JP2002270451A - Method for producing inductor component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for producing an inductor component in which attenuation characteristics can be enhanced in high frequency band and the profile can be lowered by making thin a magnetic body part. SOLUTION: The method for producing an inductor component comprises a step 11 for forming an insulating substrate, a step 14 for forming a coil, a step 16 for placing a magnetic body part in layer, a step 18 for forming an outer electrode, a step 19 for connection, and a step 20 of simultaneous firing. The step 14 for forming a coil comprises an intaglio printing step 22 for placing a printed board having a spiral recess filled with a conductive material on the insulating substrate, transferring the conductive material filling the recess of the printed board to the insulating substrate and firing it together with the insulating substrate to form a coil pattern part on the same plane of the insulating substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an inductor component for removing noise in various consumer appliances and the like.

[0002]

2. Description of the Related Art A conventional inductor component will be described below with reference to the drawings.

FIG. 8 is an exploded perspective view of a conventional inductor component, FIG. 9 is a perspective view of the inductor component, and FIG. 10 is an impedance-frequency characteristic diagram of the inductor component.

[0004] In FIGS. 8 and 9, a conventional inductor component includes a magnetic body 1 made of a magnetic material and a magnetic body 1.
And a coil pattern formed by spirally forming the conductor 2 and an external electrode 3 electrically connected to the coil pattern.

The magnetic part 1 includes a plurality of magnetic substrate layers 4
The conductor portions 2 of the coil pattern portion are arranged as arc-shaped conductor portions 2 each having less than one turn on the plurality of magnetic substrate layers 4, and the upper and lower magnetic substrate layers 4 are formed.
By electrically connecting the arc-shaped conductor portion 2 disposed in the above-described manner via the via portion 5, a coil pattern portion of about several turns is formed in the magnetic body portion 1.

Further, the conductor 2 forms a common mode choke coil.

At this time, the impedance-frequency characteristics are as shown in FIG.

[0008]

In recent years, in information communication equipment and the like, it is increasingly necessary to transfer a large amount of information signals at a high speed of about several hundred Mbps in a high frequency band of about 1 GHz.

In the above-mentioned conventional configuration, a plurality of magnetic substrate layers 4 on which the arc-shaped conductor portions 2 are arranged are laminated, and the coil pattern portion is formed in the magnetic portion 1. The magnetic part 1 is interposed between the upper and lower conductors 2 arranged on the substrate layer 4.

[0010] The magnetic part 1 allows the magnetic substrate layer 4
Since the magnetic permeability between the upper and lower opposing conductor portions 2 increases, the amount of magnetic flux (leakage magnetic flux amount) passing between the conductor portions 2 increases, and the amount of magnetic flux circulating around the coil pattern portion decreases accordingly. Accordingly, the impedance value also decreases, and a sufficient amount of attenuation cannot be obtained.

For this purpose, a magnetic material having a high magnetic permeability is used as the magnetic body portion 1 and the amount of magnetic flux circulating around the coil pattern portion is increased, thereby increasing the impedance value and suppressing a decrease in attenuation. Was.

However, when a magnetic material having a high magnetic permeability is used, the peak value of the impedance value shifts to the low frequency band side, so that the attenuation characteristic deteriorates in the high frequency band.

In particular, as shown in the impedance-frequency characteristic diagram of FIG. 10, when used as a common mode choke coil, the peak value of the impedance value 6 with respect to the common mode current which is a noise component shifts to the low frequency band side. As a result, the attenuation characteristic of the noise component in the high frequency band deteriorates, and the peak value of the impedance value 7 with respect to the normal mode current, which is the information signal component, also shifts to the low frequency band side. It will be attenuated.

In general, when laminating the magnetic substrate layer 4 on the coil pattern portion, the magnetic substrate layer 4 is pressed toward the coil pattern portion, for example, so that a gap between the conductor portions 2 of the coil pattern portion is formed. In order that the magnetic substrate layer 4 can be easily arranged, the cross-sectional shape of the conductor portion 2 is made to be a foil shape with a shorter vertical dimension than a horizontal dimension.

However, in this case, the upper and lower magnetic substrate layers 4
The stray capacitance is generated in proportion to this opposing area, and the peak value of the impedance value shifts to the lower frequency band side. Will deteriorate.

As described above, the above configuration has a problem that the attenuation characteristic is deteriorated in a high frequency band. In addition, in order to form a coil pattern portion of about several turns, a number of magnetic substrate layers 4 are stacked. Therefore, it is necessary to make the magnetic body portion 1 thick, so that the height cannot be reduced.

The present invention solves the above-mentioned problems, and can improve the attenuation characteristics in a high frequency band.
It is an object of the present invention to provide a method for manufacturing an inductor component that can reduce the height by reducing the thickness of a magnetic body.

[0018]

In order to achieve the above object, the invention according to claim 1 of the present invention is characterized in that, in the coil forming step, a printing substrate in which a spiral concave portion is filled with a conductive material is used. Providing an intaglio printing step of transferring the conductive material filled in the concave portion of the printing substrate onto the insulating substrate, forming the coil pattern portion on the same plane of the insulating substrate; After the forming step, a non-magnetic part forming step of forming a non-magnetic part made of a non-magnetic material between the conductor parts of the coil pattern part is provided, and the insulating substrate, the coil pattern part, the magnetic part, Is a manufacturing method provided with a simultaneous firing step of simultaneously firing.

Since the intaglio printing process is used according to the above manufacturing method, a coil pattern portion having a very high density between spiral conductor portions can be easily formed. In particular, the coil pattern portion can be formed on the same plane of the insulating substrate. Can be formed.

Therefore, since the coil pattern portion can be formed on the same plane, it is not necessary to divide the coil pattern portion into several layers and form the inside of the magnetic material, and the magnetic material portion is interposed between the conductor portions formed above and below. And the amount of magnetic flux (leakage magnetic flux) passing between the conductors decreases,
The amount of magnetic flux circulating around the coil pattern portion increases, and accordingly, the degree of magnetic coupling of the coil pattern portion increases, so that a decrease in attenuation can be suppressed. This allows
Even if the peak value of the impedance value is shifted to the high frequency band side by using a magnetic material having a small magnetic permeability as the magnetic body portion, a decrease in the attenuation can be suppressed.

In general, when a magnetic material having a low magnetic permeability is used as the magnetic body, the peak value of the impedance value is reduced and the attenuation is reduced.
Since the degree of magnetic coupling of the coil pattern is increased,
It is possible to suppress a decrease in the amount of attenuation while shifting the peak value of the impedance value to the high frequency band side.

Further, since the coil pattern portion can be formed on the same plane, the opposing area of the adjacent conductor portion is reduced, the stray capacitance generated between the opposing conductor portions is reduced, and the peak value of the impedance value becomes higher. In addition to being able to shift to the band side, the magnetic part can be formed thin, and the height can be reduced.

As described above, since the coil pattern portion can be formed on the same plane, no magnetic material portion is interposed between the conductor portions, so that the attenuation characteristics can be improved in a high frequency band and the height can be reduced. Can also be planned.

According to the second aspect of the present invention, the first aspect is provided.
In the described invention, a non-magnetic material is a ceramic manufacturing method.

According to the above manufacturing method, the amount of magnetic flux passing between the conductor portions of the coil pattern portion can be further reduced, and the degree of magnetic coupling can be further improved.

The third aspect of the present invention is the first aspect of the present invention.
In the invention described above, the present invention particularly relates to a production method using glass as a nonmagnetic material.

According to the above manufacturing method, not only the amount of magnetic flux passing between the conductor portions of the coil pattern portion can be further reduced to further improve the degree of magnetic coupling, but also the periphery between the conductor portions and between the conductor portions or between the conductor portions. Since the glass is filled, voids are eliminated, and corrosion and migration of the conductor due to moisture and the like contained in air in the voids can be suppressed.

The fourth aspect of the present invention is the first aspect of the present invention.
In the invention described, in the non-magnetic material part forming step, a step of filling an insulating resin as a non-magnetic material around the conductor between the conductor part and the conductor part of the coil pattern part, or between the conductor parts, and in the simultaneous firing step, A manufacturing method comprising a step of forming a gap between the conductors and between the conductors or a gap between the conductors by burning off the insulating resin.

According to the above manufacturing method, the insulating resin filled as a non-magnetic material around the conductor portions of the coil pattern portion and between the conductor portions or between the conductor portions is burned off. Is formed.

Since the gap itself becomes a non-magnetic material, the magnetic permeability between the conductors becomes very small, and the passage of the magnetic flux generated in the coil pattern between the conductors is hindered. To generate magnetic flux efficiently, improve the degree of magnetic coupling between conductors,
The amount of attenuation can be increased.

Further, since the dielectric constant of the gap is small, the stray capacitance generated between the conductors can be reduced, and the peak value of the impedance value can be shifted to a higher frequency band.

The fifth aspect of the present invention provides the first aspect.
In the invention described, in the non-magnetic material part forming step, a step of filling glass as a non-magnetic material between the conductor parts of the coil pattern part and between the conductor parts, or between the conductor parts is provided, and in the simultaneous firing step, Liquefy the glass,
The liquefied glass is infiltrated into a magnetic body portion and an insulating substrate, so as to surround the coil pattern portion.
A manufacturing method including a step of forming a glass layer and a step of forming a gap between the conductors and between the conductors or between the conductors.

According to the above manufacturing method, the glass filled as a non-magnetic material around the conductor portions of the coil pattern portion or between the conductor portions or between the conductor portions is liquefied, and the liquefied glass penetrates the magnetic material portion and the insulating substrate. Therefore, a void is formed in the remaining portion of the liquefied glass.

Since the gap itself becomes a non-magnetic material, the magnetic permeability between the conductors becomes very small, and the passage of the magnetic flux generated in the coil pattern between the conductors is hindered. To generate magnetic flux efficiently, improve the degree of magnetic coupling between conductors,
The amount of attenuation can be increased.

Further, since the dielectric constant of the gap is small, the stray capacitance generated between the conductors can be reduced, and the peak value of the impedance value can be shifted to a higher frequency band.

Further, the liquefied glass penetrates the conductor portion and the magnetic portion in the vicinity between the conductor portions or in the vicinity of the conductor portion to form a glass layer, thereby reducing the magnetic permeability of the magnetic portion and reducing the magnetic permeability. The part can be made non-magnetic.

As a result, the nonmagnetic material portion is also formed around the gap, so that the magnetic permeability between the conductor portions becomes very small, and the passage of the magnetic flux generated by the coil pattern between the conductor portions is hindered. As a result, the magnetic flux can be generated efficiently so as to go around the coil pattern portion, the degree of magnetic coupling between the conductor portions can be improved, and the attenuation can be further increased.

In addition, since the magnetic part around the gap is demagnetized, the dielectric constant in the gap and the vicinity of the gap becomes smaller, the stray capacitance generated between the conductors is reduced, and the impedance value is reduced. The peak value can be shifted to a higher frequency band side.

In particular, since a glass layer is formed around the gap, the moisture and the like generally penetrate into the gap through the magnetic body even if the magnetic body has hygroscopicity. Difficult,
Corrosion and migration of the conductor due to moisture and the like in the gap can be prevented.

The invention described in claim 6 of the present invention is the same as the first embodiment.
In the invention described above, a manufacturing method particularly includes a step of repeating a coil forming step and a magnetic part laminating step a plurality of times and alternately laminating a coil pattern part and a magnetic part.

According to the above manufacturing method, a plurality of coil pattern portions can be formed in the magnetic body portion.

The invention according to claim 7 of the present invention is characterized by claim 1
In the invention described in the description, in particular, in the connecting step, a through hole is provided in the magnetic body portion, a conductive member is filled in the through hole, and the coil pattern portion and the external electrode are electrically connected via the via portion made of the conductive member. This is a manufacturing method in which a step of making a dynamic connection is performed.

According to the above-described manufacturing method, the coil pattern portion and the external electrode can be accurately and electrically connected via the via portion.

The invention according to claim 8 of the present invention is directed to claim 7
In the invention described, in particular, the magnetic part is formed by stacking a plurality of magnetic part layers having through holes, and the via part is formed by stacking a plurality of via part layers in which the through holes are filled with a conductive member. Formed between the outer peripheral portion of the through hole of the upper and lower adjacent magnetic material layer and project from the end of the via portion layer, the outer peripheral portion of the through hole of the magnetic material portion layer and the end portion of the via portion layer. Are alternately laminated.

According to the above-described manufacturing method, it is possible to prevent a void from being formed on the contact surface between the magnetic body portion and the via portion, to suppress corrosion of the via portion due to moisture and the like contained in the air in the void, and to prevent adjacent via portions. Even if the positions of the through holes in the upper and lower magnetic part layers are displaced from each other, the adjacent upper and lower via part layers can be accurately electrically connected to each other.

Thus, the magnetic portion and the via portion can be formed to a predetermined thickness without deteriorating the electrical connection of the via portion.

[0047]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiments) The invention described in all claims of the present invention will be described below with reference to the drawings.

FIG. 1 is a manufacturing process diagram of an inductor component according to an embodiment of the present invention, FIG. 2 is a perspective view of the inductor component, FIG. 3 is a sectional view of the inductor component, and FIG. FIG. 5 is an enlarged cross-sectional view of portion A of FIG. 3 of the inductor component, FIG. 6 is a plan view of an insulating substrate on which a coil pattern portion of the inductor component is formed, and FIG. It is an impedance-frequency characteristic diagram.

Referring to FIGS. 1 to 6, an inductor component manufacturing process according to the embodiment of the present invention includes an insulating substrate forming process 11 for forming an insulating substrate 10 and a coil pattern portion 13 having a conductor portion 12 formed in a spiral shape. Forming a coil on the insulating substrate 10, forming a magnetic portion 15 on the insulating substrate 10, forming a magnetic portion 15 on the insulating substrate 10,
7 for forming an external electrode 7 and a connection step 19 for electrically connecting the external electrode 17 and the coil pattern portion 13
, Insulating substrate 10, coil pattern section 13, and magnetic body section 1
5 and a co-firing step 20 for firing simultaneously.
At this time, since the co-firing step 20 is provided, the unsintered insulating substrate 10 and the magnetic body portion 15 may be used. After the co-firing step 20, a glass laminating step is provided to perform the first Protective glass 25 and second protective glass 27
May be formed.

In the coil forming step 14, the printing substrate in which the conductive material is filled in the spiral concave portion is overlapped on the insulating substrate 10, and the conductive material filled in the concave portion of the printing substrate is placed in the insulating substrate 1.
0, and forms an intaglio printing step 22 in which the coil pattern portion 13 is formed on the same plane of the insulating substrate 10.

Further, after the coil forming step 14, a nonmagnetic material portion 23 made of a nonmagnetic material is formed around the conductor portions 12 or between the conductor portions 12 so as to surround the coil pattern portion 13. A non-magnetic part forming step 24 is provided.

In the non-magnetic material part forming step 24, a step of filling glass as a non-magnetic material around the conductor parts 12 of the coil pattern part 13 or between the conductor parts 12 is provided. In step 20,
A step of liquefying the glass and infiltrating the liquefied glass into the magnetic body portion 15 and the insulating substrate 10 to form a glass layer so as to surround the periphery of the coil pattern portion 13 is provided. And a step of forming a gap between the conductors 12 or between the conductors 12.

In the connecting step 19, a through hole is provided in the magnetic body portion 15, a conductive member is filled in the through hole, and the coil pattern portion 13 and the external electrode 17 are connected to the via portion 29 made of the conductive member. This is a step of making electrical connection via the extraction electrode 30.

At this time, the magnetic portion 15 is formed by laminating a plurality of magnetic portion layers 31 each having a through hole, and the via portion 29 is formed by forming a plurality of via portion layers 32 each having a through hole filled with a conductive material. The adjacent upper and lower magnetic part layers 31 are formed by lamination.
The end portion 34 of the via portion layer 32 is projected between the through hole outer peripheral portions 33 of the magnetic material portion layer 31 so that the through hole outer peripheral portion 33 of the magnetic body portion layer 31 and the via portion layer 3
A step of alternately stacking the two end portions 34 is provided.

FIG. 7 shows impedance-frequency characteristics of such an inductor component.
When the coil pattern portion 13 is formed of the conductor portion 12 of a two-wire loop and used as a common mode choke coil, the peak value of the impedance value 35 with respect to the common mode current as a noise component can be shifted to the high frequency band side. As a result, the impedance value 36 for the normal mode current, which is the information signal component, can be reduced from the low frequency band to the high frequency band. Therefore, in a high frequency band, the impedance value 35 with respect to the common mode current as the noise component can be attenuated while the impedance value 36 with respect to the normal mode current as the information signal component is not attenuated. A large amount of information signals at several hundred Mbps
This is advantageous for transfer at a high speed.

