JP5379750B2 - Electronic circuit module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a top plate of a shield cover from coming into contact with internal electronic components even when the top plate is dented and to enable size reduction by lowering the height of the shield cover. <P>SOLUTION: An electronic circuit module 10 comprises: a circuit board 12 on which electronic components 14-20 are mounted; and a shield cover 22 made of a metal plate covering the electronic components 14-20 and mounted on the circuit board 12. The shield cover 22 has: a substantially square top plate 22a; first side walls 22b arranged on four corners of the top plate 22a; and second side walls 22c extending from the top plate 22a toward the circuit board 12 and folded inward of the shield cover 22. If the top plate 22a is pressurized from above, the top plate 22a is dented, causing the second side walls 22c to move from inside the shield cover 22 to the outside. As a result, end portions on the side of the circuit board 12 are brought into contact with the circuit board 12, thereby supporting the shield cover 22 together with the first side walls 22b. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

  The present invention relates to an electronic circuit module, and more particularly to an electronic circuit module having a metal cover.

  For example, some electronic circuit modules in which high-frequency electronic components are mounted on a circuit board include a metal shield cover that covers the electronic components. The shield cover is usually fixed to the circuit board using solder. In this state, the shield cover protects the electronic components and at the same time functions as a noise countermeasure by being grounded to the circuit on the board. In order for such a shield cover to perform its function sufficiently, it needs to be securely fixed to the circuit board both electrically and mechanically.

  As a method of fixing the shield cover to the circuit board, there is a method of soldering the shield cover to the circuit board. However, if all the side walls of the shield cover are soldered to the circuit board, the corresponding solder land, etc. It is also necessary, and the mounting area of the electronic component is reduced accordingly. In addition, the electronic components must be arranged to escape (avoid) to some extent inside the cover so that the electronic components mounted inside the shield cover do not come into contact with the solder. It becomes a factor to narrow.

Therefore, there is a technique in which soldering is performed only at the four corners of the side wall portion of the shield cover, the shield cover is fixed at the four corners, and the side wall portions other than the four corners of the shield cover are not soldered to the circuit board (for example, see Patent Document 1). ).
According to this prior art, it is considered that a large mounting area for electronic components on the circuit board can be secured by minimizing the portion to be soldered. Further, according to this prior art, the shield cover is fixed to the circuit board at the four corners of the circuit board, and the side wall of the shield cover is engaged with the end face of the circuit board, so that the shield cover can be easily positioned. I think it can be done.

JP 2008-182007 A

By the way, in recent years, electronic circuit modules have been increasingly miniaturized.
In addition to securing a mounting area as a planar problem as in the prior art described above, it is required to reduce the thickness of the electronic circuit module itself as much as possible as a problem in the height direction.

  Here, the electronic circuit module is mounted on a mother board or the like by a component mounting apparatus (mounter or the like). In this case, a tubular member called a suction nozzle is applied to the top plate portion of the cover of the electronic circuit module. The electronic circuit module is adsorbed by the adsorption nozzle by reducing the internal pressure of the adsorption nozzle and mounted at a predetermined position on the mother board or the like.

  At this time, when the suction nozzle comes into contact with the top plate portion of the cover of the electronic circuit module or when the electronic circuit module is placed at a predetermined position such as a mother board, a force (mount load) is applied from the suction nozzle to the top plate portion. ) And the top plate of the cover may be recessed inside the cover.

When the top plate portion is recessed and the recessed portion of the top plate portion comes into contact with the internal electronic component, the electronic component may break down.
Therefore, in consideration of the dent of the top plate portion, a certain clearance (clearance) that allows for the dent must be provided in advance between the top plate portion and the internal electronic component. By providing such a gap in advance, even if the top plate portion is recessed by contact with the suction nozzle, it does not come into contact with the internal electronic components, so that the cause of failure can be eliminated. This is also the case with the prior art described above, and it is necessary to provide a certain gap between the top plate and the internal electronic components.

  However, this gap becomes an obstacle to lowering the height of the cover. In other words, as a contradictory event of the electronic circuit module, in order to protect the internal electronic components, a certain gap must be provided between the top plate of the cover and the internal electronic module. In other words, if this gap increases, miniaturization of the electronic module is hindered.

