JP5336489B2 - Reflective light emitting diode - Google Patents

Description

  The present invention relates to a surface-mounted reflective light-emitting diode mounted on the surface of a printed circuit board or the like and a method for manufacturing the same.

  Conventionally, a surface-mount type light emitting diode as described in Japanese Patent No. 398635 (Patent Document 1) is known. This conventional surface mount type light emitting diode has a concave reflecting surface inside, a concave case having a groove on the upper part of the surrounding wall, a wide lead portion located outside the concave case, and a tip end side thereof. It consists of a pair of leads consisting of a narrow lead part and a light-emitting element mounted on the mounting part at the tip of the narrow lead part of one lead, and each lead has a narrow lead part that fits into the groove of the concave case. The wide lead portion is bent along the outer surface of the concave case, and the wide lead portion is bent along the outer surface of the concave case. In this configuration, the lower end portion of the housing is bent inward along the bottom surface of the concave case, and the mounting terminal is constituted by the bent portion. The concave portion of the concave case is filled with a transparent resin such as a transparent epoxy resin or a transparent silicon resin, the narrow lead portion is fixed, and the light emitting element is fixed.

  The manufacturing method of such a reflection type light emitting diode is as follows. The light emitting element is bonded to the mount portion at one end of the pair of leads extracted by etching or metal mold using a conductive adhesive, and then the other end of the light emitting element is connected to the end of the narrow lead portion of the other lead. And using a groove in the concave case so that the pair of leads mounted with the light-emitting elements are positioned in the center of the concave portion with the light-emitting elements facing downward. The lead of the lead and the other lead have a common center line, and the lead wire is positioned so that the lead wire is positioned on the center line. In this state, the concave part of the concave case is filled with a transparent resin and cured. The light emitting element and the narrow lead portion of the lead are integrated with the concave case. Thereafter, predetermined portions of the leads on both sides are bent to form a shape along the side surface of the concave case.

  Such a conventional reflection type light emitting diode can reduce the thermal resistance of the reflection type light emitting diode because the heat generated in the light emitting element can be released to the outside through the wide lead portion located outside the concave case. In addition, there is an advantage that it is possible to increase the output of the reflection type light emitting diode by enabling energization of a large current.

  However, in the conventional reflection type light emitting diode, as described above, the pair of leads on which the light emitting element is mounted are fitted into the concave case so that the light emitting element faces downward and is positioned at the center of the concave portion, and in this state, the transparent resin Since the narrow lead part of the light emitting element and the lead is fixed by filling the concave part of the concave case and then cured, each of the leads on both sides is bent to form a shape along the outer surface of the concave case. In this bending process, it was found that the lead was processed in a state in which residual stress was accumulated in the cured resin due to a force acting during the bending process between the narrow lead parts adjacent to both leads. For this reason, when the resin is used in applications where there is a process of softening the resin once during the reflow process when mounting the light emitting element package on the substrate, this residual stress connects the light emitting element and the tip of the lead. There is a problem in that a broken wire may be generated by working on a wire that is present, resulting in a defective product.

Japanese Patent No. 3968235 Japanese Patent No. 4001347

  The present invention has been made in view of the above-described problems of the prior art, and does not break the wire connected between the light-emitting element and the lead tip portion during bending of the lead, and has high reliability. It is an object of the present invention to provide a reflection type light emitting diode capable of manufacturing a product with a high yield and a manufacturing method thereof.

  Another object of the present invention is to provide a reflective light-emitting diode that has good heat dissipation and can supply a large current, and that can emit light with high luminance, and a method for manufacturing the same.

One feature of the present invention is that a support body having a concave reflecting surface therein, and an element mount side lead extending linearly horizontally from the upper central portion of the reflecting surface toward one wall surface of the support body, A wire connection side lead extending horizontally from the upper central portion of the support surface to the other wall surface facing the one wall surface, and the element mount side lead above the reflection surface of the support body. A light emitting element mounted on a central tip, and a wire bonded between the light emitting element and a central tip on the wire connection side lead above the reflecting surface of the support, The center side tip of the side lead and the center side tip of the wire connection side lead are placed in a positional relationship shifted from the position on the longitudinal extension line of the element mount side lead, and both center side tips Parts is a morphism type light emitting diode is closer to.

Another feature of the present invention is that the metal plate of the lead material is processed into a predetermined pattern, and the element mount side lead and the wire connection side lead are connected to each other between the root portions of the element mount side lead and the wire connection side lead. There have one common center line, and distal ends of the element mounting side lead and the wire connecting side lead is formed so as to be close in a direction deviating from the said center line, of the element mounting side lead A light-emitting element is mounted on the tip, a wire is bonded between the light-emitting element and the tip of the wire connection-side lead, and the opening of the reflection surface with respect to a support having a concave reflection surface inside The element mount side lead and the wire connection side lead are respectively placed on the part side in a posture in which the light emitting element faces the reflection surface above the center of the reflection surface, and the concave portion of the support body The transparent resin cured is filled to fix the respective distal end portion of said element mounting side lead wire connection-side lead into the support to each of said support and said element mounting side lead wire connection-side lead Bending the outer portion of the support and bending it downward along the outer surface of the support. The rear ends of the element mount side lead and the wire connection side lead are the bottom surfaces of the support. This is a method for manufacturing a reflection type light emitting diode that is bent inward so as to be in contact with the surface.

  According to the reflective light emitting diode of the present invention and the manufacturing method thereof, the center tip of the element mount lead and the center tip of the wire connection lead are displaced from the position on the longitudinal extension line of the element mount lead. Since both ends on the center side are close to each other, both leads are placed on the support, filled with transparent resin in the support, cured, and fixed, and then the element mount side leads The reflective light emitting diode is manufactured by a method of bending the portion of each of the leads connected to the wire connection side lead and the outside of the support body. Of the force that moves in the longitudinal direction of the side lead, the stroke for pulling the wire is reduced, so that the stress acting on the wire can be reduced, and the manufacturing process and the light emitting diode can be reduced. It is not possible to or cut off the connection portion of the wire in the process, such as reflow when mounted on the substrate, it can be manufactured with good yield reliable products as a result.

  According to the reflection type light emitting diode of the present invention, the light emitting diode is located at the center of the element mount side lead above the center of the concave reflecting surface of the support. The transition part of the element mount side lead that extends in both directions from the center of the mount side lead to one wall surface and the other wall surface is transmitted simultaneously to one outer wall surface and the other outer wall surface of the support, and radiates heat to the outside air Therefore, heat dissipation is good, and a large current can be passed through the light-emitting diode, thereby enabling high-luminance light emission.

  In addition, according to the method for manufacturing a reflective light emitting diode of the present invention, the above-described reflective light emitting device has good heat dissipation, can flow a large current through the light emitting diode, and thus can emit high luminance. Diodes can be manufactured with good yield.

FIG. 1 is a perspective view of a reflective light emitting diode according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view of the reflective light emitting diode of the above embodiment. FIG. 3 is a partially cutaway plan view of a lead frame used in manufacturing the reflective light emitting diode of the above embodiment. FIG. 4 is a perspective view of a state in which a light emitting element is attached to a pair of leads and wires are bonded in the manufacturing process of the reflective light emitting diode of the above embodiment. FIG. 5 is a perspective view of a concave case used in the manufacture of the reflective light emitting diode of the above embodiment. FIG. 6 is a manufacturing process diagram from the assembly process of a pair of leads to the concave case to the filling / curing process of the transparent resin and the bending process of the leads in the manufacture of the reflective light emitting diode of the above embodiment. FIG. 7 is a perspective view of a reflective light emitting diode according to a second embodiment of the present invention. FIG. 8 is a perspective view of a reflective light-emitting diode according to a third embodiment of the present invention. FIG. 9 is a cross-sectional view of the reflective light emitting diode of the above embodiment. FIG. 10 is a partially broken plan view of a lead frame used in manufacturing the reflective light emitting diode of the above embodiment. FIG. 11 is a perspective view of a reflective light emitting diode according to a fourth embodiment of the present invention. FIG. 12 is a cross-sectional view of the reflective light emitting diode of the above embodiment. FIG. 13 is a partially broken plan view of a lead frame used in manufacturing the reflective light emitting diode of the above embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(First embodiment)
FIG. 1 shows a reflective light emitting diode 1 according to a first embodiment of the present invention. This reflective light emitting diode 1 has a parabolic curved reflecting surface 2 on the upper surface portion, a groove 4 is formed on one side of the surrounding wall 3, and a groove 5 is formed on the upper side of the opposite side. A concave case 6 as a rectangular parallelepiped support, and a narrow upper piece 7a and a wide vertical piece 7b that cross the upper side of the reflecting surface 2 of the concave case 6 and extend along the side wall and bottom of the concave case 6. The element mount side lead 7 formed by bending the wide lower piece 7c and the element mount side lead 7 are similarly disposed. Similarly, the narrow upper piece 8a, the wide vertical piece 8b, and the wide lower piece The wire connection side lead 8 formed by bending 8c and the light emitting element 9 mounted on the case center side tip of the upper piece 7a of the element mount side lead 7 are configured. One end of a wire 10 is connected to the light emitting element 9, and the other end of the wire 10 is connected to the tip of the upper piece 8 a of the wire connection side lead 8.

  The narrow upper piece 7 a of the element mount side lead 7 has a straight shape extending linearly along the center line of the upper surface of the concave case 6. On the other hand, the upper piece 8a of the wire connection side lead 8 extends so that the tip thereof is bent from the root portion with respect to the center line, and the tip portion thereof is the tip portion on the center side of the upper piece 7a of the element mount side lead 7. And a shape located at a position close to each other in a direction perpendicular to the center line.

  The bent bases of the narrow upper pieces 7 a and 8 a of the pair of leads 7 and 8 are fitted into the grooves 4 and 5 of the concave case 6, respectively, and one pair is formed outside the grooves 4 and 5 of the concave case 6. The wide vertical pieces 7b and 8b of the respective leads 7 and 8 are along the side surface of the concave case 6, and the wide lower pieces 7c and 8c of the pair of leads are in contact with the bottom surface of the concave case 6.

  In each of the grooves 4, 5 of the concave case 6, the stepped portion of the pair of leads 7, 8 is closed so as to close the step from the upper surface side of the fitting portion of the upper pieces 7 a, 8 a to the upper edge surface of the concave case 6. A small UV curable resin is packed and cured to form the weirs 11 and 12, and at the same time, the bent bases of the upper pieces 7a and 8a of the leads 7 and 8 are fixed. Then, in the concave portion of the concave case 6, for example, a transparent epoxy resin such as a cationic polymerization type transparent epoxy resin described in Japanese Patent No. 4001347 (Patent Document 2) or a transparent resin 13 such as a transparent silicon resin is provided. By filling and curing to a depth that reaches the upper edge surface of the concave case 6, the upper pieces 7a, 8a of the pair of leads 7, 8 and the wing pieces 7d, 8d, the light emitting element 9, and the wire 10 are transparent. It is fixed in a state where it is buried in the resin 13.

  As shown in FIG. 2, in the reflection type light emitting diode 1 having the above-described configuration, the reflection type diode 1 is placed on a substrate (not shown), and the lower pieces 7c and 8c of the leads 7 and 8 on both sides of the bottom are soldered. Connect to the positive terminal and negative terminal with and fix. In this mounted state, the positive terminal and the negative terminal are energized, whereby the light emitting element 9 is energized through the leads 7 and 8 on both sides to emit light. Most of the light from the light emitting element 9 comes out downward as shown by the arrow line in FIG. 2 and is reflected by the reflecting surface 2 having a parabolic curved surface, becomes almost parallel light rays and is perpendicular to the upper surface of the concave case 6. Light in any direction. For this reason, in the reflection type light emitting diode 1, it is possible to obtain light having high directivity and strong directivity, and therefore, high brightness light when the light strikes.

  Next, a manufacturing method of the reflective light emitting diode 1 having the above structure will be described with reference to FIGS. In mass production, a highly conductive material as shown in FIG. 3, for example, containing 98% to 99% of copper (Cu) as a main component, including some iron (Fe) and sulfur (S), and 2 A thin plate having a silver plating of ˜6 μm is used as a material, and a plurality of pairs of element mount side leads 7 and wire connection side leads 8 are opposed to both sides as shown in FIG. A lead frame 20 that is formed side by side is used.

  The shape of the element mount side lead 7 is linear and has a narrow upper piece 7a, a wide vertical piece 7b, and a wide lower piece 7c that are symmetrical with respect to the center line C. The shape of the wire connection side lead 8 is such that a narrow upper piece 8a, a wide vertical piece 8b, and a wide lower piece 8c extending from the root portion to the center line C are formed. Yes. The wide connecting piece 8b and the wide lower piece 8c of the wire connecting side lead 8 are formed symmetrically with respect to the center line C.

  In the lead frame 20, in order to relieve bending stress in the portion corresponding to the boundary between the portion serving as the vertical pieces 7 b and 8 b and the portion serving as the lower pieces 7 c and 8 c of the element mount side lead 7 and the wire connection side lead 8. A stress relief hole may be formed. In FIG. 3, the flat elliptical holes 21 and 22 formed at positions corresponding to the end portions of the element mount side lead 7 and the wire connection side lead 8 that become the lower pieces 7 c and 8 c are broken. This is to reduce the cutting resistance when cutting with the wires 23 and 24.

  In such a lead frame 20, the light emitting element 9 is mounted on each pair of leads 7, 8, and wire bonding is performed. That is, as shown in FIG. 4, the light emitting element 9 is fixed to the tip portion of the upper piece 7a of the element mount side lead 7 with silver paste, and then the bent light emitting element 9 and the wire connection side lead 8 are bent. Wire bonding is performed to the tip of the upper piece 8a, and a wire 10 such as a gold wire is connected.

  On the other hand, as shown in FIG. 5, the concave case 6 is formed with a parabolic concave curved concave portion on the upper surface side, and the reflective surface 2 is formed by depositing aluminum or silver on the concave bottom surface. . A groove 4 is formed at the upper edge of one side of the wall 3 around the concave case 6, and a groove 5 is formed at the upper edge of the opposite side.

  The procedure for attaching each pair of leads 7 and 8 of the lead frame 20 to the concave case 6 is shown in FIG. That is, as shown in FIG. 6A, the pair of leads 7 and 8 on which the light-emitting element 9 is mounted and the wires 10 are connected by wire bonding are arranged so that the upper pieces 7a and Each portion corresponding to 8 a is fitted into the grooves 4 and 5 of the concave case 6. Thereby, inside the concave case 6, portions corresponding to the narrow upper pieces 7a and 8b are positioned above the reflecting surface 2, and the wide vertical pieces 7b and 8b, the lower piece 7c, A portion corresponding to each of 8c is located.

  Next, as shown in FIG. 6B, in each of the grooves 4 and 5 of the concave case 6, the concave case 6 is formed from the upper surface side of the fitting portion of the upper pieces 7 a and 8 a of the pair of leads 7 and 8. The dams 11 and 12 are formed by filling and curing a small UV curable resin in the step portion so as to block the step up to the upper surface.

  Subsequently, as shown in FIG. 6 (c), a transparent resin 13 such as a high-viscosity transparent epoxy resin or a transparent silicone resin containing a curing catalyst is filled in the concave portion of the concave case 6 up to its upper edge surface. The portions corresponding to the narrow upper pieces 7 a and 8 a, the light emitting element 9, and the wire 10 are integrated with the concave case 6 by curing in an atmosphere furnace at 130 ° C.

  After fixing the portions corresponding to the upper pieces 7a, 8a of the concave case 6 and the pair of leads 7, 8 with the transparent resin 13, as shown in FIG. 6 (d), the pair of leads 7 , 8 is bent to the outside of the concave case 6. In this bending process, the portions corresponding to the wide vertical pieces 7b, 8b are made vertical by bending the base portions of the upper pieces 7a, 8b connected thereto downward in the drawing along the side surface of the concave case 6, The concave case 6 is bent inward so that portions corresponding to the lower pieces 7c and 8c are in contact with the bottom surface. In this manner, the pair of leads 7 and 8 are bent into the narrow upper pieces 7a and 8a, the wide vertical pieces 7b and 8b, and the wide lower pieces 7c and 8c, and the bending process is completed. When this bending process is completed, the reflection type light emitting diode 1 shown in FIGS. 1 and 2 is completed. Thereafter, if necessary, the lower pieces 7c, 8c of the pair of leads 7, 8 may be fixed to the bottom surface of the concave case 6 with solder.

  As described above, in the reflection type light emitting diode 1 of the present embodiment, as shown in FIG. 3, the linear shape of the element mount side lead 7 and the narrow width of the upper piece 7a with respect to the narrow width of the wire connection side lead 8 are used. The piece 8a is bent so as to be displaced from the center line C, and is formed in such a shape that the center side tip portions are close to each other in the direction perpendicular to the center line C, and the upper piece 7a of the element mount side lead 7 is formed. Since the light emitting element 9 is attached to the front end portion of this wire and the wire 10 is bonded between the light emitting element 9 and the center side front end portion of the upper piece 8a of the wire connection side lead 8, the following effects are obtained. That is, after the transparent resin 13 is cured and the narrow upper pieces 7 a and 8 a of the pair of leads 7 and 8 are fixed in the recesses of the concave case 6 in the manufacture of the reflective light emitting diode 1 of the present embodiment. A process of bending the connection portion of the upper piece 7a, 8a with the portion corresponding to the vertical piece 7b, 8b on the outside of the concave case 6, and further bending the portion corresponding to the lower piece 7c, 8c from the vertical piece 7c, 8c. A force that separates the leads 7 and 8 between the upper pieces 7a and 8a of the leads 7 and 8a acts on the center line C due to the stress generated when the wires 10 are operated, but the wire 10 is positioned in a direction perpendicular to the direction of the separating force. Therefore, the wire 10 is not pulled by the pulling force. As a result, it is possible to effectively prevent the wire 10 from being disconnected due to the stress generated when the leads 7 and 8 are bent in the prior art, and the production yield of the product is improved.

(Second Embodiment)
FIG. 7 shows a reflective light emitting diode 1A of the second embodiment. The reflection type light emitting diode 1A according to the present embodiment is characterized in that wing pieces 7d and 8d extending laterally are formed on the side edges of the narrow upper pieces 7a and 8a of the pair of leads 7 and 8, respectively. It is said. Other configurations and the manufacturing method are the same as those in the first embodiment.

  If the wing pieces 7d and 8d extending laterally are formed on the side edges of the narrow upper pieces 7a and 8a of the pair of leads 7 and 8 as in the present embodiment, this wing The pieces 7d and 8d become a large resistance during bending, and the upper pieces 7a and 8a are effectively prevented from being displaced in the transparent resin 13, and as a result, the product yield can be further improved.

  Moreover, even in the light emission characteristics, the surface area of the narrow upper pieces 7a and 8a is increased by the formation of the blade pieces 7d and 8d, and the heat radiation performance in the upper pieces 7a and 8a is higher than that of the conventional one, and the thermal resistance is increased accordingly. When the device is used in the same temperature state as in the prior art, a larger current can be applied to the light emitting element 9 to increase the output, and conversely, when the current similar to the prior art is applied to the light emitting element 9. Can relax the temperature condition.

  According to the experiments by the inventors of the present invention, a reflection type light emitting diode having a conventional structure and a reflection type light emitting diode according to an embodiment of the present invention were manufactured, and the occurrence rate of wire breakage was evaluated. In the case of, it was confirmed that there was no generation of defective products and that it could be manufactured with good yield.

(Third embodiment)
A reflective light emitting diode 1B according to a third embodiment of the present invention and a method for manufacturing the same will be described with reference to FIGS. The reflection type light emitting diode 1B of the present embodiment has a parabolic concave reflection surface 2 on the upper surface portion, a groove 4 is formed at the upper center of one side of the surrounding wall portion 3, and the upper three portions on the opposite side. A rectangular parallelepiped support 600 having grooves 501, 502, and 503 formed therein, and the upper side of the reflection surface 2 of the support 600 crossing from one wall surface to the other wall surface, both wall side surfaces of the support body 600 and An element mount side lead 700 formed by bending narrow upper pieces 701a and 701b, wide vertical pieces 702a and 702b, and wide lower pieces 703a and 703b along the bottom surface, and this element mount side lead 700, a wire connection side lead 800 formed by bending a narrow upper piece 801, a wide vertical piece 802, and a wide lower piece 803, and an element mount side lead 700. Piece 701a, and a mounted light-emitting element 9 Metropolitan in the element mounting portion 704 formed in the central connecting portion of the 701b. Note that one end of the wire 10 is connected to the light emitting element 9, and the other end of the wire 10 is connected to the tip of the upper piece 801 of the wire connection side lead 800.

  The narrow upper pieces 701 a and 701 b of the element mount side lead 700 have a straight shape extending linearly along the center line of the upper surface of the support 600. A wide vertical piece 702a continuous with the narrow upper piece 701a on one side of the element mount side lead 700 is formed with a sub-piece 705 extending in parallel with the upper piece 701a. The tip of the sub-piece 705 is a bulging portion 706.

  On the other hand, the upper piece 801 of the wire connection side lead 800 is bent and extended toward the upper center portion of the reflection surface 2 with the tip thereof being obliquely inclined from the root portion parallel to the longitudinal center line of the element mount side lead 700, The tip portion of the element mount side lead 700 has a shape located at a position close to the element mount portion 704 at the center.

  The bent base portion of the narrower upper piece 701a and the sub-piece 705 on one side of the element mount side lead 700 is fitted into the groove 501 at the upper center position on one side of the support 600 and the groove 502 at the side position, respectively. Outside the grooves 501 and 502 of the support 600, a wide vertical piece 702a is along the side surface of the support 600, and a wide lower piece 703a is in contact with the bottom surface of the support 600.

  The bent base portion of the narrow upper piece 701b on the opposite side of the element mount side lead 700 is fitted into the groove 4 at the upper center position on the opposite side of the support 600, and the wide vertical piece outside the groove 4 of the support 600. 702 b is along the side surface of the support body 600, and the wide lower piece 703 b is in contact with the bottom surface of the support body 600.

  The bent base portion of the bent upper piece 801 of the other wire connection side lead 800 is fitted into a groove 503 at a side position on one side of the support body 600, and a wide vertical piece 802 is supported outside the groove 503 of the support body 600. A wide lower piece 803 is in contact with the bottom surface of the support body 600 along the side surface of the body 600.

  In each of the grooves 4, 501, and 503 of the support body 600, the support 600 is formed from the upper surface side of the fitting portions of the upper pieces 701 a, 701 b, and 801 of the pair of leads 700 and 800 and the fitting portion of the sub-piece 705. The step portion is filled with a small UV curable resin so as to block the step up to the upper edge surface and cured to form the weirs 11, 121, 122, 123. At the same time, the upper pieces 701a, 701b, 801 of the leads 700, 800 respectively. The bending base of the sub-piece 705 is fixed. Then, a transparent resin 13 such as a transparent epoxy resin or a transparent silicone resin such as a cationic polymerization type transparent epoxy resin described in, for example, Japanese Patent No. 4001347 (Patent Document 2) is provided in the recess of the support 600. By filling and curing to a depth that reaches the upper edge surface of the support 600, the upper piece 701a, 701b, 801 of the pair of leads 700, 800 and the sub piece 705, the light emitting element 9, and the wire 10 are transparent. It is fixed in a state where it is buried in the resin 13.

  As shown in FIG. 9, in the reflection type light emitting diode 1B having the above-described configuration, the reflection type diode 1B is placed on a substrate (not shown), and the lower pieces 703a, 703b, and 803 of the leads 700 and 800 on both sides of the bottom portion. Connect to the positive and negative terminals with solder and fix. In this mounted state, by energizing those plus terminals and minus terminals, the light emitting element 9 is energized through the leads 700 and 800 on both sides to emit light. Most of the light from the light emitting element 9 goes downward as shown by an arrow line in FIG. 9 and is reflected by the reflecting surface 2 having a parabolic curved surface, and becomes a substantially parallel light beam perpendicular to the upper surface of the support 600. Light in any direction. For this reason, even in the reflective light emitting diode 1B of the present embodiment, light having a uniform direction and strong directivity, and therefore high brightness light can be obtained where the light hits.

  Next, a manufacturing method of the reflective light emitting diode 1B having the above structure will be described with reference to FIG. 10 and FIGS. 4 to 6 referred to in the description of the manufacturing method of the first embodiment. In mass production, a highly conductive material as shown in FIG. 10, for example, containing 98% to 99% of copper (Cu) as a main component, including some iron (Fe) and sulfur (S), and 2 A thin plate having a silver plating of ˜6 μm is used as a material, and a plurality of pairs of element mount side leads 700 and wire connection side leads 800 are arranged side by side by etching or punching as shown in FIG. The formed lead frame 200 is used.

  The shape of the element mount side lead 700 is linear, narrow upper pieces 701a and 701b, wide vertical pieces 702a and 702b, wide lower pieces 703a and 703b, element mount portion 704, sub-piece 705, and bulging portion 706. Each part is formed. Here, a line passing through the center of the portion that becomes the upper piece of the narrow width is defined as a longitudinal center line C. The portions of the element mount side lead 700 that become the wide vertical piece 702b and the wide lower piece 703b are formed symmetrically with respect to the center line C.

  The shape of the wire connection side lead 800 is a narrow upper piece 801 that is bent from a root portion parallel to the center line C and extends obliquely toward a portion that becomes the element mount portion 704 of the element mount side lead 700, and a wide vertical width. The part which becomes each piece 802 and the wide lower piece 803 is formed.

  In the lead frame 200, bending stress is applied to a portion corresponding to the boundary between the portion that becomes the vertical pieces 702 a, 702 b, and 802 and the portion that becomes the lower pieces 703 a, 703 b, and 803 of the element mount side lead 700 and the wire connection side lead 800. A stress relief hole may be formed to relieve the stress. In FIG. 10, flat elliptical holes 210 and 220 formed at positions corresponding to the end portions of the lower portions 703a, 703b, and 803 of the element mount side lead 700 and the wire connection side lead 800, respectively. This is for reducing the cutting resistance when cutting the fracture lines 230 and 240.

  In such a lead frame 200, the light emitting element 9 is mounted on each pair of leads 700 and 800, and wire bonding is performed. Hereinafter, a wire bonding step, a step of forming the reflecting surface 2 on the support 600 side, a step of forming grooves 4, 501 to 503 in the wall portion 3 around the support 600, and a pair of lead frames 200 Each of the leads 700 and 800 is attached to the support 600, and the weirs 11 and 121 to 123 are formed in the grooves 4 and 501 to 503, respectively, and the resin is filled in the support 600 and cured. The process of fixing 800, the process of bending the leads 700 and 800, etc. are the same as the processes shown in FIGS. 4 to 6 described in the first embodiment.

  Thus, in the reflective light emitting diode 1B of the present embodiment, as shown in FIG. 8, the upper pieces 701a and 701b of the element mount side lead 700 are extended from one side to the opposite side of the upper edge of the support 600. In addition, since the wide vertical pieces 702a and 702b are exposed on each of the one side surface and the opposite side surface of the support 600, in addition to achieving the same effect as the first embodiment, The heat dissipating area can be made wider than in the first and second embodiments, and when a current of the same magnitude flows, the temperature rise can be suppressed, and the current is passed until the temperature rises to an allowable temperature. In the case of emitting light 9, since a larger current can be passed, the luminance can be improved.

(Fourth embodiment)
A reflective light emitting diode 1C according to a fourth embodiment of the present invention and a method for manufacturing the same will be described with reference to FIGS. The reflective light emitting diode 1C of the present embodiment has a parabolic concave reflecting surface 2 on the upper surface portion, and grooves 451, 452, and 453 at the upper center of one side of the surrounding wall portion 3 and the left and right three locations. And a rectangular parallelepiped support body 650 having grooves 551, 552, and 553 formed in the upper three portions of the opposite side. An element mount side lead 750 and a wire connection side lead 850 are installed above the reflecting surface 2 of the support 650 so as to be bent in a U-shape in opposite directions.

  The element mount side lead 750 is disposed above the reflecting surface 2, and has narrow upper pieces 751 a and 751 b that are bent in a U-shape that crosses from one wall surface to the other wall surface of the support 650, and the support 650. It is composed of wide vertical pieces 752a and 752b arranged along both the wall side surface and the bottom surface, and wide lower pieces 753a and 753b connected to the vertical pieces 752a and 752b.

  Sub-pieces 755a and 755b extending horizontally in parallel with the narrow upper pieces 751a and 751b are formed on the wide vertical pieces 752a and 752b on both sides of the element mount side lead 750, respectively. In addition, bulged portions 756a and 756b are formed at the tips of the sub-pieces 755a and 755b, respectively.

  The wire connection side lead 850 opposed to the element mount side lead 750 is similarly composed of narrow upper pieces 851a and 851b, wide vertical pieces 852a and 852b, and wide lower pieces 853a and 853b. Yes.

  The light emitting element 9 is installed on the element mount portion 754 formed at the connecting portion of the upper pieces 751a and 751b of the element mount side lead 700, and is positioned substantially in the upper middle part of the reflecting surface 2. The wire 10 is connected between the light emitting element 9 on the element mount portion 754 and the wire bonding portion 854 formed at the connecting portion of the upper pieces 851a and 851b of the wire connection side lead 850.

  The bent bases of the narrow upper piece 751a and the sub-piece 755a on one side of the element mount side lead 750 are fitted into the groove 551 at the upper central position and the groove 552 at the lateral position on one side of the support 650, respectively. Outside the grooves 551 and 552 of the support 650, the wide vertical piece 752 a is along the side surface of the support 650, and the wide lower piece 753 a is in contact with the bottom surface of the support 650.

  The bent base portion of the narrow upper piece 751b and the sub piece 755b on the opposite side of the element mount side lead 750 is fitted into the groove 451 at the upper center position and the groove 452 at the side position on the opposite side of the support 650, respectively. Further, outside the grooves 451 and 452 of the support body 650, the wide vertical piece 752b is along the side surface of the support body 650, and the wide lower piece 753b is in contact with the bottom surface of the support body 650.

  The bent bases of the bent upper pieces 851a and 851b of the other wire connection side lead 850 are fitted into the grooves 453 and 553 on one side of the support body 650 and the opposite sides thereof, and the groove 453 of the support body 650 is placed. , 553, wide vertical pieces 852a, 852b are along the side surface of the support 650, and wide lower pieces 853a, 853b are in contact with the bottom surface of the support 650.

  In each of the grooves 451 to 453 and 551 to 553 of the support 650, the upper surfaces of the fitting portions of the upper pieces 751a, 751b, 851a and 851b of the pair of leads 750 and 850 and the fitting portions of the sub pieces 755a and 755b. The stepped portion is filled with a small UV curable resin so as to block the step from the side to the upper edge surface of the support 650 and cured to form weirs 111 to 113, 121 to 123, and at the same time above the leads 750 and 850, respectively. The bent bases of the pieces 751a, 751b, 851a, 851b and the sub-pieces 755a, 755b are fixed. Then, a transparent resin 13 such as a transparent epoxy resin such as a cationic polymerization type transparent epoxy resin described in Japanese Patent No. 4001347 (Patent Document 2) or a transparent resin 13 such as a transparent silicon resin is provided in the recess of the support 650. By filling and curing to a depth reaching the upper edge surface of the support 650, the pair of leads 750, 850, the upper pieces 751a, 751b, 851a, 851b and the sub-pieces 755a, 755b, the light emitting element 9, The wire 10 is fixed in a state where it is buried in the transparent resin 13.

  As shown in FIG. 12, the reflection type light emitting diode 1C having the above-described configuration has the reflection type diode 1C placed on a substrate (not shown), and lower pieces 753a, 753b, 853a, leads 750, 850 on both sides of the bottom. Each of 853b is connected and fixed to a plus terminal and a minus terminal with solder. In this mounted state, by energizing those plus terminals and minus terminals, the light emitting element 9 is energized through the leads 750 and 850 on both sides to emit light. Most of the light from the light emitting element 9 goes downward as shown by an arrow line in FIG. 12 and is reflected by the reflecting surface 2 having a parabolic curved surface, and becomes a substantially parallel light beam perpendicular to the upper surface of the support 650. Light in any direction. For this reason, even in the reflective light emitting diode 1C of the present embodiment, light having a uniform direction and strong directivity, and therefore high brightness light can be obtained where the light hits.

  Next, a manufacturing method of the reflective light emitting diode 1C having the above structure will be described with reference to FIG. 13 and FIGS. 4 to 6 referred to in the manufacturing method of the first embodiment. In mass production, a highly conductive material as shown in FIG. 13, for example, containing 98% to 99% of copper (Cu) as a main component, including some iron (Fe) and sulfur (S), and 2 A thin plate having a silver plating of ˜6 μm is used as a material, and a plurality of pairs of element mount side leads 750 and wire connection side leads 850 are arranged side by side by etching or punching as shown in FIG. The formed lead frame 250 is used.

  The shape of the element mount side lead 750 is a square shape with narrow upper pieces 751a and 751b, wide vertical pieces 752a and 752b, wide lower pieces 753a and 753b, an element mount portion 754, sub-pieces 755a and 755b, Portions that are respectively bulged portions 756a and 756b are formed. Here, a line passing through the center of the portion to be the element mount portion 754 is a longitudinal center line C.

  The shape of the wire connection side lead 850 is a dogleg shape opposite to the element mount side lead 750, and has narrow upper pieces 851a and 851b, wide vertical pieces 852a and 852b, wide lower pieces 853a and 853b, wires A portion to be each land portion 854 is formed.

  In the lead frame 250, a portion corresponding to a boundary between a portion that becomes the vertical pieces 752a, 752b, 852a, and 852b and a portion that becomes the lower pieces 753a, 753b, 853a, and 853b of the element mount side lead 750 and the wire connection side lead 850, respectively. A stress relief hole may be formed for relaxing the bending stress. In FIG. 13, flat elliptical holes 251 formed at positions corresponding to the end portions of the lower portions 753a, 753b, 853a, 853b of the element mount side lead 750 and the wire connection side lead 850, respectively. 252 is for reducing the cutting resistance when the cutting process is performed at the broken lines 261 and 262.

  In such a lead frame 250, the light emitting element 9 is mounted on each pair of leads 750 and 850, and wire bonding is performed.

  Hereinafter, a step of wire bonding, a step of forming the reflecting surface 2 on the support 650 side, a step of forming grooves 451 to 453 and 551 to 553 in the wall 3 around the support 650, and each of the lead frames 250 A pair of leads 750 and 850 are attached to the support 650, and the weirs 111 to 113 and 121 to 123 are formed in the grooves 451 to 453 and 551 to 553, respectively, and the support 650 is filled with the resin 13 The process of hardening and fixing both leads 750 and 850, the process of bending the leads 750 and 850, and the like are the same as the processes shown in FIGS. 4 to 6 described in the first embodiment.

  As described above, in the reflective light emitting diode 1C of the present embodiment, as shown in FIGS. 11 and 12, the upper pieces 751a and 751b of the element mount side lead 750 are arranged so that the upper edge of the support 650 extends from one side to the opposite side. The wide vertical pieces 752a and 752b are exposed on each of the one side surface and the opposite side surface of the support 650, and the upper pieces 851a and 851b of the wire connection side lead 850 are similarly used as the support. Since the upper edge of 650 is extended from one side to the opposite side, and the wide vertical pieces 852a and 852b are exposed on each of the one side surface and the opposite side surface of the support 650, the first In addition to the same effects as the embodiment, the heat radiation area can be made wider than that of the first and second embodiments, and the temperature rise is suppressed when the same current flows. It can, also, it is possible to improve the luminance in order to be able is to flow a larger current in the case where the light emitting elements 9 by applying a current to rise to an acceptable temperature.

  As described above, the present invention has been described according to the first to fourth embodiments. However, it should not be understood that the description and drawings constituting a part of this disclosure limit the present invention. The element mount portion of the element mount side lead and the wire of the wire connection side lead at a position shifted from the center line in the horizontal plane including the center line in the longitudinal direction of the element mount side lead at the upper central portion of the concave reflecting surface of the support Any structure that is close to and facing the connecting portion is within the technical scope of the present invention.

  As described above, the present invention naturally includes various embodiments not described herein. Therefore, the technical scope of the present invention is defined only by the invention specifying matters according to the scope of claims reasonable from the above description.

DESCRIPTION OF SYMBOLS 1,1A-1C Reflective type light emitting diode 2 Reflecting surface 3 Wall part 4,451-453 Groove 5,501-503,551-553 Groove 6 Recessed case 600,650 Support body 7,700,750 Element mount side lead 7a, 701a, 701b, 751a, 751b Upper piece 7b, 702a, 702b, 751a, 751b Vertical piece 7c, 703a, 703b, 751a, 751b Lower piece 8, 800, 850 Wire connection side lead 8a, 801, 851a, 851b Upper piece 8b , 802, 852a, 852b Vertical piece 8c, 803, 853a, 853b Lower piece 9 Light emitting element 10 Wire

Claims (5)

A support having a concave reflecting surface inside;
An element mount side lead extending linearly horizontally from the upper central portion of the support to the one wall surface;
A wire connection-side lead extending horizontally from the upper central portion of the reflective surface of the support toward the other wall surface facing the one wall surface;
A light emitting element mounted on a center side tip of the support on the element mount side lead above the reflecting surface;
A wire bonded between the light emitting element and a central tip of the support on the wire connection side lead above the reflecting surface;
The tip end on the center side of the element mount side lead and the tip end on the center side of the lead on the wire connection side are placed in a positional relationship shifted from the position on the longitudinal extension line of the lead on the element mount side, and both tip ends on the center side A reflection type light emitting diode characterized in that the two are close to each other. The wire connection-side lead has a root portion located on an upper portion of the other wall surface in a straight line having a center line whose center line coincides with a center line of the element mount-side lead, and from the root portion to the center side. The intermediate part reaching the tip part is extended so as to bend obliquely forward from the root part, and the center side tip part is adjacent to the center side tip part of the element mount side lead in a direction perpendicular to the center line. The reflective light-emitting diode according to claim 1, wherein the reflective light-emitting diode has a shape located at a position where the reflective light-emitting diode is located. The element mounting side lead, wherein each wire connection-side lead, reflection type light emitting diode according to claim 1 or 2, characterized in that bent along an outer surface of the support. A metal plate of the lead material is processed into a predetermined pattern, and the element mount side lead and the wire connection side lead are formed as one central line where the root portions of the element mount side lead and the wire connection side lead are common to each other. a, and the distal end portions of the element mounting side lead and the wire connecting side lead is formed so as to be close in a direction deviating from the said center line,
Mount the light emitting element on the tip of the element mount side lead,
Bonding a wire between the light emitting element and the tip of the wire connection side lead,
With respect to the support having a concave reflecting surface inside, the light emitting element is arranged above the center of the reflecting surface with the element mount side lead and the wire connecting side lead on the opening side of the reflecting surface. Place it in a posture facing the reflective surface,
Filling and curing the transparent resin in the concave portion of the support to fix each of the tip portions of the element mount side lead and the wire connection side lead in the support body,
The element mount side lead and the wire connection side lead are bent to the outside of the support body and bent downward along the outer surface of the support body. A method of manufacturing a reflective light emitting diode, wherein the rear end of each of the lead and the wire connection side lead is bent inward so as to contact the bottom surface of the support. The element mount side lead is formed in a shape in which both sides are symmetrical with respect to the center line from the tip part to the intermediate part and the root part ,
The wire connection side lead to shape both sides are symmetrical from the base portion to the intermediate portion with respect to the center line, so that outside the portions from the intermediate portion up to the tip of the tip portion from the center line is bent, the reflection type light emitting diode according to claim 4, characterized in that the shaped close in a direction perpendicular to the center line the tip to the distal end portion of the element mounting side lead Production method.

Images