JP3111672U - High frequency electronic components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-frequency electronic component having improved strength while keeping the shielding property of an outer case.
A high frequency electronic component includes a substrate, a surface mount component, and an outer case. The surface mount component 1 includes a first terminal electrode 21 and a second terminal electrode 22 formed for input / output of a high frequency signal or application of a power supply voltage. The surface mounting component 1 has a flat surface facing the outer case 9. The first terminal electrode 21 has a first folded portion 31 formed on the surface facing the outer case 9, and the second terminal electrode 22 is a second folded portion formed on the surface facing the outer case 9. Part 32. The outer case 9 includes a first opening 11 formed so that the first folded portion is exposed, a second opening 12 formed so that the second folded portion is exposed, and the first opening 11. And an opening portion 41 between the first opening portion 12 and the second opening portion 12.
[Selection] Figure 2

Description

  The present invention relates to a high-frequency electronic component.

  A wireless communication device such as a cellular phone includes high-frequency electronic components such as an antenna switch module and a PLL (Phase Locked Loop) module. The high-frequency electronic component includes a substrate such as a ceramic multilayer substrate. On the surface of the substrate, a surface mount component (SMD) such as a semiconductor component or a multilayer ceramic capacitor is disposed.

  Some high-frequency electronic components include an outer case formed so as to cover these surface-mounted components. The outer case is formed so that the surface-mounted component disposed on the surface of the substrate is not affected as much as possible from other electronic components or other electronic devices. In addition, the outer case is formed so as not to electromagnetically affect other electronic components or other electronic devices from the surface mount component.

  The outer case is formed in order to avoid physical contact between the surface mount component and other electronic components. Further, the outer case is formed in order to suck the high frequency electronic component with a suction nozzle when the high frequency electronic component is mounted on the mother board, and to protect the surface mounted component from dust or the like. The outer case is mainly made of metal, and is usually grounded so that the potential of the outer case becomes the ground potential.

  Japanese Patent Application Laid-Open No. 2001-244127 discloses a communication device including a chip component such as a chip coil mounted on an upper surface of a substrate and a metal cover disposed on the upper surface of the substrate. In this communication device, a hole is formed at a position above the chip coil. The chip coil is a small surface mount component among the surface mount components arranged on the surface of the substrate. The hole formed in the metal cover is formed so that the diameter or width of the hole is larger than that of the chip coil. In this communication device, it is disclosed that it is possible to provide a communication device that can suppress the fluctuation of the chip coil inductance due to the fluctuation of the gap between the metal cover and the chip coil and obtain stable characteristics.

  Japanese Patent Application Laid-Open No. 2002-94410 discloses an antenna switch module including a SAW (Surface Acoustic Wave) filter disposed on an upper surface of a multilayer substrate and an outer case having an opening corresponding to the size of the SAW filter. ing. The opening of the outer case is formed sufficiently large so that the SAW filter can be inserted from the outside. In this antenna switch module, it is disclosed that an outer case can be easily attached and an antenna switch module having a lower height than conventional ones can be provided.

Japanese Patent Application Laid-Open No. 7-273504 discloses a filter device in which a dielectric resonator is disposed on the surface of a substrate and a shield cover is disposed so as to cover the dielectric resonator. An opening is formed in the shield cover in this filter device so as to correspond to the connection conductor on the outer peripheral surface of the dielectric resonator. The outer conductor of the dielectric resonator is in contact with the shield cover. In this filter device, it is disclosed that the connection between the outer conductor of the dielectric resonator and the ground can be improved, and the filter device can be reduced in size.
JP 2001-244127 A JP 2002-94410 A JP-A-7-273504

  As described above, in the high-frequency electronic component including the outer case and the surface mount component, the surface mount component is disposed so as to be sandwiched between the substrate and the outer case. Some surface-mounted components have a surface facing the outer case, and have terminal electrodes formed so as to extend from the side surface toward the facing surface. That is, the terminal electrode of the surface mount component and the outer case may face each other. Since a power supply voltage is applied to the terminal electrode or a high-frequency signal is input / output, the distance between the terminal electrode and the outer case is preferably long.

  On the other hand, miniaturization is progressing in wireless communication devices, and it is desired to reduce the size of high-frequency electronic components arranged inside the wireless communication device.

