JP5436220B2 - 組み込み環境向け熱管理システム及びその製造方法 - Google Patents
組み込み環境向け熱管理システム及びその製造方法 Download PDFInfo
- Publication number
- JP5436220B2 JP5436220B2 JP2009540355A JP2009540355A JP5436220B2 JP 5436220 B2 JP5436220 B2 JP 5436220B2 JP 2009540355 A JP2009540355 A JP 2009540355A JP 2009540355 A JP2009540355 A JP 2009540355A JP 5436220 B2 JP5436220 B2 JP 5436220B2
- Authority
- JP
- Japan
- Prior art keywords
- lung
- thermal management
- management system
- ejector
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S165/00—Heat exchange
- Y10S165/908—Fluid jets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Treatment Of Fiber Materials (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Control Of Heat Treatment Processes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/608,378 US20080137289A1 (en) | 2006-12-08 | 2006-12-08 | Thermal management system for embedded environment and method for making same |
| US11/608,378 | 2006-12-08 | ||
| PCT/US2007/082642 WO2008073592A1 (en) | 2006-12-08 | 2007-10-26 | Thermal management system for embedded environment and method for making same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010512642A JP2010512642A (ja) | 2010-04-22 |
| JP2010512642A5 JP2010512642A5 (enExample) | 2012-09-13 |
| JP5436220B2 true JP5436220B2 (ja) | 2014-03-05 |
Family
ID=39111420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009540355A Expired - Fee Related JP5436220B2 (ja) | 2006-12-08 | 2007-10-26 | 組み込み環境向け熱管理システム及びその製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US20080137289A1 (enExample) |
| EP (1) | EP2092406B1 (enExample) |
| JP (1) | JP5436220B2 (enExample) |
| KR (1) | KR101447761B1 (enExample) |
| CN (1) | CN101548255B (enExample) |
| AT (1) | ATE505759T1 (enExample) |
| DE (1) | DE602007013933D1 (enExample) |
| WO (1) | WO2008073592A1 (enExample) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080137289A1 (en) * | 2006-12-08 | 2008-06-12 | General Electric Company | Thermal management system for embedded environment and method for making same |
| US7550901B2 (en) * | 2007-09-27 | 2009-06-23 | Intel Corporation | Piezoelectric fan, cooling device containing same, and method of cooling a microelectronic device using same |
| US7633753B2 (en) * | 2007-09-27 | 2009-12-15 | Intel Corporation | Piezoelectric air jet augmented cooling for electronic devices |
| US7619894B2 (en) * | 2008-02-22 | 2009-11-17 | Inventec Corporation | Heat dissipation device |
| US8418934B2 (en) | 2008-08-26 | 2013-04-16 | General Electric Company | System and method for miniaturization of synthetic jets |
| US8453715B2 (en) * | 2008-10-30 | 2013-06-04 | General Electric Company | Synthetic jet embedded heat sink |
| US10274263B2 (en) | 2009-04-09 | 2019-04-30 | General Electric Company | Method and apparatus for improved cooling of a heat sink using a synthetic jet |
| US8496049B2 (en) * | 2009-04-09 | 2013-07-30 | General Electric Company | Heat sinks with distributed and integrated jet cooling |
| US9615482B2 (en) | 2009-12-11 | 2017-04-04 | General Electric Company | Shaped heat sinks to optimize flow |
| US9478479B2 (en) | 2010-10-26 | 2016-10-25 | General Electric Company | Thermal management system and method |
| CN101881285A (zh) * | 2009-05-07 | 2010-11-10 | 鸿富锦精密工业(深圳)有限公司 | 压电风扇 |
| TWI465647B (zh) * | 2009-05-20 | 2014-12-21 | Hon Hai Prec Ind Co Ltd | 壓電風扇 |
| US10226991B2 (en) * | 2009-10-28 | 2019-03-12 | GM Global Technology Operations LLC | Air curtain using smart materials |
| US8776871B2 (en) | 2009-11-19 | 2014-07-15 | General Electric Company | Chassis with distributed jet cooling |
| US20110141691A1 (en) * | 2009-12-11 | 2011-06-16 | Slaton David S | Systems and methods for manufacturing synthetic jets |
| US8695686B2 (en) * | 2010-01-07 | 2014-04-15 | General Electric Company | Method and apparatus for removing heat from electronic devices using synthetic jets |
| US8434906B2 (en) * | 2010-02-23 | 2013-05-07 | General Electric Company | Lighting system with thermal management system |
| US8651708B2 (en) | 2010-06-25 | 2014-02-18 | General Electric Company | Heat transfer system for a light emitting diode (LED) lamp |
| US8506105B2 (en) | 2010-08-25 | 2013-08-13 | Generla Electric Company | Thermal management systems for solid state lighting and other electronic systems |
| US20120073788A1 (en) * | 2010-09-24 | 2012-03-29 | John Jay Streyle | Method and system for synthetic jet cooling |
| US20130243030A1 (en) * | 2012-03-16 | 2013-09-19 | Nuventix, Inc. | Augmentation of Fans With Synthetic Jet Ejectors |
| US9006956B2 (en) | 2012-05-09 | 2015-04-14 | Qualcomm Incorporated | Piezoelectric active cooling device |
| KR20150128935A (ko) | 2013-03-14 | 2015-11-18 | 제네럴 일렉트릭 컴퍼니 | 합성 제트 서스펜션 구조체 |
| EP2969235A4 (en) | 2013-03-14 | 2016-11-16 | Gen Electric | LOW RESONANCE ACOUSTIC SYNTHETIC JET STRUCTURE |
| US20140376185A1 (en) * | 2013-06-19 | 2014-12-25 | Fairchild Korea Semiconductor Ltd. | Cooling device |
| US9333599B2 (en) | 2013-12-20 | 2016-05-10 | General Electric Company | Electronics chassis and method of fabricating the same |
| US10085363B2 (en) * | 2014-05-22 | 2018-09-25 | General Electric Company | Integrated compact impingement on extended heat surface |
| US9288892B2 (en) | 2014-06-02 | 2016-03-15 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Transversely actuated piezoelectric bellows heatsink |
| US9879661B2 (en) | 2014-08-29 | 2018-01-30 | General Electric Company | Vibrational fluid mover jet with active damping mechanism |
| KR20160031715A (ko) * | 2014-09-15 | 2016-03-23 | 삼성전자주식회사 | 기류 가변이 가능한 전면 송풍방식 공기조화장치 |
| US10359035B2 (en) | 2014-10-15 | 2019-07-23 | Ge Aviation Systems Llc | Air agitator assemblies |
| US10028408B2 (en) | 2014-10-15 | 2018-07-17 | Ge Aviation Systems Llc | Air agitator assemblies |
| US10629514B2 (en) * | 2015-12-09 | 2020-04-21 | Ozyegin Universitesi | Heat sink cooling with preferred synthetic jet cooling devices |
| US12089374B2 (en) | 2018-08-10 | 2024-09-10 | Frore Systems Inc. | MEMS-based active cooling systems |
| US11464140B2 (en) | 2019-12-06 | 2022-10-04 | Frore Systems Inc. | Centrally anchored MEMS-based active cooling systems |
| US11456234B2 (en) | 2018-08-10 | 2022-09-27 | Frore Systems Inc. | Chamber architecture for cooling devices |
| US12000704B2 (en) | 2018-10-15 | 2024-06-04 | Nokia Technologies Oy | Apparatus and method for processing a fluid zone |
| US11802554B2 (en) | 2019-10-30 | 2023-10-31 | Frore Systems Inc. | MEMS-based airflow system having a vibrating fan element arrangement |
| US11796262B2 (en) | 2019-12-06 | 2023-10-24 | Frore Systems Inc. | Top chamber cavities for center-pinned actuators |
| US11510341B2 (en) | 2019-12-06 | 2022-11-22 | Frore Systems Inc. | Engineered actuators usable in MEMs active cooling devices |
| US12193192B2 (en) | 2019-12-06 | 2025-01-07 | Frore Systems Inc. | Cavities for center-pinned actuator cooling systems |
| US12033917B2 (en) | 2019-12-17 | 2024-07-09 | Frore Systems Inc. | Airflow control in active cooling systems |
| WO2021126791A1 (en) | 2019-12-17 | 2021-06-24 | Frore Systems Inc. | Mems-based cooling systems for closed and open devices |
| CN116325139A (zh) | 2020-10-02 | 2023-06-23 | 福珞尔系统公司 | 主动式热沉 |
| US11692776B2 (en) * | 2021-03-02 | 2023-07-04 | Frore Systems Inc. | Mounting and use of piezoelectric cooling systems in devices |
| US11963337B2 (en) * | 2022-03-22 | 2024-04-16 | Baidu Usa Llc | Contactless device and chip thermal management plate |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4519751A (en) * | 1982-12-16 | 1985-05-28 | The Abet Group | Piezoelectric pump with internal load sensor |
| JPH0273657A (ja) * | 1988-09-09 | 1990-03-13 | Hitachi Ltd | 半径流ヒートシンクおよびこれを用いた半導体冷却装置 |
| JPH03116961A (ja) | 1989-09-29 | 1991-05-17 | Victor Co Of Japan Ltd | 放熱装置 |
| US5758823A (en) * | 1995-06-12 | 1998-06-02 | Georgia Tech Research Corporation | Synthetic jet actuator and applications thereof |
| US6123145A (en) * | 1995-06-12 | 2000-09-26 | Georgia Tech Research Corporation | Synthetic jet actuators for cooling heated bodies and environments |
| US5914856A (en) * | 1997-07-23 | 1999-06-22 | Litton Systems, Inc. | Diaphragm pumped air cooled planar heat exchanger |
| US6575715B1 (en) * | 1997-09-19 | 2003-06-10 | Omnitek Research & Development, Inc. | Structural elements forming a pump |
| KR20000050679A (ko) * | 1999-01-13 | 2000-08-05 | 윤종용 | 전자기기용 방열장치 |
| JP2000286579A (ja) | 1999-03-30 | 2000-10-13 | Sony Corp | 冷却装置および電子機器 |
| US6901430B1 (en) | 1999-11-05 | 2005-05-31 | Ford Motor Company | Online system and method of locating consumer product having specific configurations in the enterprise production pipeline and inventory |
| US6471477B2 (en) * | 2000-12-22 | 2002-10-29 | The Boeing Company | Jet actuators for aerodynamic surfaces |
| US6628522B2 (en) * | 2001-08-29 | 2003-09-30 | Intel Corporation | Thermal performance enhancement of heat sinks using active surface features for boundary layer manipulations |
| US6722581B2 (en) * | 2001-10-24 | 2004-04-20 | General Electric Company | Synthetic jet actuators |
| US6869275B2 (en) * | 2002-02-14 | 2005-03-22 | Philip Morris Usa Inc. | Piezoelectrically driven fluids pump and piezoelectric fluid valve |
| US7061161B2 (en) * | 2002-02-15 | 2006-06-13 | Siemens Technology-To-Business Center Llc | Small piezoelectric air pumps with unobstructed airflow |
| US6588497B1 (en) * | 2002-04-19 | 2003-07-08 | Georgia Tech Research Corporation | System and method for thermal management by synthetic jet ejector channel cooling techniques |
| US7031155B2 (en) * | 2003-01-06 | 2006-04-18 | Intel Corporation | Electronic thermal management |
| US7204615B2 (en) * | 2003-03-31 | 2007-04-17 | Lumination Llc | LED light with active cooling |
| US6937472B2 (en) * | 2003-05-09 | 2005-08-30 | Intel Corporation | Apparatus for cooling heat generating components within a computer system enclosure |
| US6801430B1 (en) * | 2003-05-09 | 2004-10-05 | Intel Corporation | Actuation membrane to reduce an ambient temperature of heat generating device |
| CN1846060A (zh) * | 2003-07-07 | 2006-10-11 | 乔治亚技术研究公司 | 利用分布式合成喷流致动器进行热管理的系统和方法 |
| JP4677744B2 (ja) * | 2003-11-04 | 2011-04-27 | ソニー株式会社 | 噴流発生装置、電子機器及び噴流発生方法 |
| US20060196638A1 (en) * | 2004-07-07 | 2006-09-07 | Georgia Tech Research Corporation | System and method for thermal management using distributed synthetic jet actuators |
| JP2006063900A (ja) * | 2004-08-27 | 2006-03-09 | Sony Corp | 噴流発生装置及び電子機器 |
| US7641468B2 (en) * | 2004-09-01 | 2010-01-05 | Hewlett-Packard Development Company, L.P. | Imprint lithography apparatus and method employing an effective pressure |
| US7252140B2 (en) * | 2004-09-03 | 2007-08-07 | Nuveatix, Inc. | Apparatus and method for enhanced heat transfer |
| US20060232166A1 (en) * | 2005-04-13 | 2006-10-19 | Par Technologies Llc | Stacked piezoelectric diaphragm members |
| JP4747657B2 (ja) * | 2005-04-21 | 2011-08-17 | ソニー株式会社 | 噴流発生装置及び電子機器 |
| JP4887652B2 (ja) * | 2005-04-21 | 2012-02-29 | ソニー株式会社 | 噴流発生装置及び電子機器 |
| JP2006310586A (ja) * | 2005-04-28 | 2006-11-09 | Sony Corp | 気流発生装置及び電子機器 |
| EP1722412B1 (en) * | 2005-05-02 | 2012-08-29 | Sony Corporation | Jet generator and electronic device |
| US7248475B2 (en) * | 2005-05-31 | 2007-07-24 | Intel Corporation | Wireless device enclosure using piezoelectric cooling structures |
| US7607470B2 (en) * | 2005-11-14 | 2009-10-27 | Nuventix, Inc. | Synthetic jet heat pipe thermal management system |
| US20080137289A1 (en) * | 2006-12-08 | 2008-06-12 | General Electric Company | Thermal management system for embedded environment and method for making same |
| US8006917B2 (en) * | 2008-08-26 | 2011-08-30 | General Electric Company | Method and apparatus for reducing acoustic noise in a synthetic jet |
| US8752775B2 (en) * | 2008-08-26 | 2014-06-17 | General Electric Company | Method and apparatus for reducing acoustic noise in a synthetic jet |
| US7688583B1 (en) * | 2008-09-30 | 2010-03-30 | General Electric Company | Synthetic jet and method of making same |
| US8881994B2 (en) * | 2009-12-16 | 2014-11-11 | General Electric Company | Low frequency synthetic jet actuator and method of manufacturing thereof |
-
2006
- 2006-12-08 US US11/608,378 patent/US20080137289A1/en not_active Abandoned
-
2007
- 2007-10-26 DE DE602007013933T patent/DE602007013933D1/de active Active
- 2007-10-26 WO PCT/US2007/082642 patent/WO2008073592A1/en not_active Ceased
- 2007-10-26 US US12/517,679 patent/US8120908B2/en not_active Expired - Fee Related
- 2007-10-26 CN CN2007800451216A patent/CN101548255B/zh not_active Expired - Fee Related
- 2007-10-26 EP EP07844627A patent/EP2092406B1/en not_active Not-in-force
- 2007-10-26 AT AT07844627T patent/ATE505759T1/de not_active IP Right Cessation
- 2007-10-26 JP JP2009540355A patent/JP5436220B2/ja not_active Expired - Fee Related
- 2007-10-26 KR KR1020097011635A patent/KR101447761B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008073592A1 (en) | 2008-06-19 |
| KR20090086243A (ko) | 2009-08-11 |
| CN101548255A (zh) | 2009-09-30 |
| JP2010512642A (ja) | 2010-04-22 |
| US8120908B2 (en) | 2012-02-21 |
| US20100067191A1 (en) | 2010-03-18 |
| EP2092406A1 (en) | 2009-08-26 |
| CN101548255B (zh) | 2013-04-24 |
| KR101447761B1 (ko) | 2014-10-06 |
| DE602007013933D1 (de) | 2011-05-26 |
| US20080137289A1 (en) | 2008-06-12 |
| EP2092406B1 (en) | 2011-04-13 |
| ATE505759T1 (de) | 2011-04-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5436220B2 (ja) | 組み込み環境向け熱管理システム及びその製造方法 | |
| JP6555845B2 (ja) | 多機能シンセティックジェットおよび同製作の方法 | |
| CN102046978B (zh) | 压电微型鼓风机 | |
| JP5711468B2 (ja) | 分散型及び一体型の噴流冷却機能を有する熱管理システム | |
| KR102496273B1 (ko) | 패키지 통합형 합성 제트 디바이스 | |
| KR101333542B1 (ko) | 유체 펌프 | |
| JP2000513070A (ja) | 低プロフィールで軸方向空気流の単一ブレード圧電ファン | |
| US9902152B2 (en) | Piezoelectric package-integrated synthetic jet devices | |
| JP6863009B2 (ja) | 物質検出素子 | |
| US20110168361A1 (en) | Heat dissipation device and airflow generator thereof | |
| US11952994B2 (en) | Piezoelectric pump housing and terminal arrangement | |
| TWI679525B (zh) | 熱管理系統及製造熱管理系統的方法 | |
| US20140376185A1 (en) | Cooling device | |
| TWM542099U (zh) | 流體控制裝置 | |
| WO2015042192A1 (en) | Zipping actuator fluid motivation | |
| WO2007007491A1 (ja) | メッシュ材及び電子機器 | |
| JP2007154784A (ja) | 噴流発生装置及び電子機器 | |
| JP2007209845A (ja) | 噴流発生装置及び電子機器 | |
| JP2006055741A (ja) | 噴流発生装置及び電子機器 | |
| KR20140147682A (ko) | 냉각장치 | |
| JP2017098304A (ja) | 圧電デバイス、センサ装置および発電装置 | |
| JP2008014208A (ja) | 噴流発生装置、給電線及び電子機器 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101001 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20101001 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20101001 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110929 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120727 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20121015 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121023 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130118 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130709 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131003 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20131112 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20131210 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5436220 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |