JP5438606B2 - 配線基板及びその製造方法 - Google Patents

配線基板及びその製造方法 Download PDF

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Publication number
JP5438606B2
JP5438606B2 JP2010147420A JP2010147420A JP5438606B2 JP 5438606 B2 JP5438606 B2 JP 5438606B2 JP 2010147420 A JP2010147420 A JP 2010147420A JP 2010147420 A JP2010147420 A JP 2010147420A JP 5438606 B2 JP5438606 B2 JP 5438606B2
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insulating layer
connection pad
wiring board
layer
chip
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JP2012015158A5 (enExample
JP2012015158A (ja
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健太郎 金子
人資 近藤
和弘 小林
雅子 佐藤
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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JP2010147420A 2010-06-29 2010-06-29 配線基板及びその製造方法 Active JP5438606B2 (ja)

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JP2010147420A JP5438606B2 (ja) 2010-06-29 2010-06-29 配線基板及びその製造方法

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JP2010147420A JP5438606B2 (ja) 2010-06-29 2010-06-29 配線基板及びその製造方法

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JP2012015158A JP2012015158A (ja) 2012-01-19
JP2012015158A5 JP2012015158A5 (enExample) 2013-05-30
JP5438606B2 true JP5438606B2 (ja) 2014-03-12

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6445816B2 (ja) * 2013-09-30 2018-12-26 積水化学工業株式会社 配線板の製造方法、絶縁フィルム及び配線板用絶縁フィルム
JP7452517B2 (ja) * 2021-11-04 2024-03-19 株式会社村田製作所 インダクタ部品および実装部品

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