The inductor component manufactured by the above manufacturing method has a vertical direction of 0.5 to 1.6 mm and a horizontal direction of 1.0.
An insulating substrate 10 made of Ni-based ferrite having an outer dimension of 0 to 3.2 mm and a height direction of 0.9 to 1.2 mm and a relative magnetic permeability of about 650; A coil pattern portion 13 in which the conductor portion 12 is formed in a spiral shape; and a magnetic body portion 15 made of Ni-based ferrite having a relative magnetic permeability of about 100 laminated on the insulating substrate 10.
And an external electrode 17 electrically connected to the coil pattern portion 13 via the lead electrode 30. The thickness (H1) of the insulating substrate 10 is larger than one time the thickness (H2) of the magnetic body portion 15. , And the conductor portion 12 is spirally
And the width (W1) between the conductors 12 between the adjacent conductors 12 is one of the width (W2) of the conductors 12.
It is larger than / 2 times and smaller than 2 times.

A non-magnetic material portion 23 made of glass such as crystallized non-magnetic material is formed around the conductor portions 12 of the coil pattern portion 13 so as to surround the coil pattern portion 13. ing. At this time, the nonmagnetic material glass penetrates in the vicinity of the magnetic part 15 in contact with the nonmagnetic part 23 to form a magnetic material layer made of glass.

Further, a through hole is provided in the magnetic body portion 15, and the through hole is filled with a conductive member made of Ag to form a via portion 29, and the coil pattern portion 13 and the external electrode 17 are connected to the via hole 29. They are electrically connected via a part 29.

At this time, the magnetic part 15 is formed by laminating a plurality of magnetic part layers 31 each having a through hole.
The via portion 29 is formed by laminating a plurality of via portion layers 32 in which a through hole is filled with a conductive member, and an end portion 34 of the via portion layer 32 is provided between the outer peripheral portions 33 of the adjacent upper and lower magnetic body portions 31. Are projected, and the outer peripheral portion 33 of the through hole of the magnetic body portion layer 31 and the end portion 34 of the via portion layer 32 are alternately laminated.

Since the intaglio printing step 22 is used according to the above manufacturing method, the coil pattern portion 13 having a very high density between the spiral conductor portions 12 can be easily formed. In particular, the coil pattern portion 13 can be formed on the same plane of the insulating substrate 10. The coil pattern portion 13 can be formed.

Accordingly, since the coil pattern portion 13 can be formed on the same plane, it is not necessary to divide the coil pattern portion 13 into several layers and form the coil pattern portion 13 inside the magnetic body. The magnetic flux amount (leakage magnetic flux amount) passing between the conductor portions 12 decreases, and the magnetic flux amount circulating around the coil pattern portion 13 increases accordingly. The degree of magnetic coupling of the pattern portion 13 is increased, so that a decrease in attenuation can be suppressed. Thereby, even if the magnetic material part 15 is made of a magnetic material having a small magnetic permeability and the peak value of the impedance value is shifted to the high frequency band side, a decrease in the attenuation can be suppressed.

In general, when a magnetic material having a low magnetic permeability is used as the magnetic body portion 15, the peak value of the impedance value is reduced and the attenuation is reduced. Since the degree of coupling is increased, it is possible to suppress a decrease in the attenuation while shifting the peak value of the impedance value toward the high frequency band.

Furthermore, since the coil pattern portion 13 can be formed on the same plane, the opposing area of the adjacent conductor portions 12 is reduced, the stray capacitance generated between the opposing conductor portions 12 is reduced, and the peak value of the impedance value is reduced. It is possible to shift to a higher frequency band side, and the magnetic body portion 15 can be formed thin, so that the height can be reduced.

As described above, since the coil pattern portion 13 can be formed on the same plane, the magnetic portion 15
Without intervening, it is possible to improve the attenuation characteristics in a high frequency band, and to reduce the height.

In particular, since the non-magnetic material is glass, not only the amount of magnetic flux passing between the conductor portions 12 of the coil pattern portion 13 can be further reduced and the degree of magnetic coupling can be further improved, but also the conductor portion 12 and the conductor portion can be improved. The space between the conductors 12 or the space between the conductors 12 is filled with glass, so that the voids are eliminated, and the conductors 1 caused by moisture and the like contained in the air in the voids
2 can also suppress corrosion and migration.

Further, the conductor portion 1 of the coil pattern portion 13
The glass filled as a non-magnetic material between the conductors 2 and between the conductors 12 or between the conductors 12 is liquefied, and the liquefied glass penetrates into the magnetic body 15 and the insulating substrate 10. Is formed, and the gap itself becomes the nonmagnetic portion 23. At this time, the conductor 1
The magnetic permeability between the two becomes very small, and the passage of the magnetic flux generated in the coil pattern portion 13 between the conductor portions 12 is prevented,
A magnetic flux can be efficiently generated so as to go around the coil pattern portion 13 to improve the degree of magnetic coupling between the conductor portions 12 and increase the amount of attenuation, and the dielectric constant of the void portion is small. , And the peak value of the impedance value can be shifted to a higher frequency band side.

The liquefied glass penetrates into the magnetic portion 15 around the conductor portions 12 or between the conductor portions 12 or in the vicinity of the conductor portions 12 to form a glass layer.
The magnetic permeability can be reduced to make the magnetic body portion 15 non-magnetic, so that the non-magnetic body portion 23 is also formed around the gap. At this time, the magnetic permeability between the conductor portions 12 becomes very small, and the passage of the magnetic flux generated in the coil pattern portion 13 between the conductor portions 12 is hindered. Is generated, the degree of magnetic coupling between the conductors 12 is improved, the attenuation can be increased, and the magnetic body 1 around the gaps
5 is demagnetized, the dielectric constant in the gap and the vicinity of the gap becomes smaller, the stray capacitance generated between the conductors 12 is reduced, and the peak value of the impedance value is shifted to the higher frequency band side. Can be.

In particular, since the glass layer is formed around the gap, the moisture is generally absorbed into the gap through the magnetic body 15 even if the magnetic body 15 has a hygroscopic property. It is difficult to penetrate, and it is possible to prevent corrosion and migration of the conductor portion 12 due to moisture and the like in the void portion.

Further, it is possible to prevent a gap from being formed on the contact surface between the magnetic body section 15 and the via section 29, to suppress corrosion of the via section 29 due to moisture and the like contained in the air in the gap, and to prevent adjacent via sections 29 from being adjacent to each other. Even if the positions of the through holes of the upper and lower magnetic body layers 31 are shifted from each other, the adjacent upper and lower via section layers 32
Electrical connection can be accurately established between the via portions 29.
The magnetic body portion 15 and the via portion 29 can be formed to a predetermined thickness dimension without deteriorating the electrical connection of the semiconductor device.

As described above, according to the embodiment of the present invention,
Since the coil pattern portion 13 can be formed on the same plane,
The conductor portions 12 are not formed on the upper and lower magnetic substrate layers, so that the magnetic portions 15 are not interposed between the conductor portions 12, so that the attenuation characteristics can be improved in a high frequency band, and the magnetic portion can be improved. 15 can be thinned to reduce the height.

Further, since the non-magnetic material is glass, not only the amount of magnetic flux passing between the conductor portions 12 of the coil pattern portion 13 can be further reduced to improve the degree of magnetic coupling, but also the conductor portion 12 and the conductor portion can be improved. Since the space between the conductors 12 or the space between the conductors 12 is filled with glass, the gaps are eliminated, and the corrosion and migration of the conductors 12 due to the moisture and the like contained in the air in the gaps can be suppressed.

Further, the magnetic body portion 15 and the via portion 29 can be formed to a predetermined thickness without deteriorating the electrical connection of the via portion 29.

In this embodiment, the non-magnetic material is glass, but ceramic or insulating resin may be used. However, in the case of ceramic, no void is formed in the non-magnetic material part forming step 24, and the insulating resin is used. The voids can be formed by burning off the insulating resin at a firing temperature that is lower than or equal to the firing temperature at which the magnetic body portion 15 is fired.

Further, in the embodiment, the coil forming step 14 and the magnetic part laminating step 16 are performed only once, but the coil pattern part 13 and the magnetic part 15 are alternately laminated plural times. May be provided.

[0075]

As described above, according to the present invention, since the coil pattern portion can be formed on the same plane, no conductor portion is formed on the upper and lower magnetic substrate layers, and the magnetic portion is interposed between the conductor portions. Thus, it is possible to provide a method of manufacturing an inductor component that can improve the attenuation characteristic in a high frequency band and can reduce the height by reducing the thickness of the magnetic body.

[Brief description of the drawings]

FIG. 1 is a manufacturing process diagram of an inductor component according to an embodiment of the present invention.

FIG. 2 is a perspective view of the inductor component.

FIG. 3 is a sectional view of the inductor component.

FIG. 4 is an enlarged sectional view of a portion A in FIG. 3 of the inductor component.

FIG. 5 is an enlarged sectional view of a portion B in FIG. 3 of the inductor component.

FIG. 6 is a plan view of an insulating substrate on which a coil pattern portion of the inductor component is formed.

FIG. 7 is an impedance-frequency characteristic diagram of the inductor component.

FIG. 8 is an exploded perspective view of a conventional inductor component.

FIG. 9 is a perspective view of the inductor component.

FIG. 10 is an impedance-frequency characteristic diagram of the inductor component.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 insulating substrate 11 insulating substrate forming step 12 conductor part 13 coil pattern part 14 coil forming step 15 magnetic part 16 magnetic part laminating step 17 external electrode 18 external electrode forming step 19 connecting step 22 intaglio printing step 23 non-magnetic part 24 Non-magnetic part forming step 29 Via part 30 Lead electrode 31 Magnetic part part layer 32 Via part layer 33 Peripheral part of through hole 34 End part 35 Impedance value for common mode current 36 Impedance value for normal mode current

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Ike ▲ Saki ▼ Hiroshi Kadoma 1006 Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F term (reference) 5E062 FF01 5E070 AA01 AB02 AB07 BA12 CB03 CB13 CB17 CB18 EA02

Claims (8)

[Claims] An insulating substrate forming step of forming an insulating substrate; a coil forming step of forming a coil pattern portion having a conductor portion formed in a spiral shape on the insulating substrate; and a magnetic body portion laminated on the insulating substrate. A magnetic material portion laminating step, an external electrode forming step of forming an external electrode, and a connecting step of electrically connecting the external electrode and the coil pattern section. In the coil forming step, a conductor is formed in a spiral concave portion. A printing substrate filled with a material is superimposed on the insulating substrate, and the conductive material filled in the concave portion of the printing substrate is transferred to the insulating substrate, and the coil pattern portion is formed on the same plane of the insulating substrate. Providing an intaglio printing step, and after the coil forming step, providing a non-magnetic part forming step of forming a non-magnetic part made of a non-magnetic material between the conductors of the coil pattern part; A method for manufacturing an inductor component, comprising a simultaneous firing step of simultaneously firing the insulating substrate, the coil pattern portion, and the magnetic body portion. 2. The method according to claim 1, wherein the non-magnetic material is ceramic.
A method for manufacturing the inductor component as described in the above. 3. The method according to claim 1, wherein the non-magnetic material is glass. 4. The method according to claim 1, wherein the step of forming the non-magnetic material portion includes a step of filling an insulating resin as a non-magnetic material between the conductor portions of the coil pattern portion or between the conductor portions or between the conductor portions. Burning off the insulating resin,
The method for manufacturing an inductor component according to claim 1, further comprising a step of forming a gap between the conductors and between the conductors or between the conductors. 5. The method according to claim 1, wherein the step of forming a non-magnetic material portion includes a step of filling glass as a non-magnetic material around or between the conductor portions of the coil pattern portion or between the conductor portions. The glass is liquefied, the liquefied glass is infiltrated into a magnetic body portion and an insulating substrate, and a step of forming a glass layer is provided so as to surround the periphery of the coil pattern portion, and the conductor portion and the 2. The method for manufacturing an inductor component according to claim 1, further comprising a step of forming a gap between the conductors or between the conductors. 6. The method for manufacturing an inductor component according to claim 1, further comprising a step of repeating the coil forming step and the magnetic body part laminating step a plurality of times to alternately laminate the coil pattern part and the magnetic body part. 7. The connecting step includes providing a through hole in the magnetic body portion, filling the through hole with a conductive member, and electrically connecting the coil pattern portion and the external electrode via a via portion made of the conductive member. 2. The method for manufacturing an inductor component according to claim 1, wherein 8. A magnetic body part is formed by laminating a plurality of magnetic body part layers, and a via part is formed by laminating a plurality of via part layers, and a contact part between the magnetic body part and the via part is formed. 8. The method of manufacturing an inductor component according to claim 7, further comprising the step of alternately stacking the ends of the magnetic body and the ends of the vias.