JP5347681B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP5347681B2
JP5347681B2 JP2009102328A JP2009102328A JP5347681B2 JP 5347681 B2 JP5347681 B2 JP 5347681B2 JP 2009102328 A JP2009102328 A JP 2009102328A JP 2009102328 A JP2009102328 A JP 2009102328A JP 5347681 B2 JP5347681 B2 JP 5347681B2
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JP
Japan
Prior art keywords
light emitting
mounting substrate
sealing member
light
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009102328A
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English (en)
Japanese (ja)
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JP2010251666A5 (enExample
JP2010251666A (ja
Inventor
大輔 三賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2009102328A priority Critical patent/JP5347681B2/ja
Publication of JP2010251666A publication Critical patent/JP2010251666A/ja
Publication of JP2010251666A5 publication Critical patent/JP2010251666A5/ja
Application granted granted Critical
Publication of JP5347681B2 publication Critical patent/JP5347681B2/ja
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JP2009102328A 2009-04-20 2009-04-20 発光装置 Expired - Fee Related JP5347681B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009102328A JP5347681B2 (ja) 2009-04-20 2009-04-20 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009102328A JP5347681B2 (ja) 2009-04-20 2009-04-20 発光装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013122108A Division JP5747947B2 (ja) 2013-06-10 2013-06-10 発光装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2010251666A JP2010251666A (ja) 2010-11-04
JP2010251666A5 JP2010251666A5 (enExample) 2012-05-24
JP5347681B2 true JP5347681B2 (ja) 2013-11-20

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ID=43313645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009102328A Expired - Fee Related JP5347681B2 (ja) 2009-04-20 2009-04-20 発光装置

Country Status (1)

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JP (1) JP5347681B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012134253A (ja) * 2010-12-20 2012-07-12 Toyoda Gosei Co Ltd 照明用ledモジュール
JP6318495B2 (ja) 2013-08-07 2018-05-09 日亜化学工業株式会社 発光装置
JP6201617B2 (ja) 2013-10-17 2017-09-27 日亜化学工業株式会社 発光装置
USD747817S1 (en) 2014-03-27 2016-01-19 Nichia Corporation Light emitting diode
JP6252302B2 (ja) 2014-03-28 2017-12-27 日亜化学工業株式会社 発光装置の製造方法
JP6432656B2 (ja) * 2017-08-22 2018-12-05 日亜化学工業株式会社 発光装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080278061A1 (en) * 2004-06-29 2008-11-13 Koninklijke Philips Electronics, N.V. Light Emitting Diode Module
US9061450B2 (en) * 2007-02-12 2015-06-23 Cree, Inc. Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding
JP2008207450A (ja) * 2007-02-27 2008-09-11 Towa Corp 発光素子の圧縮成形方法

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Publication number Publication date
JP2010251666A (ja) 2010-11-04

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