JP5420124B1 - 電球形ランプ、照明装置及び電球形ランプの製造方法 - Google Patents

電球形ランプ、照明装置及び電球形ランプの製造方法 Download PDF

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Publication number
JP5420124B1
JP5420124B1 JP2013543079A JP2013543079A JP5420124B1 JP 5420124 B1 JP5420124 B1 JP 5420124B1 JP 2013543079 A JP2013543079 A JP 2013543079A JP 2013543079 A JP2013543079 A JP 2013543079A JP 5420124 B1 JP5420124 B1 JP 5420124B1
Authority
JP
Japan
Prior art keywords
light emitting
hole
terminal
shaped lamp
insertion member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013543079A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2014006789A1 (ja
Inventor
健太 渡邉
敏明 倉地
功幸 長浜
直紀 田上
考志 大村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2013543079A priority Critical patent/JP5420124B1/ja
Application granted granted Critical
Publication of JP5420124B1 publication Critical patent/JP5420124B1/ja
Publication of JPWO2014006789A1 publication Critical patent/JPWO2014006789A1/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90Methods of manufacture
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/53Fixed connections for rigid printed circuits or like structures connecting to cables except for flat or ribbon cables
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10242Metallic cylinders
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10295Metallic connector elements partly mounted in a hole of the PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
JP2013543079A 2012-07-06 2013-03-04 電球形ランプ、照明装置及び電球形ランプの製造方法 Expired - Fee Related JP5420124B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013543079A JP5420124B1 (ja) 2012-07-06 2013-03-04 電球形ランプ、照明装置及び電球形ランプの製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012152865 2012-07-06
JP2012152865 2012-07-06
PCT/JP2013/001300 WO2014006789A1 (ja) 2012-07-06 2013-03-04 電球形ランプ、照明装置及び電球形ランプの製造方法
JP2013543079A JP5420124B1 (ja) 2012-07-06 2013-03-04 電球形ランプ、照明装置及び電球形ランプの製造方法

Publications (2)

Publication Number Publication Date
JP5420124B1 true JP5420124B1 (ja) 2014-02-19
JPWO2014006789A1 JPWO2014006789A1 (ja) 2016-06-02

Family

ID=49881567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013543079A Expired - Fee Related JP5420124B1 (ja) 2012-07-06 2013-03-04 電球形ランプ、照明装置及び電球形ランプの製造方法

Country Status (3)

Country Link
JP (1) JP5420124B1 (zh)
CN (1) CN204387719U (zh)
WO (1) WO2014006789A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150330615A1 (en) * 2014-05-15 2015-11-19 Posco Led Company Ltd. Optical semiconductor illuminating apparatus
CN106969277A (zh) * 2017-06-02 2017-07-21 横店集团得邦照明股份有限公司 一种绝缘固化型led灯

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004207649A (ja) * 2002-12-26 2004-07-22 Rohm Co Ltd 発光装置及び照明装置
JP2009016662A (ja) * 2007-07-06 2009-01-22 Yazaki Corp メタルコア基板
JP2010157459A (ja) * 2008-12-31 2010-07-15 Keiji Iimura Ledランプおよび電球形ledランプ
CA2687529A1 (en) * 2009-12-03 2010-08-23 Allen H. L. Su Led light bulb with improved illumination and heat dissipation
WO2012060061A1 (ja) * 2010-11-04 2012-05-10 パナソニック株式会社 電球形ランプ及び照明装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004207649A (ja) * 2002-12-26 2004-07-22 Rohm Co Ltd 発光装置及び照明装置
JP2009016662A (ja) * 2007-07-06 2009-01-22 Yazaki Corp メタルコア基板
JP2010157459A (ja) * 2008-12-31 2010-07-15 Keiji Iimura Ledランプおよび電球形ledランプ
CA2687529A1 (en) * 2009-12-03 2010-08-23 Allen H. L. Su Led light bulb with improved illumination and heat dissipation
WO2012060061A1 (ja) * 2010-11-04 2012-05-10 パナソニック株式会社 電球形ランプ及び照明装置

Also Published As

Publication number Publication date
JPWO2014006789A1 (ja) 2016-06-02
WO2014006789A1 (ja) 2014-01-09
CN204387719U (zh) 2015-06-10

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