  As disclosed in the above publication, when opening a hole larger than the surface-mounted component when viewed in plan, for example, a small surface-mounted component such as a chip coil has a small opening. It ’s enough. However, when a large surface mount component such as an LC filter is disposed on the surface of the substrate, there is a problem that the strength of the outer case is greatly reduced if a hole larger than the surface mount component is formed in the outer case. there were.

  In addition, if a large hole is formed in the outer case, there may be an electromagnetic effect on other electronic components and other electronic devices. In addition, there is a problem that a large amount of foreign matter such as dust enters from the hole. As described above, there is a problem that the shielding property against the electromagnetic influence and the shielding property against the intrusion of the foreign matter are deteriorated.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a high-frequency electronic component that is improved in strength while keeping the shielding property of the outer case.

  A high-frequency electronic component according to the present invention includes a substrate, a surface-mounted component disposed on the main surface of the substrate, and an outer case fixed to the substrate and formed to cover the surface-mounted component. The surface mount component includes a first terminal electrode and a second terminal electrode formed for input / output of a high frequency signal or application of a power supply voltage. The surface mount component has a flat surface facing the outer case. The first terminal electrode is formed to extend from a side surface, has a first folded portion formed on a surface facing the outer case, and the second terminal electrode is formed to extend from a side surface, It has the 2nd folding | turning part formed in the surface facing the said outer case. The outer case includes a first opening formed to expose the first folded portion, a second opening formed to expose the second folded portion, and the first opening. And an opening portion between the opening portion and the second opening portion. By adopting this configuration, it is possible to provide a high-frequency electronic component that is improved in strength while maintaining the shielding of the outer case.

  Preferably, in the above device, the surface mount component includes a ground electrode to be grounded. The ground electrode is formed to extend from a side surface and has a third folded portion formed on a surface facing the outer case. In the ground electrode, the third folded portion is disposed directly below the opening portion. By adopting this configuration, the distance between the opening portion and the first terminal electrode or the second terminal electrode can be increased, and electromagnetic influences with other electronic components or other electronic devices can be achieved. And the electromagnetic influence can be reduced.

  Preferably, in the above device, the opening portion is electrically connected to the ground electrode directly or via a conductive member. By adopting this configuration, the ground electrode can be easily grounded. In addition, the distance between the outer case and the surface-mounted component can be reduced, and the height of the high-frequency electronic component can be reduced.

  Preferably, the device includes a plurality of the surface-mounted components including the first terminal electrode and the second terminal electrode, and the first opening and the second opening are formed on the surface-mounted component having the highest height. It is formed in the position which opposes. By adopting this configuration, it is possible to reduce the number of openings formed in the outer case, and it is possible to suppress a decrease in the function of the outer case.

  Preferably, in the above device, the first opening is formed so as to be closer to a corner of the outer case than the second opening when seen in a plan view, and the first opening is the second opening. It is formed to be smaller than the opening area of the part. By adopting this configuration, the strength of the outer case can be increased.

  Preferably, in the above device, a distance between the first terminal electrode and the second terminal electrode is L, a distance between the first terminal electrode and the opening portion is L1, and the second terminal electrode and the opening portion are When L2 is L2, L1 <L and L2 <L. By adopting this configuration, it is possible to suppress an electromagnetic failure that occurs between the first terminal electrode and the second terminal electrode.

  Preferably, in the above device, the maximum diameter of the first opening and the second opening is formed to be ¼ or less of the wavelength of the high frequency used. By adopting this configuration, it is possible to suppress leakage of electromagnetic waves of the mounting component from the first opening or the second opening.

  ADVANTAGE OF THE INVENTION According to this invention, the high frequency electronic component which aimed at the intensity | strength improvement can be provided, maintaining the shielding of an outer case.

(Embodiment 1)
With reference to FIGS. 1 to 7, a high-frequency electronic component according to Embodiment 1 based on the present invention will be described.

  FIG. 1 is a schematic plan view of the high-frequency electronic component in the present embodiment. 2 is a cross-sectional view taken along the line II-II in FIG. FIG. 3 is a schematic perspective view of the high-frequency electronic component in the present embodiment.

  With reference to FIGS. 1 to 3, the high-frequency electronic component in the present embodiment includes a substrate 44, surface-mounted components 1 to 3, 5, 6 disposed on one surface of substrate 44, and substrate 44. A surface mount component 4 disposed on the other surface and an outer case 9 formed so as to cover the surface mount components 1 to 3, 5, and 6 are provided.

  The substrate 44 in the present embodiment is a ceramic multilayer substrate in which internal elements such as capacitors, inductors, and resistors are formed. The ceramic multilayer substrate is formed, for example, by laminating and sintering ceramic green sheets on which wirings and via holes are formed. However, the substrate 44 may be a resin multilayer substrate in which a plurality of resin layers are laminated.

  A surface electrode such as a pad is formed on the surface of the substrate 44, and each surface mount component 1 to 6 is connected and fixed to the surface electrode via a bonding material such as solder.

  In the present embodiment, the surface mount components 1 to 3 and 6 are electronic components such as a filter, a chip coil, and a chip capacitor. The surface mount components 4 and 5 are ICs (Integrated Circuits).

  The surface mount component 1 is formed in a rectangular parallelepiped shape. With reference to FIG. 1, the surface-mounted component 1 is disposed so as to be close to a rectangular corner portion that is a planar shape of the substrate 44 when viewed in plan.

  FIG. 4 shows a schematic perspective view of one surface-mounted component among the surface-mounted components in the present embodiment. The terminal electrodes of the surface mount component in the present embodiment are arranged so as to sandwich the surface mount component. The surface mount component 1 includes a first terminal electrode 21 formed for input / output of a high frequency signal or application of a power supply voltage. The surface mount component 1 includes a second terminal electrode 22 formed for input / output of a high frequency signal or application of a power supply voltage.

  The first terminal electrode 21 is formed in a U shape so as to extend from the lower surface of the surface-mounted component toward the upper surface via the side surface. Similarly, the second terminal electrode 22 is formed in a U shape so as to extend from the lower surface of the surface-mounted component 1 toward the upper surface via the side surface.

  The first terminal electrode 21 and the second terminal electrode 22 are arranged so as to face two sides facing each other in a rectangular shape when the surface-mounted component 1 is viewed in plan. Further, two first terminal electrodes 21 or two second terminal electrodes 22 are formed on each side of the rectangle.

  The first terminal electrode 21 has a first folded portion 31 formed on the surface facing the outer case. Similarly, the second terminal electrode 22 has a second folded portion 32 formed on the surface facing the outer case. The folded portion of the terminal electrode in the present embodiment is disposed on the surface facing the outer case and the surface facing the substrate, among the surfaces of the high-frequency electronic component.

  The surface mount component 1 includes a third terminal electrode 23 to be grounded. The third terminal electrode 23 is formed in a U shape so as to extend from the lower surface of the surface-mounted component 1 toward the upper surface via the side surface. The third terminal electrode 23 has a third folded portion 33 on the surface facing the outer case of the surface mount component 1. In the present embodiment, two third folded portions 33 are formed. When the surface-mounted component 1 is viewed in plan, the third folded portion 33 is disposed on two sides facing each other among the square sides that are planar. Moreover, the 3rd folding | turning part 33 is formed in the edge | side different from the edge | side in which the 1st terminal electrode 21 and the 2nd terminal electrode 22 are formed when planarly viewed.

  FIG. 5 shows an enlarged schematic cross-sectional view of the surface-mounted component portion of the high-frequency electronic component. A surface electrode 45 is formed on the surface of the substrate 44. The first terminal electrode 21 and the surface electrode 45 are electrically connected and fixed by solder 46. The surface of the surface mount component 1 facing the outer case 9 is formed in a flat shape. The surface of the outer case 9 and the surface of the surface mount component 1 that faces the outer case 9 are arranged so as to be substantially parallel to each other.

  The first terminal electrode 21 and the second terminal electrode 22 are arranged so as to sandwich the surface-mounted component from both sides in the longitudinal direction. The first terminal electrode 21 and the second terminal electrode 22 are formed so as to reach the top surface through the side surface from the bottom surface of the surface mount component 1. An outer case 9 is arranged on the upper side of the surface mount component 1.

  Referring to FIGS. 1 to 3, outer case 9 in the present embodiment is formed to have a U-shaped cross section. The outer case 9 has a flat upper surface. The outer case 9 is fixed to the side surface of the substrate 44 with legs.

  The outer case 9 includes a first opening 11 and a second opening 12 formed on the upper surface. The first opening 11 and the second opening 12 are holes that penetrate the outer case 9. The first opening 11 is formed so that the first folded portion 31 of the first terminal electrode 21 is exposed. The second opening 12 is formed such that the second folded portion 32 of the second terminal electrode 22 is exposed. The first opening 11 is formed so that the entire first folded portion 31 of the two first terminal electrodes 21 can be seen when viewed in plan. The second opening 12 is formed so that the entire second folded portion 32 of the two second terminal electrodes 22 can be seen.

  In the outer case 9, an opening portion 41 is formed between the first opening portion 11 and the second opening portion 12. The high-frequency electronic component in the present embodiment is formed so that a part of the surface-mounted component 1 is hidden by the opening portion 41 when viewed in plan.

  Thus, by forming the first opening and the second opening in the outer case so as to correspond to the first terminal electrode and the second terminal electrode, the first terminal electrode or the second terminal electrode, and the outer case And the contact between the outer case and the first terminal electrode or the second terminal electrode and electromagnetic interference can be reduced.

  Further, since the size of the opening formed in the outer case can be reduced, it is possible to suppress a decrease in the strength of the outer case accompanying the formation of the opening. Furthermore, it is possible to suppress a decrease in shielding property that prevents electromagnetic interference with other electronic components or other electronic devices. Furthermore, it is possible to prevent a reduction in shielding property that suppresses entry of foreign matters such as dust. Furthermore, the distance between the outer case and the surface mount component can be reduced, and the height of the high frequency electronic component can be reduced. That is, the high-frequency electronic component can be reduced in size, particularly reduced in height.

  Referring to FIG. 1, the high frequency electronic component in the present embodiment includes a third terminal electrode 23 as a ground electrode to be grounded. The third terminal electrode 23 is disposed on a side different from the side on which the first terminal electrode 21 or the second terminal electrode 22 is disposed when viewed in plan.

  The third terminal electrode 23 includes a folded portion 33 formed on a surface facing the outer case 9. A folded portion 33 of the third terminal electrode 23 is disposed directly below the opening portion 41. The folded portion 33 is almost entirely disposed between the first opening portion 11 and the second opening portion 12. By adopting this configuration, the portion between the openings of the outer case can be disposed in the vicinity of the ground electrode. As a result, when the distance between the first terminal electrode and the outer case or the distance between the second terminal electrode and the outer case is the same, the sizes of the first opening and the second opening can be reduced. Therefore, the shielding property of the outer case and the strength of the outer case can be improved.

  Referring to FIG. 2, the surface mount component 2 includes a first terminal electrode 29 and a second terminal electrode 30. The surface mount component 1 is formed so as to be higher than the surface mount component 2. In the upper part of the surface mount component 2, the opening of the outer case is not formed so as to correspond to the first terminal electrode 29 or the second terminal electrode 30. In this way, the number of openings formed in the outer case can be reduced by forming the openings at positions facing the terminal electrodes of the surface mounting component having the highest height among the plurality of surface mounting components. It is possible to improve the shielding and strength of the outer case. Note that the surface mount component 3 has no terminal electrode for input / output of a high frequency signal or application of a power supply voltage on the surface facing the outer case.

  Referring to FIG. 1, when viewed in plan, the first opening 11 and the second opening 12 are formed in a rectangular planar shape. Further, the first opening 11 is formed at the corner of the outer case 9 more than the second opening 12. Further, the first opening 11 is formed to be smaller than the opening area of the second opening 12. By disposing an opening having a small opening area at a corner, when viewed from above, a decrease in strength of the outer case can be suppressed.

  Moreover, in this Embodiment, it forms so that the largest diameter may become 1/4 or less of the wavelength of the high frequency used among the diameter of a 1st opening part and the diameter of a 2nd opening part. By adopting this configuration, it is possible to suppress the high frequency to be used from leaking to the outside of the surface mount component, and it is possible to suppress the influence of electromagnetic waves on other electronic components or other electronic devices. In the present invention, the length over which two arbitrary points of the formed opening are passed is called the diameter. For example, when the planar shape is a rectangle, the maximum diameter indicates the length of the diagonal line, and when the planar shape is an ellipse, the maximum diameter indicates the length of the major axis.

  Further, referring to FIG. 5, the distance between the first terminal electrode 21 and the second terminal electrode 22 is L. The distance between the first terminal electrode 21 and the first opening 11 (inter-opening portion 41) is L1. The distance between the second terminal electrode 22 and the second opening (inter-opening portion 41) is L2. The high frequency electronic component in the present embodiment is formed so that L1 <L and L2 <L. That is, the distance between the terminal electrode and the opening is formed to be smaller than the distance between the terminal electrodes facing each other. By adopting this configuration, the separation between the first terminal electrode 21 and the second terminal electrode 22 is improved. For example, when the surface-mounted component 1 is a band-pass filter, noise (noise) generated between the first terminal electrode 21 and the second terminal electrode 22 can be reduced.

  In the present embodiment, in the rectangular shape when the surface-mounted component is viewed in plan, the ground electrode is disposed on the long side portion, and the first terminal electrode and the second terminal electrode are disposed on the short side portion. However, the present invention is not limited to this configuration, and the first terminal electrode and the second terminal electrode are arranged apart from each other, the first opening of the outer case is formed at a position corresponding to the first terminal electrode, and the second It suffices if the second opening of the outer case is formed at a position corresponding to the terminal electrode.

  FIG. 6 is a schematic perspective view of another surface mount component in the present embodiment. The surface mount component 7 includes a first terminal electrode 24 and a second terminal electrode 25. The first terminal electrode 24 and the second terminal electrode 25 are terminal electrodes formed for input / output of a high-frequency signal or application of a power supply voltage. The third terminal electrode 26 is a terminal electrode formed as a ground electrode.

  In the surface-mounted component 7, the first terminal electrode 24 and the second terminal electrode 25 are formed on the long side in the rectangular shape when viewed in plan. One first terminal electrode 24 is formed, and two second terminal electrodes 25 are formed.

  The present invention can also be applied to a high-frequency electronic component including the surface mount component 7 by forming an opening of the outer case so as to correspond to the terminal electrode immediately above each terminal electrode. Thus, the number of positions of the first terminal electrode and the second terminal electrode is not limited, and the present invention can be applied to a high-frequency electronic component including a surface-mounted component on which an arbitrary number of terminal electrodes are formed.

  In the surface-mounted component 7, the first terminal electrode 24 and the second terminal electrode 25 are arranged in a portion that is a long side of a planar rectangular shape when viewed in plan. However, it is preferable that the first terminal electrode 24 and the second terminal electrode 25 are arranged in a portion that becomes a short side when the planar shape of the surface-mounted component is a rectangle. By adopting this configuration, the distance between the first terminal electrode and the second terminal electrode can be increased, and the separation between the terminal electrodes can be improved.

  FIG. 7 is a perspective view of still another surface mount component in the present embodiment. The surface mount component 8 includes a first terminal electrode 27 and a second terminal electrode 28. The first terminal electrode 27 and the second terminal electrode 28 are formed so as to cover a rectangular short side when the surface-mounted component 8 is viewed in plan. Even if the surface mount component has such a terminal electrode, the present invention can be applied by forming the opening of the outer case so as to correspond to the terminal electrode.

(Embodiment 2)
With reference to FIG. 8 and FIG. 9, the high frequency electronic component in Embodiment 2 based on this invention is demonstrated. FIG. 8 is a schematic perspective view of a part of one surface-mounted component of the high-frequency electronic component in the present embodiment, and FIG. 9 is a schematic cross-sectional view.

  The high frequency electronic component in the present embodiment includes a surface mount component 7. The surface mounting component 7 is bonded to a surface electrode 47 disposed on the surface of the substrate 44. The surface mount component 7 includes a first terminal electrode 24, a second terminal electrode 25, and a third terminal electrode 26. The outer case 10 has a first opening 13 and a second opening 14. The outer case 10 has an opening portion 42 between the first opening portion 13 and the second opening portion 14. A first opening 13 is formed right above the first terminal electrode 24, and a second opening 14 is formed right above the second terminal electrode 25.

  The high-frequency electronic component in the present embodiment is formed so that the opening portion 42 and the third terminal electrode 26 are in contact with each other. That is, the third terminal electrode as the ground electrode and the opening portion 42 are electrically connected. By adopting this configuration, the terminal electrode to be grounded of the surface mount component can be easily grounded. Further, the ground wiring of the surface mount component 7 formed on the substrate 44 is not necessary.

  In the present embodiment, the opening portion and the ground terminal electrode are formed so as to be in direct contact with each other. However, the present embodiment is not limited to this, and the opening portion and the ground terminal electrode are interposed via a conductive member. It may be electrically connected. For example, a conductive adhesive or solder may be disposed between the opening portion and the third terminal electrode.

  Since other configurations, operations, and effects are the same as those in the first embodiment, description thereof will not be repeated here.

  In each drawing in the above embodiment, the same or corresponding parts are denoted by the same reference numerals.

  In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It is not restrictive. The scope of the present invention is shown not by the above description but by the scope of the utility model registration request, and includes all modifications within the meaning and scope equivalent to the scope of the utility model registration request.

1 is a schematic plan view of a high frequency electronic component in a first embodiment. 1 is a schematic cross-sectional view of a high frequency electronic component in Embodiment 1. 1 is a schematic perspective view of a high frequency electronic component in a first embodiment. 2 is a schematic perspective view of a first surface mount component in Embodiment 1. FIG. 2 is a schematic cross-sectional view of a portion of a first surface-mounted component of the high-frequency electronic component in Embodiment 1. FIG. FIG. 3 is a schematic perspective view of a second surface mount component in the first embodiment. FIG. 5 is a schematic perspective view of a third surface mounted component in the first embodiment. FIG. 6 is a schematic perspective view of a surface mount component portion of a high frequency electronic component in a second embodiment. FIG. 6 is a schematic cross-sectional view of a surface mount component portion of a high frequency electronic component in a second embodiment.

Explanation of symbols

  1-8 Surface mount components, 9, 10 Outer case, 11, 13 First opening, 12, 14 Second opening, 21, 24, 27, 29 First terminal electrode, 22, 25, 28, 30 Second Terminal electrode, 23, 26 Third terminal electrode, 31 First folded portion, 32 Second folded portion, 33 Third folded portion, 41, 42 Opening portion, 44 Substrate, 45, 47 Surface electrode, 46 Solder , L, L1, L2 length.

Claims (7)

A substrate,
A surface-mounted component disposed on the main surface of the substrate;
An outer case fixed to the substrate and formed to cover the surface-mounted component;
The surface mount component includes a first terminal electrode and a second terminal electrode formed for input / output of a high frequency signal or application of a power supply voltage,
The surface mounting component has a surface facing the outer case formed in a flat shape,
The first terminal electrode is formed to extend from a side surface and has a first folded portion disposed on a surface facing the outer case,
The second terminal electrode is formed to extend from a side surface, and has a second folded portion disposed on a surface facing the outer case,
The outer case includes a first opening formed so that the first folded portion is exposed;
A second opening formed to expose the second folded portion;
A high-frequency electronic component having an opening portion between the first opening and the second opening. The surface mount component includes a ground electrode to be grounded,
The ground electrode is formed to extend from a side surface, and has a third folded portion disposed on a surface facing the outer case,
2. The high-frequency electronic component according to claim 1, wherein the ground electrode has the third folded portion disposed immediately below the portion between the openings.   The high-frequency electronic component according to claim 2, wherein the opening portion is electrically connected to the ground electrode directly or via a conductive member. A plurality of the surface mount components including the first terminal electrode and the second terminal electrode;
4. The high-frequency electronic component according to claim 1, wherein the first opening and the second opening are formed at positions facing the surface mount component having the highest height. 5. The first opening is formed so as to be closer to a corner of the outer case than the second opening when viewed in plan.
5. The high-frequency electronic component according to claim 1, wherein the first opening is formed to be smaller than an opening area of the second opening.   The distance between the first terminal electrode and the second terminal electrode is L, the distance between the first terminal electrode and the opening portion is L1, and the distance between the second terminal electrode and the opening portion is L2. 6. The high-frequency electronic component according to claim 1, wherein the high-frequency electronic component is formed so that L1 <L and L2 <L.   The diameter of the said 1st opening part and the diameter of the said 2nd opening part are formed so that the largest diameter may become 1/4 or less of the wavelength of the high frequency to be used. High frequency electronic components.

Images