JP5314792B2 - Lighting device - Google Patents
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- JP5314792B2 JP5314792B2 JP2012175555A JP2012175555A JP5314792B2 JP 5314792 B2 JP5314792 B2 JP 5314792B2 JP 2012175555 A JP2012175555 A JP 2012175555A JP 2012175555 A JP2012175555 A JP 2012175555A JP 5314792 B2 JP5314792 B2 JP 5314792B2
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Abstract
Description
本発明は、少量多品種で両面発光用の導光板を湾曲等させることにより立体的に配設した照明装置に関する。 The present invention relates to a lighting device that is three-dimensionally arranged by bending a light guide plate for double-sided light emission in a small amount and a variety of products.
従来、LED光を光源とする導光板を設けた照明装置において、該導光板を直線部及び曲線部により形成し、板状でデザイン的に乏しい直線部を曲線部で覆い、且つ直線部からの発光を損なわない程度に部分的に発光させる構成がある(例えば、特許文献1参照。)。 Conventionally, in an illuminating device provided with a light guide plate using LED light as a light source, the light guide plate is formed by a straight portion and a curved portion, the straight portion that is plate-like and poor in design is covered by the curved portion, and from the straight portion. There is a configuration in which light is emitted partially to the extent that light emission is not impaired (see, for example, Patent Document 1).
しかしながら、前述の構成では、少量多品種の導光板に対応することは困難であり、且つ導光板を任意の角度に湾曲させることができない問題があった。 However, in the above-described configuration, it is difficult to cope with a small amount of various types of light guide plates, and there is a problem that the light guide plates cannot be bent at an arbitrary angle.
そこで、本発明は前述の技術的な課題に鑑み、少量多品種に対応し、且つ任意の角度に湾曲させた導光板であっても、該導光板の面内における光の明暗の差を小さくすることができる導光板を配設した、室内施設等の壁面又は天井面に備え付けて使用する照明装置を提供することを目的とする。 Therefore, in view of the above-mentioned technical problems, the present invention reduces the difference in brightness of light within the surface of the light guide plate even if it is a light guide plate corresponding to a small variety of products and curved at an arbitrary angle. An object of the present invention is to provide an illuminating device provided with a light guide plate that can be provided and used on a wall surface or ceiling surface of an indoor facility or the like.
前述の課題を解決すべく、本発明の照明装置は、入射端面から入射した光を表面部、裏面部及び前記入射端面に対向した端面から出射するもので、対向する前記表面部及び前記裏面部に反射ドットが形成された後に、前記入射端面に対向した前記端面から前記入射端面に向けて切開され、前記切開により得られた2つの切断片を互いに反対の方向に向くように曲げ、且つねじるように曲げることで所定の曲率に湾曲させた導光板と、前記導光板にLED光を入射させるLED光源と、前記導光板を壁面又は天井面に固定する固定部材とを有することを特徴とする。 In order to solve the above-described problems, the illumination device of the present invention emits light incident from the incident end face from the front surface portion, the back surface portion, and the end surface facing the incident end surface, and the facing front surface portion and the back surface portion. After the reflective dots are formed on the surface, the incision is made from the end surface facing the incident end surface toward the incident end surface, and two cut pieces obtained by the incision are bent and twisted so as to face in opposite directions. A light guide plate bent to have a predetermined curvature by bending, an LED light source that causes LED light to enter the light guide plate, and a fixing member that fixes the light guide plate to a wall surface or a ceiling surface. .
本発明に係る照明装置によれば、該照明装置に配設した導光板が、少量多品種に対応し、且つ任意の角度に湾曲させた状態であっても、該導光板の面内における光の明暗の差を小さくすることができる。 According to the illuminating device of the present invention, the light guide plate disposed in the illuminating device corresponds to a small amount of a wide variety and is curved at an arbitrary angle. The difference in brightness can be reduced.
以下、本発明の照明装置に係る好適な実施形態について、図面を参照しながら説明する。なお、本発明の照明装置は、以下の記述に限定されるものではなく、本発明の要旨を逸脱しない範囲において、適宜変更可能である。 DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments according to a lighting device of the invention will be described with reference to the drawings. In addition, the illuminating device of this invention is not limited to the following description, In the range which does not deviate from the summary of this invention, it can change suitably.
[第1の実施形態]
最初に本願発明に係る照明装置に配設された曲げ加工前の導光板の構成について説明し、次に導光板の加工具及び加工装置と、該加工装置を用いた導光板の製造方法について説明し、さらに導光板の光学的な仕様等について説明し、次に照明装置を構成する曲げ加工後の導光板とLEDユニットの構成について説明し、最後に本願発明に係る照明装置について説明する。
[First Embodiment]
First, the configuration of the light guide plate before bending disposed in the lighting device according to the present invention will be described, and then the processing tool and processing device of the light guide plate and the method of manufacturing the light guide plate using the processing device will be described. Then, the optical specifications of the light guide plate will be described, the configuration of the bent light guide plate and LED unit constituting the lighting device will be described, and finally the lighting device according to the present invention will be described.
まず最初に、本願発明に係る照明装置に配設された曲げ加工前の導光板10の構成について、図1及び図2を参照しながら説明する。 First, the configuration of the light guide plate 10 before bending that is disposed in the lighting device according to the present invention will be described with reference to FIGS. 1 and 2.
なお、図1は照明装置に配設された曲げ加工前の導光板10を示す模式図であり、さらに図1(a)は導光板10の表面部10A、同様に図1(b)は導光板10の側面部10C、同様に図1(c)は導光板10の裏面部10Dを示す模式図である。また、図2は照明装置に配設された曲げ加工前の導光板10の表面部10Aの一部を拡大して示す模式図である。 FIG. 1 is a schematic view showing the light guide plate 10 before bending, which is disposed in the lighting device. FIG. 1A is a surface portion 10A of the light guide plate 10, and FIG. FIG. 1C is a schematic diagram showing the back surface portion 10D of the light guide plate 10, similarly to the side surface portion 10C of the light plate 10. FIG. FIG. 2 is an enlarged schematic view showing a part of the surface portion 10A of the light guide plate 10 before bending that is disposed in the lighting device.
導光板10は、例えばメタクリル樹脂(Polymethylmethacrylate)板から成る、複数の凹パターン痕が形成された所定の大きさの板状部から構成される。具体的には、該板状部の大きさは、例えば100mm×100mmからB0版サイズ相当の1450mm×1030mmの長方形状で、4mmから12mmの厚みに対応する。ここで、図1に示すように、導光板10の表面部10Aには表面部凹パターン痕10Bが形成され、導光板10の裏面部10Dには裏面部凹パターン痕10Eが形成されている。また、その凹パターン痕は、例えば長径0.6mm及び深さ0.4mmの四角錐形状痕から形成されてピッチパターンとして、例えば1.2、1.5、2.0、及び8.0mmピッチ等で構成されたマトリクス状の成形痕にて形成されている。 The light guide plate 10 is composed of a plate-shaped portion having a predetermined size and having a plurality of concave pattern marks formed of, for example, a methacrylic resin (Polymethylmethacrylate) plate. Specifically, the size of the plate-like portion is, for example, a rectangular shape of 100 mm × 100 mm to 1450 mm × 1030 mm corresponding to the B0 plate size, and corresponds to a thickness of 4 mm to 12 mm. Here, as shown in FIG. 1, a front surface concave pattern mark 10 </ b> B is formed on the front surface part 10 </ b> A of the light guide plate 10, and a back surface concave pattern mark 10 </ b> E is formed on the back surface part 10 </ b> D of the light guide plate 10. The concave pattern trace is formed from a square pyramid-shaped trace having a major axis of 0.6 mm and a depth of 0.4 mm, for example, as a pitch pattern, for example, 1.2, 1.5, 2.0, and 8.0 mm pitch. It is formed with a matrix-shaped molding mark composed of the like.
次に、照明装置に配設された曲げ加工前の導光板10の加工具及び加工装置について説明する。具体的には、導光板10に設けられた凹パターン痕を形成する加工具20、及び超音波加工装置30について、図3及び図4を参照しながら説明する。 Next, the processing tool and processing device of the light guide plate 10 before bending that are disposed in the lighting device will be described. Specifically, the processing tool 20 and the ultrasonic processing apparatus 30 that form the concave pattern marks provided on the light guide plate 10 will be described with reference to FIGS. 3 and 4.
なお、図3は照明装置に配設された曲げ加工前の導光板10に設けられた凹パターン痕を形成するエンボス加工用の加工具20を示す模式図であり、さらに図3(a)は加工具20の支持部20B、同様に図3(b)は加工具20の超音波加工部20Aを示す模式図である、また、図4は照明装置に配設された曲げ加工前の導光板10に設けられた凹パターン痕を形成するエンボス加工用の超音波加工装置30を示す斜視図である。 FIG. 3 is a schematic view showing an embossing processing tool 20 for forming a concave pattern mark provided on the light guide plate 10 before bending, which is disposed in the lighting device, and FIG. 3B is a schematic view showing the ultrasonic processing section 20A of the processing tool 20, and FIG. 4 is a light guide plate before bending that is disposed in the lighting device. 1 is a perspective view showing an ultrasonic processing apparatus 30 for embossing that forms a concave pattern mark provided in FIG.
加工具20は、超音波加工用ホーンであり、超音波加工用ホーンの矩形状の先端面にマトリクス状に加工ドットを配列させた超音波加工部20A、及び該超音波加工部20Aを支持する支持部20Bから構成される。また、超音波加工部20Aにおいて、各加工ドットは四角錐形状に形成されている。なお、図2(b)においては、一例として4行4列のマトリクス状に加工ドットを配列させた超音波加工部20Aを記載している。 The processing tool 20 is an ultrasonic processing horn, and supports the ultrasonic processing unit 20A in which processing dots are arranged in a matrix on the rectangular front end surface of the ultrasonic processing horn, and the ultrasonic processing unit 20A. It is comprised from the support part 20B. In the ultrasonic processing section 20A, each processing dot is formed in a quadrangular pyramid shape. FIG. 2B shows an ultrasonic processing unit 20A in which processing dots are arranged in a matrix of 4 rows and 4 columns as an example.
超音波加工装置30は、機台31、作業台32、移動機構33、真空ポンプ34、及び超音波発振器35等から構成される。なお、超音波加工装置30には、例えば本願発明と同一の出願人により実用新案登録出願され、登録3140292号として登録済みの超音波加工装置を用いることができる。この様な超音波加工装置30に、加工具20の支持部20Bを装着して、加工具20の超音波加工部20Aに超音波振動を印加することにより、加工部材5の表面又は裏面、もしくは両面に凹パターン痕を形成して導光板10を製造する。 The ultrasonic processing apparatus 30 includes a machine base 31, a work table 32, a moving mechanism 33, a vacuum pump 34, an ultrasonic oscillator 35, and the like. As the ultrasonic machining apparatus 30, for example, an ultrasonic machining apparatus that has been filed for a utility model registration by the same applicant as the present invention and has been registered as registration No. 3140292 can be used. By attaching the support portion 20B of the processing tool 20 to such an ultrasonic processing device 30 and applying ultrasonic vibration to the ultrasonic processing portion 20A of the processing tool 20, the front surface or the back surface of the processing member 5, or The light guide plate 10 is manufactured by forming concave pattern marks on both sides.
具体的には、超音波加工装置30において、加工具20の超音波加工部20Aを加工部材5の一主面に押圧させることにより、加工部材5の一主面に超音波加工部20Aに設けられた加工ドットを反映した反射ドットを形成させる。なお、加工具20を加工部材5に対して相対的に移動させて反射ドットの形成を繰り返すことにより、加工部材5の一主面の所定範囲に反射ドットを形成する。また、加工ドットの四角錐形状の稜線の延長方向の少なくとも一方向は加工部材5を加工することにより形成された導光板10の側面から入射する光の入射方向と実質的に略平行とされる様に、加工具20の超音波加工部20Aを加工部材5の一主面に押圧させる。なお、加工部材5の形状誤差を考慮した、より具体的な凹パターン痕の形成方法については、図5を参照しながら後述する。 Specifically, in the ultrasonic processing apparatus 30, the ultrasonic processing unit 20 </ b> A of the processing tool 20 is pressed against one main surface of the processing member 5, thereby providing the ultrasonic processing unit 20 </ b> A on one main surface of the processing member 5. Reflective dots reflecting the processed dots are formed. In addition, the reflective dot is formed in the predetermined range of one main surface of the processing member 5 by moving the processing tool 20 relative to the processing member 5 and repeating the formation of the reflective dots. Further, at least one direction of the extending direction of the quadrangular pyramid ridge line of the processing dots is substantially parallel to the incident direction of the light incident from the side surface of the light guide plate 10 formed by processing the processing member 5. Similarly, the ultrasonic processing portion 20 </ b> A of the processing tool 20 is pressed against one main surface of the processing member 5. Note that a more specific method for forming the concave pattern trace in consideration of the shape error of the processed member 5 will be described later with reference to FIG.
次に、照明装置に配設された曲げ加工前の導光板10の製造方法について説明する。具体的には、加工部材5の形状誤差を考慮した、導光板10に設けられた凹パターン痕の形成について、図5を参照しながら具体的に説明する。 Next, the manufacturing method of the light-guide plate 10 before the bending process arrange | positioned at an illuminating device is demonstrated. Specifically, the formation of the concave pattern marks provided on the light guide plate 10 in consideration of the shape error of the processed member 5 will be specifically described with reference to FIG.
なお、図5は照明装置に配設された曲げ加工前の導光板10に設けられた凹パターン痕を形成するエンボス加工の状態を示す模式図であり、さらに図5(a)乃至(e)はエンボス加工を行う前に加工部材5の加工開始基準高さを測定し、次に該加工開始基準高さに合わせて加工部材5に対してエンボス加工を行う状態を順に示す模式図である。 FIG. 5 is a schematic view showing an embossing state for forming a concave pattern mark provided on the light guide plate 10 before bending, which is disposed in the lighting device, and FIGS. 5A to 5E. FIG. 4 is a schematic diagram sequentially illustrating a state in which a processing start reference height of the processing member 5 is measured before embossing, and then the processing member 5 is embossed in accordance with the processing start reference height.
図5(a)に示すように、加工部材5の表面の加工開始基準高さH1を、超音波加工装置30の図示せぬ測定部に配設された可動式のプローブDを加工部材5の表面に接触させることにより検出する。また該加工部材5には、例えば所定の形状で透明なメタクリル樹脂板を用いる。なお、プローブDは、機械的な構成に限定されることはなく、例えば超音波加工装置30の図示せぬ測定部から測定光を照射して、加工部材5の表面からの反射光を受光する構成としても良い。 As shown in FIG. 5 (a), the processing start reference height H 1 of the surface of the processing member 5 is set to the movable probe D disposed in a measurement unit (not shown) of the ultrasonic processing apparatus 30. Detect by contacting the surface. For the processed member 5, for example, a transparent methacrylic resin plate having a predetermined shape is used. The probe D is not limited to a mechanical configuration. For example, the probe D emits measurement light from a measurement unit (not shown) of the ultrasonic processing apparatus 30 and receives reflected light from the surface of the processing member 5. It is good also as a structure.
同様に、図5(b)に示すように、超音波加工装置30に装着された加工具20を、加工開始基準高さH1を検出した表面部10Aの上方の位置まで移動させた後、該加工開始基準高さH1を基準として、加工具20の先端に設けられた超音波加工部20Aに超音波振動を印加し、表面部10Aの加工開始基準高さH1から所定の深さまで超音波加工部20Aを降下させる。また、次の超音加工箇所である加工部材5の表面の加工開始基準高さH2を、超音波加工装置30の測定部に配設された可動式のプローブDにより検出する。 Similarly, as shown in FIG. 5B, after the processing tool 20 mounted on the ultrasonic processing apparatus 30 is moved to a position above the surface portion 10A where the processing start reference height H1 is detected, With reference to the processing start reference height H1, ultrasonic vibration is applied to the ultrasonic processing portion 20A provided at the tip of the processing tool 20, and ultrasonic processing is performed from the processing start reference height H1 of the surface portion 10A to a predetermined depth. Lower part 20A. Further, the processing start reference height H2 of the surface of the processing member 5 which is the next ultrasonic processing location is detected by the movable probe D disposed in the measurement unit of the ultrasonic processing apparatus 30.
同様に、図5(c)に示すように、超音波加工装置30に装着された加工具20を、加工開始基準高さH2を検出した表面部10Aの上方の位置まで移動させた後、該加工開始基準高さH2を基準として、加工具20の先端に設けられた超音波加工部20Aに超音波振動を印加し、表面部10Aの加工開始基準高さH2から所定の深さまで超音波加工部20Aを降下させる。また、次の超音加工箇所である加工部材5の表面の加工開始基準高さH3を、超音波加工装置30の測定部に配設された可動式のプローブDにより検出する。 Similarly, as shown in FIG. 5C, after moving the processing tool 20 mounted on the ultrasonic processing apparatus 30 to a position above the surface portion 10A where the processing start reference height H2 is detected, Using the processing start reference height H2 as a reference, ultrasonic vibration is applied to the ultrasonic processing portion 20A provided at the tip of the processing tool 20, and ultrasonic processing is performed from the processing start reference height H2 of the surface portion 10A to a predetermined depth. Lower part 20A. Further, the machining start reference height H3 of the surface of the machining member 5 which is the next ultrasonic machining location is detected by the movable probe D disposed in the measurement unit of the ultrasonic machining apparatus 30.
同様に、図5(d)に示すように、超音波加工装置30に装着された加工具20を、加工開始基準高さH3を検出した表面部10Aの上方の位置まで移動させた後、該加工開始基準高さH3を基準として、加工具20の先端に設けられた超音波加工部20Aに超音波振動を印加し、表面部10Aの加工開始基準高さH3から所定の深さまで超音波加工部20Aを降下させる。また、次の超音加工箇所である加工部材5の表面の加工開始基準高さH4を、超音波加工装置30の測定部に配設された可動式のプローブDにより検出する。 Similarly, as shown in FIG. 5D, after moving the processing tool 20 mounted on the ultrasonic processing apparatus 30 to a position above the surface portion 10A where the processing start reference height H3 is detected, Using the processing start reference height H3 as a reference, ultrasonic vibration is applied to the ultrasonic processing portion 20A provided at the tip of the processing tool 20, and ultrasonic processing is performed from the processing start reference height H3 of the surface portion 10A to a predetermined depth. Lower part 20A. Further, the machining start reference height H4 of the surface of the machining member 5 which is the next ultrasonic machining location is detected by the movable probe D disposed in the measurement unit of the ultrasonic machining apparatus 30.
さらに、図5(e)に示すように、超音波加工装置30に装着された加工具20を、加工開始基準高さH4を検出した表面部10Aの上方の位置まで移動させた後、該加工開始基準高さH4を基準として、加工具20の先端に設けられた超音波加工部20Aに超音波振動を印加し、表面部10Aの加工開始基準高さH4から所定の深さまで超音波加工部20Aを降下させる。 Further, as shown in FIG. 5E, the processing tool 20 mounted on the ultrasonic processing apparatus 30 is moved to a position above the surface portion 10A where the processing start reference height H4 is detected, and then the processing is performed. With reference to the start reference height H4, ultrasonic vibration is applied to the ultrasonic processing unit 20A provided at the tip of the processing tool 20, and the ultrasonic processing unit from the processing start reference height H4 of the surface portion 10A to a predetermined depth. Lower 20A.
次に、上述した照明装置に配設された曲げ加工前の導光板10に設けられた凹パターン痕の形成方法に係る効果について、図6及び図7を参照しながら具体的に説明する。 Next, the effect of the method for forming the concave pattern marks provided on the light guide plate 10 before bending that is provided in the lighting device described above will be specifically described with reference to FIGS. 6 and 7.
なお、図6は照明装置に配設された曲げ加工前の導光板10の側面部10Cを示す模式図であり、さらに図6(a)は加工部材5に湾曲や厚み斑が無い場合の導光板10の側面部10Cを示す模式図、同様に図6(b)は加工部材5に湾曲や厚み斑が有る場合の導光板10の側面部10Cを示す模式図である。また、図7は従来の導光板40の製造において加工部材5に湾曲や厚み斑が有る場合の導光板40の側面部40Aを示す模式図である。 FIG. 6 is a schematic diagram showing the side surface portion 10C of the light guide plate 10 before bending, which is disposed in the lighting device, and FIG. 6 (a) is a guide when the processed member 5 has no curvature or unevenness in thickness. FIG. 6B is a schematic diagram showing the side surface portion 10 </ b> C of the light guide plate 10 when the processed member 5 has a curve or a thickness unevenness. FIG. 7 is a schematic view showing the side surface portion 40A of the light guide plate 40 when the processed member 5 has a curve or thickness unevenness in the manufacture of the conventional light guide plate 40.
図6(a)に示すように、加工部材5に湾曲や厚み斑が無い場合には、加工毎に表面部10Aの加工開始基準高さを検出しなくても、導光板10の表面部10Aの位置に寄らず、表面部10Aに対して一定深さの表面部凹パターン痕10Bを形成できる。同様に、導光板10の裏面部10Dの位置に寄らず、裏面部10Dに対して一定深さの裏面部凹パターン痕10Eを形成できる。 As shown in FIG. 6A, when the processed member 5 has no curvature or unevenness in thickness, the surface portion 10A of the light guide plate 10 can be detected without detecting the processing start reference height of the surface portion 10A for each processing. Regardless of the position, the surface portion concave pattern mark 10B having a constant depth can be formed with respect to the surface portion 10A. Similarly, the back surface concave pattern mark 10E having a certain depth can be formed on the back surface portion 10D regardless of the position of the back surface portion 10D of the light guide plate 10.
しかし、図6(b)に示すように、加工部材5に湾曲や厚み斑が有る場合には、加工毎に表面部10Aの加工開始基準高さを検出しなければ、表面部10Aに対して一定深さの表面部凹パターン痕10Bを形成できない。同様に、加工毎に裏面部10Dの加工開始基準高さを検出しなければ、裏面部10Dに対して一定深さの裏面部凹パターン痕10Eを形成できない。 However, as shown in FIG. 6 (b), when the processed member 5 has a curve or thickness unevenness, if the processing start reference height of the surface portion 10A is not detected for each processing, the surface portion 10A is not detected. The surface portion concave pattern mark 10B having a certain depth cannot be formed. Similarly, unless the processing start reference height of the back surface portion 10D is detected for each processing, the back surface concave pattern mark 10E having a certain depth cannot be formed on the back surface portion 10D.
ここで、導光板10用の基板となる加工部材5には、例えば樹脂板であって、具体的にはメタクリル樹脂板等を用いる。メタクリル樹脂板は、押し出し製法により製造されることから、メタクリル樹脂板の厚みの個体差は、基準値が厚み8mmのもので約±1mmもある。また、一枚のメタクリル樹脂板においても厚み斑が大きく、具体的には最大厚みと最少厚みの差分は約0.4mmもある。なお、メタクリル樹脂板は、水分を吸収することにより反り返るように変形することがある。この様に、メタクリル樹脂板は、厚みの個体差、厚み斑、及び反り返り等に起因する厚み成分の誤差が大きい。一方、導光板10の表面部10Aに形成する表面部凹パターン痕10Bの深さ、及び導光板10の裏面部10Dに形成する裏面部凹パターン痕10Eの深さは、それぞれ0.3mmから0.5mmに設定する場合が多い。 Here, the processing member 5 that becomes the substrate for the light guide plate 10 is, for example, a resin plate, specifically, a methacrylic resin plate or the like. Since the methacrylic resin plate is manufactured by an extrusion manufacturing method, the individual difference in the thickness of the methacrylic resin plate is about ± 1 mm when the standard value is 8 mm. Further, even in a single methacrylic resin plate, the thickness unevenness is large. Specifically, the difference between the maximum thickness and the minimum thickness is about 0.4 mm. In addition, a methacrylic resin board may deform | transform so that it may warp by absorbing a water | moisture content. As described above, the methacrylic resin plate has a large error in the thickness component due to individual differences in thickness, thickness unevenness, warping, and the like. On the other hand, the depth of the front surface concave pattern mark 10B formed on the front surface part 10A of the light guide plate 10 and the depth of the back surface concave pattern mark 10E formed on the back surface part 10D of the light guide plate 10 are 0.3 mm to 0 respectively. Often set to 5 mm.
したがって、導光板10用の基板となる加工部材5のメタクリル樹脂板の加工において、超音波加工装置30の測定部に装着された可動式のプローブDにより検出した後に、該加工開始基準高さを基準として、加工具20先端の設けられた超音波加工部20Aに超音波振動を印加しながら、メタクリル樹脂板の表面から所定の深さまで超音波加工部20Aを降下させて、加工することは必須である。 Therefore, in the processing of the methacrylic resin plate of the processing member 5 serving as the substrate for the light guide plate 10, the processing start reference height is detected after being detected by the movable probe D attached to the measurement unit of the ultrasonic processing apparatus 30. As a reference, it is essential to lower the ultrasonic processing unit 20A from the surface of the methacrylic resin plate to a predetermined depth while applying ultrasonic vibration to the ultrasonic processing unit 20A provided at the tip of the processing tool 20. It is.
