JP5426241B2 - チップ抵抗器の表電極および裏電極 - Google Patents

チップ抵抗器の表電極および裏電極 Download PDF

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Publication number
JP5426241B2
JP5426241B2 JP2009139413A JP2009139413A JP5426241B2 JP 5426241 B2 JP5426241 B2 JP 5426241B2 JP 2009139413 A JP2009139413 A JP 2009139413A JP 2009139413 A JP2009139413 A JP 2009139413A JP 5426241 B2 JP5426241 B2 JP 5426241B2
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JP
Japan
Prior art keywords
glass frit
electrode
chip resistor
conductive paste
metal oxide
Prior art date
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Active
Application number
JP2009139413A
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English (en)
Japanese (ja)
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JP2010287678A (ja
Inventor
光 宇野
浩 柴田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Priority to JP2009139413A priority Critical patent/JP5426241B2/ja
Priority to TW99117453A priority patent/TW201110159A/zh
Priority to CN2010102004973A priority patent/CN101923929A/zh
Publication of JP2010287678A publication Critical patent/JP2010287678A/ja
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Publication of JP5426241B2 publication Critical patent/JP5426241B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/14—Silica-free oxide glass compositions containing boron
    • C03C3/145—Silica-free oxide glass compositions containing boron containing aluminium or beryllium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/22—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions containing two or more distinct frits having different compositions

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Adjustable Resistors (AREA)
  • Details Of Resistors (AREA)
  • Non-Insulated Conductors (AREA)
JP2009139413A 2009-06-10 2009-06-10 チップ抵抗器の表電極および裏電極 Active JP5426241B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009139413A JP5426241B2 (ja) 2009-06-10 2009-06-10 チップ抵抗器の表電極および裏電極
TW99117453A TW201110159A (en) 2009-06-10 2010-05-31 Chip resistor front electrode and back electrode
CN2010102004973A CN101923929A (zh) 2009-06-10 2010-06-04 片式电阻器正面电极和背面电极

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009139413A JP5426241B2 (ja) 2009-06-10 2009-06-10 チップ抵抗器の表電極および裏電極

Publications (2)

Publication Number Publication Date
JP2010287678A JP2010287678A (ja) 2010-12-24
JP5426241B2 true JP5426241B2 (ja) 2014-02-26

Family

ID=43338781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009139413A Active JP5426241B2 (ja) 2009-06-10 2009-06-10 チップ抵抗器の表電極および裏電極

Country Status (3)

Country Link
JP (1) JP5426241B2 (zh)
CN (1) CN101923929A (zh)
TW (1) TW201110159A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10115505B2 (en) 2017-02-23 2018-10-30 E I Du Pont De Nemours And Company Chip resistor

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012099877A1 (en) * 2011-01-18 2012-07-26 Heraeus Precious Metals North America Conshohocken Llc Electroconductive paste compositions and solar cell electrodes and contacts made therefrom
US8808581B2 (en) * 2011-08-15 2014-08-19 E I Du Pont De Nemours And Company Conductive compositions containing Li2RuO3 and ion-exchanged Li2RuO3 and their use in the manufacture of semiconductor devices
CN102636527A (zh) * 2012-04-23 2012-08-15 常州联德电子有限公司 镶嵌式板状氧传感器及其制备方法
MY183351A (en) * 2014-09-12 2021-02-18 Shoei Chemical Ind Co Resistive composition
CN104795128B (zh) * 2015-05-14 2017-02-22 刘飞全 一种无铅电阻浆料及其制造工艺和应用
US20180061536A1 (en) * 2016-08-26 2018-03-01 E I Du Pont De Nemours And Company Chip resistor
CN108766696A (zh) * 2018-06-08 2018-11-06 肇庆市安捷电子有限公司 一种片式压敏电阻器用钯银浆料
CN110931145A (zh) * 2019-12-18 2020-03-27 广东顺德弘暻电子有限公司 一种基于不锈钢基材的厚膜银铂电阻浆料及其制备方法
WO2021145269A1 (ja) * 2020-01-16 2021-07-22 ナミックス株式会社 導電性ペースト、電極及びチップ抵抗器
CN111230353B (zh) * 2020-01-19 2021-08-17 深圳第三代半导体研究院 一种改善银电迁移的纳米Ag-SnO2焊膏制备方法及其应用

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7339780B2 (en) * 2004-06-09 2008-03-04 Ferro Corporation Copper termination inks containing lead free and cadmium free glasses for capacitors
US7556748B2 (en) * 2005-04-14 2009-07-07 E. I. Du Pont De Nemours And Company Method of manufacture of semiconductor device and conductive compositions used therein
EP2191479A1 (en) * 2007-10-18 2010-06-02 E. I. du Pont de Nemours and Company Conductive compositions and processes for use in the manufacture of semiconductor devices: flux materials

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10115505B2 (en) 2017-02-23 2018-10-30 E I Du Pont De Nemours And Company Chip resistor

Also Published As

Publication number Publication date
TW201110159A (en) 2011-03-16
JP2010287678A (ja) 2010-12-24
CN101923929A (zh) 2010-12-22

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