JP5383031B2 - 防湿ledパッケージ - Google Patents
防湿ledパッケージ Download PDFInfo
- Publication number
- JP5383031B2 JP5383031B2 JP2007321815A JP2007321815A JP5383031B2 JP 5383031 B2 JP5383031 B2 JP 5383031B2 JP 2007321815 A JP2007321815 A JP 2007321815A JP 2007321815 A JP2007321815 A JP 2007321815A JP 5383031 B2 JP5383031 B2 JP 5383031B2
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- JP
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- Prior art keywords
- moisture
- housing
- proof
- led package
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
- H01L2224/48097—Kinked the kinked part being in proximity to the bonding area outside the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Description
MSLテスト過程は、以下の通りである。
2a、2b LEDチップ
10 リードフレーム
11、12、13、14 リード端子
20 ハウジング
21 空洞
30 封止材
102 防湿孔
202 防壁
W ボンディングワイヤ
Claims (7)
- LEDが受容される空洞が形成されたハウジングと、
前記空洞から前記ハウジングを経て前記ハウジングの外側まで延長されたリード端子と、
前記空洞に充填された保護部材と、
前記ハウジング内から前記空洞内に至る位置において前記リード端子に貫通形で形成された防湿孔と、
を備える防湿LEDパッケージであって、
前記ハウジングは樹脂から成り、前記樹脂は前記防湿孔を塞ぎ且つ前記リード端子を支持するようにモールディングして形成されることを特徴とする防湿LEDパッケージ。 - 前記空洞は、ハウジングの上面部から下に行くほど漸進的に細くなる傾いた形状を有することを特徴とする請求項1に記載の防湿LEDパッケージ。
- 前記保護部材は、蛍光体を含むことを特徴とする請求項1に記載の防湿LEDパッケージ。
- 前記保護部材は、透光性の樹脂が前記空洞内に充填されて形成された透光性の封止材であることを特徴とする請求項1乃至3のうちいずれか1項に記載の防湿LEDパッケージ。
- 前記防湿孔は、前記ハウジング及び前記空洞と接するように位置し、前記防湿孔を塞ぐ前記ハウジングの一部が前記封止材と接合されたことを特徴とする請求項4に記載の防湿LEDパッケージ。
- 前記防湿孔は、前記リード端子に複数個が形成されることを特徴とする請求項1に記載の防湿LEDパッケージ。
- 前記防湿孔は、前記空洞を囲むように曲がった形状を有することを特徴とする請求項1に記載の防湿LEDパッケージ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2007-0122399 | 2007-11-29 | ||
KR1020070122399A KR101365622B1 (ko) | 2007-11-29 | 2007-11-29 | 방습 led 패키지 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009135379A JP2009135379A (ja) | 2009-06-18 |
JP5383031B2 true JP5383031B2 (ja) | 2014-01-08 |
Family
ID=40866968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007321815A Active JP5383031B2 (ja) | 2007-11-29 | 2007-12-13 | 防湿ledパッケージ |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5383031B2 (ja) |
KR (1) | KR101365622B1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101823506B1 (ko) * | 2011-06-29 | 2018-01-30 | 엘지이노텍 주식회사 | 발광 소자 패키지 및 이를 구비한 라이트 유닛 |
CN102426030B (zh) * | 2011-10-28 | 2013-06-26 | 西安欣源测控技术有限公司 | 水文长观孔监测仪防潮非屏蔽防盗保护罩 |
KR101946910B1 (ko) * | 2012-04-23 | 2019-02-12 | 엘지이노텍 주식회사 | 발광 소자, 발광 모듈 및 조명 시스템 |
CN108604629B (zh) * | 2016-02-05 | 2021-05-25 | Lg 伊诺特有限公司 | 发光元件封装 |
KR102385940B1 (ko) * | 2017-09-01 | 2022-04-13 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 패키지 및 광원 장치 |
CN113784565B (zh) * | 2021-09-16 | 2022-12-16 | 斐旻(上海)电子科技有限公司 | 一种电子元件的防潮封装体 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5326933Y2 (ja) * | 1973-11-19 | 1978-07-08 | ||
JPS6178149A (ja) * | 1984-09-26 | 1986-04-21 | Hitachi Ltd | 半導体装置 |
JPH038459A (ja) * | 1989-06-05 | 1991-01-16 | Geinzu:Kk | シャワーヘッド |
JPH038459U (ja) * | 1989-06-12 | 1991-01-28 | ||
JP3426574B2 (ja) * | 1997-07-24 | 2003-07-14 | 協和化成株式会社 | 表面実装部品及びその製造方法 |
JP3472450B2 (ja) * | 1997-09-04 | 2003-12-02 | シャープ株式会社 | 発光装置 |
JP2003218255A (ja) * | 2002-01-18 | 2003-07-31 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
JP2005197329A (ja) * | 2004-01-05 | 2005-07-21 | Stanley Electric Co Ltd | 表面実装型半導体装置及びそのリードフレーム構造 |
KR100638721B1 (ko) | 2005-01-28 | 2006-10-30 | 삼성전기주식회사 | 수지 흐름 개선용 리드 프레임 구조를 갖는 측면형발광다이오드 패키지 |
KR100798382B1 (ko) * | 2006-03-31 | 2008-01-28 | 서울반도체 주식회사 | 방열부를 갖는 리드 프레임 및 이를 이용한 발광 다이오드패키지 |
KR100764449B1 (ko) | 2006-10-24 | 2007-10-05 | 삼성전기주식회사 | 발광소자 패키지 |
-
2007
- 2007-11-29 KR KR1020070122399A patent/KR101365622B1/ko active IP Right Grant
- 2007-12-13 JP JP2007321815A patent/JP5383031B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2009135379A (ja) | 2009-06-18 |
KR101365622B1 (ko) | 2014-02-24 |
KR20090055659A (ko) | 2009-06-03 |
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