CN101548255B - 用于嵌入式环境的热学管理系统及其制作方法 - Google Patents

用于嵌入式环境的热学管理系统及其制作方法 Download PDF

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Publication number
CN101548255B
CN101548255B CN2007800451216A CN200780045121A CN101548255B CN 101548255 B CN101548255 B CN 101548255B CN 2007800451216 A CN2007800451216 A CN 2007800451216A CN 200780045121 A CN200780045121 A CN 200780045121A CN 101548255 B CN101548255 B CN 101548255B
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China
Prior art keywords
primo
thermal management
management system
injector
flexible
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Expired - Fee Related
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CN2007800451216A
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English (en)
Chinese (zh)
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CN101548255A (zh
Inventor
梅麦特·阿里克
查尔斯·F·沃尔夫
约根·V·厄特卡
查尔斯·E·西利
戴维·S·斯莱顿
威廉·H·利肯巴克
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General Electric Co
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General Electric Co
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/908—Fluid jets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Control Of Heat Treatment Processes (AREA)
CN2007800451216A 2006-12-08 2007-10-26 用于嵌入式环境的热学管理系统及其制作方法 Expired - Fee Related CN101548255B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/608,378 US20080137289A1 (en) 2006-12-08 2006-12-08 Thermal management system for embedded environment and method for making same
US11/608,378 2006-12-08
PCT/US2007/082642 WO2008073592A1 (en) 2006-12-08 2007-10-26 Thermal management system for embedded environment and method for making same

Publications (2)

Publication Number Publication Date
CN101548255A CN101548255A (zh) 2009-09-30
CN101548255B true CN101548255B (zh) 2013-04-24

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CN2007800451216A Expired - Fee Related CN101548255B (zh) 2006-12-08 2007-10-26 用于嵌入式环境的热学管理系统及其制作方法

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Country Link
US (2) US20080137289A1 (enExample)
EP (1) EP2092406B1 (enExample)
JP (1) JP5436220B2 (enExample)
KR (1) KR101447761B1 (enExample)
CN (1) CN101548255B (enExample)
AT (1) ATE505759T1 (enExample)
DE (1) DE602007013933D1 (enExample)
WO (1) WO2008073592A1 (enExample)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080137289A1 (en) * 2006-12-08 2008-06-12 General Electric Company Thermal management system for embedded environment and method for making same
US7550901B2 (en) * 2007-09-27 2009-06-23 Intel Corporation Piezoelectric fan, cooling device containing same, and method of cooling a microelectronic device using same
US7633753B2 (en) * 2007-09-27 2009-12-15 Intel Corporation Piezoelectric air jet augmented cooling for electronic devices
US7619894B2 (en) * 2008-02-22 2009-11-17 Inventec Corporation Heat dissipation device
US8418934B2 (en) 2008-08-26 2013-04-16 General Electric Company System and method for miniaturization of synthetic jets
US8453715B2 (en) * 2008-10-30 2013-06-04 General Electric Company Synthetic jet embedded heat sink
US10274263B2 (en) 2009-04-09 2019-04-30 General Electric Company Method and apparatus for improved cooling of a heat sink using a synthetic jet
US8496049B2 (en) * 2009-04-09 2013-07-30 General Electric Company Heat sinks with distributed and integrated jet cooling
US9615482B2 (en) 2009-12-11 2017-04-04 General Electric Company Shaped heat sinks to optimize flow
US9478479B2 (en) 2010-10-26 2016-10-25 General Electric Company Thermal management system and method
CN101881285A (zh) * 2009-05-07 2010-11-10 鸿富锦精密工业（深圳）有限公司 压电风扇
TWI465647B (zh) * 2009-05-20 2014-12-21 Hon Hai Prec Ind Co Ltd 壓電風扇
US10226991B2 (en) * 2009-10-28 2019-03-12 GM Global Technology Operations LLC Air curtain using smart materials
US8776871B2 (en) 2009-11-19 2014-07-15 General Electric Company Chassis with distributed jet cooling
US20110141691A1 (en) * 2009-12-11 2011-06-16 Slaton David S Systems and methods for manufacturing synthetic jets
US8695686B2 (en) * 2010-01-07 2014-04-15 General Electric Company Method and apparatus for removing heat from electronic devices using synthetic jets
US8434906B2 (en) * 2010-02-23 2013-05-07 General Electric Company Lighting system with thermal management system
US8651708B2 (en) 2010-06-25 2014-02-18 General Electric Company Heat transfer system for a light emitting diode (LED) lamp
US8506105B2 (en) 2010-08-25 2013-08-13 Generla Electric Company Thermal management systems for solid state lighting and other electronic systems
US20120073788A1 (en) * 2010-09-24 2012-03-29 John Jay Streyle Method and system for synthetic jet cooling
US20130243030A1 (en) * 2012-03-16 2013-09-19 Nuventix, Inc. Augmentation of Fans With Synthetic Jet Ejectors
US9006956B2 (en) 2012-05-09 2015-04-14 Qualcomm Incorporated Piezoelectric active cooling device
KR20150128935A (ko) 2013-03-14 2015-11-18 제네럴 일렉트릭 컴퍼니 합성 제트 서스펜션 구조체
EP2969235A4 (en) 2013-03-14 2016-11-16 Gen Electric LOW RESONANCE ACOUSTIC SYNTHETIC JET STRUCTURE
US20140376185A1 (en) * 2013-06-19 2014-12-25 Fairchild Korea Semiconductor Ltd. Cooling device
US9333599B2 (en) 2013-12-20 2016-05-10 General Electric Company Electronics chassis and method of fabricating the same
US10085363B2 (en) * 2014-05-22 2018-09-25 General Electric Company Integrated compact impingement on extended heat surface
US9288892B2 (en) 2014-06-02 2016-03-15 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Transversely actuated piezoelectric bellows heatsink
US9879661B2 (en) 2014-08-29 2018-01-30 General Electric Company Vibrational fluid mover jet with active damping mechanism
KR20160031715A (ko) * 2014-09-15 2016-03-23 삼성전자주식회사 기류 가변이 가능한 전면 송풍방식 공기조화장치
US10359035B2 (en) 2014-10-15 2019-07-23 Ge Aviation Systems Llc Air agitator assemblies
US10028408B2 (en) 2014-10-15 2018-07-17 Ge Aviation Systems Llc Air agitator assemblies
US10629514B2 (en) * 2015-12-09 2020-04-21 Ozyegin Universitesi Heat sink cooling with preferred synthetic jet cooling devices
US12089374B2 (en) 2018-08-10 2024-09-10 Frore Systems Inc. MEMS-based active cooling systems
US11464140B2 (en) 2019-12-06 2022-10-04 Frore Systems Inc. Centrally anchored MEMS-based active cooling systems
US11456234B2 (en) 2018-08-10 2022-09-27 Frore Systems Inc. Chamber architecture for cooling devices
US12000704B2 (en) 2018-10-15 2024-06-04 Nokia Technologies Oy Apparatus and method for processing a fluid zone
US11802554B2 (en) 2019-10-30 2023-10-31 Frore Systems Inc. MEMS-based airflow system having a vibrating fan element arrangement
US11796262B2 (en) 2019-12-06 2023-10-24 Frore Systems Inc. Top chamber cavities for center-pinned actuators
US11510341B2 (en) 2019-12-06 2022-11-22 Frore Systems Inc. Engineered actuators usable in MEMs active cooling devices
US12193192B2 (en) 2019-12-06 2025-01-07 Frore Systems Inc. Cavities for center-pinned actuator cooling systems
US12033917B2 (en) 2019-12-17 2024-07-09 Frore Systems Inc. Airflow control in active cooling systems
WO2021126791A1 (en) 2019-12-17 2021-06-24 Frore Systems Inc. Mems-based cooling systems for closed and open devices
CN116325139A (zh) 2020-10-02 2023-06-23 福珞尔系统公司 主动式热沉
US11692776B2 (en) * 2021-03-02 2023-07-04 Frore Systems Inc. Mounting and use of piezoelectric cooling systems in devices
US11963337B2 (en) * 2022-03-22 2024-04-16 Baidu Usa Llc Contactless device and chip thermal management plate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1846060A (zh) * 2003-07-07 2006-10-11 乔治亚技术研究公司 利用分布式合成喷流致动器进行热管理的系统和方法

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4519751A (en) * 1982-12-16 1985-05-28 The Abet Group Piezoelectric pump with internal load sensor
JPH0273657A (ja) * 1988-09-09 1990-03-13 Hitachi Ltd 半径流ヒートシンクおよびこれを用いた半導体冷却装置
JPH03116961A (ja) 1989-09-29 1991-05-17 Victor Co Of Japan Ltd 放熱装置
US5758823A (en) * 1995-06-12 1998-06-02 Georgia Tech Research Corporation Synthetic jet actuator and applications thereof
US6123145A (en) * 1995-06-12 2000-09-26 Georgia Tech Research Corporation Synthetic jet actuators for cooling heated bodies and environments
US5914856A (en) * 1997-07-23 1999-06-22 Litton Systems, Inc. Diaphragm pumped air cooled planar heat exchanger
US6575715B1 (en) * 1997-09-19 2003-06-10 Omnitek Research & Development, Inc. Structural elements forming a pump
KR20000050679A (ko) * 1999-01-13 2000-08-05 윤종용 전자기기용 방열장치
JP2000286579A (ja) 1999-03-30 2000-10-13 Sony Corp 冷却装置および電子機器
US6901430B1 (en) 1999-11-05 2005-05-31 Ford Motor Company Online system and method of locating consumer product having specific configurations in the enterprise production pipeline and inventory
US6471477B2 (en) * 2000-12-22 2002-10-29 The Boeing Company Jet actuators for aerodynamic surfaces
US6628522B2 (en) * 2001-08-29 2003-09-30 Intel Corporation Thermal performance enhancement of heat sinks using active surface features for boundary layer manipulations
US6722581B2 (en) * 2001-10-24 2004-04-20 General Electric Company Synthetic jet actuators
US6869275B2 (en) * 2002-02-14 2005-03-22 Philip Morris Usa Inc. Piezoelectrically driven fluids pump and piezoelectric fluid valve
US7061161B2 (en) * 2002-02-15 2006-06-13 Siemens Technology-To-Business Center Llc Small piezoelectric air pumps with unobstructed airflow
US6588497B1 (en) * 2002-04-19 2003-07-08 Georgia Tech Research Corporation System and method for thermal management by synthetic jet ejector channel cooling techniques
US7031155B2 (en) * 2003-01-06 2006-04-18 Intel Corporation Electronic thermal management
US7204615B2 (en) * 2003-03-31 2007-04-17 Lumination Llc LED light with active cooling
US6937472B2 (en) * 2003-05-09 2005-08-30 Intel Corporation Apparatus for cooling heat generating components within a computer system enclosure
US6801430B1 (en) * 2003-05-09 2004-10-05 Intel Corporation Actuation membrane to reduce an ambient temperature of heat generating device
JP4677744B2 (ja) * 2003-11-04 2011-04-27 ソニー株式会社 噴流発生装置、電子機器及び噴流発生方法
US20060196638A1 (en) * 2004-07-07 2006-09-07 Georgia Tech Research Corporation System and method for thermal management using distributed synthetic jet actuators
JP2006063900A (ja) * 2004-08-27 2006-03-09 Sony Corp 噴流発生装置及び電子機器
US7641468B2 (en) * 2004-09-01 2010-01-05 Hewlett-Packard Development Company, L.P. Imprint lithography apparatus and method employing an effective pressure
US7252140B2 (en) * 2004-09-03 2007-08-07 Nuveatix, Inc. Apparatus and method for enhanced heat transfer
US20060232166A1 (en) * 2005-04-13 2006-10-19 Par Technologies Llc Stacked piezoelectric diaphragm members
JP4747657B2 (ja) * 2005-04-21 2011-08-17 ソニー株式会社 噴流発生装置及び電子機器
JP4887652B2 (ja) * 2005-04-21 2012-02-29 ソニー株式会社 噴流発生装置及び電子機器
JP2006310586A (ja) * 2005-04-28 2006-11-09 Sony Corp 気流発生装置及び電子機器
EP1722412B1 (en) * 2005-05-02 2012-08-29 Sony Corporation Jet generator and electronic device
US7248475B2 (en) * 2005-05-31 2007-07-24 Intel Corporation Wireless device enclosure using piezoelectric cooling structures
US7607470B2 (en) * 2005-11-14 2009-10-27 Nuventix, Inc. Synthetic jet heat pipe thermal management system
US20080137289A1 (en) * 2006-12-08 2008-06-12 General Electric Company Thermal management system for embedded environment and method for making same
US8006917B2 (en) * 2008-08-26 2011-08-30 General Electric Company Method and apparatus for reducing acoustic noise in a synthetic jet
US8752775B2 (en) * 2008-08-26 2014-06-17 General Electric Company Method and apparatus for reducing acoustic noise in a synthetic jet
US7688583B1 (en) * 2008-09-30 2010-03-30 General Electric Company Synthetic jet and method of making same
US8881994B2 (en) * 2009-12-16 2014-11-11 General Electric Company Low frequency synthetic jet actuator and method of manufacturing thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1846060A (zh) * 2003-07-07 2006-10-11 乔治亚技术研究公司 利用分布式合成喷流致动器进行热管理的系统和方法

Also Published As

Publication number Publication date
WO2008073592A1 (en) 2008-06-19
KR20090086243A (ko) 2009-08-11
CN101548255A (zh) 2009-09-30
JP2010512642A (ja) 2010-04-22
US8120908B2 (en) 2012-02-21
US20100067191A1 (en) 2010-03-18
EP2092406A1 (en) 2009-08-26
KR101447761B1 (ko) 2014-10-06
DE602007013933D1 (de) 2011-05-26
US20080137289A1 (en) 2008-06-12
EP2092406B1 (en) 2011-04-13
ATE505759T1 (de) 2011-04-15
JP5436220B2 (ja) 2014-03-05

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