JP2008124071A - Electronic circuit module, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic circuit module that can fix the leg piece of a sheet metal cover reliably, can utilize the entire bottom surface of a wiring board as the formation region of a land for external connection, and can promote miniaturization easily, and to provide a method of manufacturing the electronic circuit module. <P>SOLUTION: The electronic circuit module 1 has the wiring board 2 having a wiring pattern 20 and distributing the land 21 for external connection on a bottom surface for arrangement, an electronic component 3 mounted onto the ceiling surface of the wiring board 2, and the sheet metal cover 4 covering the electronic component 3. On the wiring board 2, there are a bottomed mounting hole 22 into which the leg piece 40 of the sheet metal cover 4 is inserted and a vertical hole 23 that communicates with the mounting hole 22 and releases air and a long hole 24. The inner wall section of the mounting hole 22 is composed of a metal film 22a to which the leg piece 40 is joined by solder, and the vertical hole 23 is exposed at a ceiling surface corner on the wiring board 2 not covered with the sheet metal cover 4. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic circuit module in which electronic components mounted on the top surface of a wiring board are covered with a sheet metal cover, and in particular, an electronic circuit module in which external connection lands are distributed on the bottom surface of the wiring board; And its manufacturing method.

  As an electronic circuit module used by being mounted on a high-frequency circuit motherboard, a ceramic multilayer substrate on which a wiring pattern is formed is used as a wiring substrate, and an electronic component mounted on the top surface of the wiring substrate is covered with a sheet metal cover. What is constituted so that it can shield electromagnetically by this is widely known. In this type of electronic circuit module, a large number of external connection lands that are connected to the wiring pattern are formed on the bottom surface of the wiring board, so that the mounting area on the motherboard can be greatly reduced. Suitable for mounting.

In this type of electronic circuit module, leg pieces provided at the four corners or the like of the sheet metal cover are respectively fixed to through-holes provided at corresponding portions of the wiring board. That is, in the conventional electronic circuit module, each leg piece of the sheet metal cover is inserted into the corresponding through hole, and the leg piece is soldered to the metal film formed on the inner wall portion of the through hole, whereby the sheet metal cover is The electronic component is fixed to the wiring board in a posture covering the electronic component (see, for example, Patent Document 1).
Japanese Patent No. 3474366 (page 1-2, FIG. 7)

  However, in the electronic circuit module in which the leg piece of the sheet metal cover is inserted into the through hole of the wiring board and soldered as in the conventional example described above, the through hole is exposed on the bottom surface of the wiring board. Since the external connection lands cannot be provided in the portion, there is a problem that it is difficult to disperse and arrange a large number of external connection lands on the bottom surface of the wiring board when the miniaturization of the module is promoted. In other words, in order to form the required number of external connection lands in the remaining area of the bottom surface of the wiring board that is not occupied by the through-holes, the bottom surface of the wiring board must have an appropriate area. Therefore, downsizing of the entire module is inevitably hindered.

  If a bottomed hole with a closed bottom is provided in the wiring board instead of the through hole, and the leg pieces of the sheet metal cover are inserted into the bottomed hole and soldered together, the entire bottom of the wiring board is connected to the external connection land. It can be used as a formation region. However, when such a bottomed hole is used, air is sealed inside the bottomed hole sealed with leg pieces or solder, so the reflow process performed after mounting the electronic circuit module on the motherboard, etc. Further, the leg piece may be pushed up by the thermal expansion pressure of the enclosed air in the bottomed hole. Therefore, if a mounting structure in which a leg piece of a sheet metal cover is inserted into a bottomed hole in which air is sealed and soldered is used, a mounting failure of the sheet metal cover in which the leg piece is lifted is likely to occur. It is not preferable.

  The present invention has been made in view of such a state of the art, and a first object of the present invention is to reliably fix the leg pieces of the sheet metal cover and to form an external connection land on the entire bottom surface of the wiring board. An object of the present invention is to provide an electronic circuit module that can be used as a region and facilitates downsizing. The second object of the present invention is to provide a method for manufacturing such an electronic circuit module.

  In order to achieve the first object, in the electronic circuit module of the present invention, a wiring board in which external connection lands are distributed on the bottom surface, an electronic component mounted on the top surface of the wiring board, A sheet metal cover having leg pieces fixed to the wiring board and covering the electronic component, the bottom of the wiring board having an inner wall portion made of a metal film and exposed on the top surface of the wiring board; In addition, an air vent hole that communicates with the mounting hole and is exposed on the top surface or side surface of the wiring board is provided, and the leg piece is inserted into the mounting hole and soldered to the metal film. I made it.

  If the sheet metal cover is fixed to the wiring board by inserting and soldering the leg pieces of the sheet metal cover into the bottomed mounting holes communicated with the air vent holes in this way, the internal space of the mounting holes Is in communication with the external space through the air vent hole, so that there is no possibility that the leg piece of the sheet metal cover is lifted by the thermal expansion pressure of the air in the mounting hole during the reflow process after mounting. Further, since the mounting hole is not exposed on the bottom surface of the wiring board, the entire bottom surface of the wiring board can be used as a region for forming external connection lands.

  In the above configuration, when the wiring board is a ceramic multilayer board, not only can the wiring pattern etc. be efficiently formed using the inner layer of the board, but also a bottomed mounting hole and an air vent hole communicating with the mounting hole can be easily formed. It is preferable because it can be formed.

  As a means for achieving the above second object, in the method of manufacturing an electronic circuit module according to the present invention, the first through hole in which the inner wall portion is made of a metal film and the second through hole in which the metal film does not exist. The first through hole group and the second through hole group are disposed between a plurality of ceramic green sheets arranged side by side and a ceramic green sheet having an external connection land on the bottom surface. A laminated pressure bonding step of obtaining a multilayer green sheet by laminating and pressing these ceramic green sheets through a ceramic green sheet provided with a long hole for communication, and firing the multilayer green sheet to A firing step of obtaining a multilayer ceramic assembly substrate having air flow passages in the long holes, an electronic component mounting step of mounting electronic components on the top surface of the ceramic assembly substrate, A cover mounting for mounting a sheet metal cover covering the electronic component on the top surface of the Mick assembly substrate, inserting the leg pieces of the sheet metal cover into the first through hole group, and soldering the leg pieces to the metal film And a dividing step of dividing the ceramic aggregate substrate to obtain a large number of individual ceramic multilayer substrates. The second transparent plate is formed in a region of the top surface of the ceramic multilayer substrate that is not covered by the sheet metal cover. The hole group was exposed.

  In the electronic circuit module manufactured in this manner, the first through hole group and the second through hole group are exposed on the top surface of the ceramic multilayer substrate, and the length provided in the ceramic multilayer substrate is long. The first and second through hole groups communicate with each other through the hole, and the bottomed first through hole group whose inner wall portion is made of a metal film is used for inserting and joining the leg pieces of the sheet metal cover. Functions as a mounting hole. Since the second through hole group and the elongated hole function as an air vent hole that allows the internal space of the first through hole group to communicate with the external space of the ceramic multilayer substrate, the first through hole group is mounted during a reflow process after mounting. There is no possibility that the leg pieces of the sheet metal cover are lifted by the thermal expansion pressure of the air in the hole group. Further, since the first through hole group which is the mounting hole for the leg piece is not exposed on the bottom surface of the ceramic multilayer substrate, the entire bottom surface of the ceramic multilayer substrate can be used as a region for forming external connection lands.

  Further, as another solution for achieving the second object, in the method of manufacturing an electronic circuit module according to the present invention, the inner wall portion is arranged in parallel with a virtual line in which a through hole made of a metal film is divided later. A ceramic green sheet provided with elongated holes for communicating the through hole groups between a plurality of layers of ceramic green sheets provided and a ceramic green sheet provided with an external connection land on the bottom surface. A laminated pressure bonding step for obtaining a multilayer green sheet by interposing and laminating and pressing these ceramic green sheets, and a multilayer ceramic structure substrate in which the multilayer green sheet is fired to have an air flow passage in the elongated hole A firing step for obtaining an electronic component, an electronic component mounting step for mounting an electronic component on a top surface of the ceramic aggregate substrate, and a top of the ceramic aggregate substrate Mounting a sheet metal cover that covers the electronic component and inserting a leg piece of the sheet metal cover into the through hole group, and soldering the leg piece to the metal film; and the ceramic aggregate substrate A dividing step of dividing a plurality of individual ceramic multilayer substrates by dividing along a virtual line, and the dividing portion of the elongated hole is exposed to the side surface of the ceramic multilayer substrate by the dividing step.

  In the electronic circuit module manufactured in this way, the inner wall portion is made of a metal film, and the group of through holes exposed on the top surface of the ceramic multilayer substrate is communicated with the two-divided elongated holes exposed on the side surface of the ceramic multilayer substrate. The bottomed through hole group functions as a mounting hole for inserting and soldering the leg pieces of the sheet metal cover. In addition, since the two-divided long holes function as air vent holes that connect the internal space of the through hole group with the external space of the ceramic multilayer substrate, the thermal expansion pressure of the air in the through hole group is used during a reflow process after mounting. Therefore, there is no possibility that the leg pieces of the sheet metal cover are lifted. Further, since the through hole group which is the mounting hole for the leg piece is not exposed on the bottom surface of the ceramic multilayer substrate, the entire bottom surface of the ceramic multilayer substrate can be used as a region for forming external connection lands.

  In the above configuration, the reinforcing paste is previously filled in the elongated hole in the laminating and crimping step, and at least a part of the reinforcing paste is burned and vaporized in the next firing step, whereby an air flow passage is formed in the elongated hole. It is preferable to obtain an existing multilayered ceramic aggregate substrate. If this is done, the laminating and crimping process is performed in a state where the oblong hole for venting is filled with the reinforcing paste, so there is a possibility that the oblong hole may be crushed by the pressure applied from the hydrostatic press device or the like in this process. In addition, there is no need to add a special process for securing an air flow path in the long hole filled with the reinforcing paste.

  According to the electronic circuit module of the present invention, the sheet metal cover is fixed to the wiring board by inserting and soldering the leg pieces of the sheet metal cover into the bottomed mounting holes communicated with the air vent holes. Since the internal space of the hole is in communication with the external space through the air vent hole, there is no possibility that the leg piece of the sheet metal cover will be lifted by the thermal expansion pressure of the air in the mounting hole during the reflow process after mounting. . Further, since the mounting hole is not exposed on the bottom surface of the wiring board, the entire bottom surface of the wiring board can be used as a region for forming external connection lands, and the module can be easily downsized.

  Further, in the electronic circuit module obtained by the manufacturing method of the present invention, a bottomed through hole group whose inner wall portion is made of a metal film and is exposed on the top surface of the ceramic multilayer substrate inserts the leg pieces of the sheet metal cover and solders them And a long hole communicating with the mounting hole inside the ceramic multilayer substrate is communicated with another through hole group exposed on the top surface of the ceramic multilayer substrate, or is a long hole. Since the hole is directly exposed to the side surface of the ceramic multilayer substrate, there is no possibility that the leg piece of the sheet metal cover is lifted by the thermal expansion pressure of the air in the mounting hole during the reflow process after mounting. Also, since the mounting holes for the leg pieces are not exposed on the bottom surface of the ceramic multilayer substrate, the entire bottom surface of the ceramic multilayer substrate can be used as a region for forming external connection lands, and the module can be easily downsized.

  An embodiment of the invention will be described with reference to the drawings. FIG. 1 is a perspective view of an electronic circuit module according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view of the main part of the module, and FIG. 4 is a manufacturing process diagram of the module, FIG. 5 is a plan view of a main part corresponding to FIG. 4, and FIG. 6 is a plan view of a main part showing a ceramic green sheet having a long hole in FIG.

  The electronic circuit module 1 shown in FIGS. 1 to 3 is a high-frequency unit used by being mounted on a mother board for a high-frequency circuit. The electronic circuit module 1 includes a wiring board 2 which is a ceramic multilayer board on which a wiring pattern 20 (see FIG. 4), an external connection land 21 and the like are formed, and an electronic component 3 mounted on the top surface of the wiring board 2. And a sheet metal cover 4 having leg pieces 40 fixed to the wiring board 2 and covering the electronic component 3.

  The wiring board 2 has a bottomed mounting hole 22 into which the leg pieces 40 of the sheet metal cover 4 are inserted, a bottomed vertical hole 23 provided in parallel in the vicinity of the mounting hole 22, and the mounting hole 22 and the vertical hole 23. And a long hole 24 that allows the two to communicate with each other. The mounting holes 22 and the vertical holes 23 are bottomed holes having the same depth exposed on the top surface of the wiring board 2, but the vertical holes 23 are not covered by the sheet metal cover 4 because they are located at the corners of the wiring board 2. Further, the inner wall portion of the mounting hole 22 is made of a metal film 22 a, but no metal film is formed in the vertical hole 23, and the long hole 24 is formed in a horizontal hole shape inside the wiring board 2. A large number of external connection lands 21 are distributed over the entire bottom surface of the wiring board 2, and these external connection lands 21 are electrically connected to the wiring pattern 20 through via holes 25 (see FIG. 4).

  The electronic component 3 on the wiring board 2 is electrically connected to the wiring pattern 20, and the electronic component 3 is covered with the sheet metal cover 4 and is electromagnetically shielded. Leg pieces 40 project downward from the four corners of the sheet metal cover 4, and each leg piece 40 is inserted into a corresponding attachment hole 22 of the wiring board 2, and the metal film 22 a of the attachment hole 22 and the solder 5. Are joined by.

  The electronic circuit module 1 configured as described above is manufactured by the following procedure. First, ceramic green sheets 61 to 66 including a low-temperature sintered ceramic material are prepared, and a wiring pattern 20 and a via hole 25 are formed on each green sheet. At this time, the green sheets 61 to 64 from the uppermost layer to the fourth layer shown in FIG. 4 are provided with through holes 6a and 6b having different inner diameters in parallel, and the same method as in the case of forming a through hole is used. A cylindrical metal film 22a is formed on the inner wall portion of the large-diameter through hole 6a group. Further, as shown in FIG. 6, a long hole 24 is formed in the fifth layer green sheet 65, and the reinforcing paste 7 is filled in the long hole 24. As the reinforcing paste 7, a material that burns and vaporizes at 800 ° C. or lower, for example, a polyvinyl butyral resin paste is suitable. In addition, the external connection land 21 is formed on the bottom side of the sixth green sheet 66. 4 and 6 indicate imaginary lines L to be divided later.

  Next, the ceramic green sheets 61 to 66 are aligned and stacked as shown in FIG. 4, and then the green body 61 to 66 is pressure-bonded by pressing the stacked body with a hydrostatic pressure press device (not shown). Thereby, the multilayer green sheet 60 is obtained. In the green sheets 61 to 64 constituting the multilayer green sheet 60 from the uppermost layer to the fourth layer, the through holes 6a are matched with each other, and the through holes 6b are matched with each other. And the long hole 24 of the green sheet 65 of the 5th layer is arrange | positioned in the position which connects the through-hole 6a group and the through-hole 6b group. In addition, by laminating and pressing the green sheets 61 to 66 in this way, the through hole 6a group becomes the mounting hole 22, and the through hole 6b group becomes the vertical hole 23.

  Next, a V-groove process is performed on the top surface of the multilayer green sheet 60 to form a divided groove 6c extending along the virtual line L. By forming the dividing grooves 6 c in a lattice shape in this way, the top surface of the multilayer green sheet 60 is partitioned into a large number of small sections corresponding to the individual wiring boards (ceramic multilayer boards) 2. Thereafter, the multilayer green sheet 60 is fired at a low temperature of about 800 ° C. to obtain a ceramic aggregate substrate (LTCC substrate). In this firing step, the reinforcing paste 7 in the long hole 24 burns and vaporizes, so that the long hole 24 becomes a cavity.

  Next, the electronic component 3 is mounted in each of a number of small sections partitioned by the dividing grooves 6c of the ceramic aggregate substrate. Furthermore, in order to attach the sheet metal cover 4 to each of these small sections, the leg pieces 40 of each sheet metal cover 4 are inserted into the attachment holes 22 (groups of through holes 6a) and soldered to the metal film 22a. Thereafter, the ceramic aggregate substrate is divided along the dividing grooves 6c, so that a large number of wiring boards 2 on which the electronic component 3 and the sheet metal cover 4 are mounted are obtained. That is, the electronic circuit module 1 shown in FIGS.

  In the electronic circuit module 1 manufactured in this way, the bottomed through-hole 6a group whose inner wall portion is made of the metal film 22a and is exposed on the top surface of the wiring substrate (ceramic multilayer substrate) 2 is the leg piece 40 of the sheet metal cover 4. Is a mounting hole 22 for soldering, and a long hole 24 communicating with the mounting hole 22 inside the wiring board 2 is another through-hole 6b exposed on the top surface of the wiring board 2. Communicating with the group. Therefore, there is no possibility that the leg piece 40 of the sheet metal cover 4 is lifted by the thermal expansion pressure of the air in the mounting hole 22 during the reflow process performed after the electronic circuit module 1 is mounted on the motherboard of the high frequency circuit. Further, since the mounting hole 22 is not exposed on the bottom surface of the wiring board 2, the entire bottom surface of the wiring board 2 can be used as a region for forming the external connection land 21 as shown in FIG. Is easy. In addition, when the wiring board 2 is manufactured, the laminating and crimping process is performed in a state where the oblong holes 24 for air venting are filled with the reinforcing paste 7, so that the pressurizing force applied from the hydrostatic press device is used in this process. There is no possibility that the long hole 24 is crushed. Further, since the air flow passage is formed by burning and vaporizing the reinforcing paste 7 in the firing step, a special air flow passage is secured in the long hole 24 filled with the reinforcing paste 7. There is no need to add a process.

  7 is a perspective view of an electronic circuit module according to a second embodiment of the present invention, FIG. 8 is a cross-sectional view of the main part of the module, FIG. 9 is a manufacturing process diagram of the module, and FIG. 10 is a main part corresponding to FIG. FIG. 11 is a plan view of a main part showing a ceramic green sheet having a long hole in FIG. 9, and the parts corresponding to those in FIGS. Omitted as appropriate.

  The electronic circuit module 10 shown in FIGS. 7 and 8 is a wiring board which is a ceramic multilayer board on which a wiring pattern 20 (see FIG. 9), external connection lands 21 and the like are formed, as in the first embodiment. 2, an electronic component 3 mounted on the top surface of the wiring board 2, and a sheet metal cover 4 having leg pieces 40 fixed to the wiring board 2 and covering the electronic component 3.

  The wiring board 2 is formed with a bottomed mounting hole 22 into which the leg piece 40 of the sheet metal cover 4 is inserted, and a long hole 26 communicating with the mounting hole 22 and exposed to the side surface of the wiring board 2. . The mounting hole 22 is a bottomed hole that is exposed on the top surface of the wiring board 2, and the inner wall portion thereof is made of a metal film 22a. The long hole 26 is formed in a horizontal hole shape inside the wiring board 2. A large number of external connection lands 21 are distributed over the entire bottom surface of the wiring board 2, and these external connection lands 21 are electrically connected to the wiring pattern 20 via via holes 25 (see FIG. 9). The electronic component 3 on the wiring board 2 is electrically connected to the wiring pattern 20, and the leg pieces 40 of the sheet metal cover 4 covering the electronic component 3 are inserted into the mounting holes 22 of the wiring board 2 and soldered to the metal film 22a. It is joined.

  When manufacturing the electronic circuit module 10 configured as described above, as in the first embodiment, first, ceramic green sheets 81 to 86 are prepared, and wiring patterns 20 and via holes 25 are provided on each green sheet. Form. At this time, through holes 8a are formed in the green sheets 81 to 84 from the uppermost layer to the fourth layer shown in FIG. 9, and the inner wall portion of each through hole 8a is formed in the same manner as in the case of forming a through hole. A cylindrical metal film 22a is formed. Further, a long hole 27 is formed in the fifth green sheet 85, and the long hole 27 is filled with a reinforcing paste 7 made of, for example, a polyvinyl butyral resin paste. As will be described later, the elongated hole 26 is formed by dividing the elongated hole 27 into two parts. Further, the external connection land 21 is formed on the bottom layer side of the sixth layer green sheet 86.

  Next, as shown in FIG. 9, these ceramic green sheets 81 to 86 are aligned, stacked, and pressure-bonded to obtain a multilayer green sheet 80. In the green sheets 81 to 84 constituting the multilayer green sheet 80, the through-holes 8a are matched with each other, and adjacent groups of through-holes 8a sandwiching an imaginary line L divided later. The long holes 27 of the fifth-layer green sheet 85 are arranged at positions where the two are connected. By laminating and pressure-bonding the green sheets 81 to 86 in this manner, the group of through holes 8a becomes the attachment holes 22.

  Next, after the dividing groove 8c extending along the imaginary line L is formed on the top surface of the multilayer green sheet 80, the multilayer green sheet 80 is fired at a low temperature to form a ceramic aggregate substrate (LTCC substrate). Similar to the first embodiment, the reinforcing paste 7 in the long hole 27 is burned and vaporized in this firing step, so that the long hole 27 becomes a cavity.

  Next, after the electronic component 3 is mounted on each of the small sections partitioned by the dividing grooves 8c of the ceramic aggregate substrate, the leg pieces 40 are attached to the mounting holes 22 (transparent holes) in order to attach the sheet metal cover 4 to each of the small sections. Is inserted into the hole 8a group) and soldered to the metal film 22a. Thereafter, by dividing the ceramic aggregate substrate along the dividing groove 8c, a large number of wiring boards 2 on which the electronic component 3 and the sheet metal cover 4 are mounted are obtained, and the electronic circuit module 10 shown in FIGS. It is done. In this division step, the long holes 27 that connect the adjacent through holes 8 a are divided into two to form the long holes 26, so that the divided portions of the long holes 26 are exposed on the side surface of the wiring board 2.

  The electronic circuit module 10 manufactured in this way has a long hole 26 through which a bottomed mounting hole 22 (through hole group 8a) for fixing the leg piece 40 of the sheet metal cover 4 is exposed on the side surface of the wiring board 2. Since the electronic circuit module 10 is mounted on the mother board of the high frequency circuit, there is no possibility that the leg piece 40 is lifted by the thermal expansion pressure of the air in the mounting hole 22 during the reflow process performed after the electronic circuit module 10 is mounted on the motherboard of the high frequency circuit. Similarly to the first embodiment, the entire bottom surface of the wiring board 2 can be used as a region for forming the external connection land 21 and a long hole 27 (long hole 26) filled with the reinforcing paste 7 is used. Is not crushed in the laminating and crimping process, and the reinforcing paste 7 is combusted and vaporized in the firing process, so that it is not necessary to add a special process to secure an air flow path in the elongated hole 27.

  In the first and second embodiments described above, the reinforcing paste 7 filled in the long holes 24 and 27 is made of a material that burns and vaporizes in the firing step to make the long holes hollow. However, the long hole may not be completely hollow as long as an air flow passage is secured. Therefore, as a reinforcing paste for filling the elongated holes, for example, a material in which an appropriate binder is mixed in alumina may be used, and the air permeability may be ensured by burning and vaporizing the binder in a firing process.

1 is a perspective view of an electronic circuit module according to a first embodiment of the present invention. It is principal part sectional drawing of the module shown in FIG. It is a bottom view of the module shown in FIG. It is a manufacturing-process figure of the module shown in FIG. It is a principal part top view corresponding to FIG. It is a principal part top view which shows the ceramic green sheet which has the long hole in FIG. It is a perspective view of the electronic circuit module which concerns on the example of 2nd Embodiment of this invention. It is principal part sectional drawing of the module shown in FIG. FIG. 8 is a manufacturing process diagram of the module shown in FIG. 7. It is a principal part top view corresponding to FIG. It is a principal part top view which shows the ceramic green sheet which has the long hole in FIG.

Explanation of symbols

1, 10 Electronic circuit module 2 Wiring board 3 Electronic component 4 Sheet metal cover 5 Solder 6a Through hole (first through hole)
6b Through hole (second through hole)
6c, 8c Dividing groove 7 Reinforcing paste 8a Through hole 21 External connection land 22 Mounting hole 22a Metal film 23 Vertical hole (air vent hole)
24, 26, 27 Long hole (air vent hole)
40 Leg piece 60, 80 Multilayer green sheet 61-66, 81-86 Ceramic green sheet L Virtual line

Claims (5)

A wiring board in which lands for external connection are dispersedly arranged on the bottom surface, an electronic component mounted on the top surface of the wiring board, and a sheet metal cover having leg pieces fixed to the wiring board and covering the electronic component And
The wiring board has a bottomed mounting hole whose inner wall portion is made of a metal film and is exposed on the top surface of the wiring board, and an air vent hole that is in communication with the mounting hole and is exposed on the top surface or side surface of the wiring board. An electronic circuit module, wherein the electronic circuit module is provided and the leg pieces are inserted into the mounting holes and soldered to the metal film.   2. The electronic circuit module according to claim 1, wherein the wiring board is a ceramic multilayer board. A ceramic green sheet having a plurality of layers of ceramic green sheets in which a first through hole whose inner wall portion is made of a metal film and a second through hole in which the metal film does not exist, and a land for external connection are provided on the bottom surface A ceramic green sheet provided with a long hole for communicating the first through hole group and the second through hole group is interposed between the sheets and the ceramic green sheets are laminated. A lamination pressure bonding step for obtaining a multilayer green sheet by pressure bonding;
A firing step of firing the multilayer green sheet to obtain a multilayered ceramic aggregate substrate having air flow passages in the elongated holes;
An electronic component mounting step of mounting electronic components on the top surface of the ceramic aggregate substrate;
A cover that mounts a sheet metal cover covering the electronic component on the top surface of the ceramic aggregate substrate, inserts the leg pieces of the sheet metal cover into the first through hole group, and solders the leg pieces to the metal film. Installation process;
Dividing the ceramic aggregate substrate to obtain a large number of individual ceramic multilayer substrates, and
The method of manufacturing an electronic circuit module, wherein the second through hole group is exposed in a region of the top surface of the ceramic multilayer substrate that is not covered by the sheet metal cover. Between a ceramic green sheet of a plurality of layers that are arranged side by side across an imaginary line in which a through hole made of a metal film is divided later, and a ceramic green sheet having an external connection land on the bottom surface, A laminated crimping step for obtaining a multilayer green sheet by laminating and crimping each ceramic green sheet via a ceramic green sheet provided with an elongated hole for communicating the through hole groups;
A firing step of firing the multilayer green sheet to obtain a multilayered ceramic aggregate substrate having air flow passages in the elongated holes;
An electronic component mounting step of mounting electronic components on the top surface of the ceramic aggregate substrate;
A cover mounting step of mounting a sheet metal cover covering the electronic component on the top surface of the ceramic aggregate substrate, inserting a leg piece of the sheet metal cover into the through hole group, and soldering the leg piece to the metal film; ,
A dividing step of dividing the ceramic aggregate substrate along the imaginary line to obtain a large number of individual ceramic multilayer substrates,
The method of manufacturing an electronic circuit module according to claim 1, wherein the slotted portion is exposed on a side surface of the ceramic multilayer substrate by the dividing step.   5. The elongated hole according to claim 3 or 4, wherein the elongated hole is filled with a reinforcing paste in the laminating and crimping step, and at least a part of the reinforcing paste is burned and vaporized in the firing step. A method of manufacturing an electronic circuit module, characterized in that a multilayered ceramic aggregate substrate having an air flow passage is provided.

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