JP4724238B2 - Lighting device - Google Patents

Lighting device Download PDF

Info

Publication number
JP4724238B2
JP4724238B2 JP2009144842A JP2009144842A JP4724238B2 JP 4724238 B2 JP4724238 B2 JP 4724238B2 JP 2009144842 A JP2009144842 A JP 2009144842A JP 2009144842 A JP2009144842 A JP 2009144842A JP 4724238 B2 JP4724238 B2 JP 4724238B2
Authority
JP
Japan
Prior art keywords
light guide
guide plate
light
concave pattern
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009144842A
Other languages
Japanese (ja)
Other versions
JP2011003367A5 (en
JP2011003367A (en
Inventor
光秀 坂本
博 中嶋
英介 羽田野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SKG Co Ltd
Original Assignee
SKG Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2009144842A priority Critical patent/JP4724238B2/en
Application filed by SKG Co Ltd filed Critical SKG Co Ltd
Priority to CN201410103350.0A priority patent/CN103899956A/en
Priority to KR1020117009574A priority patent/KR101265118B1/en
Priority to CN201210063213.XA priority patent/CN102635794B/en
Priority to EP10789131.9A priority patent/EP2444722A4/en
Priority to US13/379,030 priority patent/US20120140517A1/en
Priority to CN2010800036889A priority patent/CN102257318A/en
Priority to EP12005373A priority patent/EP2518384A2/en
Priority to KR1020127017580A priority patent/KR101256124B1/en
Priority to PCT/JP2010/001631 priority patent/WO2010146746A1/en
Priority to TW099107499A priority patent/TWI390159B/en
Publication of JP2011003367A publication Critical patent/JP2011003367A/en
Publication of JP2011003367A5 publication Critical patent/JP2011003367A5/ja
Application granted granted Critical
Publication of JP4724238B2 publication Critical patent/JP4724238B2/en
Priority to HK14112269.3A priority patent/HK1198776A1/en
Priority to HK12111852.0A priority patent/HK1171065A1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Description

本発明は、少量多品種で両面発光用の複数の導光板を立体的に配設して壁面や側面等を照らす照明装置に関する。   The present invention relates to a lighting device that illuminates wall surfaces, side surfaces, and the like by three-dimensionally arranging a plurality of light guide plates for double-sided light emission in a small amount and a variety.

従来、LED光を光源とする照明装置において、特に電球ランプ型では、立体的な配光特性を得るために、例えば多数の白色LEDを立体的に設けた構成がある(例えば、特許文献1参照。)。   2. Description of the Related Art Conventionally, in a lighting device using LED light as a light source, in particular, a light bulb lamp type has a configuration in which, for example, a large number of white LEDs are three-dimensionally provided in order to obtain a three-dimensional light distribution characteristic (see, for example, Patent Document 1). .)

特開2005−310561号公報JP 2005-310561 A

しかしながら、前述の構成では、製造工程上、様々な形状の照明装置に対応させることは困難であり、且つ製造コストが掛かる問題があった。   However, the above-described configuration has a problem that it is difficult to correspond to lighting devices having various shapes in the manufacturing process, and the manufacturing cost is high.

そこで、本発明は前述の技術的な課題に鑑み、照明装置を装着する施設の形状やユーザの要望に合わせた配光特性を有し、光の明暗の差を抑制して且つ照射する角度に依存せず、さらに低コストで製造することができる、室内施設等の床面や側面を照らして使用する照明装置を提供することを目的とする。   In view of the above technical problems, the present invention has a light distribution characteristic tailored to the shape of the facility to which the lighting device is mounted and the user's request, and suppresses the difference in light brightness and the angle for irradiation. An object of the present invention is to provide an illuminating device that illuminates a floor surface or a side surface of an indoor facility or the like that can be manufactured at a lower cost without depending on it.

前述の課題を解決すべく、本発明の照明装置は、側面から入射された光を拡散光として導出させる反射ドットが前記側面に直交する主面に形成され透明な複数の導光板と、前記複数の導光板の前記側面に沿って設けられ、前記複数の導光板の前記側面からLED光を入射させるLED光源と、前記LED光源を保持する保持部材とを有し、前記複数の導光板は一の前記導光板の前記主面に対して他の前記導光板の前記側面及び前記主面にそれぞれ直交した面が所定の角度で接合されていることを特徴とする。
In order to attain the above object, the lighting apparatus of the present invention includes a plurality of light guide plate reflective dots for leading out light as diffused light transparent formed on the principal surface perpendicular to the side which is incident from the side surface, said plurality An LED light source that is provided along the side surface of the plurality of light guide plates and allows LED light to enter from the side surfaces of the plurality of light guide plates ; and a holding member that holds the LED light sources, and the plurality of light guide plates includes one The main surface of the light guide plate is joined to the side surface of the other light guide plate and a surface orthogonal to the main surface at a predetermined angle.

本発明に係る照明装置によれば、照明装置を装着する施設の形状やユーザの要望に合わせた配光特性を有し、光の明暗の差を抑制して且つ照射する角度に依存せず、さらに低コストで製造することができる。   According to the lighting device according to the present invention, it has a light distribution characteristic that matches the shape of the facility to which the lighting device is mounted and the user's request, does not depend on the angle of irradiation while suppressing the difference between light and dark, Further, it can be manufactured at low cost.

本発明の第1の実施形態の照明装置に配設された導光板を示す模式図であり、(a)は導光板の表面部を示す模式図、(b)は導光板の側面部を示す模式図、(c)は導光板の裏面部を示す模式図である。It is a schematic diagram which shows the light-guide plate arrange | positioned at the illuminating device of the 1st Embodiment of this invention, (a) is a schematic diagram which shows the surface part of a light-guide plate, (b) shows the side part of a light-guide plate. A schematic diagram and (c) are schematic diagrams which show the back surface part of a light-guide plate. 本発明の第1の実施形態の照明装置に配設された導光板の表面部の一部を示す模式図である。It is a schematic diagram which shows a part of surface part of the light-guide plate arrange | positioned at the illuminating device of the 1st Embodiment of this invention. 本発明の第1の実施形態の照明装置に配設された導光板に設けられた凹パターン痕を形成するエンボス加工用の加工具を示す模式図であり、(a)は加工具の支持部を示す模式図、(b)は加工具の超音波加工部を示す模式図である、It is a schematic diagram which shows the processing tool for embossing which forms the concave pattern trace provided in the light-guide plate arrange | positioned at the illuminating device of the 1st Embodiment of this invention, (a) is a support part of a processing tool (B) is a schematic diagram showing an ultrasonic processing portion of the processing tool, 本発明の第1の実施形態の照明装置に配設された導光板に設けられた凹パターン痕を形成するエンボス加工用の超音波加工装置を示す斜視図である。It is a perspective view which shows the ultrasonic processing apparatus for embossing which forms the concave pattern trace provided in the light-guide plate arrange | positioned at the illuminating device of the 1st Embodiment of this invention. 本発明の第1の実施形態の照明装置に配設された導光板に設けられた凹パターン痕を形成するエンボス加工の状態を示す模式図であり、(a)乃至(e)はエンボス加工を行う前に加工部材の加工開始基準高さを測定し、次に該加工開始基準高さに合わせて加工部材に対してエンボス加工を行う状態を順に示す模式図である。It is a schematic diagram which shows the state of the embossing which forms the concave pattern trace provided in the light-guide plate arrange | positioned at the illuminating device of the 1st Embodiment of this invention, (a) thru | or (e) are embossing. It is a schematic diagram which shows the state which measures the process start reference height of a process member before performing, and performs embossing with respect to a process member next according to this process start reference height. 本発明の第1の実施形態の照明装置に配設された導光板の側面部を示す模式図であり、(a)は加工部材に湾曲や厚み斑が無い場合の導光板の側面部を示す模式図、(b)は加工部材に湾曲や厚み斑が有る場合の導光板の側面部を示す模式図である。It is a schematic diagram which shows the side part of the light-guide plate arrange | positioned at the illuminating device of the 1st Embodiment of this invention, (a) shows the side part of a light-guide plate in case a processing member does not have a curve and a thickness spot. (B) is a schematic diagram which shows the side part of a light-guide plate in case a process member has a curve and a thickness spot. 従来の導光板の製造において加工部材に湾曲や厚み斑が有る場合の導光板の側面部を示す模式図である。It is a schematic diagram which shows the side part of a light-guide plate in case the curvature or thickness spot exists in a process member in manufacture of the conventional light-guide plate. 本発明の第1の実施形態の照明装置に配設された導光板の表面部に形成された表面部凹パターン痕と裏面部に形成された裏面部凹パターン痕を透過させた状態で示す模式図であり、(a)は表面部凹パターン痕に対して裏面部凹パターン痕が対面同一に形成されている状態を示す模式図、(b)は表面部凹パターン痕に対して裏面部凹パターン痕がX方向に半ピッチ偏心して形成されている状態を示す模式図、(c)は表面部凹パターン痕に対して裏面部凹パターン痕がY方向に半ピッチ偏心して形成されている状態を示す模式図、(d)は表面部凹パターン痕に対して裏面部凹パターン痕がX,Y方向ともに半ピッチ偏心して形成されている状態を示す模式図である。The model shown in the state which permeate | transmitted the surface part concave pattern trace formed in the surface part of the light-guide plate arrange | positioned in the illuminating device of the 1st Embodiment of this invention, and the back part concave pattern trace formed in the back surface part. It is a figure, and (a) is a mimetic diagram showing the state where the back part concave pattern trace is formed in the same face to the front part concave pattern trace, and (b) is the back part concave with respect to the front part concave pattern trace. Schematic diagram showing a state in which the pattern marks are formed with a half pitch eccentricity in the X direction, (c) is a state in which the back surface concave pattern marks are formed with a half pitch eccentricity in the Y direction with respect to the front surface concave pattern marks. (D) is a schematic diagram showing a state where the back surface concave pattern trace is formed with a half-pitch eccentricity in both the X and Y directions with respect to the front surface concave pattern trace. 本発明の第1の実施形態の照明装置に配設された表面部凹パターン痕と裏面部凹パターン痕の深さをそれぞれ異ならせた導光板の側面部を示す模式図である。It is a schematic diagram which shows the side part of the light-guide plate which varied the depth of the surface part concave pattern trace arrange | positioned in the illuminating device of the 1st Embodiment of this invention, and a back surface concave pattern trace, respectively. 本発明の第1の実施形態の照明装置に配設された表面部凹パターン痕と裏面部凹パターン痕の深さをそれぞれ異ならせた導光板と該導光板に接着させた反射テープの側面部を示す模式図である。A light guide plate having different depths of the front surface concave pattern trace and the back surface concave pattern trace disposed in the lighting device of the first embodiment of the present invention, and a side surface portion of a reflective tape bonded to the light guide plate It is a schematic diagram which shows. 本発明の第1の実施形態の照明装置を示す側面図である。It is a side view which shows the illuminating device of the 1st Embodiment of this invention. 本発明の第1の実施形態の照明装置を示す上面図である。It is a top view which shows the illuminating device of the 1st Embodiment of this invention.

以下、本発明の照明装置に係る好適な実施形態について、図面を参照しながら説明する。なお、本発明の照明装置は、以下の記述に限定されるものではなく、本発明の要旨を逸脱しない範囲において、適宜変更可能である。   DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments according to a lighting device of the invention will be described with reference to the drawings. In addition, the illuminating device of this invention is not limited to the following description, In the range which does not deviate from the summary of this invention, it can change suitably.

[第1の実施形態]
最初に本願発明に係る照明装置に配設された導光板の構成について説明し、次に導光板の加工具及び加工装置と、該加工装置を用いた導光板の製造方法について説明し、さらに導光板の光学的な仕様等について説明し、次に照明装置を構成する導光板とLEDユニットの構成について説明し、最後に本願発明に係る照明装置について説明する。
[First Embodiment]
First, the structure of the light guide plate disposed in the lighting device according to the present invention will be described, then the light guide plate processing tool and processing device, and the light guide plate manufacturing method using the processing device will be described. The optical specifications and the like of the light plate will be described, then the structure of the light guide plate and the LED unit constituting the lighting device will be described, and finally the lighting device according to the present invention will be described.

まず最初に、本願発明に係る照明装置に配設された導光板10の構成について、図1及び図2を参照しながら説明する。   First, the configuration of the light guide plate 10 disposed in the lighting device according to the present invention will be described with reference to FIGS. 1 and 2.

なお、図1は照明装置に配設された導光板10を示す模式図であり、さらに図1(a)は導光板10の表面部10A、同様に図1(b)は導光板10の側面部10C、同様に図1(c)は導光板10の裏面部10Dを示す模式図である。また、図2は照明装置に配設された導光板10の表面部10Aの一部を拡大して示す模式図である。   1 is a schematic diagram showing the light guide plate 10 disposed in the lighting device. FIG. 1A is a front surface portion 10A of the light guide plate 10, and FIG. 1B is a side view of the light guide plate 10. Similarly to FIG. 1C, the part 10 </ b> C is a schematic diagram showing the back surface part 10 </ b> D of the light guide plate 10. FIG. 2 is an enlarged schematic view showing a part of the surface portion 10A of the light guide plate 10 disposed in the lighting device.

導光板10は、例えばメタクリル樹脂(Polymethylmethacrylate)板から成る、複数の凹パターン痕が形成された所定の大きさの板状部から構成される。具体的には、該板状部の大きさは、例えば100mm×100mmからB0版サイズ相当の1450mm×1030mmの長方形状で、4mmから12mmの厚みに対応する。ここで、図1に示すように、導光板10の表面部10Aには表面部凹パターン痕10Bが形成され、導光板10の裏面部10Dには裏面部凹パターン痕10Eが形成されている。また、その凹パターン痕は、例えば長径0.6mm及び深さ0.4mmの四角錐形状痕から形成されてピッチパターンとして、例えば1.2、1.5、2.0、及び8.0mmピッチ等で構成されたマトリクス状の成形痕にて形成されている。   The light guide plate 10 is composed of a plate-shaped portion having a predetermined size and having a plurality of concave pattern marks formed of, for example, a methacrylic resin (Polymethylmethacrylate) plate. Specifically, the size of the plate-like portion is, for example, a rectangular shape of 100 mm × 100 mm to 1450 mm × 1030 mm corresponding to the B0 plate size, and corresponds to a thickness of 4 mm to 12 mm. Here, as shown in FIG. 1, a front surface concave pattern mark 10 </ b> B is formed on the front surface part 10 </ b> A of the light guide plate 10, and a back surface concave pattern mark 10 </ b> E is formed on the back surface part 10 </ b> D of the light guide plate 10. The concave pattern trace is formed from a square pyramid-shaped trace having a major axis of 0.6 mm and a depth of 0.4 mm, for example, as a pitch pattern, for example, 1.2, 1.5, 2.0, and 8.0 mm pitch. It is formed with a matrix-shaped molding mark composed of the like.

次に、照明装置に配設された導光板10の加工具及び加工装置について説明する。具体的には、導光板10に設けられた凹パターン痕を形成する加工具20、及び超音波加工装置30について、図3及び図4を参照しながら説明する。   Next, a processing tool and a processing apparatus for the light guide plate 10 disposed in the lighting device will be described. Specifically, the processing tool 20 and the ultrasonic processing apparatus 30 that form the concave pattern marks provided on the light guide plate 10 will be described with reference to FIGS. 3 and 4.

なお、図3は照明装置に配設された導光板10に設けられた凹パターン痕を形成するエンボス加工用の加工具20を示す模式図であり、さらに図3(a)は加工具20の支持部20B、同様に図3(b)は加工具20の超音波加工部20Aを示す模式図である、また、図4は照明装置に配設された導光板10に設けられた凹パターン痕を形成するエンボス加工用の超音波加工装置30を示す斜視図である。   FIG. 3 is a schematic diagram showing a processing tool 20 for embossing that forms a concave pattern mark provided on the light guide plate 10 provided in the lighting device, and FIG. 3B is a schematic diagram showing the ultrasonic processing portion 20A of the processing tool 20, and FIG. 4 is a concave pattern mark provided on the light guide plate 10 provided in the illumination device. It is a perspective view which shows the ultrasonic processing apparatus 30 for embossing which forms.

加工具20は、超音波加工用ホーンであり、超音波加工用ホーンの矩形状の先端面にマトリクス状に加工ドットを配列させた超音波加工部20A、及び該超音波加工部20Aを支持する支持部20Bから構成される。また、超音波加工部20Aにおいて、各加工ドットは四角錐形状に形成されている。なお、図2(b)においては、一例として4行4列のマトリクス状に加工ドットを配列させた超音波加工部20Aを記載している。   The processing tool 20 is an ultrasonic processing horn, and supports the ultrasonic processing unit 20A in which processing dots are arranged in a matrix on the rectangular front end surface of the ultrasonic processing horn, and the ultrasonic processing unit 20A. It is comprised from the support part 20B. In the ultrasonic processing section 20A, each processing dot is formed in a quadrangular pyramid shape. FIG. 2B shows an ultrasonic processing unit 20A in which processing dots are arranged in a matrix of 4 rows and 4 columns as an example.

超音波加工装置30は、機台31、作業台32、移動機構33、真空ポンプ34、及び超音波発振器35等から構成される。なお、超音波加工装置30には、例えば本願発明と同一の出願人により実用新案登録出願され、登録3140292号として登録済みの超音波加工装置を用いることができる。この様な超音波加工装置30に、加工具20の支持部20Bを装着して、加工具20の超音波加工部20Aに超音波振動を印加することにより、加工部材5の表面又は裏面、もしくは両面に凹パターン痕を形成して導光板10を製造する。   The ultrasonic processing apparatus 30 includes a machine base 31, a work table 32, a moving mechanism 33, a vacuum pump 34, an ultrasonic oscillator 35, and the like. As the ultrasonic machining apparatus 30, for example, an ultrasonic machining apparatus that has been filed for a utility model registration by the same applicant as the present invention and has been registered as registration No. 3140292 can be used. By attaching the support portion 20B of the processing tool 20 to such an ultrasonic processing device 30 and applying ultrasonic vibration to the ultrasonic processing portion 20A of the processing tool 20, the front surface or the back surface of the processing member 5, or The light guide plate 10 is manufactured by forming concave pattern marks on both sides.

具体的には、超音波加工装置30において、加工具20の超音波加工部20Aを加工部材5の一主面に押圧させることにより、加工部材5の一主面に超音波加工部20Aに設けられた加工ドットを反映した反射ドットを形成させる。なお、加工具20を加工部材5に対して相対的に移動させて反射ドットの形成を繰り返すことにより、加工部材5の一主面の所定範囲に反射ドットを形成する。また、加工ドットの四角錐形状の稜線の延長方向の少なくとも一方向は加工部材5を加工することにより形成された導光板10の側面から入射する光の入射方向と実質的に略平行とされる様に、加工具20の超音波加工部20Aを加工部材5の一主面に押圧させる。なお、加工部材5の形状誤差を考慮した、より具体的な凹パターン痕の形成方法については、図5を参照しながら後述する。   Specifically, in the ultrasonic processing apparatus 30, the ultrasonic processing unit 20 </ b> A of the processing tool 20 is pressed against one main surface of the processing member 5, thereby providing the ultrasonic processing unit 20 </ b> A on one main surface of the processing member 5. Reflective dots reflecting the processed dots are formed. In addition, the reflective dot is formed in the predetermined range of one main surface of the processing member 5 by moving the processing tool 20 relative to the processing member 5 and repeating the formation of the reflective dots. Further, at least one direction of the extending direction of the quadrangular pyramid ridge line of the processing dots is substantially parallel to the incident direction of the light incident from the side surface of the light guide plate 10 formed by processing the processing member 5. Similarly, the ultrasonic processing portion 20 </ b> A of the processing tool 20 is pressed against one main surface of the processing member 5. Note that a more specific method for forming the concave pattern trace in consideration of the shape error of the processed member 5 will be described later with reference to FIG.

次に、照明装置に配設された導光板10の製造方法について説明する。具体的には、加工部材5の形状誤差を考慮した、導光板10に設けられた凹パターン痕の形成について、図5を参照しながら具体的に説明する。   Next, the manufacturing method of the light-guide plate 10 arrange | positioned at the illuminating device is demonstrated. Specifically, the formation of the concave pattern marks provided on the light guide plate 10 in consideration of the shape error of the processed member 5 will be specifically described with reference to FIG.

なお、図5は照明装置に配設された導光板10に設けられた凹パターン痕を形成するエンボス加工の状態を示す模式図であり、さらに図5(a)乃至(e)はエンボス加工を行う前に加工部材5の加工開始基準高さを測定し、次に該加工開始基準高さに合わせて加工部材5に対してエンボス加工を行う状態を順に示す模式図である。   FIG. 5 is a schematic view showing an embossing state in which a concave pattern mark provided on the light guide plate 10 provided in the lighting device is formed, and FIGS. 5A to 5E further illustrate the embossing. It is a schematic diagram which shows the state which measures the process start reference | standard height of the process member 5 before performing, and performs embossing with respect to the process member 5 according to this process start reference | standard height next.

図5(a)に示すように、加工部材5の表面の加工開始基準高さH1を、超音波加工装置30の図示せぬ測定部に配設された可動式のプローブDを加工部材5の表面に接触させることにより検出する。また該加工部材5には、例えば所定の形状で透明なメタクリル樹脂板を用いる。なお、プローブDは、機械的な構成に限定されることはなく、例えば超音波加工装置30の図示せぬ測定部から測定光を照射して、加工部材5の表面からの反射光を受光する構成としても良い。   As shown in FIG. 5 (a), the processing start reference height H 1 of the surface of the processing member 5 is set to the movable probe D disposed in a measurement unit (not shown) of the ultrasonic processing apparatus 30. Detect by contacting the surface. For the processed member 5, for example, a transparent methacrylic resin plate having a predetermined shape is used. The probe D is not limited to a mechanical configuration. For example, the probe D emits measurement light from a measurement unit (not shown) of the ultrasonic processing apparatus 30 and receives reflected light from the surface of the processing member 5. It is good also as a structure.

同様に、図5(b)に示すように、超音波加工装置30に装着された加工具20を、加工開始基準高さH1を検出した表面部10Aの上方の位置まで移動させた後、該加工開始基準高さH1を基準として、加工具20の先端に設けられた超音波加工部20Aに超音波振動を印加し、表面部10Aの加工開始基準高さH1から所定の深さまで超音波加工部20Aを降下させる。また、次の超音加工箇所である加工部材5の表面の加工開始基準高さH2を、超音波加工装置30の測定部に配設された可動式のプローブDにより検出する。   Similarly, as shown in FIG. 5B, after the processing tool 20 mounted on the ultrasonic processing apparatus 30 is moved to a position above the surface portion 10A where the processing start reference height H1 is detected, With reference to the processing start reference height H1, ultrasonic vibration is applied to the ultrasonic processing portion 20A provided at the tip of the processing tool 20, and ultrasonic processing is performed from the processing start reference height H1 of the surface portion 10A to a predetermined depth. Lower part 20A. Further, the processing start reference height H2 of the surface of the processing member 5 which is the next ultrasonic processing location is detected by the movable probe D disposed in the measurement unit of the ultrasonic processing apparatus 30.

同様に、図5(c)に示すように、超音波加工装置30に装着された加工具20を、加工開始基準高さH2を検出した表面部10Aの上方の位置まで移動させた後、該加工開始基準高さH2を基準として、加工具20の先端に設けられた超音波加工部20Aに超音波振動を印加し、表面部10Aの加工開始基準高さH2から所定の深さまで超音波加工部20Aを降下させる。また、次の超音加工箇所である加工部材5の表面の加工開始基準高さH3を、超音波加工装置30の測定部に配設された可動式のプローブDにより検出する。   Similarly, as shown in FIG. 5C, after moving the processing tool 20 mounted on the ultrasonic processing apparatus 30 to a position above the surface portion 10A where the processing start reference height H2 is detected, Using the processing start reference height H2 as a reference, ultrasonic vibration is applied to the ultrasonic processing portion 20A provided at the tip of the processing tool 20, and ultrasonic processing is performed from the processing start reference height H2 of the surface portion 10A to a predetermined depth. Lower part 20A. Further, the machining start reference height H3 of the surface of the machining member 5 which is the next ultrasonic machining location is detected by the movable probe D disposed in the measurement unit of the ultrasonic machining apparatus 30.

同様に、図5(d)に示すように、超音波加工装置30に装着された加工具20を、加工開始基準高さH3を検出した表面部10Aの上方の位置まで移動させた後、該加工開始基準高さH3を基準として、加工具20の先端に設けられた超音波加工部20Aに超音波振動を印加し、表面部10Aの加工開始基準高さH3から所定の深さまで超音波加工部20Aを降下させる。また、次の超音加工箇所である加工部材5の表面の加工開始基準高さH4を、超音波加工装置30の測定部に配設された可動式のプローブDにより検出する。   Similarly, as shown in FIG. 5D, after moving the processing tool 20 mounted on the ultrasonic processing apparatus 30 to a position above the surface portion 10A where the processing start reference height H3 is detected, Using the processing start reference height H3 as a reference, ultrasonic vibration is applied to the ultrasonic processing portion 20A provided at the tip of the processing tool 20, and ultrasonic processing is performed from the processing start reference height H3 of the surface portion 10A to a predetermined depth. Lower part 20A. Further, the machining start reference height H4 of the surface of the machining member 5 which is the next ultrasonic machining location is detected by the movable probe D disposed in the measurement unit of the ultrasonic machining apparatus 30.

さらに、図5(e)に示すように、超音波加工装置30に装着された加工具20を、加工開始基準高さH4を検出した表面部10Aの上方の位置まで移動させた後、該加工開始基準高さH4を基準として、加工具20の先端に設けられた超音波加工部20Aに超音波振動を印加し、表面部10Aの加工開始基準高さH4から所定の深さまで超音波加工部20Aを降下させる。   Further, as shown in FIG. 5E, the processing tool 20 mounted on the ultrasonic processing apparatus 30 is moved to a position above the surface portion 10A where the processing start reference height H4 is detected, and then the processing is performed. With reference to the start reference height H4, ultrasonic vibration is applied to the ultrasonic processing unit 20A provided at the tip of the processing tool 20, and the ultrasonic processing unit from the processing start reference height H4 of the surface portion 10A to a predetermined depth. Lower 20A.

次に、上述した照明装置に配設された導光板10に設けられた凹パターン痕の形成方法に係る効果について、図6及び図7を参照しながら具体的に説明する。   Next, the effect of the method for forming the concave pattern marks provided on the light guide plate 10 provided in the above-described lighting device will be specifically described with reference to FIGS. 6 and 7.

なお、図6は照明装置に配設された導光板10の側面部10Cを示す模式図であり、さらに図6(a)は加工部材5に湾曲や厚み斑が無い場合の導光板10の側面部10Cを示す模式図、同様に図6(b)は加工部材5に湾曲や厚み斑が有る場合の導光板10の側面部10Cを示す模式図である。また、図7は従来の導光板40の製造において加工部材5に湾曲や厚み斑が有る場合の導光板40の側面部40Aを示す模式図である。   FIG. 6 is a schematic diagram showing the side surface portion 10C of the light guide plate 10 disposed in the lighting device. Further, FIG. 6A shows the side surface of the light guide plate 10 when the processed member 5 has no curvature or uneven thickness. Similarly, FIG. 6B is a schematic diagram illustrating the side surface portion 10C of the light guide plate 10 when the processed member 5 has a curve or a thickness unevenness. FIG. 7 is a schematic view showing the side surface portion 40A of the light guide plate 40 when the processed member 5 has a curve or thickness unevenness in the manufacture of the conventional light guide plate 40.

図6(a)に示すように、加工部材5に湾曲や厚み斑が無い場合には、加工毎に表面部10Aの加工開始基準高さを検出しなくても、導光板10の表面部10Aの位置に寄らず、表面部10Aに対して一定深さの表面部凹パターン痕10Bを形成できる。同様に、導光板10の裏面部10Dの位置に寄らず、裏面部10Dに対して一定深さの裏面部凹パターン痕10Eを形成できる。   As shown in FIG. 6A, when the processed member 5 has no curvature or unevenness in thickness, the surface portion 10A of the light guide plate 10 can be detected without detecting the processing start reference height of the surface portion 10A for each processing. Regardless of the position, the surface portion concave pattern mark 10B having a constant depth can be formed with respect to the surface portion 10A. Similarly, the back surface concave pattern mark 10E having a certain depth can be formed on the back surface portion 10D regardless of the position of the back surface portion 10D of the light guide plate 10.

しかし、図6(b)に示すように、加工部材5に湾曲や厚み斑が有る場合には、加工毎に表面部10Aの加工開始基準高さを検出しなければ、表面部10Aに対して一定深さの表面部凹パターン痕10Bを形成できない。同様に、加工毎に裏面部10Dの加工開始基準高さを検出しなければ、裏面部10Dに対して一定深さの裏面部凹パターン痕10Eを形成できない。   However, as shown in FIG. 6 (b), when the processed member 5 has a curve or thickness unevenness, if the processing start reference height of the surface portion 10A is not detected for each processing, the surface portion 10A is not detected. The surface portion concave pattern mark 10B having a certain depth cannot be formed. Similarly, unless the processing start reference height of the back surface portion 10D is detected for each processing, the back surface concave pattern mark 10E having a certain depth cannot be formed on the back surface portion 10D.

ここで、導光板10用の基板となる加工部材5には、例えば樹脂板であって、具体的にはメタクリル樹脂板等を用いる。メタクリル樹脂板は、押し出し製法により製造されることから、メタクリル樹脂板の厚みの個体差は、基準値が厚み8mmのもので約±1mmもある。また、一枚のメタクリル樹脂板においても厚み斑が大きく、具体的には最大厚みと最少厚みの差分は約0.4mmもある。なお、メタクリル樹脂板は、水分を吸収することにより反り返るように変形することがある。この様に、メタクリル樹脂板は、厚みの個体差、厚み斑、及び反り返り等に起因する厚み成分の誤差が大きい。一方、導光板10の表面部10Aに形成する表面部凹パターン痕10Bの深さ、及び導光板10の裏面部10Dに形成する裏面部凹パターン痕10Eの深さは、それぞれ0.3mmから0.5mmに設定する場合が多い。   Here, the processing member 5 that becomes the substrate for the light guide plate 10 is, for example, a resin plate, specifically, a methacrylic resin plate or the like. Since the methacrylic resin plate is manufactured by an extrusion manufacturing method, the individual difference in the thickness of the methacrylic resin plate is about ± 1 mm when the standard value is 8 mm. Further, even in a single methacrylic resin plate, the thickness unevenness is large. Specifically, the difference between the maximum thickness and the minimum thickness is about 0.4 mm. In addition, a methacrylic resin board may deform | transform so that it may warp by absorbing a water | moisture content. As described above, the methacrylic resin plate has a large error in the thickness component due to individual differences in thickness, thickness unevenness, warping, and the like. On the other hand, the depth of the front surface concave pattern mark 10B formed on the front surface part 10A of the light guide plate 10 and the depth of the back surface concave pattern mark 10E formed on the back surface part 10D of the light guide plate 10 are 0.3 mm to 0 respectively. Often set to 5 mm.

したがって、導光板10用の基板となる加工部材5のメタクリル樹脂板の加工において、超音波加工装置30の測定部に装着された可動式のプローブDにより検出した後に、該加工開始基準高さを基準として、加工具20先端の設けられた超音波加工部20Aに超音波振動を印加しながら、メタクリル樹脂板の表面から所定の深さまで超音波加工部20Aを降下させて、加工することは必須である。   Therefore, in the processing of the methacrylic resin plate of the processing member 5 serving as the substrate for the light guide plate 10, the processing start reference height is detected after being detected by the movable probe D attached to the measurement unit of the ultrasonic processing apparatus 30. As a reference, it is essential to lower the ultrasonic processing unit 20A from the surface of the methacrylic resin plate to a predetermined depth while applying ultrasonic vibration to the ultrasonic processing unit 20A provided at the tip of the processing tool 20. It is.

なお、メタクリル樹脂板の表面の加工開始基準高さを検出しない場合には、図7に示す従来の導光板40の様に、導光板40の表面部40Aにおいて一定深さの表面部凹パターン痕40Bを形成することができない。同様に、導光板40の裏面部40Dにおいて一定深さの裏面部凹パターン痕40Eを形成することができない。   When the processing start reference height of the surface of the methacrylic resin plate is not detected, the surface portion concave pattern trace having a certain depth in the surface portion 40A of the light guide plate 40 as in the conventional light guide plate 40 shown in FIG. 40B cannot be formed. Similarly, the back surface concave pattern mark 40E having a certain depth cannot be formed on the back surface portion 40D of the light guide plate 40.

次に、照明装置に配設された導光板10の光学的な仕様について説明する。具体的には、導光板10の両面に形成された凹パターン痕に係る光学的な仕様について、図8を参照しながら具体的に説明する。   Next, the optical specification of the light guide plate 10 disposed in the illumination device will be described. Specifically, the optical specifications relating to the concave pattern marks formed on both surfaces of the light guide plate 10 will be specifically described with reference to FIG.

なお、図8は照明装置に配設された導光板10の表面部10AにピッチP1で形成された表面部凹パターン痕10Bと裏面部10DにピッチP1で形成された裏面部凹パターン痕10Eとを透過させた状態で示す模式図であり、さらに図8(a)は表面部凹パターン痕10Bに対して裏面部凹パターン痕10Eが対面同一に形成されている状態、同様に図8(b)は表面部凹パターン痕10Bに対して裏面部凹パターン痕10EがX方向に半ピッチP2偏心して形成されている状態、同様に図8(c)は表面部凹パターン痕10Bに対して裏面部凹パターン痕10EがY方向に半ピッチP2偏心して形成されている状態、同様に図8(d)は表面部凹パターン痕10Bに対して裏面部凹パターン痕10EがX,Y方向ともに半ピッチP2偏心して形成されている状態を示す。   8 shows a front surface concave pattern mark 10B formed at a pitch P1 on the front surface part 10A of the light guide plate 10 disposed in the lighting device, and a back surface concave pattern mark 10E formed at a pitch P1 on the back surface part 10D. FIG. 8A is a state in which the back surface concave pattern mark 10E is formed so as to face the same with respect to the front surface concave pattern mark 10B. Similarly, FIG. ) Is a state in which the back surface concave pattern mark 10E is formed eccentrically by a half pitch P2 in the X direction with respect to the front surface concave pattern mark 10B. Similarly, FIG. FIG. 8 (d) shows a state in which the concave pattern trace 10E is formed with a half pitch P2 eccentricity in the Y direction. Similarly, in FIG. 8D, the rear concave pattern trace 10E is half in the X and Y directions with respect to the front concave pattern trace 10B. Pitch P2 eccentric It shows the state of being formed Te.

ここで、導光板の表面部10Aに形成された表面部凹パターン痕10Bと、裏面部10Dに形成された裏面部凹パターン痕10Eに対して、それぞれLED光が照射される。具体的には、図8(a)乃至(d)の各図において、凹パターン痕に対して図8の水平方向XからLED光の入射光L1が照射される。同様に、図8(a)乃至(d)の各図において、凹パターン痕に対して図8の垂直方向YからLED光の入射光L2が照射される。以下、凹パターン痕の仕様に係る光学特性に関し、図8(a)に示す表面部凹パターン痕10Bと裏面部凹パターン痕10Eが対面同一に形成されている状態を基準の条件として、図8(b)乃至(d)に示す表面部凹パターン痕10Bに対し裏面部凹パターン痕10Eが半ピッチP2偏心している3つの条件における光学特性についてそれぞれ説明する。   Here, LED light is irradiated to the front surface concave pattern mark 10B formed on the front surface part 10A of the light guide plate and the back surface concave pattern mark 10E formed on the back surface part 10D, respectively. Specifically, in each of FIGS. 8A to 8D, the incident light L1 of LED light is irradiated from the horizontal direction X of FIG. Similarly, in each of FIGS. 8A to 8D, the incident light L2 of LED light is irradiated from the vertical direction Y of FIG. Hereinafter, with respect to the optical characteristics related to the specification of the concave pattern mark, the condition that the front surface concave pattern mark 10B and the back surface concave pattern mark 10E shown in FIG. Optical characteristics under three conditions in which the back surface concave pattern mark 10E is decentered by a half pitch P2 with respect to the front surface concave pattern mark 10B shown in FIGS.

まず、図8(b)に示す様に表面部凹パターン痕10Bに対して裏面部凹パターン痕10EがX方向に半ピッチP2偏心して形成されている条件での光学特性について、図8(a)と比較しながら説明する。この条件において、導光板10の表面部10A側から視認できるX方向での導光板10に形成された凹パターン痕の視認できる密度は、図8(a)の場合と比較して2倍である。このため、図8(a)の場合と比較して、導光板10の表面部10A側から視認できる凹パターン痕による輝点がX方向では2倍になるため光の明暗の差が小さくなる。また、導光板10の表面部10A側から視認できるY方向での導光板10に形成された凹パターン痕の密度は、図8(a)の場合と同一である。このため、図8(a)の場合と比較して、Y方向においては光の明暗の差は同一である。   First, as shown in FIG. 8B, the optical characteristics under the condition that the back surface concave pattern mark 10E is formed by decentering by a half pitch P2 in the X direction with respect to the front surface concave pattern mark 10B. ) And explain. Under this condition, the density at which the concave pattern marks formed on the light guide plate 10 in the X direction visible from the surface portion 10A side of the light guide plate 10 can be seen is twice that in the case of FIG. . For this reason, compared with the case of FIG. 8A, the bright spot due to the concave pattern trace visible from the surface portion 10A side of the light guide plate 10 is doubled in the X direction, so the difference in light brightness is small. Further, the density of the concave pattern marks formed in the light guide plate 10 in the Y direction that can be visually recognized from the surface portion 10A side of the light guide plate 10 is the same as in the case of FIG. For this reason, compared with the case of Fig.8 (a), the difference of the brightness of light is the same in the Y direction.

また、図8(c)に示す様に表面部凹パターン痕10Bに対して裏面部凹パターン痕10EがY方向に半ピッチP2偏心して形成されている条件での光学特性について、図8(a)と比較しながら説明する。この条件において、導光板10の表面部10A側から視認できるY方向での導光板10に形成された凹パターン痕の密度は、図8(a)の場合と比較して2倍である。このため、図8(a)の場合と比較して、導光板10の表面部10A側から視認できる凹パターン痕による拡散光がY方向では2倍になるため光の明暗の差が小さくなる。また、導光板10の表面部10A側から視認できるX方向での導光板10に形成された凹パターン痕の密度は、図8(a)の場合と同一である。このため、図8(a)の場合と比較して、X方向では光の明暗の差は同一である。   Further, as shown in FIG. 8C, the optical characteristics under the condition that the back surface concave pattern mark 10E is formed by decentering by a half pitch P2 in the Y direction with respect to the front surface concave pattern mark 10B. ) And explain. Under this condition, the density of the concave pattern marks formed on the light guide plate 10 in the Y direction visible from the surface portion 10A side of the light guide plate 10 is twice that in the case of FIG. For this reason, compared with the case of FIG. 8A, since the diffused light by the concave pattern trace visually recognizable from the surface portion 10A side of the light guide plate 10 is doubled in the Y direction, the difference in light brightness is reduced. Further, the density of the concave pattern marks formed on the light guide plate 10 in the X direction visible from the surface portion 10A side of the light guide plate 10 is the same as in the case of FIG. For this reason, compared with the case of Fig.8 (a), the difference of the brightness of light is the same in the X direction.

同様に、図8(d)に示す様に表面部凹パターン痕10Bに対して裏面部凹パターン痕10EがX,Y方向ともに半ピッチP2偏心して形成されている条件での光学特性について、図8(a)と比較しながら説明する。この条件において、導光板10の表面部10A側から視認できるX,Y方向での導光板10に形成された凹パターン痕の密度は、図8(a)の場合と比較してそれぞれ2倍である。このため、図8(a)の場合と比較して、導光板10の表面部10A側から視認できる凹パターン痕による拡散光がX,Y方向ともに2倍になるため光の明暗の差がそれぞれ小さくなる。   Similarly, as shown in FIG. 8D, the optical characteristics under the condition that the back surface concave pattern mark 10E is formed with the half pitch P2 decentered in the X and Y directions with respect to the front surface concave pattern mark 10B. This will be described in comparison with 8 (a). Under these conditions, the density of the concave pattern marks formed on the light guide plate 10 in the X and Y directions visible from the surface portion 10A side of the light guide plate 10 is twice as high as that in the case of FIG. is there. For this reason, compared with the case of FIG. 8A, the diffused light due to the concave pattern traces visible from the surface portion 10A side of the light guide plate 10 is doubled in both the X and Y directions, so the difference in light brightness is different. Get smaller.

以上、図8(a)乃至(d)を参照しながら上述した通り、表面部凹パターン痕10Bに対する裏面部凹パターン痕10Eの位置をX,Y方向に偏心して形成することにより、光学特性を任意に選択することができる。なお、特に図8(d)に示した条件においては、図8(a)に示した条件と比較して、X,Y方向ともに光の明暗の差がそれぞれ小さくなるため、良好な光学特性が得られる。   As described above with reference to FIGS. 8A to 8D, by forming the position of the back surface concave pattern mark 10E with respect to the front surface concave pattern mark 10B eccentrically in the X and Y directions, the optical characteristics can be improved. Can be arbitrarily selected. In particular, in the condition shown in FIG. 8D, since the difference in light brightness in the X and Y directions is smaller than in the condition shown in FIG. can get.

ここで、照明装置に配設された導光板10の構成を応用した形態である導光板50の構成について、図9を参照しながら説明する。なお、図9は表面部凹パターン痕50Bと裏面部凹パターン痕50Eの深さをそれぞれ異ならせた導光板50の側面部50Cを示す模式図である。   Here, the configuration of the light guide plate 50, which is an application of the configuration of the light guide plate 10 disposed in the illumination device, will be described with reference to FIG. FIG. 9 is a schematic diagram showing the side surface portion 50C of the light guide plate 50 in which the depths of the front surface concave pattern mark 50B and the back surface concave pattern mark 50E are different.

導光板50は、導光板10に形成された略均一な深さの表面部凹パターン痕10B及び裏面部凹パターン痕10Eと異なり、表面部及び裏面部の凹パターン痕の深さを段階的に異ならせていることに特徴を有している。具体的には、導光板50を側面部50Cから見た場合、図9左側の表面及び裏面の凹パターン痕の深さと比較して、図9右側の表面及び裏面の凹パターン痕の方が段階的に深くなるように、凹パターン痕が形成されている。ここで、側面部50Cの図9左側からLED光の入射光L3が照射されると、光学特性から光源に近くなれば光密度が高く、遠くなれば光密度が低くなることから、図9左側よりの凹パターン痕の反射面積を小から大へ変化させることにより拡散光の取り出しが平均化する。すなわち、導光板50は、導光板10よりも拡散光の取り出しを平均化することができる。なお、この凹パターン痕加工は片側光源使用時に有効となる。   Unlike the front surface concave pattern mark 10B and the back surface concave pattern mark 10E formed on the light guide plate 10 with a substantially uniform depth, the light guide plate 50 gradually increases the depth of the concave pattern marks on the front surface and the back surface part. It is characterized by being different. Specifically, when the light guide plate 50 is viewed from the side surface portion 50C, the concave pattern marks on the front surface and the back surface on the right side of FIG. 9 are stepped in comparison with the depth of the concave pattern marks on the front surface and the back surface on the left side in FIG. A concave pattern mark is formed so as to be deeper. Here, when the incident light L3 of the LED light is irradiated from the left side of FIG. 9 of the side surface portion 50C, the light density is high if it is close to the light source due to optical characteristics, and the light density is low if it is far away. By changing the reflection area of the concave pattern trace from small to large, the extraction of diffused light is averaged. That is, the light guide plate 50 can average the extraction of diffused light more than the light guide plate 10. This concave pattern trace processing is effective when a one-side light source is used.

さらに、上述した導光板50の構成を応用した形態である導光板60の構成について、図10を参照しながら説明する。なお、図10は表面部凹パターン痕60Bと裏面部凹パターン痕60Eの深さをそれぞれ異ならせた導光板60と該導光板60に接着させた反射テープ61の側面部を示す模式図である。   Furthermore, the configuration of the light guide plate 60, which is an application of the configuration of the light guide plate 50 described above, will be described with reference to FIG. FIG. 10 is a schematic diagram showing the light guide plate 60 in which the depths of the front surface concave pattern mark 60B and the back surface concave pattern mark 60E are different, and the side surface part of the reflective tape 61 bonded to the light guide plate 60. .

導光板60は、導光板10に形成された略均一な深さの表面部凹パターン痕10B及び裏面部凹パターン痕10Eと異なり、表面部及び裏面部の凹パターン痕の深さを段階的に異ならせ、且つ導光板60の側面部の片側に例えば可視光領域の光に対して反射率の高い薄膜状に形成された金属から成る反射テープ61を接着させていることに特徴を有している。具体的には、導光板60の構造に関し、表面部60Aの表面部凹パターン痕60Bの深さと、裏面部60Dの裏面部凹パターン痕60Eの深さは、図10左側の側面部60C'から右側の側面部60C''に対して、それぞれ段階的に深くなるように形成されている。但し、図10右端の側面部60C''では、表面部60Aの表面部凹パターン痕60Bの深さと、裏面部60Dの裏面部凹パターン痕60Eの深さともに、相対的に浅くなるように形成されている。具体的には、例えば図10に示す表面部60Aの表面部凹パターン痕60Bにおいて、凹パターン痕の深さは、凹パターン痕T1が一番浅く、凹パターン痕T5が一番深く、且つ凹パターン痕T1<T2<T3<T4<T5の関係にある。   Unlike the front surface concave pattern mark 10B and the back surface concave pattern mark 10E formed on the light guide plate 10 with a substantially uniform depth, the light guide plate 60 gradually increases the depth of the concave pattern marks on the front surface and the back surface part. It is characterized in that a reflective tape 61 made of a metal formed in a thin film shape having a high reflectivity with respect to light in the visible light region, for example, is adhered to one side of the side surface portion of the light guide plate 60. Yes. Specifically, regarding the structure of the light guide plate 60, the depth of the front surface concave pattern mark 60B of the front surface part 60A and the depth of the back surface concave pattern mark 60E of the back surface part 60D are from the side surface part 60C ′ on the left side of FIG. The right side surface portion 60C ″ is formed so as to be deeper in stages. However, in the side surface portion 60C '' at the right end in FIG. 10, both the depth of the front surface concave pattern mark 60B of the front surface portion 60A and the depth of the back surface concave pattern mark 60E of the back surface portion 60D are formed to be relatively shallow. Has been. Specifically, for example, in the surface portion concave pattern trace 60B of the surface portion 60A shown in FIG. 10, the depth of the concave pattern trace is the shallowest in the concave pattern trace T1, the deepest in the concave pattern trace T5, and the concave. The pattern mark T1 <T2 <T3 <T4 <T5.

なお、導光板60の光学特性に係る効果に関し、図10左側の側面部60C'からLED光の入射光L4が照射されると、光学特性から光源に近くなれば光密度が高く、遠くなれば光密度が低くなることから、図10左側から凹パターン痕の反射面積を小から大へ変化させることにより、表面部60A及び裏面部60Dにおいて、拡散光の取り出しが平均化する。ここで、導光板60の側面部60C''に接着された反射テープ61により、LED光の入射光L4が側面部60C''で反射されて反射光L5が発生する。該反射光L5は、凹パターン痕により拡散光に変換されることから、LED光が拡散光に変換される割合が増加する。この様な反射光L5は、側面部60C''近傍の凹パターン痕において拡散光に影響を及ぼしている。したがって、側面部60C''では、表面部60Aの表面部凹パターン痕60Bの深さと、裏面部60Dの裏面部凹パターン痕60Eの深さともに、相対的に浅くなるように形成される。このように、導光板60の側面部の片側に反射テープ61を接着させる構成において、必要とされる発光面サイズに対応した均一な拡散光の取出しが可能となる。すなわち、導光板60は、導光板50よりも更に拡散光の取り出しを平均化することができる。   Regarding the effect relating to the optical characteristics of the light guide plate 60, when the incident light L4 of LED light is irradiated from the side surface portion 60C ′ on the left side of FIG. Since the light density is lowered, the extraction of diffused light is averaged at the front surface portion 60A and the back surface portion 60D by changing the reflection area of the concave pattern trace from the small side to the large side from the left side of FIG. Here, the incident light L4 of the LED light is reflected by the side surface portion 60C ″ by the reflective tape 61 bonded to the side surface portion 60C ″ of the light guide plate 60, and the reflected light L5 is generated. Since the reflected light L5 is converted into diffused light by the concave pattern trace, the rate at which the LED light is converted into diffused light increases. Such reflected light L5 affects the diffused light at the concave pattern marks in the vicinity of the side surface portion 60C ″. Accordingly, the side surface portion 60C ″ is formed so that both the depth of the front surface concave pattern mark 60B of the front surface portion 60A and the depth of the back surface concave pattern mark 60E of the back surface portion 60D are relatively shallow. As described above, in the configuration in which the reflective tape 61 is adhered to one side of the side surface portion of the light guide plate 60, it is possible to take out uniform diffused light corresponding to the required light emitting surface size. That is, the light guide plate 60 can average the extraction of diffused light more than the light guide plate 50.

最後に、本願発明に係る照明装置200について、図11及び図12を参照しながら説明する。なお、図11は照明装置200を示す側面図であり、図12は照明装置200を示す上面図である。   Finally, the illumination device 200 according to the present invention will be described with reference to FIGS. 11 and 12. FIG. 11 is a side view showing the lighting device 200, and FIG. 12 is a top view showing the lighting device 200.

照明装置200は、導光板100A、導光板100B、LEDユニット110、筐体120、及び口金130から構成される。以下、照明装置200の構成について、図11及び図12を参照しながら説明する。導光板100Aは、板状に形成されている導光板10、導光板50、又は導光板60の4隅に丸み持たせる等の加工を行うことにより、例えばランプの形状を模するように形成する。なお、該導光板100Bは、例えば導光板100Aの両面の中央部にそれぞれ接着固定する。具体的には、導光板100Aと100Bを上面から見た場合に、例えば略十字の形状になるように、導光板100Aと100Bを接合する。また、導光板は例えば略十字形状に一体成形された機材にエンボス加工を施して形成する。   The lighting device 200 includes a light guide plate 100A, a light guide plate 100B, an LED unit 110, a housing 120, and a base 130. Hereinafter, the configuration of the illumination device 200 will be described with reference to FIGS. 11 and 12. The light guide plate 100A is formed so as to imitate the shape of a lamp, for example, by performing processing such as rounding the four corners of the light guide plate 10, the light guide plate 50, or the light guide plate 60 formed in a plate shape. . The light guide plate 100B is bonded and fixed to, for example, the central portions of both surfaces of the light guide plate 100A. Specifically, when the light guide plates 100A and 100B are viewed from above, the light guide plates 100A and 100B are joined so as to have, for example, a substantially cross shape. In addition, the light guide plate is formed by embossing, for example, a piece of equipment integrally formed in a substantially cross shape.

また、照明装置200を構成するLEDユニット110は、LED光源であり、例えば耐熱プラスチックから成り棒状部から形成され、1個以上の白色LEDが配設されている。この様なLEDユニット110は、導光板100Aや導光板100Bの側面部の長さに合わせて、それぞれ所定の長さに形成される。なお、各導光板の側面部の長さに合わせて、LEDユニット110を適当な長さに切断して使用しても良い。また、十字形状に一体に形成されたLEDユニット110に複数の白色LEDを設ける構成としても良い。ここで、白色LEDに駆動電流を印加することにより白色LED光を導光板に入射させると、該白色LED光が導光板の表面部及び裏面部に形成された凹パターン痕に照射されることにより、それぞれ拡散光が発生する。なお、LEDユニット110は、導光板100A及び導光板100Bに対して、例えば接着固定する。   Moreover, the LED unit 110 which comprises the illuminating device 200 is an LED light source, for example, consists of a heat-resistant plastic, is formed from the rod-shaped part, and 1 or more white LED is arrange | positioned. Such LED units 110 are each formed to have a predetermined length in accordance with the lengths of the side surfaces of the light guide plate 100A and the light guide plate 100B. In addition, according to the length of the side part of each light-guide plate, you may cut | disconnect and use the LED unit 110 to suitable length. Moreover, it is good also as a structure which provides several white LED in the LED unit 110 integrally formed in the cross shape. Here, when white LED light is made incident on the light guide plate by applying a drive current to the white LED, the white LED light is irradiated on the concave pattern marks formed on the front surface portion and the back surface portion of the light guide plate. , Respectively, diffuse light is generated. The LED unit 110 is bonded and fixed to the light guide plate 100A and the light guide plate 100B, for example.

同様に、照明装置200を構成する筐体120は、例えば耐熱プラスチックから成り略円錐形状部から形成される。この様な筐体120の一端部に、LEDユニット110を例えば接着固定するか、若しくは図示せぬネジ等を用いてネジ留めする。なお、筐体15は、従来の電球の筐体と基本的に同様の外形形状とすることにより、従来の照明設備に照明装置200を取り付ける際に、筐体120が照明設備に干渉して取付不可となることを防止することが望ましい。   Similarly, the housing | casing 120 which comprises the illuminating device 200 consists of heat resistant plastics, for example, and is formed from the substantially cone-shaped part. For example, the LED unit 110 is bonded and fixed to one end portion of such a casing 120 or screwed using a screw or the like (not shown). The casing 15 has an outer shape basically similar to that of a conventional bulb, so that when the lighting device 200 is mounted on the conventional lighting equipment, the casing 120 is interfered with the lighting equipment. It is desirable to prevent it from becoming impossible.

同様に、照明装置200を構成する口金130は、照明装置200を図示せぬ電球ソケットに接続させるものである。この様な口金130は、例えばプラスチックから成り略円筒形状部で形成され、照明装置200に配設されたLEDを通電させるための金属が外周の一部に設けられている。この様な口金130に、筐体120を例えば接着固定するか、若しくは圧入加工等して固定する。なお、口金130は、従来の電球に設けられている口金と同様の外形形状及び仕様とすることにより、照明装置200を従来の電球ソケットに装着可能にする。なお、口金130の直径は、例えば最も一般的な電球の口金サイズである直径26mmとする。なお、上述した筐体120と口金130はLEDユニット110を保持する保持部材として一体に形成しても良い。   Similarly, the base 130 constituting the lighting device 200 is for connecting the lighting device 200 to a light bulb socket (not shown). Such a base 130 is made of, for example, plastic and is formed in a substantially cylindrical shape, and a metal for energizing the LED disposed in the lighting device 200 is provided on a part of the outer periphery. The casing 120 is fixed to such a base 130 by, for example, bonding or press-fitting. Note that the base 130 has the same external shape and specifications as those of the base provided in the conventional light bulb, so that the lighting device 200 can be attached to the conventional light bulb socket. The diameter of the base 130 is, for example, 26 mm in diameter, which is the most common bulb size. The casing 120 and the base 130 described above may be integrally formed as a holding member that holds the LED unit 110.

以上、第1の実施形態に係る例えば天井面から吊り下げて使用する照明装置200によれば、導光板100の表面部凹パターン痕に対する裏面部凹パターン痕の位置をX,Y方向に偏心して形成することにより、光の明暗の差に係る光学特性を任意に選択することができる。例えば、表面部凹パターン痕に対する裏面部凹パターン痕の位置をX,Y方向に半ピッチP2偏心して形成することにより、X,Y方向ともに光の明暗の差をそれぞれ小さくすることができる。   As described above, according to the illuminating device 200 that is suspended from the ceiling surface, for example, according to the first embodiment, the position of the back surface concave pattern trace with respect to the front surface concave pattern trace of the light guide plate 100 is decentered in the X and Y directions. By forming the optical characteristics, it is possible to arbitrarily select the optical characteristics related to the difference in light brightness. For example, by forming the position of the back surface concave pattern trace with respect to the front surface concave pattern trace with a half-pitch P2 eccentricity in the X and Y directions, it is possible to reduce the difference in light intensity in both the X and Y directions.

また、第1の実施形態に係る例えば天井面から吊り下げて使用する照明装置200によれば、例えば略十字の形状になるように、導光板100Aと100Bを接合した導光板を配設することにより、光の明暗の差を抑制し、且つ照射する角度に依存しない状態で、LED光を面発光から立体発光へ変化させることが可能であることから、空間に対してより広がりを持った間接照明や装飾照明として利用できる。すなわち、照明装置200によれば、照射角度に依存せず、より均一に拡散されたLEDを床面や側面に対して照らすことができる。   In addition, according to the lighting device 200 that is suspended from the ceiling surface, for example, according to the first embodiment, the light guide plate obtained by joining the light guide plates 100A and 100B is disposed so as to have, for example, a substantially cross shape. This makes it possible to change the LED light from surface light emission to three-dimensional light emission in a state that does not depend on the angle of irradiation and suppresses the difference in light brightness and darkness. It can be used as lighting or decorative lighting. That is, according to the illuminating device 200, it is possible to illuminate the floor surface and the side surface with more uniformly diffused LEDs without depending on the irradiation angle.

さらに、第1の実施形態に係る例えば天井面から吊り下げて使用する照明装置200によれば、導光板を切断若しくは切削加工することが容易であることから、複数の導光板を所定の角度で組み合わせて接合することにより、任意の形状の発光部を有する照明装置200を容易に形成することができる。したがって、施設の形状やユーザの要望に合わせた配光特性を有する照明装置200を容易に製作することができる。   Furthermore, according to the lighting device 200 that is used by being suspended from, for example, the ceiling surface according to the first embodiment, it is easy to cut or cut the light guide plate. By combining and bonding, it is possible to easily form the lighting device 200 having a light emitting portion having an arbitrary shape. Therefore, it is possible to easily manufacture the lighting device 200 having a light distribution characteristic according to the shape of the facility and the user's request.

なお、第1の実施形態に係る例えば天井面から吊り下げて使用する照明装置200によれば、加工具20の超音波加工部20Aを加工部材5の一主面に押圧させることにより、加工部材5の一主面に対してマトリクス状の加工ドットを反映した複数の反射ドットを1度に形成した導光板10等を所定の形状に形成した導光板100を用いる。この様に少量多品種に対応できる導光板100において、超音波マルチホーンを用いたフレキシブルなドット加工が対応可能であり、且つ製造に係るタクトを大幅に短縮させることができる。   In addition, according to the illuminating device 200 suspended from the ceiling surface, for example, according to the first embodiment, the processing member 20 is pressed by pressing the ultrasonic processing portion 20A of the processing tool 20 against one main surface of the processing member 5. The light guide plate 100 in which the light guide plate 10 and the like in which a plurality of reflective dots reflecting matrix-like processed dots are formed at a time on one main surface is formed in a predetermined shape is used. In this way, in the light guide plate 100 that can deal with a small amount and a variety of products, flexible dot processing using an ultrasonic multihorn can be supported, and the tact associated with manufacturing can be greatly shortened.

なお、上述した第1の実施形態においては、複数の導光板を所定の形状に組み合わせて照明装置に配設した光デバイスとしてそれぞれ説明したが、このような形態に限定されることはなく、本発明の要旨を逸脱しない範囲において適宜変更可能である。また、LEDユニットに配設するLEDは、白色のLEDに限定されるものではなく、例えば白色、赤色、青色、及び緑色の中の一色からなるLED、若しくはそれら各色のLEDの組み合わせとしても良い。   In the first embodiment described above, each of the optical devices has been described as an optical device in which a plurality of light guide plates are combined in a predetermined shape and disposed in the lighting device. However, the present invention is not limited to such a form. Modifications can be made as appropriate without departing from the scope of the invention. Moreover, LED arrange | positioned in an LED unit is not limited to white LED, For example, it is good also as LED which consists of one color in white, red, blue, and green, or the combination of these LED of each color.

5 加工部材
10 導光板
10A 表面部
10B 表面部凹パターン痕
10C 側面部
10D 裏面部
10E 裏面部凹パターン痕
20 加工具
20A 超音波加工部
20B 支持部
30 超音波加工装置
31 機台
32 作業台
33 移動機構
34 真空ポンプ
35 超音波発振器
40 導光板
40A 表面部
40B 表面部凹パターン痕
40C 側面部
40D 裏面部
40E 裏面部凹パターン痕
50 導光板
50A 表面部
50B 表面部凹パターン痕
50C 側面部
50D 裏面部
50E 裏面部凹パターン痕
60 導光板
60A 表面部
60B 表面部凹パターン痕
60C', 60C'' 側面部
60D 裏面部
60E 裏面部凹パターン痕
61 反射テープ
100A,100B 導光板
110 LEDユニット
120 筐体
130 口金
200 照明装置
D プローブ
H1,H2,H3,H4 加工開始基準高さ
P1 ピッチ
P2 半ピッチ
L1,L2,L3,L4 入射光
L5 反射光
T1,T2,T3,T4,T5 凹パターン痕
5 Processing member 10 Light guide plate 10A Surface portion 10B Surface portion concave pattern mark 10C Side surface portion 10D Back surface portion 10E Back surface portion concave pattern mark 20 Processing tool 20A Ultrasonic processing section 20B Support section 30 Ultrasonic processing apparatus 31 Machine base 32 Worktable 33 Moving mechanism 34 Vacuum pump 35 Ultrasonic oscillator 40 Light guide plate 40A Surface portion 40B Surface portion concave pattern mark 40C Side surface portion 40D Back surface portion 40E Back surface portion concave pattern mark 50 Light guide plate 50A Surface portion 50B Surface portion concave pattern mark 50C Side surface portion 50D Back surface Part 50E back side concave pattern mark 60 light guide plate 60A surface part 60B surface part concave pattern mark 60C ', 60C''side face part 60D back side part 60E back side concave pattern mark 61 reflective tape 100A, 100B light guide plate 110 LED unit 120 housing 130 Base 200 Illumination Device D Probe H1, H2, H3, H4 Processing start reference height P1 Pitch P2 Half pitch L1, L2, L3, L4 Incident light L5 Reflected light T1, T2, T3, T4, T5 Concave pattern trace

Claims (7)

