion 2a on the substrate 2 held on the substrate holding base 12a. Since the component tool 20 is heated by the head side heater H1 as described above, the component 3 picked up by the mounting head 15 via the component tool 20 is heated to the same temperature as the component tool 20. In this state, it is mounted on the component mounting portion 2a on the substrate 2.

  In FIG. 3, the imaging camera 16 can freely move forward and backward in the substrate holding area AR <b> 1, and has a prism in a housing 21 having openings (lower opening 21 a and upper opening 21 b) on the upper and lower surfaces. 22 and upper and lower shutters (lower shutter 25a and upper shutter 25b). The prism 22 is provided between the lower opening 21a and the upper opening 21b. The lower shutter 25a and the upper shutter 25b are moved in the horizontal plane in the casing 21 by the operation of the shutter moving mechanism 26. The side opening 21a and the upper opening 21b are opened and closed (arrow C1 and arrow C2 shown in FIG. 3).

  In FIG. 3, when the lower shutter 25a opens the lower opening 21a and the upper shutter 25b closes the upper opening 21b, the light LT1 incident on the lower opening 21a from the lower side of the housing 21 is a lens. Since the light is received by the CCD camera 24 via 23, an object located below the lower opening 21 a is imaged by the imaging camera 16. On the other hand, when the lower shutter 25a closes the lower opening 21a and the upper shutter 25b opens the upper opening 21b, the light LT2 incident on the upper opening 21b from the upper side of the housing 21 passes through the lens 23. Since the light is received by the CCD camera 24, an object located above the upper opening 21 b is imaged by the imaging camera 16.

  As described above, the imaging camera 16 can selectively perform imaging by switching the imaging direction downward or upward by the operation of the lower shutter 25a and the upper shutter 25b. In other words, in the present embodiment, the imaging camera 16 has a function of imaging an object positioned downward with the imaging field of view downward and a function of imaging an object positioned upward with the imaging field of view upward. Together.

  The imaging camera 16 moves from the standby position in the horizontal plane to the upper position of the substrate positioning unit 12 by moving away from the “standby position” (FIG. 4A) retracted from above the substrate positioning unit 12. It can be moved between “position” (FIG. 4 (b), FIG. 5 (a) or FIG. 5 (b)).

  In FIG. 2, the advancing direction of the imaging camera 16 to the upper side of the substrate holding area AR1 outside the substrate holding area AR1 holding the substrate 2 on the substrate holding table 12a (the direction in which the arrow D shown in FIG. 2 is directed). Hereinafter, a jig component placement portion AR2 is provided in each of the front side and the rear side of the substrate holding area AR1 as viewed from the “advancing direction of the imaging camera 16”, and each jig component placement is provided. A jig part JG is placed on the placement part AR2. In the present embodiment, as shown in FIG. 2, one jig component placement part AR <b> 2 (1) on the front side in the advance direction of the imaging camera 16 and one on the back side in the advance direction of the imaging camera 16. A total of two jig component placement portions AR2 including the jig component placement portion AR2 (2) are provided.

  The jig component JG is composed of a block-like member having an upper surface and a lower surface formed in parallel, and a recognition mark M for image recognition is provided at the center thereof (see an enlarged view in FIG. 2). The jig part JG is made of a highly transparent glass material, and the recognition mark M can be recognized from both above and below the jig part JG.

  The movement operation (that is, the positioning operation of the board 2) of the board holding table 12a provided in the board positioning unit 12 in the horizontal plane direction is performed by the work execution unit 30a (FIG. 6) of the control device 30 (FIG. 6) provided in the component mounting apparatus 1. Is performed by controlling the operation of the substrate holding table moving mechanism 12b.

  The horizontal movement and vertical movement of the reversing head 14 are performed by the work execution unit 30a of the control device 30 controlling the operation of a reversing head moving mechanism 31 (FIG. 6) including an actuator (not shown). The pickup (suction) operation of the component 3 is performed by the operation execution unit 30a of the control device 30 performing operation control of the reversing head suction mechanism 32 (FIG. 6) including an actuator (not shown). In addition, the upside down operation of the reversing head 14 is performed when the work execution unit 30a of the control device 30 controls the operation of the reversing head reversing mechanism 33 (FIG. 6) including an actuator (not shown).

  The movement operation of the mounting head 15 in the horizontal plane direction is performed when the work execution unit 30a of the control device 30 controls the operation of the mounting head moving mechanism 34 (FIG. 6) including an actuator (not shown). The lifting / lowering operation of the tool holding unit 15a provided is performed by the work execution unit 30a of the control device 30 controlling the operation of the tool holding unit lifting / lowering mechanism 35 (FIG. 6) including an actuator (not shown). Further, the operation of adsorbing and releasing the component 3 by the tool holding unit 15a included in the mounting head 15 is performed by the work execution unit 30a of the control device 30 to control the operation of the mounting head adsorption mechanism 36 (FIG. 6) including an actuator (not shown). Is made by

  The switching of the imaging direction of the imaging camera 16 is performed by the work execution unit 30a of the control device 30 performing the operation control of the shutter moving mechanism 26 described above, and the imaging operation by the imaging camera 16 is performed by the control device 30. The unit 30a controls the operation of the CCD camera drive mechanism 37 (FIG. 6). Further, the movement operation between the standby position and the imaging position of the imaging camera 16 is performed by the operation execution unit 30a of the control device 30 performing operation control of the imaging camera moving mechanism 38 (FIG. 6) including an actuator (not shown). Made.

  Image data obtained by imaging by the CCD camera 24 is input to the control device 30 and image recognition is performed by the image recognition unit 30b (FIG. 6) of the control device 30.

  Operation control of the substrate heater H2 that heats the substrate 2 on the substrate holder 12a is performed by the control device 30 (FIG. 6).

  When the work execution unit 30a of the control device 30 mounts the component 3 picked up from the reversing head 14 by the mounting head 15 on the component mounting portion 2a on the substrate 2 held in the substrate holding area AR1 of the substrate holding base 12a, The alignment between the component 3 and the component mounting part 2a is performed in advance (alignment before component mounting).

  In this positioning before mounting the component, the imaging camera 16 images the component mounting site 2a on the substrate 2 from above the component mounting site 2a by the imaging camera 16, and the component 3 picked up by the mounting head 15 is below the component 3. The image is picked up by the image pickup camera 16, and the component 3 (the mounting head 15) is moved relative to the substrate 2 based on the positional deviation between the component 3 and the component mounting portion 2 a in both captured images. The optical axis of the imaging camera 16 is located at the position of the component mounting part 2a in the captured image obtained by the imaging camera 16 imaging the lower part and the position of the component 3 in the captured image obtained by the imaging camera 16 imaging the upper part. Error and an error based on the assembly accuracy of each part of the component mounting apparatus 1 (apparatus error) are included. Therefore, it is necessary to detect such an apparatus error in advance. There are the following, the flow chart of FIG. 7 the detection procedure will be described with reference to the explanatory views of FIGS.

  In the detection of the apparatus error, the work execution unit 30a of the control device 30 first moves the mounting head 15 to which the jig tool 20J is attached above one of the two jig component placement units AR2. (Mounting head moving step of step ST1 shown in FIG. 7), the imaging camera 16 is advanced to the imaging position above the jig component placement part AR2 (arrow D1 shown in FIG. 8A; step shown in FIG. 7). ST2 imaging camera advance process).

  When the work execution unit 30a of the control device 30 advances the imaging camera 16 to the imaging position above the jig component placement unit AR2, the work execution unit 30a immediately above the jig component JG placed on the jig component placement unit AR2. The lower opening 21a of the imaging camera 16 is positioned at the upper side, and the jig part JG on the jig part placement part AR2 is imaged from above the jig part JG by the imaging camera 16 to obtain a first captured image. (FIG. 8A. First captured image acquisition step of step ST3 shown in FIG. 7).

  When the work execution unit 30a of the control device 30 acquires the first captured image, the operation camera 30 retracts the imaging camera 16 to the standby position (arrow D2 shown in FIG. 8B). Imaging camera retracting step in step ST4 shown in FIG. ). Then, the mounting head 15 is lowered (arrow E1 shown in FIG. 8B), the jig component JG is adsorbed to the jig tool 20J (FIG. 8B), and then the mounting head 15 is moved to the imaging camera 16. The jig part JG is picked up by the mounting head 15 by raising it to a predetermined position above (arrow E2 shown in FIG. 8C) (the jig part pick-up process in step ST5 shown in FIG. 7). ).

  When the work execution unit 30a of the control device 30 picks up the jig part JG with the mounting head 15, the work execution unit 30a advances the imaging camera 16 to the imaging position above the jig part placement part AR2 (in FIG. 8C). The arrow D3 shown in Fig. 7. The imaging camera advancement step in step ST6 shown in Fig. 7), and the upper opening 21b of the imaging camera 16 is positioned directly below the jig part JG picked up by the mounting head 15. At this time, the imaging camera 16 is positioned at the same position as when the jig component JG is imaged. And the work execution part 30a of the control apparatus 30 images the jig | tool component JG from the downward direction of the jig | tool component JG with the imaging camera 16, and acquires a 2nd captured image (FIG.8 (c)). (2nd captured image acquisition process of step ST7).

  As described above, in the present embodiment, the work execution unit 30a of the control device 30 is placed on one jig component placement part AR2 selected from a plurality (two) of jig part placement parts AR2. The jig part JG is picked up by the imaging camera 16 from above the jig part JG to obtain a first picked-up image, and the jig part JG picked up from the jig part placement part AR2 by the mounting head 15 is obtained. It functions as a pre-component mounting image acquisition unit that acquires an image captured by the imaging camera 16 from below the jig component JG and acquires a second captured image.

  After obtaining the second captured image, the work execution unit 30a of the control device 30 retracts the imaging camera 16 from the imaging position to the standby position (imaging camera retracting step in step ST8 shown in FIG. 7).

  When the imaging camera 16 is retracted to the standby position, the device error detection unit 30c (FIG. 6) of the control device 30 obtains the first captured image (the mounting head 15) obtained in step ST3 and recognized by the image recognition unit 30b. The image obtained by picking up the jig part JG before picking up by the image pickup camera 16 from above the jig part JG) and the second image pickup obtained in step ST7 and recognized by the image recognition unit 30b. From the image (the image obtained by imaging the jig part JG after being picked up by the mounting head 15 by the imaging camera 16 from below the jig part JG), the jig part JG and the second part in the first captured image are obtained. The relative position with respect to the jig part JG in the captured image is grasped (relative position grasping step in step ST9 shown in FIG. 7), and from the grasped relative position, the imaging camera 16 The amount of positional deviation between the jig part JG in the captured image obtained by imaging the lower part and the jig part JG in the captured image obtained by imaging the upper part by the imaging camera 16 is calculated (detected) as an apparatus error ( Device error calculation step of step ST10 shown in FIG.

  That is, in the present embodiment, the device error detection unit 30c of the control device 30 includes the jig component JG in the first captured image acquired by the work execution unit 30a of the control device 30 as the pre-part-mount image acquisition unit, and It functions as a positional deviation amount detecting means for detecting the positional deviation amount with respect to the jig part JG in the second captured image.

  The image SG shown in FIG. 9 is a state in which the first captured image acquired by the lower imaging by the imaging camera 16 and the second captured image acquired by the upper imaging by the imaging camera 16 are viewed from the same direction. The black circle indicated by reference numeral M1 is a recognition mark M in the jig part JG visually recognized by lower imaging by the imaging camera 16, and the white circle indicated by reference numeral M2 is visually recognized by upper imaging by the imaging camera 16. The recognition mark M in the jig | tool component JG to be shown is represented. In this case, when the component 3 is mounted on the substrate 2, the positional deviation amount between the component mounting portion 2 a on the substrate 2 imaged by the imaging camera 16 and the component 3 picked up by the mounting head 15 is an apparatus error of the component mounting apparatus 1. Is required as data.

  Note that the device error data detected as described above changes over time as the component mounting operation progresses, and it is touched not only at the start of the component mounting operation but also during the component mounting operation. Need to be done frequently.

  Next, the execution procedure of the component mounting operation by the component mounting apparatus 1 according to the present embodiment will be described with reference to the flowchart of FIG. In the component mounting work, the work execution unit 30a of the control device 30 first detects a device error according to the above-described procedure (device error detection step of step ST21 shown in FIG. 10).

  The work execution unit 30a of the control device 30 completes the mounting head so that the jig tool 20J attached to the lower end of the tool holding unit 15a is replaced with the component tool 20 after the device error detection process of step ST21 is completed. 15 is operated, the substrate 2 is transferred to the substrate positioning unit 12 by a substrate transfer device (not shown) (substrate transfer process of step ST22 shown in FIG. 10).

  When the substrate transfer process of step ST22 is completed, the work execution unit 30a of the control device 30 picks up the component 3 in the pallet 13a by the reversing head 14, and rotates the reversing head 14 around the rotation axis R to remove the component 3. The front and back are reversed and moved toward the mounting head 15 (part picking up, reversing and moving steps in step ST23 shown in FIG. 10).

  The work execution unit 30a of the control device 30 moves the mounting head 15 immediately above the component 3 that the reversing head 14 reverses the front and back after moving the reversing head 14 that has reversed the part 3 to the mounting head 15 side. After that, the part 3 is picked up by the mounting head 15 (part picking up step ST24 shown in FIG. 10).

  When the work execution unit 30a of the control device 30 picks up the component 3 by the mounting head 15, the mounting head 15 is positioned above the board positioning unit 12, and then the imaging camera 16 is moved to the imaging position above the component mounting site 2a. Advancing (arrow F1 shown in FIG. 11A), the imaging camera 16 images the component mounting part 2a on the substrate 2 from above the component mounting part 2a to obtain a third captured image (FIG. 11). (A) Third captured image acquisition step of step ST25 shown in Fig. 10, the component 3 picked up by the mounting head 15 by the imaging camera 16 is imaged from below the component 3 to acquire a fourth captured image ( Fig. 11 (b) is a fourth captured image acquisition step of step ST26 shown in Fig. 10.

  As described above, the work execution unit 30a of the control device 30 in the present embodiment captures the component mounting part 2a on the substrate 2 on which the component 3 picked up by the mounting head 15 is mounted from above the component mounting part 2a. 16 to obtain a third captured image, and to capture a part 3 picked up by the mounting head 15 from below the part 3 by the imaging camera 16 to obtain a fourth captured image. Functions as a means.

  When the work execution unit 30a of the control device 30 acquires the third captured image in step ST25 and acquires the fourth captured image in step ST26, the work mounting unit 30a and the fourth captured image in the third captured image are acquired. Based on the positional deviation amount with respect to the component 3 in the image and the apparatus error detected (calculated) at step ST21 (subtracting the apparatus error from the positional deviation amount between the component mounting portion 2a and the component 3), the pickup is picked up by the mounting head 15. Alignment of the component 3 to the component mounting part 2a on the substrate 2 (alignment before component mounting) is performed (alignment step of step ST27 shown in FIG. 10).

  When the alignment process of step ST27 is completed, the work execution unit 30a of the control device 30 retracts the imaging camera 16 from the imaging position to the standby position (arrow F2 shown in FIG. 11C), and then the mounting head 15 is lowered (arrow G shown in FIG. 11C), and the component 3 adsorbed to the mounting head 15 is mounted on the component mounting portion 2a of the substrate 2 (FIG. 11C), step ST28 shown in FIG. Part mounting process). As a result, the component 3 attracted to the mounting head 15 is accurately mounted on the component mounting portion 2 a on the substrate 2.

  As described above, in the present embodiment, the work execution unit 30a of the control device 30 detects the amount of positional deviation between the component mounting site 2a in the acquired third captured image and the component in the fourth captured image, and the device error detection unit. A mounting head that aligns the component 3 picked up by the mounting head 15 with respect to the component mounting site 2a based on the apparatus error detected in 30c, and then lowers the mounting head 15 to mount the component 3 on the component mounting site 2a. It functions as an operating means.

  When the component mounting process of step ST26 is completed, the work execution unit 30a of the control device 30 determines whether or not all the components 3 to be mounted on the board 2 that is currently the mounting target of the components 3 have been mounted ( (Part mounting determination step in step ST29 shown in FIG. 10). If the work execution unit 30a of the control device 30 has not mounted all the components 3 to be mounted on the substrate 2, the operation execution unit 30a returns to step ST23 to pick up the components 3 in the pallet 13a by the reversing head 14, and the front and back sides. When all of the components 3 to be mounted on the substrate 2 are mounted by reversing and moving, the substrate 2 is transferred to the outside of the component mounting apparatus 1 by the substrate transfer device (not shown) (see FIG. 10). Step ST30 substrate unloading step).

  After carrying out the board 2 to the outside of the component mounting apparatus 1, the work execution unit 30a of the control device 30 determines whether there is still a board 2 on which the component 3 is to be mounted (in step ST31 shown in FIG. 10). Substrate presence / absence determination process). If there is still a board 2 on which the component 3 is to be mounted, it is further determined whether or not it is necessary to execute the apparatus error detection process in step ST21 (in step ST32 shown in FIG. 10). Device error detection execution determination step). In this step ST32, for example, when a certain time has passed after starting the component mounting work or when a certain work amount has been executed, it is determined to execute the apparatus error detection step of step ST21.

  When the work execution unit 30a of the control device 30 determines in step ST32 that it is not necessary to execute the device error detection process in step ST21, the work execution unit 30a returns to step ST22 and performs a new transfer of the substrate 2 to the substrate holder 12a. If it is determined that it is necessary to execute the apparatus error detection process, the process returns to step ST21 to execute the apparatus error detection process. If the work execution unit 30a of the control device 30 determines in step ST31 that there is no board 2 on which the component 3 is to be mounted, the series of component mounting work is terminated.

  As described above, the component mounting method according to the present embodiment is a component mounting method using the component mounting apparatus 1, and is mounted on one jig component mounting portion AR2 selected from a plurality of jig component mounting portions AR2. The mounted jig component JG is imaged from above the jig component JG by the imaging camera 16 to obtain a first captured image, and the jig component picked up from the jig component mounting portion AR2 by the mounting head 15 A process of acquiring a second captured image by capturing an image of JG from below the jig part JG with the imaging camera 16 (step ST3 and step ST5), the jig part JG and the second part in the acquired first captured image. A step of detecting an apparatus error from the amount of misalignment with the jig component JG in the captured image (step ST10), component mounting on the substrate 2 on which the component 3 picked up by the mounting head 15 is mounted The position 2a is imaged by the imaging camera 16 from above the component mounting part 2a to obtain a third captured image, and the component 3 picked up by the mounting head 15 is imaged by the imaging camera 16 from below the component 3 to obtain the fourth. The captured image is acquired based on the step (step ST25 and step ST26) and the amount of positional deviation between the component mounting site 2a in the acquired third captured image and the component 3 in the fourth captured image and the detected apparatus error. This includes a step (step ST28) of aligning the component 3 picked up by the head 15 with respect to the component mounting portion 2a and then lowering the mounting head 15 to mount the component 3 on the component mounting portion 2a.

  By the way, the work execution unit 30a of the control device 30 as the part pre-mounting image acquisition unit is configured to use two jig component placement units AR2 (1), AR2 ( 2) Which one is to be selected, when the first captured image is acquired (step ST3) and when the second captured image is acquired (step ST7), the imaging camera 16 is heated by the substrate heater H2. The situation becomes close to the situation where the imaging camera 16 is heated by the substrate heater H2 when imaging the component mounting portion 2a on the substrate 2 and the component 3 picked up by the mounting head 15 in subsequent steps ST25 and ST26. To the standard.

  Specifically, as shown in FIG. 12, the substrate holding area AR1 is divided into two in the advance direction of the imaging camera 16 (the direction from the right side to the left side in FIG. 12), and the front side of the advance direction (FIG. 12). A small area AR1 (1) on the right side of the paper and a small area AR1 (2) on the far side in the advance direction (left side of the paper in FIG. 12), and the substrate 2 in the small area AR1 (1) on the near side in the advance direction. When it is planned to mount the component 3 on the upper side, an apparatus error is caused by using the jig component JG mounted on the jig component mounting portion AR2 (1) provided on the front side in the advance direction. Is detected (FIG. 13A) and then the component 3 is mounted (FIG. 13B), and the component 3 is mounted on the substrate 2 in the small area AR1 (2) on the far side in the advance direction. When there is a plan to mount the jig parts on the far side in the advance direction Part AR2 (2) in the placed jig parts JG detection device error using mounting parts 3 after performing (FIG. 14 (a)) to to perform (Figure 14 (b)).

  The imaging camera 16 is heated by the substrate heater H2 when detecting the apparatus error using the jig component JG placed on the jig component placement part AR2 (1) on the near side in the advance direction of the imaging camera 16. The situation (FIG. 13 (a)) is performed when aligning the component 3 and the component mounting portion 2a when mounting the component 3 on the small area AR1 (1) on the near side in the advance direction of the imaging camera 16. It becomes close to the situation where the imaging camera 16 is heated by the substrate heater H2 (FIG. 13B). In addition, when the apparatus error is detected using the jig part JG placed on the jig part placement part AR2 (2) on the far side in the advancing direction of the imaging camera 16, the imaging camera 16 detects the substrate heater H2. 14 (a) is the position of the component 3 and the component mounting portion 2a when the component 3 is mounted on the small area AR1 (2) on the far side in the advancing direction of the imaging camera 16. At the time of alignment, the imaging camera 16 becomes close to the situation (FIG. 14B) heated by the substrate heater H2.

  For this reason, the situation in which the imaging camera 16 is heated by the substrate heater H2 is substantially the same at the time of alignment before component mounting and at the time of component mounting, and the mounting accuracy of the component 3 can be improved.

  In the above description, as shown in FIG. 12, one jig component placement portion AR <b> 2 (1) is provided on the front side in the advance direction of the imaging camera 16 and the back side in the advance direction of the imaging camera 16. Are provided with one jig component placement part AR2 (2), and the substrate holding area AR1 is divided into two small areas AR1 (1) and AR1 (2) so as to correspond to these two jig part placement parts AR2. Although it was divided, as shown in FIG. 15, a plurality (in this case, the vertical direction of the drawing in FIG. 15) in the horizontal direction perpendicular to the advancing direction of the imaging camera 16 is provided on the front side of the advancing direction of the imaging camera 16. Three jig component placement portions AR2 (1a), AR2 (1b), and AR2 (1c) are provided, and three jig component placement portions AR2 (2a) are arranged on the back side in the advancing direction of the imaging camera 16. , AR2 (2b), AR2 (2c) In this case, the substrate holding area AR1 on the front side is divided into three small areas AR1 (1a), AR1 (corresponding to the three jig component placement parts AR2 (1a), AR2 (1b), AR2 (1c). 1b) and AR1 (1c), and the back side substrate holding area AR1 is divided into three parts so as to correspond to the back side jig component placement portions AR2 (2a), AR2 (2b), and AR2 (2c). It divides | segments into small area | region AR1 (2a), AR1 (2b), AR1 (2c), small area | region AR1 (1a), AR1 (1b), ..., AR1 (2c), and jig component mounting part AR2 (1a) ), AR2 (1b),..., AR2 (2c) may be detected by detecting an apparatus error and mounting the component 3 on the board 2 thereafter. In this way, the amount of movement of the mounting head 15 relative to the board holding base 12a between the time when the device error is obtained and the time when the component 3 is mounted on the component mounting portion 2a is reduced. The time can be shortened, and the positional relationship between the imaging camera 16 and the board holding area AR1 in the horizontal direction orthogonal to the advancing direction of the imaging camera 16 is substantially the same between the alignment before component mounting and the component mounting. Thus, the situation in which the imaging camera 16 is heated by the substrate heater H2 can be further matched.

  As described above, in the component mounting apparatus 1 and the component mounting method using the component mounting apparatus 1 according to the present invention, the jig component JG is viewed from the upward direction of the substrate holding area AR1 of the imaging camera 16 when viewed from the board holding area AR1. When the jig component JG is imaged (first captured image and second captured image) are mounted on a plurality of jig component mounting portions AR2 provided in the respective front and rear regions of When the imaging camera 16 is heated by the substrate heater H2 and when the component 3 is mounted on the substrate 2 by the mounting head 15 (a third captured image and a fourth captured image are acquired). When the imaging of the jig component JG is performed so that the imaging camera 16 is close to the situation where the imaging camera 16 is heated by the substrate heater H2, the jig component placement portion AR2 is selected. Situation where the image camera 16 is heated by the substrate heater H2 is made to coincide substantially with the component mounting front alignment when the parts during mounting, it is possible to improve the mounting accuracy of components 3.

  Although the embodiment of the present invention has been described so far, the present invention is not limited to the above. For example, in the above-described embodiment, the component mounting apparatus 1 to which the present invention is applied is a flip chip bonder that mounts the component 3 on the substrate 2 by turning the component 3 upside down (up and down), but the present invention is a flip chip type. The present invention can be applied to a surface mounting type component mounting apparatus and the like in addition to a die bonder that is not provided.

  Component mounting apparatus and component capable of improving component mounting accuracy so that the state in which the imaging means is heated by the substrate heater is substantially the same at the time of alignment before component mounting and at the time of component mounting Provide an implementation method.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Board | substrate 2a Component mounting part 3 Components 12a Board | substrate holding stand (board | substrate holding part)
15 Mounting head 16 Imaging camera (imaging means)
30a Work execution unit (pre-component mounting image acquisition unit, component mounting image acquisition unit, mounting head actuating unit)
30c Device error detection unit (device error detection means)
AR1 Substrate holding area AR2 Jig parts placement part H2 Substrate heater (Substrate heating means)
JG jig parts

Claims (2)

A substrate holding unit for holding the substrate in the substrate holding region;
A substrate heating means for heating the substrate held by the substrate holder;
A mounting head for mounting a component picked up by being attracted to the lower end of the tool to a component mounting site on the substrate held by the substrate holding unit;
An imaging means that can freely move forward and backward in the substrate holding area, and that performs imaging in the lower and upper directions in a state of being advanced above the substrate holding area;
A plurality of jig component placement portions provided in respective areas on the front side and the back side of the substrate holding region as seen from the upward advance direction of the substrate holding region of the imaging means;
Jig parts placed on a plurality of jig part placement parts;
The first picked-up image is acquired by picking up an image of the jig component placed on one jig component placement portion selected from the plurality of jig component placement portions from above the jig component. In addition, image acquisition means before component mounting for acquiring a second captured image by capturing an image of the jig component picked up from the jig component mounting portion by the mounting head from below the jig component;
Apparatus error detection means for detecting an apparatus error from the amount of positional deviation between the jig part in the first captured image and the jig part in the second captured image acquired by the image acquisition means before component mounting;
The component mounting site on the board on which the component picked up by the mounting head is mounted is imaged by the imaging means from above the component mounting site to obtain a third captured image, and the component picked up by the mounting head is A component mounting image acquisition unit that captures an image from below and acquires a fourth captured image;
Pick-up to the mounting head based on the amount of positional deviation between the component mounting site in the third captured image acquired by the component mounting image acquisition means and the component in the fourth captured image and the device error detected by the device error detection means. And a mounting head actuating means for lowering the mounting head and mounting the component on the component mounting site.
The pre-component-mounting image acquisition unit is configured such that when the first captured image and the second captured image are acquired, the imaging unit is heated by the substrate heating unit. When the first captured image and the second captured image are acquired so that the imaging unit is heated by the substrate heating unit when the fourth captured image is acquired, A component mounting apparatus characterized by performing selection. A substrate holding unit that holds the substrate in the substrate holding region, a substrate heating unit that heats the substrate held by the substrate holding unit, and a component that is picked up and picked up by the lower end of the tool is held on the substrate held by the substrate holding unit A mounting head to be mounted on the component mounting site, an imaging unit that can move forward and backward in the upward direction of the substrate holding region, and that performs upper and lower imaging in a state of being advanced above the substrate holding region, and substrate holding of the imaging unit A plurality of jig component placement portions provided in the front and back regions of the substrate holding region as viewed from the upward advance direction of the region, and a jig placed on the plurality of jig component placement portions. A component mounting method by a component mounting apparatus comprising a component part,
The first picked-up image is acquired by picking up an image of the jig component placed on one jig component placement portion selected from the plurality of jig component placement portions from above the jig component. And a step of obtaining a second captured image by taking an image of the jig component picked up from the jig component placement portion by the mounting head from below the jig component with an imaging means;
A step of detecting an apparatus error from the amount of positional deviation between the jig component in the acquired first captured image and the jig component in the second captured image;
The component mounting site on the board on which the component picked up by the mounting head is mounted is captured by the imaging means from above the component mounting site to obtain a third captured image, and the component picked up by the mounting head is captured from below the component. Obtaining a fourth captured image by imaging by means;
Based on the amount of positional deviation between the component mounting site in the acquired third captured image and the component in the fourth captured image and the detected device error, the component picked up by the mounting head is aligned with the component mounting site, and then mounted. Lowering the head and mounting the component on the component mounting site,
The situation in which the imaging means is heated by the substrate heating means when acquiring the first captured image and the second captured image is that the imaging means is heated by the substrate heating when acquiring the third captured image and the fourth captured image. A component mounting method comprising: selecting a jig component placement portion when acquiring the first captured image and the second captured image so as to be close to a state of being heated by the means.

Images