JP5384693B2 - Semiconductor package - Google Patents

Description

The present invention relates to a semiconductor package, and more particularly, the functional element having a semiconductor substrate arranged on one surface, a space more independent in a region which does not overlap with the functional elements on one surface the It relates to a semiconductor package comprising a protective substrate which is bonded via the adhesive layer.

Conventionally, as a semiconductor package including a functional element such as an image sensor, the functional element disposed on the semiconductor substrate is sealed with a protective substrate in order to protect the functional element from the external atmosphere during the manufacturing process and in use. This structure is widely used.
For example, in Patent Document 1, a functional substrate is provided on one surface, a semiconductor substrate having a through electrode that is electrically connected to the functional device and extends to the other surface, and a cap substrate are disposed around the functional device. A semiconductor package having a structure in which the functional elements are bonded to each other by using an arranged sealing material and a manufacturing method thereof are described.

In the structure of a semiconductor package including a semiconductor substrate in which a functional element is arranged on one surface and a protective substrate bonded to the one surface via an adhesive layer, it is important to improve the reliability of the bonding It is.
However, when an adhesive layer is formed on the semiconductor substrate and bonded to the protective substrate by thermocompression bonding, bubbles are generated at the interface between the adhesive layer and the substrate for various reasons. The generation of the bubbles is caused by, for example, gas generated when the adhesive resin is thermally cured, or unevenness on the surface of the adhesive resin or the substrate. In the case where the adhesive layer is formed in the entire adhesive area, there is a risk that the air bubbles may cause poor bonding and eventually decrease reliability.

JP 2006-19428 A

The present invention has been made in view of the above circumstances, and reduces the generation of bubbles at the interface between the adhesive layer and each substrate when the adhesive layer is disposed between the semiconductor substrate and the protective substrate and bonded together. In addition, a first object is to provide a semiconductor package having a structure in which the generated bubbles are less likely to induce a defective bonding state.
In addition, the present invention reduces the generation of bubbles at the interface between the adhesive layer and each substrate when an adhesive layer is disposed between the semiconductor substrate and the protective substrate and bonded to each other. It is a second object to provide a method for manufacturing a semiconductor package that can be formed.

To solve the above problems, a semi-conductor package according to claim 1 of the present invention includes a semiconductor substrate having an optical device is disposed on one side, are joined via a transparent adhesive layer on one face the A semiconductor package comprising a transparent protective substrate, wherein the optical device is sealed by the semiconductor substrate and the adhesive layer, and the adhesive layer has a plurality of first spaces in a region that does not overlap the optical device. The first spaces are arranged independently of each other and isolated from the external space, and all the first spaces are respectively connected to the protective layer from the semiconductor substrate to the protective substrate. It penetrates in the thickness direction .

A semiconductor package according to a second aspect of the present invention is the semiconductor package according to the first aspect, wherein the first space is arranged in an outer peripheral region of the semiconductor substrate.
A semiconductor package according to a third aspect of the present invention is characterized in that, in the first or second aspect, the adhesive layer has a second space in a region overlapping the optical device .
A semiconductor package according to a fourth aspect of the present invention is characterized in that, in any one of the first to third aspects, the adhesive layer is made of a resin having an adhesive function.

  A method for manufacturing a semiconductor package according to claim 5 of the present invention uses a semiconductor substrate in which functional elements are arranged on one surface, and a plurality of first spaces are formed in a region that does not overlap the functional elements on the one surface. It is characterized by comprising at least a process A for forming an inherent adhesive layer so as to be independent from each other and isolated from the external space, and a process B for attaching a protective substrate via the adhesive layer.

  The method for manufacturing a semiconductor package according to claim 6 of the present invention is the method for manufacturing a semiconductor package according to claim 5, wherein the adhesive layer is provided so that the second space is included in a region where the step A and the functional element overlap with the first space. It is characterized by that.

  A semiconductor package according to the present invention (Claim 1) is provided by providing a plurality of independent first and second isolated spaces from an external space in an adhesive layer that joins a semiconductor substrate and a protective substrate. These first spaces function as a pool for outgas generated when the adhesive resin is thermally cured to form an adhesive layer. Therefore, since the outgas is induced from the vicinity of the interface between the adhesive layer and each substrate to the first space, the outgas hardly remains in the vicinity of the interface, and as a result, the generation of bubbles at the interface can be reduced (first). One effect). In addition, the presence of these first spaces results in a configuration in which the adhesive layer is in contact with both substrates in an uneven manner, so that when the substrates are pressure-bonded with the adhesive layer sandwiched, the adhesive layer made of resin is excessive. This eliminates the possibility of receiving external force and thus suppresses deformation of the adhesive layer itself (second effect). By combining these two effects, the present invention contributes to the provision of a semiconductor package with high reliability in the bonded state.

  A method of manufacturing a semiconductor package according to the present invention (Claim 5) uses a semiconductor substrate in which a functional element is disposed on one surface, and a plurality of independent elements are provided in a region that does not overlap the functional element on the one surface. In addition, the process B for attaching the protective substrate through the adhesive layer is followed by the process A for forming the adhesive layer having the first space so as to be isolated from the external space. The outgas generated near the interface with the substrate can be guided to a first space provided in a region that does not overlap with the functional element. As a result, it is difficult for the outgas to remain in the region overlapping the functional element, and the bubbles generated in the region overlapping the functional element can be significantly reduced. Therefore, according to the present invention, it is possible to obtain a manufacturing method capable of easily forming a semiconductor package having a good bonded state.

The schematic diagram which shows an example of the semiconductor package of 1st embodiment which concerns on this invention. The schematic diagram which shows another example of the semiconductor package of 1st embodiment which concerns on this invention. The schematic diagram which shows another example of the semiconductor package of 1st embodiment which concerns on this invention. The schematic diagram which shows an example of the semiconductor package of 2nd embodiment which concerns on this invention. The schematic diagram showing the process of the manufacturing method of the semiconductor package shown in FIG. The schematic diagram showing the process of following FIG. FIG. 5 is a schematic diagram showing a process of the semiconductor package manufacturing method shown in FIG. 4. The schematic diagram showing the process of following FIG.

Hereinafter, embodiments of a semiconductor package according to the present invention will be described with reference to the drawings.
FIG. 1 is a drawing showing an example of a semiconductor package according to the first embodiment of the present invention. FIG. 1A is a schematic plan view showing the shape of an adhesive layer taken along the line AA in FIG. FIG. 2B is a schematic cross-sectional view of the semiconductor package viewed from the thickness direction.
The semiconductor package 1 according to the first embodiment of the present invention includes a plurality of first spaces 13a in a region α where the semiconductor substrate 11 and the protective substrate 16 in which the functional elements 12 are arranged on one surface do not overlap the functional elements 12. It is comprised by joining through the contact bonding layer 14 which has (13). At this time, the first spaces 13a (13) are independent of each other.
At that time, as shown in FIG. 2, the first space 13 b (13) penetrating between the semiconductor substrate 11 and the protective substrate 16 may be used, or only one of the semiconductor substrate 11 and the protective substrate 16 may be provided. The first space 13c (13) may be arranged so as to open.
According to the structure of the semiconductor package of the present invention, a plurality of first spaces 13 that are independent from each other are provided in a region α that does not overlap the functional element 12 in the adhesive layer 14 that joins the semiconductor substrate 11 and the protective substrate 16. As a result, these first spaces 13 function as a pool of outgas generated when the adhesive resin 14 is formed by thermosetting the adhesive resin. Therefore, since the outgas is induced from the vicinity of the interface between the adhesive layer 14 and each substrate to the first space 13, it is difficult for the outgas to remain in the vicinity of this interface, and as a result bubbles (hereinafter also referred to as “voids”) at the interface. ) Can be reduced (first effect). Further, due to the presence of the first space 13, the adhesive layer 14 comes into contact with both substrates in an uneven manner, and the adhesive layer 14 made of resin is excessive when the substrates are pressure-bonded with the adhesive layer 14 in between. This eliminates the possibility of receiving external force and thus suppresses deformation of the adhesive layer itself (second effect). As a result, it is possible to improve the reliability of the bonding state between the two substrates bonded via the adhesive layer 14.