  Therefore, the present invention prevents the top plate portion from coming into contact with the internal electronic components even when the top plate portion of the cover is pressed and recessed from above, and the height of the cover is lowered to reduce the height of the electronic module itself. It is an object to provide a technology capable of downsizing.

In order to solve the above problems, the present invention employs the following solutions.
An electronic circuit module (which may be an electronic circuit unit or a high-frequency module) of the present invention includes a circuit board on which an electronic component is mounted, and a cover made of a metal plate that covers the electronic component and is mounted on the circuit board.

  Here, the cover is connected to a substantially rectangular top plate portion and a part of the periphery of the top plate portion via a folding portion, and is bent substantially perpendicular to the top plate portion by the folding portion, and is connected to the circuit board. The first side wall portion for fixing the cover to the circuit board and the other part of the peripheral edge of the top plate portion are connected via the folding portion, extend from the top plate portion toward the circuit board, and the inside of the cover by the folding portion. And a second side wall portion that is bent into a first side wall.

  In addition, the second side wall of the cover is in contact with the circuit board without being in contact with the circuit board in a normal state where it is disposed inside the cover with a certain gap, and the top plate is pressed from above. Then, when the top plate portion is recessed, the cover moves from the inside to the outside of the cover, and it is possible to shift the contact state where the end portion on the circuit board side contacts the circuit board.

  In the electronic circuit module of the present invention, in the normal state where the top plate portion is not pressurized, the second side wall portion is kept inside the cover with a certain clearance from the circuit board without contacting the circuit board. Has been placed. Since the second side wall portion is bent toward the inside of the cover, the second side wall portion is housed inside the cover in such a normal state.

  Further, when the top plate portion is pressed from above, the second side wall portion moves from the inside to the outside of the cover due to the depression of the top plate portion, and the end on the circuit board side contacts the circuit board. Transition to contact state. That is, the second side wall portion has a concave central portion of the top plate portion in a state where the top plate portion is pressurized, and the second side wall portion moves outward from the inside of the cover along with the depression.

  When the second side wall portion comes into contact with the circuit board, the second side wall portion is in a state of being held between the top plate portion and the circuit board in this state, and functions to receive the pressurizing force of the top plate portion. Thereby, even if a top plate part receives pressurization from the upper part, the dent of a top plate part can be suppressed to the minimum.

  Thus, by suppressing the dent of the top plate portion to a minimum, it is possible to prevent the top plate portion from being recessed and coming into contact with the electronic component to cause the electronic component to fail. In addition, by minimizing the dents on the top plate, the clearance between the top plate and the electronic components in anticipation of the dents can be minimized, and as a result, the height of the cover is lowered. It is possible to reduce the size of the electronic circuit module.

  As a configuration of the electronic circuit module of the present invention, the first side wall portion is formed at the four corners of the peripheral edge of the top plate portion, and the second side wall portion is formed at a portion excluding the four corners of the peripheral edge of the top plate portion. Is preferred.

  According to this invention, the first side wall portion is formed at the four corners of the peripheral edge of the top plate portion, and the second side wall portion is formed at a portion excluding the four corners of the peripheral edge of the top plate portion. While the cover is stably fixed at the four corners, the internal electronic components can be firmly protected by the second side wall portion in the other portions of the top plate portion. Moreover, since the first side wall portion supports the top plate portion at the four corners, when the top plate portion is pressurized from above, the pressure force is evenly distributed, and the dent of the top plate portion is accordingly distributed. Can be reduced.

  As a configuration of the electronic circuit module of the present invention, it is preferable that the second side wall portion is in contact with the circuit board substantially perpendicularly in the contact state.

  According to the present invention, in the contact state, the second side wall portion is in contact with the circuit board substantially perpendicularly, so that the pressure from the top plate portion of the cover can be received in an optimum and efficient state. .

  As a configuration of the electronic circuit module according to the present invention, the top plate portion is formed by pressure applied when the suction nozzle of the component mounting apparatus comes into contact or is sucked by the suction nozzle of the component mounting apparatus and placed at a predetermined position on the mother board. It is preferable to apply pressure.