なお、メタクリル樹脂板の表面の加工開始基準高さを検出しない場合には、図7に示す従来の導光板40の様に、導光板40の表面部40Aにおいて一定深さの表面部凹パターン痕40Bを形成することができない。同様に、導光板40の裏面部40Dにおいて一定深さの裏面部凹パターン痕40Eを形成することができない。 When the processing start reference height of the surface of the methacrylic resin plate is not detected, the surface portion concave pattern trace having a certain depth in the surface portion 40A of the light guide plate 40 as in the conventional light guide plate 40 shown in FIG. 40B cannot be formed. Similarly, the back surface concave pattern mark 40E having a certain depth cannot be formed on the back surface portion 40D of the light guide plate 40.
次に、照明装置に配設された曲げ加工前の導光板10の光学的な仕様について説明する。具体的には、導光板10の両面に形成された凹パターン痕に係る光学的な仕様について、図8を参照しながら具体的に説明する。 Next, the optical specification of the light guide plate 10 before bending that is disposed in the lighting device will be described. Specifically, the optical specifications relating to the concave pattern marks formed on both surfaces of the light guide plate 10 will be specifically described with reference to FIG.
なお、図8は照明装置に配設された曲げ加工前の導光板10の表面部10AにピッチP1で形成された表面部凹パターン痕10Bと裏面部10DにピッチP1で形成された裏面部凹パターン痕10Eとを透過させた状態で示す模式図であり、さらに図8(a)は表面部凹パターン痕10Bに対して裏面部凹パターン痕10Eが対面同一に形成されている状態、同様に図8(b)は表面部凹パターン痕10Bに対して裏面部凹パターン痕10EがX方向に半ピッチP2偏心して形成されている状態、同様に図8(c)は表面部凹パターン痕10Bに対して裏面部凹パターン痕10EがY方向に半ピッチP2偏心して形成されている状態、同様に図8(d)は表面部凹パターン痕10Bに対して裏面部凹パターン痕10EがX,Y方向ともに半ピッチP2偏心して形成されている状態を示す。 Note that FIG. 8 shows a front surface concave pattern mark 10B formed at a pitch P1 on the front surface portion 10A of the light guide plate 10 before bending and disposed on the lighting device, and a back surface concave portion formed at a pitch P1 on the back surface portion 10D. FIG. 8A is a schematic diagram showing the state in which the pattern mark 10E is transmitted, and FIG. 8A shows a state in which the back surface concave pattern mark 10E is formed on the same surface facing the front surface concave pattern mark 10B. FIG. 8B shows a state in which the back surface concave pattern mark 10E is formed eccentrically by a half pitch P2 in the X direction with respect to the front surface concave pattern mark 10B. Similarly, FIG. In contrast, the back surface concave pattern mark 10E is formed with a half pitch P2 eccentricity in the Y direction. Similarly, FIG. Half-pitch in Y direction It shows the state of being formed by Ji P2 eccentric.
ここで、導光板の表面部10Aに形成された表面部凹パターン痕10Bと、裏面部10Dに形成された裏面部凹パターン痕10Eに対して、それぞれLED光が照射される。具体的には、図8(a)乃至(d)の各図において、凹パターン痕に対して図8の水平方向XからLED光の入射光L1が照射される。同様に、図8(a)乃至(d)の各図において、凹パターン痕に対して図8の垂直方向YからLED光の入射光L2が照射される。以下、凹パターン痕の仕様に係る光学特性に関し、図8(a)に示す表面部凹パターン痕10Bと裏面部凹パターン痕10Eが対面同一に形成されている状態を基準の条件として、図8(b)乃至(d)に示す表面部凹パターン痕10Bに対し裏面部凹パターン痕10Eが半ピッチP2偏心している3つの条件における光学特性についてそれぞれ説明する。 Here, LED light is irradiated to the front surface concave pattern mark 10B formed on the front surface part 10A of the light guide plate and the back surface concave pattern mark 10E formed on the back surface part 10D, respectively. Specifically, in each of FIGS. 8A to 8D, the incident light L1 of LED light is irradiated from the horizontal direction X of FIG. Similarly, in each of FIGS. 8A to 8D, the incident light L2 of LED light is irradiated from the vertical direction Y of FIG. Hereinafter, with respect to the optical characteristics related to the specification of the concave pattern mark, the condition that the front surface concave pattern mark 10B and the back surface concave pattern mark 10E shown in FIG. Optical characteristics under three conditions in which the back surface concave pattern mark 10E is decentered by a half pitch P2 with respect to the front surface concave pattern mark 10B shown in FIGS.
まず、図8(b)に示す様に表面部凹パターン痕10Bに対して裏面部凹パターン痕10EがX方向に半ピッチP2偏心して形成されている条件での光学特性について、図8(a)と比較しながら説明する。この条件において、導光板10の表面部10A側から視認できるX方向での導光板10に形成された凹パターン痕の視認できる密度は、図8(a)の場合と比較して2倍である。このため、図8(a)の場合と比較して、導光板10の表面部10A側から視認できる凹パターン痕による輝点がX方向では2倍になるため光の明暗の差が小さくなる。また、導光板10の表面部10A側から視認できるY方向での導光板10に形成された凹パターン痕の密度は、図8(a)の場合と同一である。このため、図8(a)の場合と比較して、Y方向においては光の明暗の差は同一である。 First, as shown in FIG. 8B, the optical characteristics under the condition that the back surface concave pattern mark 10E is formed by decentering by a half pitch P2 in the X direction with respect to the front surface concave pattern mark 10B. ) And explain. Under this condition, the density at which the concave pattern marks formed on the light guide plate 10 in the X direction visible from the surface portion 10A side of the light guide plate 10 can be seen is twice that in the case of FIG. . For this reason, compared with the case of FIG. 8A, the bright spot due to the concave pattern trace visible from the surface portion 10A side of the light guide plate 10 is doubled in the X direction, so the difference in light brightness is small. Further, the density of the concave pattern marks formed in the light guide plate 10 in the Y direction that can be visually recognized from the surface portion 10A side of the light guide plate 10 is the same as in the case of FIG. For this reason, compared with the case of Fig.8 (a), the difference of the brightness of light is the same in the Y direction.
また、図8(c)に示す様に表面部凹パターン痕10Bに対して裏面部凹パターン痕10EがY方向に半ピッチP2偏心して形成されている条件での光学特性について、図8(a)と比較しながら説明する。この条件において、導光板10の表面部10A側から視認できるY方向での導光板10に形成された凹パターン痕の密度は、図8(a)の場合と比較して2倍である。このため、図8(a)の場合と比較して、導光板10の表面部10A側から視認できる凹パターン痕による拡散光がY方向では2倍になるため光の明暗の差が小さくなる。また、導光板10の表面部10A側から視認できるX方向での導光板10に形成された凹パターン痕の密度は、図8(a)の場合と同一である。このため、図8(a)の場合と比較して、X方向では光の明暗の差は同一である。 Further, as shown in FIG. 8C, the optical characteristics under the condition that the back surface concave pattern mark 10E is formed by decentering by a half pitch P2 in the Y direction with respect to the front surface concave pattern mark 10B. ) And explain. Under this condition, the density of the concave pattern marks formed on the light guide plate 10 in the Y direction visible from the surface portion 10A side of the light guide plate 10 is twice that in the case of FIG. For this reason, compared with the case of FIG. 8A, since the diffused light by the concave pattern trace visually recognizable from the surface portion 10A side of the light guide plate 10 is doubled in the Y direction, the difference in light brightness is reduced. Further, the density of the concave pattern marks formed on the light guide plate 10 in the X direction visible from the surface portion 10A side of the light guide plate 10 is the same as in the case of FIG. For this reason, compared with the case of Fig.8 (a), the difference of the brightness of light is the same in the X direction.
同様に、図8(d)に示す様に表面部凹パターン痕10Bに対して裏面部凹パターン痕10EがX,Y方向ともに半ピッチP2偏心して形成されている条件での光学特性について、図8(a)と比較しながら説明する。この条件において、導光板10の表面部10A側から視認できるX,Y方向での導光板10に形成された凹パターン痕の密度は、図8(a)の場合と比較してそれぞれ2倍である。このため、図8(a)の場合と比較して、導光板10の表面部10A側から視認できる凹パターン痕による拡散光がX,Y方向ともに2倍になるため光の明暗の差がそれぞれ小さくなる。 Similarly, as shown in FIG. 8D, the optical characteristics under the condition that the back surface concave pattern mark 10E is formed with the half pitch P2 decentered in the X and Y directions with respect to the front surface concave pattern mark 10B. This will be described in comparison with 8 (a). Under these conditions, the density of the concave pattern marks formed on the light guide plate 10 in the X and Y directions visible from the surface portion 10A side of the light guide plate 10 is twice as high as that in the case of FIG. is there. For this reason, compared with the case of FIG. 8A, the diffused light due to the concave pattern traces visible from the surface portion 10A side of the light guide plate 10 is doubled in both the X and Y directions, so the difference in light brightness is different. Get smaller.
以上、図8(a)乃至(d)を参照しながら上述した通り、表面部凹パターン痕10Bに対する裏面部凹パターン痕10Eの位置をX,Y方向に偏心して形成することにより、光学特性を任意に選択することができる。なお、特に図8(d)に示した条件においては、図8(a)に示した条件と比較して、X,Y方向ともに光の明暗の差がそれぞれ小さくなるため、良好な光学特性が得られる。 As described above with reference to FIGS. 8A to 8D, by forming the position of the back surface concave pattern mark 10E with respect to the front surface concave pattern mark 10B eccentrically in the X and Y directions, the optical characteristics can be improved. Can be arbitrarily selected. In particular, in the condition shown in FIG. 8D, since the difference in light brightness in the X and Y directions is smaller than in the condition shown in FIG. can get.
ここで、照明装置に配設された曲げ加工前の導光板10の構成を応用した形態である導光板50の構成について、図9を参照しながら説明する。なお、図9は表面部凹パターン痕50Bと裏面部凹パターン痕50Eの深さをそれぞれ異ならせた曲げ加工前の導光板50の側面部50Cを示す模式図である。 Here, the configuration of the light guide plate 50, which is an application of the configuration of the light guide plate 10 before bending, which is disposed in the lighting device, will be described with reference to FIG. FIG. 9 is a schematic view showing the side surface portion 50C of the light guide plate 50 before bending, in which the depths of the front surface concave pattern mark 50B and the back surface concave pattern mark 50E are different.
導光板50は、導光板10に形成された略均一な深さの表面部凹パターン痕10B及び裏面部凹パターン痕10Eと異なり、表面部及び裏面部の凹パターン痕の深さを段階的に異ならせていることに特徴を有している。具体的には、導光板50を側面部50Cから見た場合、図9左側の表面及び裏面の凹パターン痕の深さと比較して、図9右側の表面及び裏面の凹パターン痕の方が段階的に深くなるように、凹パターン痕が形成されている。ここで、側面部50Cの図9左側からLED光の入射光L3が照射されると、光学特性から光源に近くなれば光密度が高く、遠くなれば光密度が低くなることから、図9左側よりの凹パターン痕の反射面積を小から大へ変化させることにより拡散光の取り出しが平均化する。すなわち、導光板50は、導光板10よりも拡散光の取り出しを平均化することができる。なお、この凹パターン痕加工は片側光源使用時に有効となる。 Unlike the front surface concave pattern mark 10B and the back surface concave pattern mark 10E formed on the light guide plate 10 with a substantially uniform depth, the light guide plate 50 gradually increases the depth of the concave pattern marks on the front surface and the back surface part. It is characterized by being different. Specifically, when the light guide plate 50 is viewed from the side surface portion 50C, the concave pattern marks on the front surface and the back surface on the right side of FIG. 9 are stepped in comparison with the depth of the concave pattern marks on the front surface and the back surface on the left side in FIG. A concave pattern mark is formed so as to be deeper. Here, when the incident light L3 of the LED light is irradiated from the left side of FIG. 9 of the side surface portion 50C, the light density is high if it is close to the light source due to optical characteristics, and the light density is low if it is far away. By changing the reflection area of the concave pattern trace from small to large, the extraction of diffused light is averaged. That is, the light guide plate 50 can average the extraction of diffused light more than the light guide plate 10. This concave pattern trace processing is effective when a one-side light source is used.
さらに、上述した導光板50の構成を応用した形態である曲げ加工前の導光板60の構成について、図10を参照しながら説明する。なお、図10は表面部凹パターン痕60Bと裏面部凹パターン痕60Eの深さをそれぞれ異ならせた導光板60と該導光板60に接着させた反射テープ61の側面部を示す模式図である。 Furthermore, the configuration of the light guide plate 60 before bending, which is an application of the configuration of the light guide plate 50 described above, will be described with reference to FIG. FIG. 10 is a schematic diagram showing the light guide plate 60 in which the depths of the front surface concave pattern mark 60B and the back surface concave pattern mark 60E are different, and the side surface part of the reflective tape 61 bonded to the light guide plate 60. .
導光板60は、導光板10に形成された略均一な深さの表面部凹パターン痕10B及び裏面部凹パターン痕10Eと異なり、表面部及び裏面部の凹パターン痕の深さを段階的に異ならせ、且つ導光板60の側面部の片側に例えば可視光領域の光に対して反射率の高い薄膜状に形成された金属から成る反射テープ61を接着させていることに特徴を有している。具体的には、導光板60の構造に関し、表面部60Aの表面部凹パターン痕60Bの深さと、裏面部60Dの裏面部凹パターン痕60Eの深さは、図10左側の側面部60C'から右側の側面部60C''に対して、それぞれ段階的に深くなるように形成されている。但し、図10右端の側面部60C''では、表面部60Aの表面部凹パターン痕60Bの深さと、裏面部60Dの裏面部凹パターン痕60Eの深さともに、相対的に浅くなるように形成されている。具体的には、例えば図10に示す表面部60Aの表面部凹パターン痕60Bにおいて、凹パターン痕の深さは、凹パターン痕T1が一番浅く、凹パターン痕T5が一番深く、且つ凹パターン痕T1<T2<T3<T4<T5の関係にある。 Unlike the front surface concave pattern mark 10B and the back surface concave pattern mark 10E formed on the light guide plate 10 with a substantially uniform depth, the light guide plate 60 gradually increases the depth of the concave pattern marks on the front surface and the back surface part. It is characterized in that a reflective tape 61 made of a metal formed in a thin film shape having a high reflectivity with respect to light in the visible light region, for example, is adhered to one side of the side surface portion of the light guide plate 60. Yes. Specifically, regarding the structure of the light guide plate 60, the depth of the front surface concave pattern mark 60B of the front surface part 60A and the depth of the back surface concave pattern mark 60E of the back surface part 60D are from the side surface part 60C ′ on the left side of FIG. The right side surface portion 60C ″ is formed so as to be deeper in stages. However, in the side surface portion 60C '' at the right end in FIG. 10, both the depth of the front surface concave pattern mark 60B of the front surface portion 60A and the depth of the back surface concave pattern mark 60E of the back surface portion 60D are formed to be relatively shallow. Has been. Specifically, for example, in the surface portion concave pattern trace 60B of the surface portion 60A shown in FIG. 10, the depth of the concave pattern trace is the shallowest in the concave pattern trace T1, the deepest in the concave pattern trace T5, and the concave. The pattern mark T1 <T2 <T3 <T4 <T5.
なお、導光板60の光学特性に係る効果に関し、図10左側の側面部60C'からLED光の入射光L4が照射されると、光学特性から光源に近くなれば光密度が高く、遠くなれば光密度が低くなることから、図10左側から凹パターン痕の反射面積を小から大へ変化させることにより、表面部60A及び裏面部60Dにおいて、拡散光の取り出しが平均化する。ここで、導光板60の側面部60C''に接着された反射テープ61により、LED光の入射光L4が側面部60C''で反射されて反射光L5が発生する。該反射光L5は、凹パターン痕により拡散光に変換されることから、LED光が拡散光に変換される割合が増加する。この様な反射光L5は、側面部60C''近傍の凹パターン痕において拡散光に影響を及ぼしている。したがって、側面部60C''では、表面部60Aの表面部凹パターン痕60Bの深さと、裏面部60Dの裏面部凹パターン痕60Eの深さともに、相対的に浅くなるように形成される。このように、導光板60の側面部の片側に反射テープ61を接着させる構成において、必要とされる発光面サイズに対応した均一な拡散光の取出しが可能となる。すなわち、導光板60は、導光板50よりも更に拡散光の取り出しを平均化することができる。 Regarding the effect relating to the optical characteristics of the light guide plate 60, when the incident light L4 of LED light is irradiated from the side surface portion 60C ′ on the left side of FIG. Since the light density is lowered, the extraction of diffused light is averaged at the front surface portion 60A and the back surface portion 60D by changing the reflection area of the concave pattern trace from the small side to the large side from the left side of FIG. Here, the incident light L4 of the LED light is reflected by the side surface portion 60C ″ by the reflective tape 61 bonded to the side surface portion 60C ″ of the light guide plate 60, and the reflected light L5 is generated. Since the reflected light L5 is converted into diffused light by the concave pattern trace, the rate at which the LED light is converted into diffused light increases. Such reflected light L5 affects the diffused light at the concave pattern marks in the vicinity of the side surface portion 60C ″. Accordingly, the side surface portion 60C ″ is formed so that both the depth of the front surface concave pattern mark 60B of the front surface portion 60A and the depth of the back surface concave pattern mark 60E of the back surface portion 60D are relatively shallow. As described above, in the configuration in which the reflective tape 61 is adhered to one side of the side surface portion of the light guide plate 60, it is possible to take out uniform diffused light corresponding to the required light emitting surface size. That is, the light guide plate 60 can average the extraction of diffused light more than the light guide plate 50.
次に、照明装置を構成する曲げ加工後の導光板100とLEDユニット110の構成について、図11を参照しながら説明する。なお、図11は照明装置を構成する曲げ加工後の導光板100とLEDユニット110を示す斜視図である。 Next, the configuration of the light guide plate 100 and the LED unit 110 after bending that constitute the lighting device will be described with reference to FIG. FIG. 11 is a perspective view showing the light guide plate 100 and the LED unit 110 after bending, which constitute the lighting device.
導光板100は、図1乃至図8を参照しながら前述した導光板10、図9を参照しながら前述した導光板50、又は図10を参照しながら前述した導光板60に対して、所定の温度に加熱した後、図示せぬ所定の曲率半径を有する凹面治具に当接させた状態で一定の圧力で押下することにより、例えば図11に示すように所定の曲率半径に湾曲させて形成する。なお、導光板の加熱は、例えばオーブンや高温槽等を使用して、エンボス加工により導光板に形成された凹パターン痕の形状に著しい影響を及ぼさない範囲で行う。具体的には、導光板の材料にメタクリル樹脂を用いている場合には、導光板を120℃付近まで加熱した後、所定の曲率半径に湾曲させる。 The light guide plate 100 has a predetermined configuration relative to the light guide plate 10 described above with reference to FIGS. 1 to 8, the light guide plate 50 described above with reference to FIG. 9, or the light guide plate 60 described with reference to FIG. After being heated to a temperature, it is bent to a predetermined radius of curvature as shown in FIG. 11, for example, by pressing it with a constant pressure in contact with a concave jig (not shown) having a predetermined radius of curvature. To do. The light guide plate is heated within a range that does not significantly affect the shape of the concave pattern marks formed on the light guide plate by embossing using, for example, an oven or a high-temperature bath. Specifically, when methacrylic resin is used as the material of the light guide plate, the light guide plate is heated to around 120 ° C. and then bent to a predetermined radius of curvature.
また、導光板100の側面部100Cに対向するように1個以上の白色LEDから構成されたLED光源であるLEDユニット110を配設する。ここで、白色LEDに駆動電流を印加することにより白色LED光を導光板100に入射させると、該白色LED光が導光板100の表面部100A及び裏面部100Dに形成された凹パターン痕に照射されることにより、それぞれ拡散光が発生する。該拡散光は導光板100の表面部100A及び裏面部100Dに放出される。 Further, an LED unit 110 that is an LED light source composed of one or more white LEDs is disposed so as to face the side surface portion 100 </ b> C of the light guide plate 100. Here, when white LED light is incident on the light guide plate 100 by applying a drive current to the white LED, the white LED light is irradiated to the concave pattern marks formed on the front surface portion 100A and the back surface portion 100D of the light guide plate 100. As a result, diffused light is generated. The diffused light is emitted to the front surface portion 100A and the back surface portion 100D of the light guide plate 100.
なお、湾曲した導光板100の図11右側又は左側に、LEDユニット110を配設する。この様にLEDユニット110を配設した場合、もし導光板100の表面部100Aにしか凹パターン痕を形成していなければ、導光板100の面内における光の明暗の差が大きくなる。しかし、導光板100の裏面部100Dにも凹パターン痕を形成していれば、導光板100の面内における光の明暗の差は小さくなる。 The LED unit 110 is disposed on the right or left side of the curved light guide plate 100 in FIG. When the LED unit 110 is disposed in this way, if a concave pattern mark is formed only on the surface portion 100A of the light guide plate 100, the difference in brightness of light within the surface of the light guide plate 100 increases. However, if concave pattern traces are also formed on the back surface portion 100D of the light guide plate 100, the difference in light brightness in the surface of the light guide plate 100 is reduced.
最後に本願発明に係る照明装置について、図12乃至図14を参照しながら説明する。なお、図12乃至図14はそれぞれ本発明の照明装置の一例を示す斜視図である。 Finally, the illumination device according to the present invention will be described with reference to FIGS. 12 to 14 are perspective views showing examples of the illumination device of the present invention.
図12に示す照明装置200は、導光板100、LEDユニット110、LEDユニット固定部材120、導光板固定部材130、導光板付勢部材140、付勢ネジ150、及び取付ネジ160から構成される。以下、照明装置200の構成について、図12を参照しながら説明する。LEDユニット固定部材120は、例えばアルミニウムから成り、例えば板形状を略コの字状に曲げて形成される。この様なLEDユニット固定部材120により、LEDユニット110を収納した状態で、導光板100とLEDユニット110を一体に固定している。 12 includes a light guide plate 100, an LED unit 110, an LED unit fixing member 120, a light guide plate fixing member 130, a light guide plate biasing member 140, a biasing screw 150, and a mounting screw 160. Hereinafter, the configuration of the illumination device 200 will be described with reference to FIG. The LED unit fixing member 120 is made of, for example, aluminum, and is formed, for example, by bending a plate shape into a substantially U-shape. With such an LED unit fixing member 120, the light guide plate 100 and the LED unit 110 are integrally fixed in a state where the LED unit 110 is housed.
また、照明装置200において、導光板固定部材130は、導光板100を壁面又は天井面に固定するための固定部材であり、例えばアルミニウムから成り、例えば板形状をL字状に曲げて形成される。同様に、導光板付勢部材140は、例えば一定の伸縮性を有するゴムから成り、例えば板形状部から形成される。ここで、導光板100の一端部の両側に導光板付勢部材140をそれぞれ当接させた状態で、該導光板付勢部材140に導光板固定部材130をそれぞれ当接させる。この様な状態で、導光板固定部材130と導光板100に設けられた貫通孔に付勢ネジ150を通してボルト留めする。また、導光板固定部材130に設けられた貫通孔に取付ネジ160を通して照明装置200を壁面又は天井面にボルト留めする。 In the lighting device 200, the light guide plate fixing member 130 is a fixing member for fixing the light guide plate 100 to a wall surface or a ceiling surface, and is made of, for example, aluminum and formed by bending the plate shape into an L shape, for example. . Similarly, the light guide plate urging member 140 is made of, for example, rubber having a certain stretchability, and is formed of, for example, a plate-shaped portion. Here, in a state where the light guide plate urging members 140 are in contact with both sides of one end of the light guide plate 100, the light guide plate fixing members 130 are brought into contact with the light guide plate urging members 140, respectively. In this state, the light guide plate fixing member 130 and the through hole provided in the light guide plate 100 are bolted through the biasing screw 150. Further, the lighting device 200 is bolted to a wall surface or a ceiling surface through a mounting screw 160 in a through hole provided in the light guide plate fixing member 130.
ここで、図12に示す照明装置200、図13に示す照明装置210、及び図14に示す照明装置220のように、各照明装置に設ける導光板100は、任意の角度に湾曲させたものを使用することができる。また、任意の角度に湾曲した複数の導光板100を、自由に選択して照明装置に取り付けて使用しても良い。なお、導光板100、LEDユニット110、及びLEDユニット固定部材120を一体とし、照明装置に着脱可能な構成としても良い。また、導光板100は、例えば家庭用のドライヤー等により所定の温度に加熱した後、任意の角度に湾曲させることもできる。 Here, like the illumination device 200 shown in FIG. 12, the illumination device 210 shown in FIG. 13, and the illumination device 220 shown in FIG. 14, the light guide plate 100 provided in each illumination device is curved at an arbitrary angle. Can be used. Further, a plurality of light guide plates 100 curved at an arbitrary angle may be freely selected and used by being attached to the lighting device. The light guide plate 100, the LED unit 110, and the LED unit fixing member 120 may be integrated and detachable from the lighting device. In addition, the light guide plate 100 can be bent at an arbitrary angle after being heated to a predetermined temperature by, for example, a household dryer.
以上、第1の実施形態に係る室内施設等の壁面又は天井面に備え付けて間接照明として使用する照明装置によれば、導光板100の表面部凹パターン痕に対する裏面部凹パターン痕の位置をX,Y方向に偏心して形成することにより、光の明暗の差に係る光学特性を任意に選択することができる。例えば、表面部凹パターン痕に対する裏面部凹パターン痕の位置をX,Y方向に半ピッチP2偏心して形成することにより、X,Y方向ともに光の明暗の差をそれぞれ小さくすることができる。特に、湾曲させた導光板100を設けた照明装置において、もし導光板100の表面部100Aにしか凹パターン痕を形成していなければ導光板100の面内における光の明暗の差が大きくなるが、導光板100の裏面部100Dにも凹パターン痕を形成していれば、導光板100の面内における光の明暗の差は小さくなる。 As mentioned above, according to the illuminating device which is provided on the wall surface or ceiling surface of the indoor facility or the like according to the first embodiment and used as indirect illumination, the position of the back surface concave pattern mark relative to the front surface concave pattern mark of the light guide plate 100 is X , And the Y direction, the optical characteristics relating to the difference in light brightness can be arbitrarily selected. For example, by forming the position of the back surface concave pattern trace with respect to the front surface concave pattern trace with a half-pitch P2 eccentricity in the X and Y directions, it is possible to reduce the difference in light intensity in both the X and Y directions. In particular, in a lighting device provided with a curved light guide plate 100, if the concave pattern trace is not formed only on the surface portion 100A of the light guide plate 100, the difference in brightness of light within the surface of the light guide plate 100 increases. If the concave pattern trace is also formed on the back surface portion 100D of the light guide plate 100, the difference in light brightness in the surface of the light guide plate 100 is reduced.
したがって、導光板100を設けた照明装置によれば、光の明暗の差を抑制した状態で、LED光を面発光から立体発光へ変化させることが可能であることから、空間に対して広がりを持った間接照明や装飾照明として利用できる。さらに、導光板100を設けた照明装置によれば、導光板100を所定の方向及び角度に湾曲させることにより、LED光の入射端面の反対側の端面からの射出光を明るくしたい方向へ曲げて間接照明として使用できる。 Therefore, according to the illuminating device provided with the light guide plate 100, the LED light can be changed from the surface light emission to the three-dimensional light emission in a state in which the difference in light brightness is suppressed. It can be used as indirect lighting or decorative lighting. Furthermore, according to the illumination device provided with the light guide plate 100, the light emitted from the end surface opposite to the incident end surface of the LED light is bent in a direction to be brightened by bending the light guide plate 100 in a predetermined direction and angle. Can be used as indirect lighting.
また、第1の実施形態に係る室内施設等の壁面又は天井面に備え付けて間接照明として使用する照明装置によれば、加工具20の超音波加工部20Aを加工部材5の一主面に押圧させることにより、加工部材5の一主面に対してマトリクス状の加工ドットを反映した複数の反射ドットを1度に形成した導光板10等を曲げ加工した導光板100を用いる。この様に少量多品種に対応できる導光板100において、超音波マルチホーンを用いたフレキシブルなドット加工が対応可能であり、且つ製造に係るタクトを大幅に短縮させることができる。 Moreover, according to the illuminating device which is provided on the wall surface or ceiling surface of the indoor facility or the like according to the first embodiment and used as indirect illumination, the ultrasonic processing portion 20A of the processing tool 20 is pressed against one main surface of the processing member 5. Accordingly, the light guide plate 100 obtained by bending the light guide plate 10 or the like in which a plurality of reflective dots reflecting the matrix-like processed dots are formed at one time on one main surface of the processing member 5 is used. In this way, in the light guide plate 100 that can deal with a small amount and a variety of products, flexible dot processing using an ultrasonic multihorn can be supported, and the tact associated with manufacturing can be greatly shortened.
[第2の実施形態]
次に、第2の実施形態に係る照明装置の構成について、図15乃至図17を参照しながら説明する。なお、図15乃至図17はそれぞれ第2の実施形態に係る照明装置の一例を示す斜視図である。
[Second Embodiment]
Next, the configuration of the illumination device according to the second embodiment will be described with reference to FIGS. 15 to 17. 15 to 17 are perspective views showing examples of the illumination device according to the second embodiment.
なお、第2の実施形態の照明装置は、一方方向にのみ湾曲させた導光板100を設けた第1の実施形態の照明装置と異なり、複数の方向に分岐して湾曲させた導光板を設けていることに特徴を有している。なお、それ以外の照明装置に係る構成は、第1の実施形態で述べた照明装置の構成と同様である。そこで、第2の実施形態の照明装置においては、第1の実施形態の照明装置と異なる構造及び効果等について具体的に説明する。 The illumination device of the second embodiment is different from the illumination device of the first embodiment in which the light guide plate 100 curved in only one direction is provided, and the light guide plate branched and curved in a plurality of directions is provided. It has the feature in being. In addition, the structure which concerns on the other illuminating device is the same as that of the illuminating device described in 1st Embodiment. Therefore, in the illumination device of the second embodiment, the structure and effects that are different from those of the illumination device of the first embodiment will be specifically described.
図15に示す照明装置400において、導光板300は端面から中心部300Cに向けて切開した上で、所定の温度に加熱した後、切断片300A及び切断片300Bが互いに反対の方向に向くように曲げることにより湾曲させている。なお、図16に示す照明装置410に設けられた導光板310は、前述した照明装置400に設けられた導光板300よりも、湾曲させる角度を小さくしている。また、図17に示す照明装置420に設けられた導光板320は、照明装置400に設けられた導光板300の状態から、切断片320A及び切断片320Bを、中心部320Cを中心にしてねじるように曲げて形成している。 In the illuminating device 400 shown in FIG. 15, the light guide plate 300 is cut from the end surface toward the center portion 300C, heated to a predetermined temperature, and then the cut piece 300A and the cut piece 300B are directed in opposite directions. It is curved by bending. Note that the light guide plate 310 provided in the illumination device 410 illustrated in FIG. 16 has a smaller bending angle than the light guide plate 300 provided in the illumination device 400 described above. In addition, the light guide plate 320 provided in the illumination device 420 illustrated in FIG. 17 twists the cut piece 320A and the cut piece 320B around the center portion 320C from the state of the light guide plate 300 provided in the illumination device 400. It is bent and formed.
以上、第2の実施形態に係る室内施設等の壁面又は天井面に備え付けて間接照明として使用する照明装置においても、導光板の表面部凹パターン痕に対する裏面部凹パターン痕の位置をX,Y方向に偏心して形成することにより、光の明暗の差に係る光学特性を任意に選択することができる。例えば、表面部凹パターン痕に対する裏面部凹パターン痕の位置をX,Y方向に半ピッチP2偏心して形成することにより、X,Y方向ともに光の明暗の差をそれぞれ小さくすることができる。特に、複数の方向に分岐して湾曲させ、且つねじるように曲げた導光板を設けた照明装置において、もし導光板の表面部にしか凹パターン痕を形成していなければ導光板の面内における光の明暗の差が非常に大きくなるが、導光板の裏面部にも凹パターン痕を形成していれば、導光板の面内における光の明暗の差は小さくなる。 As described above, the position of the back-side concave pattern traces relative to the front-side concave pattern traces of the light guide plate in the illumination device that is used as indirect illumination by being provided on the wall surface or ceiling surface of the indoor facility or the like according to the second embodiment is defined as By forming it eccentrically in the direction, it is possible to arbitrarily select the optical characteristics related to the difference in brightness of light. For example, by forming the position of the back surface concave pattern trace with respect to the front surface concave pattern trace with a half-pitch P2 eccentricity in the X and Y directions, it is possible to reduce the difference in light intensity in both the X and Y directions. In particular, in an illuminating device provided with a light guide plate that is branched, curved, and twisted in a plurality of directions, if a concave pattern mark is not formed only on the surface portion of the light guide plate, it is within the plane of the light guide plate. Although the difference in brightness of light becomes very large, if the concave pattern trace is formed also in the back surface part of the light guide plate, the difference in light brightness in the surface of the light guide plate becomes small.
したがって、複数の方向に分岐して湾曲させ、且つねじるように曲げた導光板を設けた照明装置においても、光の明暗の差を抑制した状態で、LED光を面発光から立体発光へ変化させることが可能であることから、空間に対して広がりを持った間接照明や装飾照明として利用できる。さらに、複数の方向に分岐して湾曲させ、且つねじるように曲げた導光板を設けた照明装置においても、導光板を所定の方向及び角度に湾曲させることにより、LED光の入射端面の反対側の端面からの射出光を明るくしたい方向へ曲げて間接照明として使用できる。 Therefore, even in an illuminating device provided with a light guide plate that is branched, bent, and twisted in a plurality of directions, LED light is changed from surface light emission to three-dimensional light emission in a state in which the difference in light brightness is suppressed. Therefore, it can be used as indirect lighting or decorative lighting with a wide space. Furthermore, even in an illuminating device provided with a light guide plate that is branched and curved in a plurality of directions and is bent so as to be twisted, by bending the light guide plate in a predetermined direction and angle, the opposite side of the incident end face of the LED light It can be used as indirect illumination by bending the light emitted from the end face of the lamp in the direction to make it brighter.
また、第2の実施形態に係る室内施設等の壁面又は天井面に備え付けて間接照明として使用する照明装置においても、加工具20の超音波加工部20Aを加工部材5の一主面に押圧させることにより、加工部材5の一主面に対してマトリクス状の加工ドットを反映した複数の反射ドットを1度に形成した導光板10等を複数の方向に分岐して曲げ加工した導光板を用いる。この様に少量多品種に対応できる導光板において、超音波マルチホーンを用いたフレキシブルなドット加工が対応可能であり、且つ製造に係るタクトを大幅に短縮させることができる。 Moreover, also in the illuminating device which is provided on the wall surface or ceiling surface of the indoor facility or the like according to the second embodiment and used as indirect illumination, the ultrasonic processing unit 20A of the processing tool 20 is pressed against one main surface of the processing member 5. Thus, a light guide plate that is formed by branching and bending the light guide plate 10 or the like in which a plurality of reflective dots reflecting matrix-like processed dots are formed at one time on one main surface of the processed member 5 is used. . In such a light guide plate that can handle a small amount and a wide variety, flexible dot processing using an ultrasonic multihorn can be supported, and the tact for manufacturing can be greatly shortened.
なお、上述した第1及び第2の実施形態においては、所定の形状に湾曲させた導光板を照明装置に配設した光デバイスとしてそれぞれ説明したが、このような形態に限定されることはなく、本発明の要旨を逸脱しない範囲において適宜変更可能である。また、LEDユニットに配設するLEDは、白色のLEDに限定されるものではなく、例えば白色、赤色、青色、及び緑色の中の一色からなるLED、若しくはそれら各色のLEDの組み合わせとしても良い。 In the above-described first and second embodiments, the light guide plate curved into a predetermined shape has been described as an optical device disposed in the lighting device, but the present invention is not limited to such a form. The present invention can be changed as appropriate without departing from the scope of the present invention. Moreover, LED arrange | positioned in an LED unit is not limited to white LED, For example, it is good also as LED which consists of one color in white, red, blue, and green, or the combination of these LED of each color.
5 加工部材
10 導光板
10A 表面部
10B 表面部凹パターン痕
10C 側面部
10D 裏面部
10E 裏面部凹パターン痕
20 加工具
20A 超音波加工部
20B 支持部
30 超音波加工装置
31 機台
32 作業台
33 移動機構
34 真空ポンプ
35 超音波発振器
40 導光板
40A 表面部
40B 表面部凹パターン痕
40C 側面部
40D 裏面部
40E 裏面部凹パターン痕
50 導光板
50A 表面部
50B 表面部凹パターン痕
50C 側面部
50D 裏面部
50E 裏面部凹パターン痕
60 導光板
60A 表面部
60B 表面部凹パターン痕
60C', 60C'' 側面部
60D 裏面部
60E 裏面部凹パターン痕
61 反射テープ
100 導光板
100A 表面部
100C 側面部
100D 裏面部
110 LEDユニット
120 LEDユニット固定部材
130 導光板固定部材
140 導光板付勢部材
150 付勢ネジ
160 取付ネジ
200 照明装置
210 照明装置
220 照明装置
300 導光板
300A 切断片
300B 切断片
300C 中心部
310 導光板
320 導光板
320A 切断片
320B 切断片
320C 中心部
400 照明装置
410 照明装置
420 照明装置
D プローブ
H1,H2,H3,H4 加工開始基準高さ
P1 ピッチ
P2 半ピッチ
L1,L2,L3,L4 入射光
L5 反射光
T1,T2,T3,T4,T5 凹パターン痕
5 Processing member 10 Light guide plate 10A Surface portion 10B Surface portion concave pattern mark 10C Side surface portion 10D Back surface portion 10E Back surface portion concave pattern mark 20 Processing tool 20A Ultrasonic processing section 20B Support section 30 Ultrasonic processing apparatus 31 Machine base 32 Worktable 33 Moving mechanism 34 Vacuum pump 35 Ultrasonic oscillator 40 Light guide plate 40A Surface portion 40B Surface portion concave pattern mark 40C Side surface portion 40D Back surface portion 40E Back surface portion concave pattern mark 50 Light guide plate 50A Surface portion 50B Surface portion concave pattern mark 50C Side surface portion 50D Back surface 50E Back surface concave pattern mark 60 Light guide plate 60A Surface part 60B Surface part concave pattern mark 60C ', 60C''Side surface part 60D Back surface part 60E Back surface concave pattern mark 61 Reflective tape 100 Light guide plate 100A Surface part 100C Side surface part 100D Back surface Part 110 LED unit 120 LED unit fixing member 130 Light plate fixing member 140 Light guide plate urging member 150 Biasing screw 160 Mounting screw 200 Illuminating device 210 Illuminating device 220 Illuminating device 300 Light guiding plate 300A Cutting piece 300B Cutting piece 300C Center portion 310 Light guiding plate 320 Light guiding plate 320A Cutting piece 320B Cutting piece 320C Center 400 Illuminating device 410 Illuminating device 420 Illuminating device D Probes H1, H2, H3, H4 Processing start reference height P1 Pitch P2 Half pitch L1, L2, L3, L4 Incident light L5 Reflected light T1, T2, T3, T4 T5 concave pattern trace
Claims (5)
前記導光板にLED光を入射させるLED光源と、
前記導光板を壁面又は天井面に固定する固定部材とを有すること
を特徴とする照明装置。 The light incident from the incident end surface is emitted from the front surface portion, the back surface portion, and the end surface facing the incident end surface, and after the reflective dots are formed on the opposed front surface portion and the back surface portion, the light is opposed to the incident end surface. A light guide plate that is incised from the end face toward the incident end face, and is bent to a predetermined curvature by bending two cut pieces obtained by the incision in directions opposite to each other and bending in a twisted manner. ,
An LED light source for causing LED light to enter the light guide plate;
An illuminating device comprising: a fixing member that fixes the light guide plate to a wall surface or a ceiling surface.
を特徴とする請求項1に記載の照明装置。 The reflective dot of the light guide plate is formed by changing the depth stepwise on one or both of the front surface portion and the back surface portion of the light guide plate facing each other. Lighting device.
を特徴とする請求項1に記載の照明装置。 The reflective dots of the light guide plate are formed on both the front surface portion and the back surface portion of the light guide plate facing each other so as to be the same face-to-face or non-face-to-face, respectively. Item 2. The lighting device according to Item 1.
を特徴とする請求項1に記載の照明装置。 The at least one direction of the extension direction of the quadrangular pyramid ridgeline of the processed dots of the light guide plate is substantially parallel to the incident direction of light incident from the side surface of the light guide plate substrate. The lighting device described in 1.
を特徴とする請求項1に記載の照明装置。 The lighting device according to claim 1, wherein the reflective dots of the light guide plate have a quadrangular pyramid shape.
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