JP2007005494A - Part-mounting device, part-mounting method, position adjustment device and position adjustment method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a part-mounting device and part-mounting method, wherein high accuracy is realized, while an attempt can be made where the device is reduced in size and the cost is reduced. <P>SOLUTION: The part-mounting device 1 mounts parts on a board 2 by a head provided at a position facing the board 2, and comprises a stage 12 for carrying the board 2 and the parts 3, stage-driving parts 15, 16 for driving the stage 12 on a plane that is flush with the main face of the stage 12, a chip supply part 14 for supplying the parts 3 on the stage 12 to the head, a head drive part 20 for making the head drive in a direction perpendicular to the main face of the stage 12, a head rotation drive 21 for making the head rotate, by using the direction perpendicular to the main face of the stage 12 as the rotating axis, a first camera 18 fixed onto the stage 12 for detecting the surface image of the head, and a second camera 22 fixed at a position facing to the stage 12 for detecting the surface image of the stage 12. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a component mounting apparatus, and in particular, a component mounting apparatus and a component mounting method for mounting a component at a predetermined position on a workpiece while holding the component by a mount head, and a position adjusting device used in the component mounting apparatus and The present invention relates to a position adjustment method.

  Conventionally, a flip chip bonding apparatus is used when an electronic component such as a semiconductor (bare chip) is mounted on a substrate. The flip chip bonding apparatus includes a tray on which chips are placed, a substrate on which the chips are mounted, a bonding tool for mounting the chips, and a chip reversing arm that transfers the chips on the tray to the bonding tool. In the flip chip bonding apparatus, the semiconductor chip on the tray is sucked by the suction head at the tip of the chip reversing arm, and then the arm is reversed 180 degrees to reverse the front and back of the semiconductor bare chip. In this state, the semiconductor chip is sucked by the suction head of the bonding tool, and the semiconductor chip is mounted at a predetermined position on the circuit board positioned by the xy stage by the suction head of the bonding tool. Further, the flip chip bonding apparatus has a camera that images a semiconductor chip sucked and held by a suction head of a bonding tool and a camera that picks up an image on a circuit board. Image recognition is performed based on images from these two cameras. The position where the semiconductor chip is mounted is recognized.

  By the way, in the flip chip bonding apparatus, the mounting accuracy of the mounted semiconductor chip is regarded as important.

  Therefore, the conventional flip chip bonding apparatus is provided with various members for positioning while keeping the mounting accuracy high, and the apparatus itself is large and expensive. It was.

  For example, a conventional flip chip bonding apparatus 100 as shown in FIG. 12 includes a drive source for driving the tray 102 on which the semiconductor chip 101 is placed on the xy plane, and a substrate 103 on which the semiconductor chip 101 is mounted. A driving source for driving the plane, a driving source for driving the bonding tool 104 for mounting the semiconductor chip 101 in the z-axis direction, and a suction head 105 of the bonding tool 104 for attaching the semiconductor chip 101 on the tray 102. Are provided with a driving source for driving the chip reversing arm 106 and a driving source for driving the camera unit 107. Further, as shown in FIG. 13, the camera unit 107 of the flip chip bonding apparatus 100 includes a camera 111 and a substrate 103 for imaging the semiconductor chip 101 sucked and held by the suction head 105 of the bonding tool 104 in the housing 107a. Cameras 112 that image the top are juxtaposed in the y direction, and single-sided reflection mirrors 113 and 114 are arranged opposite to each other on the imaging side of the cameras 111 and 112 at an angle of ± 45 degrees in the x direction with respect to the y axis. A double-sided reflection mirror 115 is arranged between the mirrors 113 and 114 at an angle of 45 degrees in the z direction with respect to the y axis. In addition, image capturing openings 116 and 117 are provided on both surfaces of the housing 107a in the z direction with respect to the double-sided reflective mirror 115.

  The flip chip bonding apparatus 100 having such a configuration is provided with a large number of drive sources for driving the respective members, which leads to an increase in the size of the apparatus.

  Furthermore, in order to achieve high mounting accuracy, for example, a linear scale or the like is used for the drive shaft that drives the camera unit 107, and high-accuracy positioning is performed, which also increases the size of the device. And led to higher costs.

  On the other hand, in the flip chip bonding apparatus 130 shown in FIG. 14, instead of the camera unit 107 as described above, the suction head 105 of the bonding tool 104 is placed on the stage 131 on which the substrate 103 on which the semiconductor chip 101 is mounted is placed. There is also a configuration in which a camera 132 that images the semiconductor chip 101 adsorbed on the substrate 103 and a camera 133 that images the substrate 103 at a position facing the stage 131 on which the substrate 103 is placed are provided. In this case, in order to maintain the mounting accuracy with high accuracy, the relative positional relationship between the two cameras 132 and 133 that detect the accurate mounting position becomes important.

  As a method of recognizing the relative positional relationship between two cameras, a method of matching the positions of the two cameras is known. For example, as shown in FIG. 15, the camera moves to a position where the two cameras 132 and 133 face each other, and an alignment device 134 is inserted between the two cameras 132 and 133 so as to capture an object that can be recognized as the same position from the front and back. In this way, alignment is performed.

However, the camera 132 of the flip chip bonding device 130, a camera 133 for imaging the substrate 103 is disposed at a distance _{L 1} of the substrate 103 and in focus, to image the semiconductor chip 101 held by the suction head 105 of the bonding tool 104 There is disposed a distance L ₂ to the semiconductor chip 101 and in focus. As in the above-described method, when the alignment apparatus 134 for aligning the positions of the two cameras 132 and 133 were inserted between the two cameras, the alignment device 134, the distance L ₂ is separated from the camera 132, a camera 133 and causes the distance L ₁ separating, or, it is necessary to provide the focal length adjusting unit to the camera. In any of the above methods, it is necessary to move the camera in the z direction and return it to the original position for alignment, and there has been a problem that accuracy decreases with movement.

JP 2002-9113 A

  Accordingly, in view of the above-described problems, the present invention provides a component mounting apparatus and a component mounting method capable of achieving downsizing and cost reduction of the apparatus while realizing high accuracy that is the same as that of a conventional flip chip bonding apparatus. The purpose is to provide.

  Another object of the present invention is to provide a position adjusting device and a position adjusting method used for improving the positioning accuracy in the positioning operation for maintaining high accuracy in the component mounting apparatus described above. The purpose is to provide.

  In order to achieve the above-described object, a component mounting apparatus according to the present invention mounts the substrate and the component on the substrate in a component mounting apparatus that mounts the component with a head provided at a position facing the substrate. A stage, a stage drive unit that drives the stage on the same plane as the main surface of the stage, a component supply unit that supplies the components on the stage to the head, and the head as the main surface of the stage A head driving unit that drives the head in a direction perpendicular to the head, a head rotation driving unit that rotates the head around a direction perpendicular to the main surface of the stage, and a surface image of the head that is fixed on the stage. And a second camera for detecting a surface image of the stage fixed at a position facing the stage.

  The first camera or the second camera has an origin mark at a position facing the first camera and at least one place on the stage, and the first camera or the second camera detects the origin mark to thereby detect the stage. And the reference point for the relative movement of the head.

  In addition, a reference mark is provided between the first camera and the second camera, and is provided with a reference mark that can be detected by the first camera and the second camera from the direction of one surface and the other surface. A position adjusting means comprising: a recognition pattern portion; a first lens provided in contact with one surface of the recognition pattern portion; and a second lens provided in contact with the other surface of the recognition pattern portion. You may make it prepare.

  The component mounting method according to the present invention is a component mounting method in which a component is mounted on a substrate by a head provided at a position facing the substrate. The stage on which the substrate and the component are placed is a main surface of the stage. A stage driving step for driving the same plane, a component supplying step for supplying the component on the stage to the head, a head driving step for driving the head in a direction perpendicular to the main surface of the stage, A head rotation driving step of rotating the head about a direction perpendicular to the main surface of the stage as a rotation axis, and a surface image of the head by a first camera fixed on the stage and detecting a surface image of the head The first image detection step for detecting the surface and the second camera for detecting the surface image of the stage fixed at a position facing the stage. Characterized in that it comprises a second image detecting step of detecting a surface image of the over-di.

  The position adjusting device according to the present invention is disposed opposite to each other, fixed to the first member, the first member and the second member that move relative to each other in a direction perpendicular to the facing direction, and the first member The first camera applied to a moving system having a first camera that detects a surface image of the second member and a second camera that is fixed to the second member and detects the surface image of the first member. In the position adjusting device for aligning one member and the second member, a reference mark that can be detected by the first camera and the second camera is provided from one surface and the other surface direction. A recognition pattern portion, a first lens provided in contact with one surface of the recognition pattern portion, and a second lens provided in contact with the other surface of the recognition pattern portion. Features.

  The position adjusting method according to the present invention includes a first member and a second member that are arranged to face each other and relatively move in a direction perpendicular to the facing direction, and are fixed to the first member. The first camera applied to a moving system having a first camera that detects a surface image of the second member and a second camera that is fixed to the second member and detects the surface image of the first member. In the position adjustment method for aligning one member with the second member, a reference mark that can be detected by the first camera and the second camera is provided from one surface and the other surface direction. And a second lens provided in contact with the other surface of the recognition pattern portion, and a first lens provided in contact with one surface of the recognition pattern portion. The adjustment device includes the first member and the above An insertion step of inserting between the two members, a reference mark detection step of detecting the reference mark of the recognition pattern portion by the first camera and the second camera, and the reference mark detection step. Both the first camera and the second camera adjust the relative positional relationship between the first member and the second member based on the mutual position when the reference mark of the recognition pattern portion is detected. And a position adjusting step.

  The component mounting apparatus according to the present invention is fixed to a stage driving unit that drives a stage on which a substrate and components are placed, a first camera that is fixed on the stage and detects a surface image of the head, and a position facing the stage. And a second camera for detecting the surface image of the stage, the number of drive axes can be reduced, the size of the device itself can be reduced, and the cost of the device can be reduced. In addition, since the present invention can be miniaturized as described above, the moving distance of the xy stage can be reduced, and can be mounted without being greatly affected by distortion due to thermal expansion or the like. Can keep you.

  In addition, the position adjustment apparatus of the present invention aligns the first camera and the second camera that are arranged to face each other, and only the xy stage to which the first camera is fixed is perpendicular to the facing direction. Since it is moved only in the direction (xy direction), the alignment accuracy can be improved.

  Hereinafter, the component mounting apparatus 1 of the present invention will be described in detail with reference to the drawings. As shown in FIGS. 1 to 3, the component mounting apparatus 1 of the present invention includes a gantry 10, and a base 11 is disposed on the upper surface of the gantry 10. In the component mounting apparatus 1, an xy stage 12, a frame 13, and a chip supply unit 14 are attached on a base 11.

  A substrate x motor 15 and a substrate y motor 16 are attached to the xy stage 12, and a chip tray 4 on which the substrate 2 is placed and the semiconductor chip 3 is placed is provided on the xy stage 12. It has been. Further, on the xy stage 12, an upper camera 18 for recognizing an image of a chip mark for chip recognition provided on the semiconductor chip 3 attracted and held by a bonding tool 17 described later is attached. The xy stage 12 moves in the xy direction by driving the substrate x motor 15 and the substrate y motor 16.

  The frame 13 includes a bonding tool 17, a tool z linear guide 19, a tool z cylinder 20 that drives the bonding tool 17 along the tool z linear guide 19, that is, in the z-axis direction, and the z axis of the bonding tool 17. A tool control mechanism 21 that controls the rotational position, that is, the position in the θ direction, and an origin mark 41 for recognizing the position of an xy stage 12 to be described later are attached. Further, a lower camera 22 for recognizing an image of a substrate mark for substrate recognition provided on the substrate 2 is attached to the frame 13. The lower camera 22 is not limited to the above, and is a fixed position where the bonding tool 17 or the like is not driven in the z direction or the θ direction rotating with respect to the z axis, for example, an origin mark 41 fixed to the frame 13. The fixing position is not limited as long as it is a position facing the xy stage 12.

  On the chip tray 4, the semiconductor chip 3 mounted on the substrate 2 is placed. The substrate x motor 15 is connected to a drive shaft connected to the xy stage 12 in parallel to the x axis, and the xy stage 12 can be moved in the x direction along the drive shaft by driving the motor. . Similarly, the substrate y motor 16 is also connected to a drive shaft connected to the xy stage 12 in parallel to the y axis, and the xy stage 12 is moved in the y direction along the drive shaft by driving the motor. be able to.

  The bonding tool 17 is provided at a position facing the xy stage 12, and the tool z cylinder 20 is driven to move the bonding tool 17 in the z direction along the tool z linear guide 19 and to the tool control mechanism 21. The rotation angle adjusting means (not shown) provided rotates around the axis of the tool rotation shaft 21a (θ direction in FIG. 2). The bonding tool 17 delivers the semiconductor chip 3 on the chip tray 4 via the chip supply unit 14 and mounts the delivered semiconductor chip 3 on a predetermined position of the substrate 2. The bonding tool 17 has suction holding means for sucking and holding the semiconductor chip 3 to be delivered, and chip heating means for heating the semiconductor chip 3 when mounted on the substrate 2. It is mounted at a predetermined position.

  The tool z linear guide 19 is a guide provided on the frame 13 in a direction parallel to the z axis, and moves the bonding tool 17 in the z direction along this guide.

  The tool z cylinder 20 is an air cylinder, and moves the bonding tool 17 connected to the tool control mechanism 21 in the z direction along the tool z linear guide 19. The tool z cylinder 20 is between two points in the z direction when the semiconductor chip 3 delivered from the chip supply unit 14 to the bonding tool 17 is mounted on the substrate 2 (z to which the semiconductor chip 3 is supplied from the chip supply unit 14). The upper position in the direction and the lower position in the z direction in which the semiconductor chip 3 is mounted on the substrate 2 are moved. The tool z cylinder 20 presses the semiconductor chip 3 against the substrate 2 when the semiconductor chip 3 is mounted on the substrate 2. The tool z cylinder 20 is not limited to an air cylinder as described above, and may be any drive source for moving between two points and pressurizing, and a hydraulic cylinder or the like may be used.

  The tool control mechanism 21 has a rotation angle adjusting means for rotating the bonding tool 17 along the axis of the tool rotation shaft 21a provided in parallel with the z-axis. The tool control mechanism 21 controls the rotation angle adjusting means according to the position state of the semiconductor chip 3 whose image is recognized by the upper camera 18 and rotates it to a predetermined rotation position.

  The chip supply unit 14 has a chip reversing arm 14 a having a suction unit provided at the tip, and the chip reversing arm 14 a reverses after holding the semiconductor chip 3 placed on the xy stage 12 by suction. Then, it is transferred to the bonding tool 17.

  The upper camera 18 is provided on the xy stage 12, for example, between the chip tray 4 and the substrate 2, and recognizes an image of a chip mark for chip recognition provided on the semiconductor chip 3 sucked and held by the bonding tool 17. . Since the upper camera 18 is provided on the xy stage 12, the substrate x motor 15 and the substrate y motor 16 can be driven to move on the xy plane. The upper camera 18 is a camera having a fixed focal length, and the focal length is a distance that focuses on the semiconductor chip 3 before mounting, which is sucked and held by the bonding tool 17 provided at a position facing the xy stage 12. is there.

  The lower camera 22 is fixed to the frame 13 and recognizes an image of a substrate mark for substrate recognition provided on the substrate 2. Although the lower camera 22 is fixed to the frame 13 and cannot move, the desired position on the xy stage 12 can be imaged by moving the xy stage 12. Similar to the upper camera 18, the lower camera 22 is a camera having a fixed focal length, and the focal distance is a distance at which the semiconductor chip 3 and the substrate 2 placed on the chip tray 4 on the xy stage 12 are focused. It is.

  FIG. 4 is a block diagram showing a control system of such a component mounting apparatus 1, and the component mounting apparatus 1 is controlled via the control unit 23. As shown in FIG. 4, the operation panel 24, the upper camera 18, the lower camera 22, the display monitor 25, and the mounting apparatus main body are connected to the control unit 23. The operation panel 24 controls the control unit 23 with an operation mode command, various conditions (pressure bonding conditions) such as temperature, pressure, and time for mounting the semiconductor chip 3, and various shapes such as the shape and mounting position of the semiconductor chip 3. Supply data. On the other hand, data such as mounting conditions, presence / absence of an abnormal situation, and information for status display are supplied from the control unit 23 to the operation panel 24. Further, the upper camera 18 and the lower camera 22 supply image information to the control unit 23. This image information is subjected to image processing by the control unit 23. In addition, the image processing result is supplied from the control unit 23 to the display monitor 25 and displayed on the display panel.

  Further, the control unit 23 issues an operation command to the mounting apparatus body and supplies heating power for the semiconductor chip 3. From the mounting apparatus main body, output signals from sensors and encoders are given as position information. Further, data relating to the temperature and pressure of the semiconductor chip 3 to be mounted is supplied to the control unit 23 from the mounting apparatus body.

  Next, the operation of mounting the semiconductor chip 3 of the component mounting apparatus 1 having the above-described configuration on the substrate 2 will be described with reference to the flowchart shown in FIG.

  First, as preparation and work preparation, the operator operates the operation panel 24 to adjust parallelism (ST1), and then sets the substrate 2 at a predetermined position on the xy stage 12 (ST2). The chip tray 4 in which the semiconductor chip 3 is stored is set at a predetermined position on the xy stage 12 (ST3).

  Next, the control unit 23 drives the chip supply unit 14 based on the input component data and processing conditions, and sucks and holds the semiconductor chip 3 on the chip tray 4 by the suction unit of the chip reversing arm 14a ( ST4). Thereafter, the control unit 23 controls the chip supply unit 14 to invert the chip reversing arm 14a by 180 ° (ST5), and transfers the semiconductor chip 3 to the bonding tool 17 (ST6).

  Next, the controller 23 recognizes the substrate mark on the substrate 2 based on the image information from the lower camera 22 and recognizes the chip mark on the semiconductor chip 3 based on the image information from the upper camera 18. Then, the tool control mechanism 21 and the xy stage 12 are driven to correct the mounting position of the semiconductor chip 3 (ST7).

  Next, the control unit 23 controls the tool z cylinder 20, lowers the bonding tool 17 in the z direction, and mounts the semiconductor chip 3 on the substrate 2 (ST8). Further, the control unit 23 controls the tool z cylinder 20 to pressurize the semiconductor chip held by the bonding tool 17 (ST9). Finally, the control unit 23 controls the bonding tool 17 to heat the semiconductor chip 3 and mount it on the substrate 2 (ST10).

  As described above, the control unit 23 mounts the semiconductor chip 3 on the substrate 2 and repeats the above operation to mount the next semiconductor chip 3.

  Since the component mounting apparatus 1 having the above configuration is provided with the chip tray 4 on which the substrate 2 and the semiconductor chip 3 are placed on the xy stage 12, the chip tray 4 is conventionally driven in the xy direction. The two drive sources for driving and the two drive sources for driving the substrate 2 in the xy direction require four drive sources, whereas the two drive sources for driving in the x and y directions (substrate x motor 15 And the substrate y motor 16) can be moved to a desired position, the number of drive shafts can be reduced, and the apparatus itself can be downsized. In the component mounting apparatus 1, an upper camera 18 is further provided on the xy stage 12. By using a drive source (substrate x motor 15 and substrate y motor 16) of the xy stage 12, the upper camera 18 is placed on the xy plane. It can be moved to a desired position, and it is not necessary to provide a drive source for moving the upper camera 18 to a desired position, and further miniaturization can be achieved.

  Further, since the component mounting apparatus 1 uses the upper camera 18 having a fixed focal length moving on the xy plane on the xy stage 12 and the lower camera 22 fixed to the frame 13, a focus function for adjusting the focal length, etc. There is no need to provide the device, and the size can be reduced.

  Further, since the component mounting apparatus 1 can be reduced in size as described above, the moving distance of the xy stage 12 can be reduced, and mounting can be performed without being greatly affected by distortion due to thermal expansion or the like. High accuracy can be kept.

  Subsequently, alignment of the component mounting apparatus 1 will be described. The component mounting apparatus 1 can recognize and correct the position state of the semiconductor chip 3 to be mounted and the position state of the substrate 2 by the upper camera 18 and the lower camera 22. In order to further improve the accuracy, the component mounting apparatus 1 is provided at a position facing the upper camera 18 on the frame 13, and an origin mark 41 that can be recognized by the upper camera 18 is provided. The component mounting apparatus 1 can accurately align the upper camera 18 by recognizing the origin mark 41 with the upper camera 18 and using that point as the origin.

  The origin mark 41 is fixed to the frame 13 of the component mounting apparatus 1 and can be recognized by the upper camera 18 and is composed of, for example, a dot pattern. The origin mark 41 is provided at an important position in the mounting operation, for example, in the vicinity of the bonding tool 17 so that the accuracy can be further improved by reducing the movement distance.

  Next, the alignment operation of the component mounting apparatus 1 will be described. For example, the component mounting apparatus 1 sets the rough origin by detecting the torque of the board x motor 15 and the board y motor 16 as a preliminary work. Next, the component mounting apparatus 1 performs image recognition of the origin mark 41 in order to align the upper camera 18. Using the position of the origin mark 41 recognized in this way as a reference, the component mounting apparatus 1 uses the upper camera 18 to change the state of the semiconductor chip 3 delivered to the bonding tool 17 by the chip supply unit 14 as described above. While recognizing the image, the lower camera 22 recognizes the position of the substrate 2 (FIG. 6A). Further, the lower camera 22 recognizes a predetermined position of the substrate 2 (FIG. 6B), the upper camera 18 recognizes the position of the semiconductor chip 3 (FIG. 6C), and the substrate is placed at the mounting position. 2 is moved (FIG. 6D), and finally the semiconductor chip 3 is mounted at a predetermined position on the substrate 2 (FIG. 6E).

  In addition to the above, the same mark other than the origin mark 41 can be provided on the frame 13 as a reference mark, and this reference mark can also be used as the origin at which the camera can be aligned. Specifically, in the component mounting apparatus 50 as shown in FIG. 7, a reference mark 51 is provided on the frame 13 in addition to the origin mark 41. As described above, by providing the reference points for alignment at the two positions of the origin mark 41 and the reference mark 51, it is possible to perform alignment by recognizing the image at a position close to the upper camera 18 by image recognition. Therefore, the movement distance to the origin position can be shortened, and the accuracy and work efficiency can be improved. If the positional relationship between the origin mark 41 and the reference mark 51 is recognized in advance, the movement distance of the xy stage 12 can be calibrated.

  Furthermore, not only one reference mark but also a plurality of dot patterns arranged in a lattice pattern is used, and the origin position movement is shortened by performing alignment using marks near the camera. It is possible to improve accuracy and work efficiency.

  Furthermore, the upper camera 18 is not limited to processing the semiconductor chip position recognition and the origin mark 41 recognition, but a third camera for recognizing the origin mark 41 image may be provided on the xy stage 12. Good. Specifically, a component mounting apparatus 60 as shown in FIG. 8 is provided, and a third camera 61 is provided. The reference mark 62 recognized by the third camera 61 is the same as the position where the upper camera 18 recognizes an image of the semiconductor chip 3 as shown in FIG. That is, the position of the reference mark 62 recognized by the third camera 61 is provided at a position where the upper camera 18 can recognize the semiconductor chip 3 in the moving position of the xy stage 12. The origin mark 63 recognized by the third camera 61 is the same as the position where the semiconductor chip 3 is mounted on the substrate 2 by the bonding tool 17 as shown in FIG. 8B. That is, the position of the origin mark 63 recognized by the third camera is provided at the position recognized when the xy stage 12 is moved to the position where the semiconductor chip 3 is mounted on the substrate 2.

  Further, the origin mark 41 is not limited to being fixed on the frame 13 as in the component mounting apparatus 1. For example, the origin mark is provided at a predetermined position on the xy stage 12, and alignment is performed by the lower camera 22. You may do it.

  Subsequently, a position adjusting device applied to the component mounting apparatus 1 will be described.

  As shown in FIG. 9, the position adjusting device 30 is inserted between the upper camera 18 and the lower camera 22 that have been moved to opposing positions. Further, as shown in FIGS. 10 and 11, the position adjusting device 30 includes a substantially disc-shaped housing 31, a first lens 32 attached to one surface of the housing 31, and the other surface. The second lens 33 is attached, and a recognition pattern portion 34 is provided between the first lens 32 and the second lens 33. Further, the position adjusting device 30 is arranged such that the first lens 32, the recognition pattern unit 34, and the second lens 33 are on the same straight line.

  As shown in FIG. 10, the housing 31 is formed of a substantially disk-shaped member, and a fitting groove 31b for fitting the first lens 32 to one surface 31a and the other surface 31c. A fitting groove 31d for fitting the second lens 33 is provided. In addition, a recognition pattern portion 34 is provided at a substantially central portion of the housing 31. Further, the casing 31 is provided with a step 31e on the other surface 31c for attachment to a predetermined position of the component mounting apparatus 1. The housing 31 is not limited to the above, and has a thin plate portion on which only the recognition pattern portion 34 is formed, and fixes the first lens 32 and the second lens 33, and the predetermined component of the component mounting apparatus 1. The shape is not limited as long as it can be attached to the location.

  The first lens 32 and the second lens 33 are formed of convex lenses that shorten the focal length. For example, the lenses that set the focal lengths of the lower camera 22 and the upper camera 18 to ½ or more and less than one. It is. If a lens that makes the focal length of the first lens 32 smaller than ½ is used, the recognition pattern portion 34 cannot be recognized when inserted between the upper camera 18 and the lower camera 22, and the focal point is reduced. This is because if a lens with a distance of 1 is used, there is no need to provide a lens.

  The recognition pattern portion 34 is a thin plate portion at a substantially central portion of the housing 31 and can be seen from both the one surface 31a and the other surface 31c, and has a pinhole whose position can be recognized as the same from both surfaces. Is provided. For example, the recognition pattern portion 34 is provided with a pinhole having a diameter of 0.1 mm with respect to a plate thickness of 0.013 mm. Note that the recognition pattern unit 34 is a mark or the like that can be seen from both the one surface 31a and the other surface 31c, and whose position can be recognized as the same from both surfaces. For example, a pattern plated on glass, a tapered hole with a thin edge, a thin film, or a glass stamp may be provided.

  The position adjustment device 30 having the above-described configuration is arranged at the midpoint between the upper camera 18 and the lower camera 22 so that the upper camera 18, the lower camera 22, and the recognition pattern unit 34 are on the same straight line. Arrange and adjust the position. Specifically, in the component mounting apparatus 1, since the lower camera 22 is fixed to the frame 13, the recognition pattern unit 34 is arranged on the lower side of the lower camera 22, and by driving the xy stage 12, The upper camera 18 on the xy stage 12 is corrected and moved while recognizing image information from each camera so that the lower camera 22, the recognition pattern unit 34, and the upper camera 18 are on the same straight line. Only the xy stage 12 is moved and aligned so that the upper camera 18, the recognition pattern unit 34, and the lower camera 22 are on the same line, thereby adjusting the alignment of the upper camera 18 and the lower camera 22.

  According to the position adjusting device 30 having the above-described configuration, the upper camera 18 and the lower camera 22 that are disposed to face each other are aligned with respect to only the xy stage 12 to which the upper camera 18 is fixed in the facing direction. Therefore, the positioning accuracy can be improved.

  In the component mounting apparatus 1, the lower camera 22 is fixed to the frame 13, and the upper camera 18 is fixed on the xy stage 12 that can move only in the xy direction. As a result, the mounting accuracy can be improved.

It is a top view of the component mounting apparatus which concerns on one Embodiment of this invention. It is a front view of the component mounting apparatus which concerns on one Embodiment of this invention. It is a side view of the component mounting apparatus which concerns on one Embodiment of this invention. It is a block diagram which shows the relationship between the control unit and operation panel of the component mounting apparatus which concerns on one Embodiment of this invention. It is a flowchart which shows operation | movement of the component mounting apparatus which concerns on one Embodiment of this invention. It is a schematic diagram for demonstrating other embodiment of the component mounting apparatus which concerns on one Embodiment of this invention. It is a schematic diagram for demonstrating other embodiment of the component mounting apparatus which concerns on one Embodiment of this invention. It is a schematic diagram for demonstrating other embodiment of the component mounting apparatus which concerns on one Embodiment of this invention. It is a schematic diagram for demonstrating the positional relationship with the camera of the position adjustment apparatus which concerns on one Embodiment of this invention. It is a perspective view of the position adjusting device concerning one embodiment of the present invention. It is sectional drawing of the position adjustment apparatus which concerns on one Embodiment of this invention. It is a schematic diagram which shows the conventional component mounting apparatus. It is the top view, side view, and front view which show schematic structure of the camera unit of the conventional component mounting apparatus. It is a schematic diagram which shows another conventional component mounting apparatus. It is a schematic diagram for demonstrating alignment work.

Explanation of symbols

  1, 50, 60 Component mounting device, 2 substrate, 3 semiconductor chip, 4 chip tray, 10 mount, 11 base, 12 xy stage, 13 frame, 14 chip supply unit, 14a chip reversing arm, 15 substrate x motor, 16 substrate y motor, 17 bonding tool, 18 upper camera, 19 tool z linear guide, 20 tool z cylinder, 21 tool control mechanism, 22 lower camera, 23 control unit, 24 operation panel, 25 display monitor, 30 position adjustment device, 31 housing Body, 31a one surface, 31b, 31d fitting groove, 31c other surface, 32 first lens, 33 second lens, 34 recognition pattern portion, 41 origin mark, 51, 62 reference mark, 61 third Camera, 63 Origin mark

Claims (12)

In a component mounting apparatus for mounting a component on a substrate by a head provided at a position facing the substrate,
A stage on which the substrate and the components are placed;
A stage drive unit for driving the stage on the same plane as the main surface of the stage;
A component supply section for supplying the component on the stage to the head;
A head drive unit that drives the head in a direction perpendicular to the main surface of the stage;
A head rotation drive unit that rotates the head about a direction perpendicular to the main surface of the stage as a rotation axis;
A first camera fixed on the stage and detecting a surface image of the head;
A component mounting apparatus comprising: a second camera that detects a surface image of the stage fixed at a position facing the stage. The component mounting apparatus according to claim 1, wherein the head driving unit includes an air cylinder. Having an origin mark at a position facing the first camera and at least one place on the stage;
2. The component mounting apparatus according to claim 1, wherein the first camera or the second camera detects a reference mark of the origin to detect a reference point for relative movement between the stage and the head.   A recognition pattern provided between the first camera and the second camera, and provided with a reference mark that can be detected by the first camera and the second camera from one surface and the other surface direction. A position adjusting means comprising: a first lens provided in contact with one surface of the recognition pattern portion; and a second lens provided in contact with the other surface of the recognition pattern portion. The component mounting apparatus according to claim 1. In a component mounting method for mounting a component on a substrate by a head provided at a position facing the substrate,
A stage driving step of driving the stage on which the substrate and the component are placed on the same plane as the main surface of the stage;
A component supply step of supplying the component on the stage to the head;
A head driving step of driving the head in a direction perpendicular to the main surface of the stage;
A head rotation driving step of rotating the head about a direction perpendicular to the main surface of the stage as a rotation axis;
A first image detecting step of detecting a surface image of the head by a first camera fixed on the stage and detecting a surface image of the head;
A component mounting method comprising: a second image detection step of detecting a surface image of the stage by a second camera that detects a surface image of the stage fixed at a position facing the stage. The component mounting method according to claim 5, wherein the head driving step drives the head in a direction perpendicular to the main surface of the stage using an air cylinder. Further, the first camera or the second camera detects an origin mark provided at a position facing the first camera or at least one place on the stage, and the stage and the head are relatively moved. The component mounting method according to claim 5, further comprising: a reference point detecting step that is used as a reference point. A recognition pattern provided between the first camera and the second camera, and provided with a reference mark that can be detected by the first camera and the second camera from one surface and the other surface direction. A position adjustment means comprising: a first lens provided in contact with one surface of the recognition pattern portion; and a second lens provided in contact with the other surface of the recognition pattern portion. When the first camera and the second camera detect the reference mark of the recognition pattern portion, and both the first camera and the second camera detect the reference mark of the recognition pattern portion, The component mounting method according to claim 5, further comprising a position adjustment step of adjusting a relative positional relationship between the stage and the head based on the position of the head. A first member and a second member which are arranged to face each other and move relatively in a direction perpendicular to the facing direction;
A first camera fixed to the first member and detecting a surface image of the second member;
The first member and the second member that are applied to a moving system that is fixed to the second member and has a second camera that detects a surface image of the first member are aligned. In the position adjusting device for
A recognition pattern portion provided with a reference mark that can be detected by the first camera and the second camera from the direction of one surface and the other surface;
A first lens provided in contact with one surface of the recognition pattern portion;
And a second lens provided in contact with the other surface of the recognition pattern portion. The first lens and the second lens have a focal length of the first camera and a focal length of the second camera in a range of ½ or more and less than 1, respectively. The position adjusting device according to claim 9. A first member and a second member which are arranged to face each other and move relatively in a direction perpendicular to the facing direction;
A first camera fixed to the first member and detecting a surface image of the second member;
The first member and the second member that are applied to a moving system that is fixed to the second member and has a second camera that detects a surface image of the first member are aligned. In the position adjustment method for
A recognition pattern portion provided with a reference mark that can be detected by the first camera and the second camera from the direction of one surface and the other surface, and a first portion provided in contact with one surface of the recognition pattern portion. An insertion for inserting a position adjusting device including one lens and a second lens provided in contact with the other surface of the recognition pattern portion between the first member and the second member Process,
A reference mark detection step of detecting the reference mark of the recognition pattern portion by the first camera and the second camera;
The first member and the second member based on each other's position when the first camera and the second camera both detect the reference mark of the recognition pattern portion by the reference mark detection step. And a position adjusting step for adjusting a relative positional relationship with the position adjusting method. A position adjustment device is used in which the first lens and the second lens make the focal length of the first camera and the focal length of the second camera within a range of ½ or more and less than 1, respectively. The position adjustment method according to claim 11, wherein the steps are performed.

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