  According to the present invention, since the top plate portion can be designed assuming a mounting load received from the suction nozzle of the component mounting apparatus, it is suitable for being handled by the component mounting apparatus and excellent in handling during mounting. An electronic circuit module can be provided.

  As a configuration of the electronic circuit module of the present invention, it is preferable that the top plate portion has no hole and has a flat surface.

  According to this invention, since the top plate portion is not provided with a hole and has a flat surface, there is no gap between the suction nozzle of the component mounting apparatus and sufficient suction by the suction nozzle is realized. be able to. Thereby, the unexpected pressurization is excluded, and the electronic circuit module can be mounted on the mother board or the like without any problem by receiving the assumed pressurization.

  According to the present invention, the second side wall portion of the cover is bent and arranged inside the cover, so that when the top plate portion is pressurized from above, the top plate portion is recessed, The two side walls move from the inside to the outside of the cover and come into contact with the circuit board. And since a 2nd side wall part supports the whole cover with a 1st side wall part, the dent of a top-plate part can be suppressed to the minimum. Thereby, the height of a cover can be lowered | hung and size reduction can be achieved.

1 is an exploded perspective view schematically showing an overall configuration of an electronic circuit module 10 of a first embodiment. 2 is a perspective view showing a completed state of the electronic circuit module 10. FIG. It is sectional drawing of the electronic circuit module 10 which follows the III-III line | wire in FIG. It is sectional drawing of the electronic circuit module 10 which follows the IV-IV line in FIG. It is a figure explaining the state at the time of adsorb | sucking the electronic circuit module 10 of 1st Embodiment with the adsorption | suction nozzle of a component mounting apparatus. It is a figure which shows 10 A of electronic circuit modules of a comparative example. It is a figure which shows 10 A of electronic circuit modules of a comparative example. It is a figure explaining the state at the time of adsorb | sucking the electronic circuit module 10A of a comparative example with the adsorption nozzle of a component mounting apparatus. It is a figure which compares and shows the electronic circuit module 10 of 1st Embodiment, and the electronic circuit module 10A of a comparative example. It is the figure which represented the degree of displacement of electronic circuit module 10 of a 1st embodiment, and electronic circuit module 10A of a comparative example by simulation analysis. It is the schematic diagram which showed a part of manufacturing process with the electronic circuit module 10 of 1st Embodiment, and the electronic circuit module 10A of a comparative example simply. It is a disassembled perspective view which shows roughly the whole structure of the electronic circuit module 10-2 of 2nd Embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[First Embodiment]
FIG. 1 is an exploded perspective view schematically showing the overall configuration of the electronic circuit module 10 of the first embodiment. The electronic circuit module 10 is, for example, a high-frequency module (unit) having a high-frequency band wireless communication function (wireless LAN, Bluetooth: registered trademark). Such an electronic circuit module 10 is, for example, a portable information terminal or a notebook personal computer. Etc. are built in.

[Circuit board]
The electronic circuit module 10 has a circuit board 12, and an electric circuit (not shown) is formed on the circuit board 12. For this reason, a wiring pattern (not shown) is provided on the mounting surface 12 a of the circuit board 12. The circuit board 12 may have a multilayer structure. In that case, a wiring pattern is also provided on the inner layer of the circuit board 12.

[Electronic parts]
A plurality of electronic components 14, 16, 18, 20, etc. are mounted on the mounting surface 12 a of the circuit board 12. Here, only a limited number of electronic components 14 to 20 are shown in order to prevent complication of the drawing, but other electronic components are also mounted on the mounting surface 12a, and these are to some extent. It is arranged in a dense state.

  Examples of the electronic components 14 to 20 to be mounted include passive elements such as a high-frequency chip or FET array packaged with an integrated circuit, a chip resistor, a chip coil, or a chip capacitor. Good. Among these, the relatively large electronic components 14 and 16 are, for example, surface mount type package components, and the outer shape thereof is a flat rectangular parallelepiped shape. These electronic components 14 to 20 are mounted on the circuit board 12 via, for example, solder bumps provided in advance on the bottom surface (not shown in FIG. 1). The electronic components 14 and 16 are components that occupy a large area on the mounting surface 12a among components to be mounted and have a relatively upper back (mounting height) on the mounting surface 12a.

[Hole]
For example, a through hole 12b or an insertion hole 12c is formed at a corner position (corner position) of the circuit board 12, respectively. These through holes 12b and insertion holes 12c are provided so as to penetrate the circuit board 12 in the thickness direction. In addition, a conductive layer (no reference numeral) is formed on the inner wall surface of the through hole 12b by, for example, a conductive paste or conductive plating. The conductive layer is connected to a ground (GND) of an electric circuit (not shown), for example.

[Shield cover]
The electronic circuit module 10 has a shield cover 22. The shield cover 22 is disposed so as to cover the electronic components 14 to 20 (including other electronic components) on the mounting surface 12a of the circuit board 12 in a completed state of the electronic circuit module 10, and the electronic components 14 to 20 are machined. And electrical protection (blocking noise from outside, preventing unwanted radio waves from radiating outside).

The shield cover 22 is formed by pressing a metal plate. The shape of the shield cover 22 is a substantially half-box shape with the lower end surface entirely opened in the state shown in FIG.
Here, the shield cover 22 has a top plate portion 22a opposed to the mounting surface 12a, a first side wall portion 22b formed at the four corners of the top plate portion 22a, and side portions other than the four corners of the top plate portion 22a. A second side wall portion 22c formed.

  The top plate portion 22a has a substantially rectangular shape, and has corner portions (chamfered portions) 24 at the four corners. Moreover, the top plate portion 22a is not provided with a hole, and the top plate portion 22a is a member having a flat surface.

  The first side wall portion 22b is connected to the corner portions 24 at the four corners of the periphery of the top plate portion 22a via the folding portion 28, is bent substantially perpendicular to the top plate portion 22a by the folding portion 28, and is connected to the circuit board 12. This is a member for fixing the shield cover 22 to the circuit board 12.

  The second side wall portion 22c is connected to a portion (four side portions of the top plate portion 22a) excluding the corner portion 24 at the periphery of the top plate portion 22a via the folding portion 30, and is connected to the circuit board 12 from the top plate portion 22a. It is a member that extends toward the inside and is bent inside the shield cover 22 by the folding portion 30. The function (operation mode) of the second side wall portion 22c will be described later.

〔leg〕
A leg 22d is formed integrally with the first side wall 22b at the lower end of the first side wall 22b. These leg portions 22d are arranged corresponding to the first side wall portions 22b at the four corners of the circuit board 12, respectively, and these leg portions 22d all extend from the first side wall portion 22b to the circuit board 12 (downward in FIG. 1). Protrusively toward. As shown by the one-dot chain line in FIG. 1, with the shield cover 22 attached to the circuit board 12, the four leg portions 22d are inserted into the corresponding through holes 12b or insertion holes 12c, respectively. Has become.

[Press fit of legs]
FIG. 2 is a perspective view showing a completed state of the electronic circuit module 10. As described above, with the shield cover 22 installed on the circuit board 12, the four leg portions 22d are inserted into the corresponding through holes 12b or insertion holes 12c. At this time, the inner diameters of the through hole 12b and the insertion hole 12c are substantially equal to the width of the leg portion 22d, and therefore the leg portion 22d is press-fitted into the corresponding through hole 12b or the insertion hole 12c. At this time, in the through hole 12b, the leg portion 22d is crimped to the conductive layer, whereby the conductive layer and the shield cover 22 are electrically connected (crimped). The first side wall portion 22b and the circuit board 12 are fixed by soldering or the like with each leg portion 22d inserted into the through hole 12b and the insertion hole 12c. The shield cover 22 is connected to a ground (GND) of an electric circuit (not shown).

Next, the internal structure of the electronic circuit module 10 of the first embodiment will be described.
FIG. 3 is a cross-sectional view of the electronic circuit module 10 taken along the line III-III in FIG. 4 is a cross-sectional view of the electronic circuit module 10 taken along line IV-IV in FIG. 3 and 4, the dimensions of each part are exaggerated in order to facilitate understanding of the internal structure of the electronic circuit module 10 and the positional relationship between the parts.

