JP5431706B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP5431706B2
JP5431706B2 JP2008255960A JP2008255960A JP5431706B2 JP 5431706 B2 JP5431706 B2 JP 5431706B2 JP 2008255960 A JP2008255960 A JP 2008255960A JP 2008255960 A JP2008255960 A JP 2008255960A JP 5431706 B2 JP5431706 B2 JP 5431706B2
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Japan
Prior art keywords
light
phosphor
light emitting
emitting device
dispersion layer
Prior art date
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Expired - Fee Related
Application number
JP2008255960A
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English (en)
Japanese (ja)
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JP2010087324A5 (https=
JP2010087324A (ja
Inventor
英樹 加藤
哲 長曽我部
大輔 中山
怜史 島岡
翔太 笹嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Minebea Co Ltd
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Minebea Co Ltd
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Filing date
Publication date
Application filed by Minebea Co Ltd filed Critical Minebea Co Ltd
Priority to JP2008255960A priority Critical patent/JP5431706B2/ja
Publication of JP2010087324A publication Critical patent/JP2010087324A/ja
Publication of JP2010087324A5 publication Critical patent/JP2010087324A5/ja
Application granted granted Critical
Publication of JP5431706B2 publication Critical patent/JP5431706B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
JP2008255960A 2008-10-01 2008-10-01 発光装置 Expired - Fee Related JP5431706B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008255960A JP5431706B2 (ja) 2008-10-01 2008-10-01 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008255960A JP5431706B2 (ja) 2008-10-01 2008-10-01 発光装置

Publications (3)

Publication Number Publication Date
JP2010087324A JP2010087324A (ja) 2010-04-15
JP2010087324A5 JP2010087324A5 (https=) 2012-08-30
JP5431706B2 true JP5431706B2 (ja) 2014-03-05

Family

ID=42250975

Family Applications (1)

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JP2008255960A Expired - Fee Related JP5431706B2 (ja) 2008-10-01 2008-10-01 発光装置

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JP (1) JP5431706B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101902371B1 (ko) * 2017-03-02 2018-09-28 주식회사 이츠웰 파장 선택형 엘이디 패키지 및 이를 이용한 엘이디 패키지 어레이

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5440064B2 (ja) * 2008-10-21 2014-03-12 東芝ライテック株式会社 照明装置
JP5767444B2 (ja) 2010-06-16 2015-08-19 ソニー株式会社 光源装置及び画像投影装置
US9204558B2 (en) * 2010-09-21 2015-12-01 Kuo-Kuang Chang Method for manufacturing packaged light emitting diode
CN102479888B (zh) * 2010-11-30 2014-04-09 盈胜科技股份有限公司 在两光学透镜及分隔环界定的槽间中填注并密封荧光层的方法
JP5733743B2 (ja) * 2010-12-15 2015-06-10 日東電工株式会社 光半導体装置
JP2014199831A (ja) * 2011-08-12 2014-10-23 シャープ株式会社 発光装置、蛍光体シート、及びバックライトシステム、及び発光装置の製造方法
KR20130045687A (ko) * 2011-10-26 2013-05-06 엘지이노텍 주식회사 발광 장치 및 이를 구비한 조명 장치
JP6058948B2 (ja) * 2012-08-28 2017-01-11 日東光学株式会社 光学フィルタ、光源装置、照明装置
TW201417353A (zh) * 2012-08-29 2014-05-01 夏普股份有限公司 發光元件及發光元件之製造方法
KR102015907B1 (ko) 2013-01-24 2019-08-29 삼성전자주식회사 반도체 발광소자
JP2014203852A (ja) * 2013-04-01 2014-10-27 日本電気硝子株式会社 波長変換部材及び発光デバイス
HK1222879A1 (zh) 2013-11-13 2017-07-14 Nanoco Technologies Ltd 包含量子点荧光体的led盖
JP6438648B2 (ja) 2013-11-15 2018-12-19 日亜化学工業株式会社 半導体発光装置およびその製造方法
KR102254916B1 (ko) 2014-02-05 2021-05-26 삼성디스플레이 주식회사 파장 변환 부재, 및 이를 포함하는 백라이트 어셈블리 및 표시 장치
JP6183486B2 (ja) * 2015-05-29 2017-08-23 日亜化学工業株式会社 発光装置、被覆部材の製造方法及び発光装置の製造方法
JP6179628B2 (ja) * 2016-03-23 2017-08-16 セイコーエプソン株式会社 照明装置、電子機器及び投射型表示装置
JP6740762B2 (ja) 2016-07-13 2020-08-19 日亜化学工業株式会社 発光装置およびその製造方法
DE102019104268A1 (de) * 2018-02-20 2019-08-22 Epistar Corporation Lichtemittierende Vorrichtung und Herstellungsverfahren dafür
JP6822452B2 (ja) 2018-08-23 2021-01-27 セイコーエプソン株式会社 光源装置およびプロジェクター
JP7701241B2 (ja) * 2021-10-26 2025-07-01 株式会社小糸製作所 半導体発光装置、および車両用灯具

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3707688B2 (ja) * 2002-05-31 2005-10-19 スタンレー電気株式会社 発光装置およびその製造方法
JP4238681B2 (ja) * 2003-09-17 2009-03-18 豊田合成株式会社 発光装置
JP4020092B2 (ja) * 2004-03-16 2007-12-12 住友電気工業株式会社 半導体発光装置
JP4451178B2 (ja) * 2004-03-25 2010-04-14 スタンレー電気株式会社 発光デバイス
JP2005294646A (ja) * 2004-04-01 2005-10-20 Sumitomo Electric Ind Ltd 発光装置
JP4606382B2 (ja) * 2005-01-27 2011-01-05 京セラ株式会社 発光装置
US20070075306A1 (en) * 2005-09-22 2007-04-05 Toyoda Gosei Co., Ltd. Light emitting device
JP2007109947A (ja) * 2005-10-14 2007-04-26 Toyoda Gosei Co Ltd 蛍光体板及びこれを備えた発光装置
JP4873963B2 (ja) * 2006-02-27 2012-02-08 京セラ株式会社 発光装置およびそれを用いた照明装置
EP3264542B1 (en) * 2006-03-10 2019-06-05 Nichia Corporation Light-emitting device
JP2007266358A (ja) * 2006-03-29 2007-10-11 Kyocera Corp 発光装置および照明装置
JP2008004645A (ja) * 2006-06-20 2008-01-10 Harison Toshiba Lighting Corp 発光デバイス
CN101536197A (zh) * 2006-11-06 2009-09-16 皇家飞利浦电子股份有限公司 具有反射边缘的波长转换元件
EP2087563B1 (en) * 2006-11-15 2014-09-24 The Regents of The University of California Textured phosphor conversion layer light emitting diode
JP5236344B2 (ja) * 2008-04-24 2013-07-17 パナソニック株式会社 半導体発光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101902371B1 (ko) * 2017-03-02 2018-09-28 주식회사 이츠웰 파장 선택형 엘이디 패키지 및 이를 이용한 엘이디 패키지 어레이

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