Furthermore, in the semiconductor package 1 of the present invention, the plurality of independent first spaces 13 are preferably arranged in a region near the outer periphery of the semiconductor substrate 11 when viewed from the functional element 12 provided on the semiconductor substrate 11. By adopting such an arrangement, air bubbles (voids) generated in the outer peripheral region can be positively eliminated, so that it is possible to further reduce bonding defects.
At this time, the shape, area, or number of patterns constituting the first space 13 can be any as long as it satisfies the adhesive strength. For example, examples of the shape of the adhesive layer 14 include those shown in FIGS.
FIG. 3A is an arrangement example in which rectangular first spaces 13d and 13e are provided so as to have a longitudinal direction along the outer periphery of the four sides. In FIG. 3B, rectangular first spaces 13f and 13g are provided in a zigzag pattern so as to have a longitudinal direction along the outer periphery of two opposing sides, and in particular, one of the first spaces 13g is locally provided in the semiconductor package. 1 is an example of arrangement in communication with the outside of 1. FIG. 3C is an arrangement example in which a circular first space 13h is provided along the outer periphery of two opposing sides. FIG. 3D is an arrangement example in which the rectangular first spaces 13 i and 13 j are provided so that the longitudinal directions are all in one direction along the outer periphery of the four sides.
By adopting the structure in which the first space 13 is arranged in the outer peripheral area in this way, the generation of bubbles at the interface between the adhesive layer and each substrate can be reduced in the outer peripheral area. As a result, when the semiconductor package is diced by wafer level package technology, the reliability of the bonded state particularly in the vicinity of the side surface can be improved.

FIG. 4 is a drawing for explaining an example of a semiconductor package according to the second embodiment of the present invention. FIG. 4A is a view showing the shape of an adhesive layer along the line BB in FIG. (B) is sectional drawing which follows a thickness direction.
Similar to the semiconductor package according to the first embodiment, the semiconductor package 2 according to the second embodiment of the present invention includes a semiconductor substrate 11 having a functional element 12 disposed on one surface and a protective substrate 16 via an adhesive layer 14. Are joined together.
In the semiconductor package 2 according to the second embodiment, in addition to the plurality of mutually independent first spaces 13k (13) arranged in the region α that does not overlap with the functional element 12 in the adhesive layer 14, the region that overlaps with the functional element 12 The second space 15 is included in β.
According to the structure of the semiconductor package according to the second embodiment, first, similarly to the first embodiment, the effect by arranging the first space 13k (13), that is, the first effect and the second effect described above are provided. ing. In addition, by having the second space 15 in the region β that overlaps with the functional element 12, air bubbles remain in the upper part of the functional element 12, and the capability of the functional element 12 may be hindered by the influence of the air bubbles. Disappear. Therefore, the provision of the second space 15 can provide a semiconductor package in which, for example, an image sensor or a light emitting element is mounted as the functional element 12.

  Examples of semiconductor packages (devices) that can use the present invention include devices having functional elements having a three-dimensional structure on the substrate surface, such as image sensors and MEMS devices. The semiconductor package of the present invention can be suitably used for manufacturing using wafer level package technology.

  The protective substrate 16 can be selected depending on the application, such as a glass substrate or a silicon substrate. In the case of packaging an optical device such as an image sensor, a transparent substrate such as a glass substrate is generally used.

  The adhesive layer 14 is preferably formed using a resin having an adhesive function, which can reduce the temperature of the manufacturing process. In particular, it can be applied to an element having a low temperature resistance (about 200 ° C.), for example, a package of an individual imaging element. In addition, when the adhesive layer 14 is an adhesive resin layer made of a resin having an adhesive function, in the wafer level package technology, when dicing after packaging, the dicing blade is relatively less than when the adhesive layer is formed of metal. Can be easily cut. Furthermore, if a photosensitive adhesive resin or the like is used, the process can be simplified.

  The structure of the semiconductor package of the present invention is also effective for a semiconductor substrate that does not have a functional element on the surface. For example, even when an adhesive is applied to the entire surface of a device substrate or a support substrate, as in a wafer support system, by bonding the adhesive layer with a hollow structure, the interface between the adhesive layer and each substrate is provided. The generation of bubbles can be reduced, and the reliability of the joined state can be improved.

Next, an example of a method for manufacturing these semiconductor packages will be described with reference to the drawings.
FIG. 5 is a diagram for explaining a process of the semiconductor package manufacturing method according to the first embodiment of the present invention, in which a semiconductor having an adhesive layer having a plurality of independent first spaces in a region that does not overlap with a functional element. It is sectional drawing which shows an example of a board | substrate. FIG. 6 is a diagram for explaining a state in which a protective substrate is bonded to a semiconductor substrate as a process subsequent to FIG. 5. FIG. 6A shows the shape of the adhesive layer along the line CC in FIG. FIG. 6B is a cross-sectional view along the thickness direction.

In the method of manufacturing a semiconductor package according to the first embodiment of the present invention, first, as shown in FIG. 5, a region α that does not overlap with the functional element 12 on the surface of the semiconductor substrate 11 on which the functional element 12 is disposed. Then, the adhesive layer 14 having the first opening 13A is formed (step A).
Here, although an example in which the adhesive layer 14 is formed on the semiconductor substrate 11 will be described in detail, the adhesive layer 14 may be formed on the protective substrate 16.
The adhesive layer can be formed by applying a varnish-like or paste-like photosensitive adhesive by spin coating, printing, dispensing, etc., or by forming a film-like photosensitive adhesive by lamination, and by photolithography. The method of forming the pattern can be used. Examples of the adhesive resin include epoxy resin, silicone resin, acrylic resin, polyimide resin, and benzocyclobutene resin.

Next, as shown in FIG. 6, the first opening 13 </ b> A is a gap provided between the surface of the semiconductor substrate 11 on which the functional element 12 is disposed and the protective substrate 16. It is formed by being bonded to the protective substrate 16 through the layer 14 (step B).
As a joining method at that time, for example, a thermocompression bonding method is exemplified. In this method, the adhesive is heated and pressed in a vacuum chamber, and the adhesive is thermally cured at a predetermined curing temperature during or after the pressing. The curing temperature varies depending on the material, but is generally about 150 to 400 ° C.

The method for manufacturing a semiconductor package according to the first embodiment includes at least a process A and a process B following the process A, whereby the adhesive layer 14 disposed between the semiconductor substrate 11 and the protective substrate 16 is provided. A semiconductor package having a structure having a plurality of first spaces 13a (13) independent from each other can be obtained.
At that time, in step B, the outgas generated near the interface between the adhesive layer 14 and each substrate can be guided to the first space 13 a (13) provided in the region α that does not overlap the functional element 12. This makes it difficult for the outgas to remain in the region β overlapping with the functional element 12, and the bubbles generated in the region β overlapping with the functional element 12 can be significantly reduced. Therefore, according to the present invention, a manufacturing method capable of forming a highly reliable semiconductor package in a bonded state by a simple process can be obtained.
Next, as shown in FIG. 6, by performing a cutting process at a location [for example, a portion of the adhesive layer 14 b (14)] indicated by a double two-dot chain line, an individualized semiconductor package is formed. .

  The method for manufacturing a semiconductor package according to the present invention includes at least a process A and a process B. However, as long as the operations and effects of the process A and the process B can be obtained, processes other than these two processes may be separately provided. Absent.

  FIG. 7 is a diagram for explaining a process of a method for manufacturing a semiconductor package according to the second embodiment of the present invention, in a region overlapping with a functional element, together with a plurality of independent first spaces in a region not overlapping with the functional element. It is sectional drawing which shows an example of the semiconductor substrate provided with the contact bonding layer which has 2nd space. FIG. 8 is a diagram for explaining a state in which a protective substrate is bonded to a semiconductor substrate as a process following FIG. 7, and FIG. 8A shows the shape of the adhesive layer along the line CC in FIG. 8B. FIG. 6B is a cross-sectional view along the thickness direction.