As shown in FIGS. 3 and 4, electronic components 14 to 20 are arranged inside the shield cover 22. The electronic components 14 to 20 are soldered on the bottom surfaces with solders 14 a to 20 a such as solder bumps.
A fixed gap (clearance) is provided between the top plate portion 22 a of the shield cover 22 and the electronic components 14 to 20. This gap is a space for preventing contact with the electronic components 14 to 20 when the top plate 22a is recessed.
The second side wall portion 22 c extends from the top plate portion 22 a toward the circuit board 12 and is bent inside the shield cover 22 without contacting the circuit board 12.

Next, the function (operation form) of the second side wall portion 22c will be described.
FIG. 5 is a diagram illustrating a state when the electronic circuit module 10 according to the first embodiment is sucked by the suction nozzle of the component mounting apparatus. In FIG. 5, the dimensions of each part are exaggerated in order to facilitate understanding of the function of the electronic circuit module 10.

  The electronic circuit module 10 is mounted on a mother board or the like (not shown) by a component mounting apparatus (mounter or the like) in the completed state shown in FIG. In this case, a tubular member called an adsorption nozzle is brought into contact with the top plate portion 22a of the shield cover 22 of the electronic circuit module 10, and the internal pressure of the adsorption nozzle is lowered so that the electronic circuit module 10 is adsorbed by the adsorption nozzle. It is mounted at a predetermined position on the mother board. Hereinafter, the state at the time of adsorption will be described.

  First, as shown in FIG. 5A, the suction nozzle 50 descends from above the electronic circuit module 10. At this time, the second side wall portion 22c is disposed inside the shield cover 22 with a certain gap between the second side wall portion 22c and the circuit board 12 without being in contact with the circuit board 12 (normal state).

  Next, as shown in FIG. 5B, the suction nozzle 50 comes into contact with the top plate portion 22 a of the electronic circuit module 10. Even in this state, the second side wall portion 22 c is still housed inside the shield cover 22.

  And as shown in FIG.5 (C), the suction nozzle 50 pushes in the top-plate part 22a, and the top-plate part 22a is pressurized from upper direction. This pressurization is a force applied not only when the suction nozzle 50 contacts the top plate portion 22a but also when the suction nozzle 50 is placed at a predetermined position on the mother board. Due to this pressurization, the top plate portion 22a is recessed downward, whereby the second side wall portion 22c moves from the inside to the outside of the shield cover 22, and the end of the second side wall portion 22c on the circuit board 12 side is the circuit. It will be in the state which touches the board | substrate 12 (contact state). In this contact state, the second side wall portion 22 c is in contact with the circuit board 12 substantially perpendicularly and supports the shield cover 22. Here, in order for the second side wall portion 22c to contact the circuit board 12 substantially perpendicularly when the pressure is applied, the pressure condition of the component mounting apparatus and the material / thickness of the shield cover 22 are determined. This can be realized by calculating the degree of movement of the second side wall portion 22c in advance and bending the second side wall portion 22c inside the shield cover 22 by that amount.

Basically, the process ends in the state of FIG. 5C, but when further pressurized, as shown in FIG. 5D, the second side wall portion 22c slightly slides outward and spreads slightly. Even if it becomes such a state, the 2nd side wall part 22c supports the shield cover 22 with the 1st side wall part 22b.
Since the second side wall portion 22c is disposed inside the shield cover 22 in the initial state (the state shown in FIG. 5A), even if the second side wall portion 22c opens to the outside of the shield cover 22 by sliding, The spread becomes small, and as a result, the dent of the top plate portion 22a can be reduced.
In addition, the second side wall portion 22c can shift from the normal state to the contact state by receiving pressure from the suction nozzle 50, and can be changed from the contact state to the normal state by releasing the pressure from the suction nozzle 50. Can be migrated to.

6 and 7 are diagrams showing an electronic circuit module 10A of a comparative example.
As shown in FIG. 6, in the electronic circuit module 10A of the comparative example, the second side wall portion 22e is not bent inside the shield cover 22 as in the first embodiment, but the top plate portion 22a or the circuit board. 12 is arranged perpendicular to 12. As shown in FIG. 7, there is no gap between the second side wall portion 22e and the circuit board 12 as in the first embodiment, and the second side wall portion 22e and the circuit board 12 are in contact with each other. However, it is not fixed by soldering or the like and can be moved freely.

  Then, with the shield cover 22 installed on the circuit board 12, the four leg portions 22d are inserted into the corresponding through holes 12b or insertion holes 12c and fixed by soldering or the like, as shown in FIG. The completed electronic circuit module 10A is obtained.

FIG. 8 is a diagram illustrating a state when the electronic circuit module 10A of the comparative example is sucked by the suction nozzle of the component mounting apparatus.
First, as shown in FIG. 8A, the suction nozzle 50 descends from above the electronic circuit module 10A. At this time, the second side wall portion 22 e is in contact with the circuit board 12.
Next, as shown in FIG. 8B, the suction nozzle 50 contacts the top plate portion 22a of the electronic circuit module 10A. Even in this state, the second side wall portion 22 e is in contact with the circuit board 12.
Then, as shown in FIG. 8C, the suction nozzle 50 pushes the top plate portion 22a, and the top plate portion 22a is pressurized from above. At this time, the second side wall portion 22e spreads outside the shield cover 22 and is not in a vertical state. Since the second side wall portion 22e is not in the vertical state, the force for supporting the shield cover 22 is weaker than that in the vertical state, and the top plate portion 22a is also greatly recessed.

  Basically, the process ends in the state of FIG. 8C, but when further pressurized, as shown in FIG. 8D, the second side wall portion 22e slides further outward to expand, and the shield cover. The power to support 22 is further weakened. Thus, the second side wall portion 22e barely supports the shield cover 22, and the displacement of the top plate portion 22a is also increased accordingly.

FIG. 9 is a diagram comparing the electronic circuit module 10 of the first embodiment and the electronic circuit module 10A of the comparative example. FIG. 9A shows the electronic circuit module 10 of the first embodiment, and FIG. 9B shows an electronic circuit module 10A of a comparative example.
As is clear from FIG. 9, when the same pressing force is applied to the top plate portion 22a, the electronic circuit module 10 of the first embodiment in FIG. 9A is displaced from the initial state by Y1, and FIG. The electronic circuit module 10A of the comparative example of B) was displaced by Y2. This difference, that is, “Y2−Y1” is the difference between the two forms.

  FIG. 10 is a diagram showing the degree of displacement between the electronic circuit module 10 of the first embodiment and the electronic circuit module 10A of the comparative example by simulation analysis. FIG. 10A is a plan view of the electronic circuit module 10 of the first embodiment, and FIG. 10B is a plan view of the electronic circuit module 10A of the comparative example.

  Here, the dent condition of the top plate portion 22a was evaluated using CAE (Computer Aided Engineering). Here, CAE is a computer system that supports product design, and is an analysis system that calculates whether the designed structure satisfies required performance such as strength.

  In this simulation, the degree of displacement when the electronic circuit module 10 of the first embodiment and the electronic circuit module 10A of the comparative example were pressurized from above with the same pressure was analyzed. In the electronic circuit module 10 of the first embodiment, the initial bending angle of the second side wall portion 22c is 110 degrees, and in the electronic circuit module 10A of the comparative example, the initial bending angle of the second side wall portion 22e is 90 degrees. It was. The folding angle is 0 degree when the second side wall portion is not folded, and is 90 degrees when folded at a right angle (comparative example), and is further folded at 110 degrees (first embodiment). .

  In the figure, the area outside the annular line A1 is an area where the top plate portion 22a is not displaced at all in the height direction of the electronic circuit module, and the area inside the annular line A4 is the height direction of the electronic circuit module. The top plate portion 22a is the most displaced portion.

As shown in FIG. 10A, the electronic circuit module 10 of the first embodiment means that the area outside the annular line A1 is relatively wide and the area displaced by pressurization is narrow.
On the other hand, as shown in FIG. 10B, in the electronic circuit module 10A of the comparative example, the area outside the annular line A1 is wider than that of the electronic circuit module 10 of the first embodiment, and the pressure is increased. This means that the displaced area is wide.

  Further, in the most displaced region inside the annular line A4, the electronic circuit module 10 of the first embodiment has a displacement (amount of deflection) of about 13% less than the electronic circuit module 10A of the comparative example. As a result.

  FIG. 11 is a schematic view schematically showing a part of the manufacturing process of the electronic circuit module 10 of the first embodiment and the electronic circuit module 10A of the comparative example. FIG. 11A shows the electronic circuit module 10 of the first embodiment, and FIG. 11B shows an electronic circuit module 10A of a comparative example. As for the electronic circuit module, only the circuit board 12, the top plate portion 22a, and the second side wall portions 22c and 22e are shown.

  For example, a plurality of electronic circuit modules arranged on a collective substrate or the like are separated through a dicing process and separated into individual electronic circuit modules. Specifically, each electronic circuit module can be separated into pieces by cutting the assembly board from the circuit board 12 side (see arrow A in the figure).

  At this time, the circuit board 12 is cut from the back side of the circuit board 12 (upward in the drawing) with a cutting machine (not shown). As shown in FIG. 11A, the electronic circuit of the first embodiment is cut. Since the second side wall 22c of the module 10 is bent inside the shield cover 22, the end of the second side wall 22c on the circuit board 12 side ensures a wide width between the adjacent electronic circuit modules 10. (See X1 in the figure). Therefore, when cutting the circuit board 12 (during dicing), there is an effect that the risk of damaging the second side wall portion 22c can be reduced. As a result, the individual electronic circuit modules 10 can be brought closer to each other, and the width of each electronic circuit module 10 can be widened, which contributes to miniaturization also in plan view.

  In contrast, in the electronic circuit module 10A of the comparative example, as shown in FIG. 11B, the second side wall portion 22c is perpendicular to the circuit board 12, so that there is a risk of cutting the second side wall portion 22e. In order to avoid this, it is necessary to secure a wide width (X2 in the figure) to some extent, and miniaturization cannot be realized in a plane.

  As described above, according to the electronic circuit module 10 of the first embodiment, the top plate portion 22a is recessed to come into contact with the electronic components 14 to 20 by minimizing the dent of the top plate portion 22a. -20 can be prevented from failing. Further, by minimizing the dent of the top plate portion 22a, the gap of the shield cover 22 in anticipation of the dent can be minimized, and as a result, the height of the shield cover 22 is lowered and the electronic circuit module 10 is reduced. Downsizing can be realized.

  Moreover, since the 1st side wall part 22b is formed in the four corners of the periphery of the top-plate part 22a, and the 2nd side wall part 22c is formed in the part except the four corners of the periphery of the top-plate part, the top-plate part 22a While the cover is stably fixed at the four corners, the other electronic parts 14 to 20 can be securely protected by the second side wall part 22c at the other part of the top plate part 22a. Further, since the first side wall portion 22b supports the top plate portion 22a at the four corners, when the top plate portion 22a is pressurized from above, the pressure force is evenly distributed, and the top plate The dent of the part 22a can be reduced.

  Furthermore, since the second side wall portion 22c is in contact with the circuit board 12 substantially perpendicularly (see FIG. 5C), the pressure from the top plate portion 22a of the shield cover 22 is optimal and efficient. Can be received in the state.

  Furthermore, since the top plate portion 22a can be designed assuming a mounting load received from the suction nozzle 50 of the component mounting apparatus, it is suitable for being handled by the component mounting apparatus and excellent in handling during mounting. A circuit module 10 can be provided.

  In addition, since the top plate portion 22a is not provided with a hole and has a flat surface, there is no gap between the suction nozzle 50 of the component mounting apparatus and sufficient suction by the suction nozzle 50 is realized. can do. Thereby, the unexpected pressurization is excluded, and the electronic circuit module 10 can be mounted on the mother board or the like without any problem by receiving the assumed pressurization.

[Second Embodiment]
FIG. 12 is an exploded perspective view schematically showing the overall configuration of the electronic circuit module 10-2 of the second embodiment. In addition, the same code | symbol shall be provided about the matter which is common in 1st Embodiment, and the duplicate description is abbreviate | omitted.

  The difference between the electronic circuit module 10-2 of the second embodiment and the electronic circuit module 10 of the first embodiment is that, in the first embodiment, the first side wall portions 22b are formed at the four corners of the shield cover 22. On the other hand, in the second embodiment, the first side wall 22b is formed on the side of the shield cover 22-2.

  Specifically, two first side wall portions 22b are disposed on the short side of the top plate portion 22a of the shield cover 22-2, and the shield cover 22-2 is interposed between the two first side wall portions 22b. A second side wall portion 22c bent inward is disposed. On the other hand, only the second side wall portion 22c bent inside the shield cover 22-2 is disposed on the long side of the top plate portion 22a of the shield cover 22-2. On the contrary, two first side wall portions 22b may be disposed on the long side of the shield cover 22-2.

  As in the first embodiment, the leg portion 22d below the first side wall portion 22b is inserted into the through hole 12b or the insertion hole 12c, and the shield cover 22-2 is fixed to the circuit board 12 by soldering or the like. Thus, the electronic circuit module 10-2 is completed.

  Even if the first side wall portion 22b is disposed at a place other than the four corners of the shield cover 22-2 as in the second embodiment, the same effect as that of the above-described embodiment can be obtained. Moreover, the shield cover 22-2 is simplified in the unfolded state (because the first side wall portion 22b does not protrude obliquely from the shield cover 22 as in the first embodiment), and the form can be made easier to manufacture.

  The present invention can be implemented with various modifications and substitutions without being limited to the above-described embodiment. Further, the configuration of the electronic circuit module mentioned in the embodiment is a preferable example, and it goes without saying that these can be implemented by appropriately modifying them.

  In the first and second embodiments described above, the shield covers 22 and 22-2 are rectangular, but the shield covers 22 and 22-2 may be square or the like.

  Further, the arrangement of the through holes 12b and the conductive patterns 12d mentioned in the first and second embodiments is merely an example, and other arrangements may be adopted, and the size, the number of arrangements, etc. may be changed as appropriate. Is possible.

  Further, the electronic circuit module is not limited to a high frequency circuit, and may have other electronic circuits.

10, 10-2 Electronic circuit module 12 Circuit board 12a Mounting surface 12b Through hole 12c Insertion holes 14, 16, 18, 20 Electronic components 14a, 16a, 18a, 20a Solder 22, 22-2 Shield cover 22a Top plate 22b First 1 side wall part 22c 2nd side wall part 22d Leg part

Claims (5)

A circuit board on which electronic components are mounted;
A cover made of a metal plate covering the electronic component and mounted on the circuit board;
The cover is
A substantially rectangular top plate,
The top plate portion is connected to a part of the periphery of the top plate portion via a folding portion, and is bent substantially perpendicularly to the top plate portion by the folding portion, and is connected to the circuit board to fix the cover to the circuit board. 1 side wall,
A second side wall portion connected to another part of the periphery of the top plate portion via a folding portion, extending from the top plate portion toward the circuit board, and bent to the inside of the cover by the folding portion; Have
The second side wall portion is
Without contacting the circuit board, a normal state that is disposed inside the cover with a certain gap between the circuit board, and
When the top plate is pressed from above and the top plate is recessed, it moves from the inside to the outside of the cover, and the circuit board side end portion shifts to a contact state in contact with the circuit board. An electronic circuit module characterized in that it is possible. The electronic circuit module according to claim 1,
The first side wall portion is
Formed at the four corners of the periphery of the top plate,
The second side wall portion is
An electronic circuit module, wherein the electronic circuit module is formed in a portion excluding the four corners of the periphery of the top plate portion. The electronic circuit module according to claim 1 or 2,
The second side wall portion is
In the contact state, the electronic circuit module is in contact with the circuit board substantially perpendicularly. The electronic circuit module according to any one of claims 1 to 3,
The top plate is pressed by the pressure applied when the suction nozzle of the component mounting apparatus comes into contact or when it is sucked by the suction nozzle of the component mounting apparatus and placed at a predetermined position of the mother board. Electronic circuit module. The electronic circuit module according to any one of claims 1 to 4,
The top board part is not provided with a hole and has a flat surface.

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