JP5370674B2 - Electronic components - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component that can prevent a terminal electrode from peeling from a substrate. <P>SOLUTION: This electronic component has a substrate 100, electronic elements formed of laminated structures for wiring layers and insulating resin layers laminated on the substrate 100, and terminal electrodes T formed of laminated structure for the wiring layers M1, M2, and M3 laminated on the substrate 100 where, on a virtual line connecting an upper edge of the terminal electrode T and a lower edge lying in a diagonal direction with respect to the upper edge in a cross-sectional surface where the terminal electrodes T are vertically cut with respect to the substrate surface, the terminal electrodes T are formed so that portions of insulating resin layers I1 and I2 may exist. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to an electronic component, and more particularly to an electronic component formed by a thin film process advantageous for downsizing and thinning.

  As electronic parts used in mobile communication devices such as mobile phones and mobile terminals, wireless LAN devices, etc., thin film capacitors using a thin film process, directional couplers (directional couplers, hereinafter simply referred to as “couplers”) Thin film devices are used. In such an electronic component, in general, an electronic element as a component such as a capacitor or a coupler is formed by a multilayer structure of wiring layers, and a terminal electrode is formed (Patent Document 1).

  Furthermore, the electronic component is usually mounted on a wiring board (printed wiring board or the like) on which an external circuit is formed. In that case, mechanical pressure is applied between the electronic component and the wiring board, for example, with a solder bump interposed between the terminal electrode of the electronic component and the external circuit of the wiring board, The terminal electrode and the external circuit are electrically and mechanically connected or joined via the solder bump.

JP 2007-201157 A

  However, in the process of mounting the electronic component as described above on the wiring substrate, not only a force in a direction perpendicular to the wiring substrate surface of the electronic component acts on (applies to) the terminal electrode, but also on the substrate surface. It has been found that force in a parallel direction also tends to act (apply), and as a result, the terminal electrode may be peeled off from the substrate.

  Therefore, the present invention has been made in view of such circumstances, and an object thereof is to provide an electronic component capable of preventing the terminal electrode from being peeled from the substrate.

  In order to solve the above-described problems, an electronic component according to the present invention includes a substrate, an electronic element provided on the substrate, an insulating resin layer formed on the substrate, connected to the electronic element, and a plurality of electronic components. A terminal electrode composed of a wiring layer of the terminal, the terminal electrode being in a cross section obtained by cutting the terminal electrode perpendicularly to the substrate surface, and a terminal diagonal to the upper edge and the upper edge of the terminal electrode A part of the insulating resin layer is provided on a virtual line connecting the lower edge of the electrode.

  According to the above configuration, the insulating resin layer on the virtual line connecting the upper edge of the terminal electrode, the upper edge, and the lower edge in the diagonal direction in the cross section obtained by cutting the terminal electrode perpendicular to the substrate surface Even if a force is applied to the terminal electrode from the outside, the force is absorbed or dispersed by the insulating resin layer existing on the virtual line, and the force applied to the interface between the substrate and the terminal electrode is reduced. Since it is suppressed, peeling of the terminal electrode from the substrate is suppressed.

  In order to form an insulating resin layer inherent in such a terminal electrode, a part of the insulating resin layer existing on the imaginary line is cut by a ridge line of the insulating resin layer (cut the insulating resin layer perpendicular to the substrate surface). The side (wall surface) in the cross section is concavely flared (the ridge line (side wall surface) is straight, has a certain angle of inclination, and does not reach the wiring layer, but in its insulating resin layer. On at least one wiring layer constituting the terminal electrode so that the hem portion joined on the wiring layer is concavely extended outward so as to draw the skirt from the linear inclined surface) It is preferable that it extends. Thereby, the amount can be suppressed while a part of the insulating resin layer is present on the virtual line. As a result, it is possible to form a terminal electrode that is difficult to peel off while maintaining a low resistance of the terminal electrode.

  According to the present invention, in a cross section obtained by cutting the terminal electrode perpendicularly to the substrate surface, on the imaginary line connecting the upper edge of the terminal electrode and the lower edge of the terminal electrode in the diagonal direction with the upper edge. The presence of a part of the insulating resin layer allows the insulating resin layer existing on the imaginary line to absorb or disperse the force even when a force is applied to the terminal electrode from the outside. The force applied to the interface can be suppressed. Thereby, peeling of the terminal electrode from a board | substrate can be suppressed.

1 is an equivalent circuit diagram showing a configuration of a coupler which is one embodiment of an electronic component of the present invention. It is a vertical sectional view schematically showing a wiring structure of a coupler. It is a top view of the coupler for demonstrating arrangement | positioning of a terminal electrode. It is an expanded sectional view of a terminal electrode of coupler 1A of Example 1A. 12 is an enlarged cross-sectional view of a terminal electrode of a coupler 10 in Comparative Example 10. FIG. It is an expanded sectional view of the terminal electrode of coupler 1B in Example 1B. It is an expanded sectional view of the terminal electrode of coupler 1C in Example 1C. It is process sectional drawing which shows the manufacturing method of an electronic component. It is process sectional drawing which shows the manufacturing method of an electronic component. It is process sectional drawing which shows the manufacturing method of an electronic component. It is process sectional drawing which shows the manufacturing method of an electronic component. It is process sectional drawing which shows the manufacturing method of an electronic component. It is process sectional drawing which shows the manufacturing method of an electronic component. It is process sectional drawing which shows the manufacturing method of an electronic component. It is process sectional drawing which shows the manufacturing method of an electronic component.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted. Further, positional relationships such as up, down, left and right are based on the positional relationships shown in the drawings unless otherwise specified. Furthermore, the dimensional ratios in the drawings are not limited to the illustrated ratios. Further, the following embodiments are exemplifications for explaining the present invention, and are not intended to limit the present invention only to the embodiments. Furthermore, the present invention can be variously modified without departing from the gist thereof.

  FIG. 1 is an equivalent circuit diagram showing a configuration of a coupler which is one embodiment of an electronic component of the present invention. The coupler 1 includes a first line L1 and a second line L2 that is electromagnetically coupled to the first line L1. As an electromagnetic coupling between the first line L1 and the second line L2, a magnetic coupling M and capacitive couplings C1 and C2 are illustrated in FIG.

  In the coupler 1, one end of the first line L1 is connected to the input terminal electrode T11, and the other end of the first line L1 is connected to the output terminal electrode T12. One end of the second line L2 is connected to the coupling terminal electrode T21, and the other end of the second line L2 is connected to the isolation terminal electrode T22. The isolation terminal electrode T22 is fixed to the ground potential G via the resistor R.

  The lengths of the lines L1 and L2 described above vary depending on the specifications of the coupler 1, and can be set to be, for example, a 1/4 wavelength (λ / 4) resonator circuit of a transmission signal to be processed. Further, the shape of the lines L1 and L2 can be any shape as long as the above-described electromagnetic coupling is formed. For example, the shapes of the spiral shape (coil shape), meandering shape, linear shape, curved shape, etc. A form is mentioned.

  The basic operation of the coupler 1 will be described below with reference to FIG. The signal is input to the input terminal electrode T11 and output from the output terminal electrode T12. When a signal is input to the input terminal electrode T11, the main current IM flows through the first line L1. When the main current IM flows through the first line L1, the induced current IL based on the magnetic coupling M flows in one direction in the second line L2, and the displacement current IC based on the capacitive couplings C1 and C2 flows in the second line L2. It flows toward both sides. The current finally flowing through the second line L2 is the sum of the induced current IL based on the magnetic coupling M and the displacement current IC based on the capacitive couplings C1 and C2, and as a result, coincides with the direction of the induced current due to magnetic coupling. Current flows toward the coupling terminal electrode T21. Thus, when a signal is input to the input terminal electrode T11 of the coupler and output from the output terminal electrode T12, a signal corresponding to a part of the signal (about 1/100 in terms of electric power) is coupled to the coupling terminal electrode T21. Is output from.

  The coupler 1 is used, for example, for output monitoring of a power amplifier (PA). In this case, the input terminal electrode T11 of the coupler 1 is connected to the output terminal electrode of the power amplifier, and the coupling terminal electrode T21 of the coupler 1 is connected to the input terminal electrode of the power amplifier via the AGC detection circuit. As a result, when the signal output from the power amplifier is input to the input terminal electrode T11 of the coupler 1, a signal corresponding to a part of this signal is output from the coupling terminal electrode T21 of the coupler 1 and passes through the AGC detection circuit. A feedback signal is input to the power amplifier. As a result, the output gain of the power amplifier is maintained and controlled constant.

  Next, a wiring structure of a coupler which is one embodiment of the electronic component of the present invention will be described. FIG. 2 is a vertical sectional view schematically showing the wiring structure of the coupler 1 (electronic element). As shown in FIG. 2, a wiring layer M1 is formed on an insulating substrate 100 made of alumina or the like via an insulating layer 101 made of a silicon nitride film, for example. For example, a first line L1 of a coupler is formed by the wiring layer M1. On the wiring layer M1, a wiring layer M2 is formed via an insulating resin layer I1. For example, a second line L2 of a coupler is formed by the wiring layer M2. A wiring layer M3 is formed on the wiring layer M2 via an insulating resin layer I2, and an insulating resin layer I3 is formed on the wiring layer M3. For example, a lead-out wiring (connection wiring) is formed by the wiring layer M2. Vias are formed in a part of the insulating resin layers I1 and I2, and necessary connections between the wiring layers M1, M2 and M3 are ensured. Terminal electrodes T11, T12, T21, and T22 are formed by a laminate of wiring layers M1, M2, and M3 at the periphery of the coupler. Note that the terminal electrodes T11, T12, T21, and T22 are collectively referred to simply as the terminal electrode T when it is not necessary to distinguish the functions of the terminal electrodes. The insulating resin layer I3 is formed so as to expose the terminal electrode T. On the surface of the terminal electrode T, a plating film 102 is formed.

  As the insulating resin layers I1 and I2 and the insulating resin layer I3, for example, organic insulators such as polyimide and epoxy resin can be used. For example, Cu, Ag, Pd, Ag-Pd, Ni, Au, etc. can be used as the wiring layers M1, M2, M3. The wiring layers M1 to M3 are formed by a method such as sputtering, vapor deposition, printing, or photolithography. As the plating film 102, for example, Ni—P / Pd / Au plating is used. Thus, the coupler 1 is composed of a thin film multilayer structure formed on the substrate 100.

  Next, the arrangement of terminal electrodes will be described in detail. FIG. 3 is a plan view of the coupler showing the arrangement of the terminal electrodes. As shown in FIG. 3, four terminal electrodes T11, T12, T21, and T22 are formed at the four corners of the coupler chip.

Example 1A
FIG. 4 is a cross-sectional view for explaining details of the structure of the terminal electrode T of the coupler 1A of the embodiment 1A of the present invention. FIG. 4 corresponds to a cross-sectional view taken along line AA in FIG. As shown in FIG. 4, a part of the wiring layer M <b> 1 is formed in the portion of the terminal electrode T. An insulating resin layer I1 is formed on the wiring layer M1, and a through hole TH1 that exposes the wiring layer M1 at the terminal electrode portion is formed in the insulating resin layer I1. The inner wall of the through hole TH1 has a tapered shape. Further, a wiring layer M2 is formed on the insulating resin layer I1 so as to fill the inside of the through hole TH1 at the portion of the terminal electrode T. An insulating resin layer I2 is formed on the wiring layer M2, and a through hole TH2 that exposes the wiring layer M2 at the terminal electrode T is formed in the insulating resin layer I2. The inner wall of the through hole TH2 has a tapered shape. Further, a wiring layer M3 is formed on the insulating resin layer I2 so as to fill the inside of the through hole TH2 at the portion of the terminal electrode T. As described above, the terminal electrode T is formed by the laminated structure of the wiring layers M1, M2, and M3 formed around the chip, and is drawn out on the insulating resin layers I1 and I2.

  According to the configuration of Example 1A, the upper edge E1 of the terminal electrode T and the lower edge in a diagonal direction with respect to the upper edge E1 in a cross section (FIG. 4) in which the terminal electrode is cut perpendicular to the substrate surface. A part of the insulating resin layers I1 and I2 is located on the substrate surface in the area of the terminal electrode T so that a part of the insulating resin layers I1 and I2 exists on the virtual line DL connecting the end E2. (See regions G1 and G2 in the figure). In Example 1A, in the case where a force is applied to the terminal electrode T from the outside by including a part of the insulating resin layers I1, I2 in the laminated structure of the wiring layers M1, M2, M3 constituting the terminal electrode T. In addition, since the force is absorbed or dispersed by the insulating resin layer present in the terminal electrode T and the force applied to the interface between the substrate 100 and the terminal T is suppressed, peeling of the terminal electrode T from the substrate 100 is suppressed. .

  The effects of the present embodiment will be described from different viewpoints with reference to comparative examples. FIG. 5 is a cross-sectional view showing the structure of the terminal electrode T of the coupler 10 of the comparative example. FIG. 5 corresponds to a cross-sectional view taken along line AA in FIG. In the comparative example, the upper edge E1 of the terminal electrode T and the lower edge E2 diagonally connected to the upper edge E1 in the cross section (FIG. 5) obtained by cutting the terminal electrode perpendicular to the substrate surface are connected. On the virtual line DL, some of the insulating resin layers I1 and I2 do not exist.

  In the comparative example shown in FIG. 5, when a force F is applied to the upper edge E1 of the terminal electrode T from the outside, a rotational moment proportional to the distance between the upper edge E1 and the lower edge E2 starts from the lower edge E2. Occur. This rotational moment increases as the height of the terminal electrode T formed on the substrate 100 increases, and as a result, it is estimated that the terminal electrode T peels off from the substrate 100.

  On the other hand, in Example 1A shown in FIG. 4, fragile insulating resin layers I1 and I2 different from the terminal electrode T are provided on the diagonal line DL connecting the upper edge E1 and the lower edge E2 of the terminal electrode T. Is formed. For this reason, when the force F is applied to the upper edge E1 from the outside, it is estimated that the part which should become the starting point of the rotational moment which generate | occur | produces in the terminal electrode T increases. In the example shown in FIG. 4, in addition to the lower edge E2 of the terminal electrode T, the part E3 of the wiring layer M3 in the region G1 and the part E4 of the wiring layer M2 in the region G2 are the starting points of the rotational moment caused by the force F. It is estimated that The part E3 is an intersection of the diagonal line DL and the wiring layer M3, and the part E4 is an intersection of the diagonal line DL and the wiring layer M2. Thus, since there are a plurality of portions serving as starting points of the rotational moment, it is presumed that the rotational moment starting from the lower edge E2 of the terminal electrode T3, which is one starting point, decreases. Therefore, it is presumed that the terminal electrode T is prevented from peeling from the substrate 100. However, the action is not limited to this.

  In Example 1A shown in FIG. 4, a part of the insulating resin layers I1 and I2 is on the diagonal line DL connecting the upper edge E1 and the lower edge E2 of the terminal electrode T in the cross section along the short direction of the coupler. Exist. Thereby, it is estimated that peeling due to the force F from the short direction of the coupler is suppressed. However, for the purpose of preventing peeling due to the force F from the longitudinal direction of the coupler, on the diagonal line connecting the upper edge and the lower edge of the terminal electrode T in the cross section along the longitudinal direction of the coupler. In addition, a part of the insulating resin layers I1 and I2 may be present. By causing a part of the insulating resin layer to exist on the imaginary line in the cross section according to the direction of the target force F, peeling of the terminal electrode T from the substrate 100 is effectively suppressed.

(Example 1B)
FIG. 6 is a cross-sectional view for explaining details of the structure of the terminal electrode T of the coupler 1B of the embodiment 1B of the present invention. 6 corresponds to a cross-sectional view taken along line AA in FIG. Also in Example 1B, the upper edge E1 of the terminal electrode T and the lower edge E2 diagonal to the upper edge E1 in the cross section (FIG. 6) obtained by cutting the terminal electrode perpendicular to the substrate surface. A part of the insulating resin layers I1 and I2 penetrates into the terminal electrode T in the area of the terminal electrode T so that a part of the insulating resin layers I1 and I2 exists on the virtual line DL connecting . In the first embodiment, the inner walls of the through holes TH1 and TH2 are tapered, whereas in the first embodiment, the inner walls of the through holes TH1 and TH2 are gently curved. In other words, a part of the insulating resin layers I1 and I2 existing on the virtual line DL is a ridgeline of the insulating resin layers I1 and I2 (wall (wall) in a cross section obtained by cutting the insulating resin layer perpendicular to the substrate surface. ) Surface) extends at least on the wiring layer M1 constituting the terminal electrode T so that the bottom surface is concavely widened. That is, the ridgeline (side wall surface) does not reach the wiring layer in a straight line having a certain inclination angle as in Example 1A, but is joined to the wiring layer in the insulating resin layer. The hem portion is extended in a concave shape toward the outside so as to draw the skirt from the linear inclined surface.

  Also in Example 1B, the same effect as Example 1A can be produced. Furthermore, in Example 1B, a part of the insulating resin layers I1 and I2 can be present on the virtual line while suppressing the amount of the insulating resin layers I1 and I2 on the terminal electrode T. As a result, it is possible to suppress peeling of the terminal electrode T from the substrate 100 while maintaining a low resistance of the terminal electrode T.

(Example 1C)
FIG. 7 is a cross-sectional view for explaining details of the structure of the terminal electrode T of the coupler 1C according to the embodiment 1C of the present invention. FIG. 7 corresponds to a cross-sectional view taken along line AA in FIG. Also in Example 1C, the upper edge E1 of the terminal electrode T and the lower edge E2 diagonal to the upper edge E1 in the cross section (FIG. 7) obtained by cutting the terminal electrode perpendicular to the substrate surface. A part of the insulating resin layers I1 and I2 penetrates into the terminal electrode T in the area of the terminal electrode T so that a part of the insulating resin layers I1 and I2 exists on the virtual line DL connecting . In Example 1A, the inner walls of the through holes TH1 and TH2 are tapered, whereas in Example 1C, the inner walls of the through holes TH1 and TH2 are along the vertical direction (perpendicular to the surface of the substrate 100). ing. Also in Example 1C, the same effect as Example 1A can be produced.

(Production method)
Next, an example of a method for manufacturing the above coupler will be described with reference to FIGS. First, as shown in FIG. 8, an insulating layer 101 made of a silicon nitride film is formed on an insulating substrate 100 made of aluminum oxide or the like by, for example, a CVD (Chemical Vapor Deposition) method.

  Next, as shown in FIG. 9, a pattern of the wiring layer M <b> 1 is formed on the insulating layer 100. For example, after a thin copper film is formed on the entire surface of the insulating layer 101 by a sputtering method, a resist pattern having an opening in a region where the pattern of the wiring layer M1 is to be formed is formed on the copper film. The resist pattern is formed by resist application, exposure, and development. Then, a copper film having a predetermined thickness is formed by growing a copper film on the thin copper film exposed in the opening of the resist pattern by electroplating. Then, after removing the resist pattern, the thin copper film formed first by the sputtering method is removed by the ion milling method. Thus, a pattern of the wiring layer M1 made of a copper film is formed on the insulating layer 101.

  Next, as shown in FIG. 10, an insulating resin layer I1 having a through hole TH1 exposing the wiring layer M1 at a predetermined location is formed on the insulating layer 101 and the wiring layer M1. For example, a photosensitive resin made of polyimide or the like containing a photosensitive agent is applied on the insulating layer 101 and the wiring layer M1, and the photosensitive resin is exposed, developed, and cured, whereby the insulating resin layer I1 having the through hole TH1. Is formed. In addition, after forming the insulating resin layer which does not have photosensitivity, a through-hole may be formed by forming a resist pattern on the insulating resin layer and etching the insulating resin layer.

  Next, as shown in FIG. 11, a pattern of the wiring layer M2 is formed on the insulating resin layer I1. The method for forming the pattern of the wiring layer M2 is the same as that of the wiring layer M1. That is, after forming a thin copper film on the entire surface of the insulating resin layer I1 by a sputtering method, a resist pattern having an opening in a region where the pattern of the wiring layer M2 is to be formed is formed on the copper film. The resist pattern is formed by resist application, exposure, and development. Then, a copper film having a predetermined thickness is formed by growing a copper film on the thin copper film exposed in the opening of the resist pattern by electroplating. Then, after removing the resist pattern, the thin copper film formed first by the sputtering method is removed by the wet etching method. As a result, the pattern of the wiring layer M2 made of the copper film is formed on the insulating resin layer I1.

  Next, as shown in FIG. 12, an insulating resin layer I2 having a through hole TH2 that exposes the wiring layer M2 at a predetermined position is formed on the insulating resin layer I1 and the wiring layer M2. For example, an insulating resin layer having a through hole TH2 is obtained by applying a photosensitive resin made of polyimide or the like containing a photosensitive agent on the insulating resin layer I1 and the wiring layer M2, and exposing, developing, and curing the photosensitive resin. I2 is formed. In addition, after forming the insulating resin layer which does not have photosensitivity, a through-hole may be formed by forming a resist pattern on the insulating resin layer and etching the insulating resin layer.

  Next, as shown in FIG. 13, the pattern of the wiring layer M3 is formed on the insulating resin layer I2. The method for forming the pattern of the wiring layer M3 is the same as that of the wiring layer M1. That is, after forming a thin copper film on the entire surface of the insulating resin layer I2 by sputtering, a resist pattern having an opening in a region where the pattern of the wiring layer M3 is to be formed is formed on the copper film. The resist pattern is formed by resist application, exposure, and development. Then, a copper film having a predetermined thickness is formed by growing a copper film on the thin copper film exposed in the opening of the resist pattern by electroplating. Then, after removing the resist pattern, the thin copper film formed first by the sputtering method is removed by the wet etching method. As a result, the pattern of the wiring layer M3 made of the copper film is formed on the insulating resin layer I2.

  Next, as shown in FIG. 14, the insulating resin layer I3 is formed on the insulating resin layer I2 and the wiring layer M3 except for the terminal electrode T. For example, a photosensitive resin made of polyimide or the like containing a photosensitive agent is applied on the insulating resin layer I2 and the wiring layer M3, and the photosensitive resin is exposed, developed, and cured, so that the insulating resin layer I3 having a desired pattern is obtained. Is formed. In addition, after forming the insulating resin layer which does not have photosensitivity, a resist pattern may be formed on an insulating resin layer, and the pattern of an insulating resin layer may be formed by etching an insulating resin layer.

  Finally, as shown in FIG. 15, a plated film 102 is formed on the surface of the terminal electrode T by sequentially plating a Ni—P film, a Pd film, and an Au film. Note that the Pd film may be omitted. The Ni—P film is provided to prevent the elements constituting the solder from diffusing into the terminal electrode T. This is because if the element constituting the solder diffuses into the terminal electrode T, the terminal electrode T is easily peeled from the substrate 100.

  The coupler 1 of the present embodiment can be manufactured by adjusting the forming steps of the insulating resin layers I1 and I2 shown in FIGS. 10 and 12 among the steps described above. Specifically, in order to make part of the insulating resin layers I1 and I2 exist on the virtual line DL, the diameters of the through holes TH1 and TH2 at the terminal electrode T may be adjusted (reduced). Then, by adjusting the temperature and time of the curing process of the photosensitive resin, as shown in Examples 1A and 1C, the shape of the side wall of the through hole can be made vertical or tapered.

  The structure shown in Example 1B is manufactured as follows, for example. One approach is to use an annealing process. As described above, in the step of forming the insulating resin layers I1 and I2, photosensitive resin is applied, exposed, developed, and cured. The curing step is intended to dry and cure the photosensitive resin after development, and is performed at a temperature of 170 ° C. to 280 ° C. for 1 hour to 3 hours, for example. Here, after the development and before the curing step, for example, annealing is performed at a temperature that does not allow curing (for example, at a temperature of 130 ° C. for 3 minutes), whereby the photosensitive resin flows, and the shape of the skirt spread shown in FIG. Is obtained.

  Alternatively, there is a method of introducing an additive into the photosensitive resin. By introducing an additive that increases the adhesion between the wiring layer material and the resin into the photosensitive resin, the resin can be left behind on the surface of the wiring layer during development. Examples of such additives include silane coupling agents, polymer coupling agents (polycarboxylic acids), polymerizable coupling agents (triazine thiol-based), self-assembled films (alkyl thiol-based), and polycarboxylic acid-based cups. Examples thereof include a ring agent, a thiol coupling agent, diphenylsulfonic acid or a derivative thereof.

  As described above, a coupler which is an embodiment of the electronic component of the present invention is manufactured. When the above coupler is mounted on a wiring board on which an external circuit is formed, mechanical pressure is applied to the coupler with a solder bump interposed between the terminal electrode T of the coupler and the external circuit of the wiring board. Applied between the wiring boards. Thereby, electrical connection and mechanical joining of the terminal electrode and the external circuit are achieved via the solder bump. In the present embodiment, even when a force in a direction parallel to the surface of the substrate 100 is applied to the terminal electrode T in the step of mounting the coupler on the wiring substrate, the terminal electrode T is peeled off from the substrate 1100. Can be prevented.

  In addition, as above-mentioned, this invention is not limited to said each embodiment, A various deformation | transformation is possible in the limit which does not change the summary. For example, the electronic component of the present invention is applicable to thin film devices other than couplers, such as thin film capacitors and filters. Moreover, there is no limitation in the material of a wiring layer or an insulating resin layer. Furthermore, various modifications can be made without departing from the scope of the present invention.

  The electronic component of the present invention can be widely applied particularly to wireless communication devices, apparatuses, modules, and systems that are required to be reduced in size and thickness, and equipment including them.

  DESCRIPTION OF SYMBOLS 1 ... Coupler, M1, M2, M3 ... Wiring layer, I1, I2, I3 ... Insulating resin layer, IM ... Main current, IL ... Inductive current, IC ... Displacement current, C1, C2 ... Capacitive coupling, M ... Magnetic coupling, R ... resistance, G ... ground potential, L1 ... first line, L2 ... second line, T ... terminal electrode, T11 ... input terminal electrode, T12 ... output terminal electrode, T21 ... coupling terminal electrode, T22 ... isolation terminal Electrode, TH1, TH2 ... through hole, DL ... virtual line, E1 ... upper edge, E2 ... lower edge, E3, E4 ... site, 100 ... substrate, 101 ... insulating layer.

Claims (2)

Electronic components,
A substrate,
An electronic device provided on a substrate;
An insulating resin layer formed on the substrate;
It is connected to the electronic element and is composed of a plurality of wiring layers , and is provided only in a region protruding from the component surface of the electronic component and defined by the periphery of the insulating resin layer in plan view . A terminal electrode;
With
The terminal electrode includes an upper edge of the terminal electrode and a lower edge of the terminal electrode that is diagonal to the upper edge in a cross-section obtained by cutting the terminal electrode perpendicular to the substrate surface. Provided so that a part of the insulating resin layer exists on the connecting virtual line,
Electronic components. A part of the insulating resin layer present on the imaginary line extends on at least one of the wiring layers constituting the terminal electrode such that the ridge line of the insulating resin layer extends in a concave shape.
The electronic component according to claim 1.

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