In the semiconductor package manufacturing method according to the second embodiment of the present invention, the adhesive layer 14 is first formed on the semiconductor substrate 11 and then the adhesive layer 14, as in the semiconductor package manufacturing method according to the first embodiment. This is a method of bonding the protective substrate 16 on the substrate.
As shown in FIG. 7, the method for manufacturing a semiconductor package according to the second embodiment includes a plurality of independent first openings arranged in a region α that does not overlap with the functional element 12 in the step A of forming the adhesive layer 14. Simultaneously with the portion 13K, a second opening 15K disposed in the region β overlapping with the functional element 12 is provided.
Thereafter, as shown in FIG. 8, the first opening 13 </ b> K and the second opening 15 </ b> K are bonded so that a gap is provided between the surface of the semiconductor substrate 11 on which the functional element 12 is disposed and the protective substrate 16. By performing the process B in which the protective substrate 16 is bonded via the layer 14, the adhesive layer 14 disposed between the semiconductor substrate 11 and the protective substrate 16 has a plurality of regions α that do not overlap the functional element 12. A semiconductor package having a structure in which the first space 13k (13) independent from each other and the second space 15 in the region β overlapping the functional element 12 can be obtained.
Next, as shown in FIG. 8, by performing a cutting process at a location [for example, a portion of the adhesive layer 14 e (14)] indicated by a double two-dot chain line, an individualized semiconductor package is formed. . First spaces 13k and 13k ′ (13) are provided in the cut semiconductor packages, respectively.

According to the method for manufacturing a semiconductor package according to the second embodiment, first, similarly to the first embodiment, in step B, the outgas generated near the interface between the adhesive layer 14 and each substrate is converted into the first space 13k ( 13), it is possible to remarkably reduce bubbles generated at the substrate interface. In addition to this, by simultaneously forming the second space 15 in the region β overlapping with the functional element 12, bubbles remain in the upper part of the functional element 12, and the capability of the functional element 12 may be hindered by the influence of the bubbles. Disappears.
According to this method, since the first opening 13K and the second opening 15K are formed at the same time, the number of processes is not increased. For example, a semiconductor package suitable for mounting an image sensor or a light emitting element as the functional element 12 can be easily obtained. The manufacturing method which can be formed is obtained.

  INDUSTRIAL APPLICABILITY The present invention can be used for a semiconductor package in which a semiconductor substrate on which a functional element is arranged and a protective substrate are bonded via an adhesive layer having a plurality of independent spaces, and the manufacturing thereof, for example, an image sensor. It is suitable for a device having a functional element having a three-dimensional structure on the substrate surface, such as a semiconductor device or a MEMS device.

  Region that does not overlap with α functional element, region that overlaps with β functional element, 1, 2 semiconductor package, 11 semiconductor substrate, 12 functional element, 13 (13a, 13b, 13c, 13d, 13e, 13f, 13g, 13h, 13i, 13j 13k, 13k ′) first space, 13A, 13K first opening, 14 adhesive layer, 15 second space, 15K second opening, 16 protective substrate, 17 dicing line.

Claims (4)

An optical device is a semiconductor package comprising a semiconductor substrate disposed on one surface, and a transparent protective substrate bonded on the one surface via a transparent adhesive layer,
The optical device is sealed by the semiconductor substrate and the adhesive layer,
The adhesive layer has a plurality of first spaces in a region that does not overlap the optical device , the first spaces are arranged independently of each other and isolated from the external space ,
Each and every of the first space, the way extending from the semiconductor substrate to the protective substrate, a semiconductor package, characterized in that extending through the thickness direction of the adhesive layer.   The semiconductor package according to claim 1, wherein the first space is arranged in an outer peripheral region of the semiconductor substrate. The semiconductor package according to claim 1, wherein the adhesive layer has a second space in a region overlapping with the optical device .   The semiconductor package according to any one of claims 1 to 3, wherein the adhesive layer is made of a resin having an adhesive function.

Images