側面から入射された光を拡散光として導出させる反射ドットが前記側面に直交する主面に形成され透明な複数の導光板と、
前記複数の導光板の前記側面に沿って設けられ、前記複数の導光板の前記側面からLED光を入射させるLED光源と、
前記LED光源を保持する保持部材とを有し、
前記複数の導光板は一の前記導光板の前記主面に対して他の前記導光板の前記側面及び前記主面にそれぞれ直交した面が所定の角度で接合されていること
を特徴とする照明装置。
A plurality of transparent light guide plates formed on a main surface orthogonal to the side surface and reflecting dots for guiding light incident from the side surface as diffused light ;
An LED light source that is provided along the side surfaces of the plurality of light guide plates , and that allows LED light to enter from the side surfaces of the plurality of light guide plates;
A holding member for holding the LED light source;
In the plurality of light guide plates, the side surface of the other light guide plate and a surface orthogonal to the main surface are joined to the main surface of one light guide plate at a predetermined angle. apparatus.
前記複数の導光板は一の前記導光板の前記主面に対して他の前記導光板の前記側面及び前記主面にそれぞれ直交した面が略直角となる角度で接合されていること
を特徴とする請求項1に記載の照明装置。
Wherein the plurality of light guide plate and characterized in that it is joined at an angle the side and perpendicular to the surface to each of the main surface of the other of said light guide plate with respect to the major surface of one of the light guide plate is substantially perpendicular The lighting device according to claim 1.
前記導光板の前記反射ドットは前記導光板の対向する両主面の一方若しくは両方に形成されていること
を特徴とする請求項1に記載の照明装置。
The lighting device according to claim 1, wherein the reflective dots of the light guide plate are formed on one or both of the opposing main surfaces of the light guide plate.
前記導光板の前記反射ドットは前記導光板の対向する両主面の一方若しくは両方に深さを段階的に異ならせて形成されていること
を特徴とする請求項1に記載の照明装置。
The illuminating device according to claim 1, wherein the reflective dots of the light guide plate are formed with different depths on one or both of the opposing main surfaces of the light guide plate.
前記導光板の前記反射ドットは対面同一となるように、又は対面非同一となるように前記導光板の対向する両主面の両方にそれぞれ形成されていること
を特徴とする請求項1に記載の照明装置。
The reflective dots of the light guide plate are respectively formed on both opposing main surfaces of the light guide plate so as to be the same face-to-face or non-face-to-face. Lighting equipment.
前記導光板の前記加工ドットの四角錐形状の稜線の延長方向の少なくとも一方向は前記導光板用基板の側面から入射する光の入射方向と略平行とされていること
を特徴とする請求項1に記載の照明装置。
The at least one direction of the extension direction of the quadrangular pyramid ridgeline of the processed dots of the light guide plate is substantially parallel to the incident direction of light incident from the side surface of the light guide plate substrate. The lighting device described in 1.
前記導光板の前記加工ドットは四角錐形状であること
を特徴とする請求項1に記載の照明装置。
The lighting device according to claim 1, wherein the processed dots of the light guide plate have a quadrangular pyramid shape.
JP2009144842A 2009-06-18 2009-06-18 Lighting device Expired - Fee Related JP4724238B2 (en)

Priority Applications (13)

Application Number Priority Date Filing Date Title
JP2009144842A JP4724238B2 (en) 2009-06-18 2009-06-18 Lighting device
PCT/JP2010/001631 WO2010146746A1 (en) 2009-06-18 2010-03-09 Lighting device
CN201210063213.XA CN102635794B (en) 2009-06-18 2010-03-09 Lighting device
EP10789131.9A EP2444722A4 (en) 2009-06-18 2010-03-09 Lighting device
US13/379,030 US20120140517A1 (en) 2009-06-18 2010-03-09 Illumination device
CN2010800036889A CN102257318A (en) 2009-06-18 2010-03-09 Lighting device
EP12005373A EP2518384A2 (en) 2009-06-18 2010-03-09 Illumination device
KR1020127017580A KR101256124B1 (en) 2009-06-18 2010-03-09 lighting device
CN201410103350.0A CN103899956A (en) 2009-06-18 2010-03-09 Illumination device
KR1020117009574A KR101265118B1 (en) 2009-06-18 2010-03-09 lighting device
TW099107499A TWI390159B (en) 2009-06-18 2010-03-15 Lighting equipment
HK14112269.3A HK1198776A1 (en) 2009-06-18 2012-02-22 Lighting device
HK12111852.0A HK1171065A1 (en) 2009-06-18 2012-02-22 Lighting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009144842A JP4724238B2 (en) 2009-06-18 2009-06-18 Lighting device

Publications (3)

Publication Number Publication Date
JP2011003367A JP2011003367A (en) 2011-01-06
JP2011003367A5 JP2011003367A5 (en) 2011-02-17
JP4724238B2 true JP4724238B2 (en) 2011-07-13

Family

ID=43561187

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009144842A Expired - Fee Related JP4724238B2 (en) 2009-06-18 2009-06-18 Lighting device

Country Status (1)

Country Link
JP (1) JP4724238B2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102130239B (en) * 2011-01-31 2012-11-07 郑榕彬 Omnibearing lighting LED (light-emitting diode) packaging method and LED packaging part
KR101830718B1 (en) * 2011-07-15 2018-02-22 엘지이노텍 주식회사 display apparatus
JP4982618B1 (en) * 2011-07-25 2012-07-25 株式会社エス・ケー・ジー Lighting device
JP5779496B2 (en) * 2011-12-27 2015-09-16 株式会社フジクラ Manufacturing method of light emitting plate for surface light emission
JP5396498B2 (en) 2012-03-02 2014-01-22 株式会社エス・ケー・ジー Light emitting device
JP5291223B2 (en) * 2012-04-23 2013-09-18 株式会社エス・ケー・ジー Lighting device
JP6604589B2 (en) 2015-06-25 2019-11-13 パナソニックIpマネジメント株式会社 lighting equipment

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002297072A (en) * 2001-03-30 2002-10-09 Okaya Electric Ind Co Ltd Light spot type display device
JP2003141920A (en) * 2001-07-17 2003-05-16 Robert Bosch Gmbh Lighting unit
JP2006190684A (en) * 2004-12-30 2006-07-20 Osram Opto Semiconductors Gmbh Lighting device having multiple semiconductor light source
JP2007080559A (en) * 2005-09-12 2007-03-29 Skg:Kk Light guide plate and backlight device
JP2007199720A (en) * 2002-07-16 2007-08-09 Nippon Leiz Co Ltd Liquid crystal display device
JP2008077900A (en) * 2006-09-20 2008-04-03 Osram-Melco Ltd Self-ballasted led lamp and compact led lamp
JP2009080966A (en) * 2007-09-25 2009-04-16 Toshiba Lighting & Technology Corp Illumination device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002297072A (en) * 2001-03-30 2002-10-09 Okaya Electric Ind Co Ltd Light spot type display device
JP2003141920A (en) * 2001-07-17 2003-05-16 Robert Bosch Gmbh Lighting unit
JP2007199720A (en) * 2002-07-16 2007-08-09 Nippon Leiz Co Ltd Liquid crystal display device
JP2006190684A (en) * 2004-12-30 2006-07-20 Osram Opto Semiconductors Gmbh Lighting device having multiple semiconductor light source
JP2007080559A (en) * 2005-09-12 2007-03-29 Skg:Kk Light guide plate and backlight device
JP2008077900A (en) * 2006-09-20 2008-04-03 Osram-Melco Ltd Self-ballasted led lamp and compact led lamp
JP2009080966A (en) * 2007-09-25 2009-04-16 Toshiba Lighting & Technology Corp Illumination device

Also Published As

Publication number Publication date
JP2011003367A (en) 2011-01-06

Similar Documents

Publication Publication Date Title
JP4724238B2 (en) Lighting device
JP4825165B2 (en) Display device
CN102635794B (en) Lighting device
JP4481348B1 (en) Manufacturing method of light guide plate, light guide plate, backlight device, and illumination device.
JP5152928B2 (en) Partition plate device
JP4825164B2 (en) Display device
JP5314792B2 (en) Lighting device
KR101273958B1 (en) manufacturing method for light-guiding plate, light-guiding plate, backlight device, lighting device
JP5349190B2 (en) Lighting device
JP6598022B2 (en) lighting equipment
JP4528888B1 (en) Light guide plate manufacturing method, light guide plate, backlight device, and illumination device
JP2010272483A (en) Lighting device
JP2010287445A (en) Lighting device
KR20160008229A (en) Lighting device
JP4530428B1 (en) Manufacturing method of light guide plate, light guide plate, backlight device, and illumination device.
JP5064443B2 (en) Lighting device
JP4528887B1 (en) Light guide plate manufacturing method, light guide plate, backlight device, and illumination device
CN204100137U (en) A kind of flat lamp reflector and flat lamp
JP5222963B2 (en) Light guide plate, lighting device having light guide plate, and method of manufacturing light guide plate
JP4637732B2 (en) Light guide plate and manufacturing method thereof
JP5235247B2 (en) Light guide plate, lighting device having light guide plate, and method of manufacturing light guide plate
JP3171662U (en) Reception stand device
WO2013151121A1 (en) Illumination device
JP5199513B2 (en) Partition plate device and light shielding member
JP3142033U (en) Luminescent display device

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101117

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20101117

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20101117

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20101202

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101207

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110203

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110405

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110408

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140415

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4724238

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees