JP5318765B2 - キャリアガスシステムおよび基板キャリアのロードポートとの連結 - Google Patents
キャリアガスシステムおよび基板キャリアのロードポートとの連結 Download PDFInfo
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- JP5318765B2 JP5318765B2 JP2009528300A JP2009528300A JP5318765B2 JP 5318765 B2 JP5318765 B2 JP 5318765B2 JP 2009528300 A JP2009528300 A JP 2009528300A JP 2009528300 A JP2009528300 A JP 2009528300A JP 5318765 B2 JP5318765 B2 JP 5318765B2
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- Prior art keywords
- carrier
- gas supply
- chamber
- substrate
- door
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
Description
例示的な実施形態は、基板キャリアをロードポートと連結することおよび基板キャリアをパージすることに関する。
例えばフープ(FOUP;Front Opening Unified Pod)等、半導体基板を運搬するための現在の基板キャリアは、ポリカーボネート、ポリエチレン等のようなポリマー材料から製造される。これらの材料は、例えば窒素またはアルゴン等の不活性ガスの分子サイズよりも大きい分子構造を有する。このため、キャリア材料は、すべてのガスが失われるまでキャリアシェルを通って拡散する不活性ガスを収納するために十分でない場合がある。ガスの分子サイズよりも小さい分子構造を有するより高密度の材料を使用してもよいが、より高密度の材料は、キャリアに望ましくない重量を付加し得る。ガスは、基板処理中、水分または酸素の影響を受けやすい、それらの上に蒸着された材料を有し得る基板付近の環境を制御するために使用される。現在のガスパージシステムは、屋内ガス供給部に配管されたストレージネストおよび漏出を補うためにキャリア内へ継続的に入力されるガスに依存している。基板キャリアとともに移動する分離ガスコンテナも既知であり得る。
Claims (4)
- 外部雰囲気から略隔離された基板を保持および運搬するための基板搬送キャリアであって、前記基板を保持することができる少なくとも1つのチャンバおよび前記外部雰囲気とは異なるチャンバ雰囲気を有するケーシングと、
前記ケーシングと接続された携帯型ガス供給部であって、前記ガス供給部およびケーシングがユニットとして移動可能なようになされており、前記チャンバ雰囲気が所定圧力に維持されるよう、ガスの供給を維持し、前記ガス供給部から前記少なくとも1つのチャンバ内へガスを制御可能に排出するようになされている携帯型ガス供給部と、
を有する前記基板搬送キャリアと、
コントローラを有し、前記基板搬送キャリアを搬送するハンドリングシステムと、
前記基板搬送キャリアに接続されており、前記少なくとも1つのチャンバ及び/または前記携帯型ガス供給部内の圧力を監視し、前記圧力が所定のレベル未満である場合に前記ハンドリングシステムのコントローラに警告を報告する圧力監視ユニットと、
携帯型ガス供給部補充ステーションと、
を有し
前記コントローラは、前記圧力が前記所定のレベル未満である場合に、前記基板搬送キャリアを前記携帯型ガス供給部補充ステーションから離間した位置から前記携帯型ガス供給部補充ステーションへ、搬送するように命令をすることを特徴とする基板搬送システム。 - 前記ケーシングは、前記ガス供給部を画定する別のチャンバを形成する、請求項1に記載のシステム。
- 前記携帯型ガス供給部は、前記ケーシングと着脱可能に連結されている、請求項1に記載のシステム。
- 前記携帯型ガス供給部補充ステーションは、前記携帯型ガス供給部を加圧し、前記携帯型ガス供給部は、前記基板搬送キャリアが前記携帯型ガス供給部補充ステーションから離間した第2の位置にある場合に、前記チャンバの雰囲気の遠隔保守を行うことを特徴とする請求項1に記載のシステム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US82570406P | 2006-09-14 | 2006-09-14 | |
US60/825,704 | 2006-09-14 | ||
PCT/US2007/019951 WO2008147379A1 (en) | 2006-09-14 | 2007-09-14 | Carrier gas system and coupling substrate carrier to a loadport |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010503990A JP2010503990A (ja) | 2010-02-04 |
JP5318765B2 true JP5318765B2 (ja) | 2013-10-16 |
Family
ID=40988215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009528300A Active JP5318765B2 (ja) | 2006-09-14 | 2007-09-14 | キャリアガスシステムおよび基板キャリアのロードポートとの連結 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5318765B2 (ja) |
KR (1) | KR101475420B1 (ja) |
CN (1) | CN101600637A (ja) |
TW (1) | TWI484575B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120288355A1 (en) * | 2011-05-11 | 2012-11-15 | Ming-Teng Hsieh | Method for storing wafers |
JP5729148B2 (ja) * | 2011-06-07 | 2015-06-03 | 東京エレクトロン株式会社 | 基板搬送容器の開閉装置、蓋体の開閉装置及び半導体製造装置 |
US9748123B2 (en) * | 2013-03-14 | 2017-08-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pressure-controlled wafer carrier and wafer transport system |
JP6106501B2 (ja) * | 2013-04-12 | 2017-04-05 | 東京エレクトロン株式会社 | 収納容器内の雰囲気管理方法 |
TWI576297B (zh) * | 2014-12-09 | 2017-04-01 | 中勤實業股份有限公司 | 片狀物的運載器、其固持裝置的組裝方法及其與旋轉平台的組合 |
KR102597446B1 (ko) * | 2016-12-01 | 2023-11-03 | 에스케이하이닉스 주식회사 | 웨이퍼 보관 용기, 이를 포함하는 클러스터 시스템 및 클러스터 시스템의 구동 방법 |
US10790177B2 (en) | 2017-11-14 | 2020-09-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems, devices, and methods for using a real time environment sensor in a FOUP |
KR102135264B1 (ko) * | 2019-02-01 | 2020-07-17 | 크린팩토메이션 주식회사 | 반도체 제조 공정의 불활성 가스 공급 제어 시스템 및 방법 |
CN113078084A (zh) * | 2020-01-06 | 2021-07-06 | 长鑫存储技术有限公司 | 半导体制造方法及系统 |
CN114313543A (zh) * | 2020-09-30 | 2022-04-12 | 长鑫存储技术有限公司 | 传送盒及物料传送系统 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4668484A (en) * | 1984-02-13 | 1987-05-26 | Elliott David J | Transport containers for semiconductor wafers |
JPH02278746A (ja) * | 1989-04-19 | 1990-11-15 | Nec Corp | ウェハー保管箱 |
JP3191392B2 (ja) * | 1992-04-07 | 2001-07-23 | 神鋼電機株式会社 | クリーンルーム用密閉式コンテナ |
US6641349B1 (en) * | 1999-04-30 | 2003-11-04 | Tdk Corporation | Clean box, clean transfer method and system |
JP3769417B2 (ja) * | 1999-06-30 | 2006-04-26 | 株式会社東芝 | 基板収納容器 |
TW556252B (en) * | 2001-01-10 | 2003-10-01 | Asyst Technologies | Transportable container including an internal environment monitor |
US6901971B2 (en) * | 2001-01-10 | 2005-06-07 | Entegris, Inc. | Transportable container including an internal environment monitor |
US20030035713A1 (en) * | 2001-08-20 | 2003-02-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Moisture-controlled wafer storage container and method of using |
JP2006156712A (ja) * | 2004-11-30 | 2006-06-15 | Sony Corp | 基板収納搬送容器 |
-
2007
- 2007-09-14 KR KR1020097007390A patent/KR101475420B1/ko active IP Right Grant
- 2007-09-14 TW TW096134145A patent/TWI484575B/zh active
- 2007-09-14 CN CNA2007800414289A patent/CN101600637A/zh active Pending
- 2007-09-14 JP JP2009528300A patent/JP5318765B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
TW200830449A (en) | 2008-07-16 |
TWI484575B (zh) | 2015-05-11 |
KR20090057308A (ko) | 2009-06-04 |
KR101475420B1 (ko) | 2014-12-23 |
CN101600637A (zh) | 2009-12-09 |
JP2010503990A (ja) | 2010-02-04 |
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