JP5341047B2 - 部品支持基板及びその製造方法 - Google Patents
部品支持基板及びその製造方法 Download PDFInfo
- Publication number
- JP5341047B2 JP5341047B2 JP2010229651A JP2010229651A JP5341047B2 JP 5341047 B2 JP5341047 B2 JP 5341047B2 JP 2010229651 A JP2010229651 A JP 2010229651A JP 2010229651 A JP2010229651 A JP 2010229651A JP 5341047 B2 JP5341047 B2 JP 5341047B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- main surface
- ceramic
- filling
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010229651A JP5341047B2 (ja) | 2010-10-12 | 2010-10-12 | 部品支持基板及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010229651A JP5341047B2 (ja) | 2010-10-12 | 2010-10-12 | 部品支持基板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012083551A JP2012083551A (ja) | 2012-04-26 |
| JP2012083551A5 JP2012083551A5 (enExample) | 2012-11-22 |
| JP5341047B2 true JP5341047B2 (ja) | 2013-11-13 |
Family
ID=46242486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010229651A Active JP5341047B2 (ja) | 2010-10-12 | 2010-10-12 | 部品支持基板及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5341047B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10768320B2 (en) | 2017-05-11 | 2020-09-08 | University Of New Hampshire | Field deployable neutron/gamma spectrometer |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6200552B1 (ja) * | 2016-06-07 | 2017-09-20 | 株式会社フジクラ | コネクタ付きケーブル |
| CN120777411B (zh) * | 2025-08-27 | 2025-12-12 | 太原理工大学 | 一种减振降噪复合管及其制备方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4639101B2 (ja) * | 2004-03-31 | 2011-02-23 | 日本特殊陶業株式会社 | 部品支持基板及びその製造方法、光デバイス |
| JP5235635B2 (ja) * | 2008-12-06 | 2013-07-10 | 日本特殊陶業株式会社 | 光導波路付き配線基板およびその製造方法 |
-
2010
- 2010-10-12 JP JP2010229651A patent/JP5341047B2/ja active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10768320B2 (en) | 2017-05-11 | 2020-09-08 | University Of New Hampshire | Field deployable neutron/gamma spectrometer |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012083551A (ja) | 2012-04-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7150569B2 (en) | Optical device mounted substrate assembly | |
| US7221829B2 (en) | Substrate assembly for supporting optical component and method of producing the same | |
| JP5384819B2 (ja) | 光電気混載パッケージ、光電気混載モジュール | |
| US7907801B2 (en) | Optical element, package substrate and device for optical communication | |
| US20060012967A1 (en) | Ic chip mounting substrate, ic chip mounting substrate manufacturing method, optical communication device, and optical communication device manufacturing method | |
| JP2006178001A (ja) | 光路変換部材、多層プリント配線板および光通信用デバイス | |
| JPWO2005052666A1 (ja) | Icチップ実装用基板、マザーボード用基板、光通信用デバイス、icチップ実装用基板の製造方法、および、マザーボード用基板の製造方法 | |
| JP5248795B2 (ja) | 光電気混載パッケージ及びその製造方法、光素子付き光電気混載パッケージ、光電気混載モジュール | |
| JP4246563B2 (ja) | 光部品支持基板及びその製造方法、光部品付き光部品支持基板及びその製造方法 | |
| JP4202216B2 (ja) | 光電気複合配線構造体、光学素子搭載基板と光導波路層と光路変換部品とからなる構造体 | |
| JP4456354B2 (ja) | 光部品付き光部品支持基板及びその製造方法 | |
| JP5341047B2 (ja) | 部品支持基板及びその製造方法 | |
| JP4639101B2 (ja) | 部品支持基板及びその製造方法、光デバイス | |
| JP4895957B2 (ja) | 光電気混載パッケージ、光電気混載モジュール | |
| JP5367635B2 (ja) | 光導波路付き配線基板の製造方法 | |
| JP5318978B2 (ja) | 光電気混載パッケージ及びその製造方法、光素子付き光電気混載パッケージ、光電気混載モジュール | |
| JP2004258065A (ja) | 光導波路基板及びその製造方法、光電気複合実装配線基板及びその製造方法 | |
| JP2005037870A (ja) | 光学素子搭載基板及びその製造方法、光導波路付き光学素子搭載基板及びその製造方法、光ファイバコネクタ付き光学素子搭載基板及びその製造方法、光部品付き光学素子搭載基板 | |
| JP4476743B2 (ja) | 光部品支持基板及びその製造方法 | |
| JP2005115190A (ja) | 光電気複合配線基板、積層光導波路構造体 | |
| JP4234061B2 (ja) | 光導波路デバイスの製造方法 | |
| JP4764669B2 (ja) | 光パッケージ、光素子付き光パッケージ及び光導波路モジュール | |
| JP2006091753A (ja) | Icチップ実装用基板および光通信用デバイス | |
| JP2005099761A (ja) | 光部品支持基板及びその製造方法、光部品付き光部品支持基板及びその製造方法 | |
| JP2005085844A (ja) | 光電気複合配線構造体及びその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121002 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20121002 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130430 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130430 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130617 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130723 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130807 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5341047 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |