JP2010287445A - Lighting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting device which corresponds to small quantity and various kinds and prepares a light guide plate capable of lessening a difference in brightness and darkness of light within its surface even if it is bent at an optional angle, and is used by illuminating a ceiling surface or a floor surface by being mounted on a wall surface of an indoor establishment or the like. <P>SOLUTION: The lighting device includes: the light guide plate bent at a designated curvature by being heated after reflective dots reflecting a shape of processing dots are formed as the matrix-shaped processing dots arranged on a hone used for ultrasonic processing are pressed; an LED light source for making LED light incident to the light guide plate; and a fixing member for fixing the light guide plate on the wall surface. The light guide plate is arranged so as to make an end face opposite to an incident end face of the LED light emitted from the LED light source to the light guide plate bent toward a ceiling. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a lighting device that illuminates a ceiling surface or a floor surface by arranging a light guide plate for double-sided light emission in a small amount and a variety of products by bending or the like.

  Conventionally, in a lighting device provided with a light guide plate using LED light as a light source, the length of the side surface is longer than the width of the end surface, and the size of the end surface is larger than the size of the light emitting portion of the LED light source, and the surface facing the side surface There is a configuration of a light source device provided with a diffuse reflection mechanism that is arranged from coarse to dense as the distance from the end face increases (see, for example, Patent Document 1).

JP 2009-26708 A

  However, in the above-described configuration, it is difficult to cope with a small amount of various types of light guide plates, and there is a problem that the light guide plates cannot be bent at an arbitrary angle.

  Therefore, in view of the above-mentioned technical problems, the present invention reduces the difference in brightness of light within the surface of the light guide plate even if it is a light guide plate corresponding to a small variety of products and curved at an arbitrary angle. An object of the present invention is to provide an illuminating device which is provided on a wall surface of an indoor facility or the like and is used by illuminating a ceiling surface or a floor surface, which is provided with a light guide plate that can be used.

  In order to solve the above-described problem, the illumination device of the present invention is configured such that after the matrix-shaped processing dots provided on the ultrasonic processing horn are pressed, the reflective dots reflecting the shape of the processing dots are formed. A light guide plate that is heated and curved to a predetermined curvature, an LED light source that causes LED light to enter the light guide plate, and a fixing member that fixes the light guide plate to a wall surface, and the LED emitted from the LED light source The light guide plate is disposed such that an end surface opposite to an end surface of light incident on the light guide plate is curved toward the ceiling.

  According to the illuminating device of the present invention, the light guide plate disposed in the illuminating device corresponds to a small amount of a wide variety and is curved at an arbitrary angle. It is possible to illuminate the ceiling and floor with a small difference in brightness.

It is a schematic diagram which shows the light-guide plate before the bending process arrange | positioned at the illuminating device of the 1st Embodiment of this invention, (a) is a schematic diagram which shows the surface part of a light-guide plate, (b) is a light-guide plate. The schematic diagram which shows a side part, (c) is a schematic diagram which shows the back surface part of a light-guide plate. It is a schematic diagram which shows a part of surface part of the light-guide plate before the bending process arrange | positioned at the illuminating device of the 1st Embodiment of this invention. It is a schematic diagram which shows the processing tool for embossing which forms the concave pattern trace provided in the light-guide plate before the bending process arrange | positioned at the illuminating device of the 1st Embodiment of this invention, (a) is an addition. The schematic diagram which shows the support part of a tool, (b) is a schematic diagram which shows the ultrasonic processing part of a processing tool, It is a perspective view which shows the ultrasonic processing apparatus for embossing which forms the concave pattern trace provided in the light-guide plate before the bending process arrange | positioned at the illuminating device of the 1st Embodiment of this invention. It is a schematic diagram which shows the state of the embossing which forms the concave pattern trace provided in the light-guide plate before the bending process arrange | positioned at the illuminating device of the 1st Embodiment of this invention, (a) thru | or (e). FIG. 3 is a schematic diagram sequentially illustrating a state in which a machining start reference height of a machining member is measured before embossing, and then the machining member is embossed in accordance with the machining start reference height. It is a schematic diagram which shows the side part of the light-guide plate before the bending process arrange | positioned at the illuminating device of the 1st Embodiment of this invention, (a) is a light-guide plate in case a processing member does not have a curve and a thickness spot. The schematic diagram which shows a side part, (b) is a schematic diagram which shows the side part of a light-guide plate in case a process member has a curve and a thickness spot. It is a schematic diagram which shows the side part of a light-guide plate in case the curvature or thickness spot exists in a process member in manufacture of the conventional light-guide plate. The front surface concave pattern mark formed on the front surface portion of the light guide plate before bending and disposed in the lighting device of the first embodiment of the present invention and the back surface concave pattern mark formed on the back surface portion are transmitted. It is a schematic diagram which shows in a state, (a) is a schematic diagram which shows the state in which the back part concave pattern trace is formed facing the surface part concave pattern trace, (b) is a surface part concave pattern trace Schematic diagram showing a state in which the back side concave pattern trace is formed with a half-pitch eccentricity in the X direction, (c) is a back side concave pattern trace formed with a half-pitch eccentricity in the Y direction with respect to the front side concave pattern trace. (D) is a schematic diagram showing a state where the back surface concave pattern trace is formed with a half-pitch eccentricity in both the X and Y directions with respect to the front surface concave pattern trace. It is a schematic diagram which shows the side part of the light-guide plate which varied the depth of the surface part concave pattern trace before a bending process and the back part concave pattern trace which were arrange | positioned at the illuminating device of the 1st Embodiment of this invention. . A light guide plate in which the depths of the concave pattern traces on the front surface and the concave pattern on the back surface before bending are arranged in the lighting device according to the first embodiment of the present invention are different from each other, and the reflection is adhered to the light guide plate. It is a schematic diagram which shows the side part of a tape. It is a perspective view which shows the light-guide plate and LED unit after the bending process which comprises the illuminating device of the 1st Embodiment of this invention. It is a perspective view which shows an example of the illuminating device of the 1st Embodiment of this invention. It is a side view which shows an example of the illuminating device of the 1st Embodiment of this invention. It is a side view which shows an example of the illuminating device of the 1st Embodiment of this invention.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments according to a lighting device of the invention will be described with reference to the drawings. In addition, the illuminating device of this invention is not limited to the following description, In the range which does not deviate from the summary of this invention, it can change suitably.

[First Embodiment]
First, the configuration of the light guide plate before bending disposed in the lighting device according to the present invention will be described, and then the processing tool and processing device of the light guide plate and the method of manufacturing the light guide plate using the processing device will be described. Then, the optical specifications of the light guide plate will be described, the configuration of the bent light guide plate and LED unit constituting the lighting device will be described, and finally the lighting device according to the present invention will be described.

  First, the configuration of the light guide plate 10 before bending that is disposed in the lighting device according to the present invention will be described with reference to FIGS. 1 and 2.

  FIG. 1 is a schematic view showing the light guide plate 10 before bending, which is disposed in the lighting device. FIG. 1A is a surface portion 10A of the light guide plate 10, and FIG. FIG. 1C is a schematic diagram showing the back surface portion 10D of the light guide plate 10, similarly to the side surface portion 10C of the light plate 10. FIG. FIG. 2 is an enlarged schematic view showing a part of the surface portion 10A of the light guide plate 10 before bending that is disposed in the lighting device.

  The light guide plate 10 is composed of a plate-shaped portion having a predetermined size and having a plurality of concave pattern marks formed of, for example, a methacrylic resin (Polymethylmethacrylate) plate. Specifically, the size of the plate-like portion is, for example, a rectangular shape of 100 mm × 100 mm to 1450 mm × 1030 mm corresponding to the B0 plate size, and corresponds to a thickness of 4 mm to 12 mm. Here, as shown in FIG. 1, a front surface concave pattern mark 10 </ b> B is formed on the front surface part 10 </ b> A of the light guide plate 10, and a back surface concave pattern mark 10 </ b> E is formed on the back surface part 10 </ b> D of the light guide plate 10. The concave pattern trace is formed from a square pyramid-shaped trace having a major axis of 0.6 mm and a depth of 0.4 mm, for example, as a pitch pattern, for example, 1.2, 1.5, 2.0, and 8.0 mm pitch. It is formed with a matrix-shaped molding mark composed of the like.

  Next, the processing tool and processing device of the light guide plate 10 before bending that are disposed in the lighting device will be described. Specifically, the processing tool 20 and the ultrasonic processing apparatus 30 that form the concave pattern marks provided on the light guide plate 10 will be described with reference to FIGS. 3 and 4.

  FIG. 3 is a schematic view showing an embossing processing tool 20 for forming a concave pattern mark provided on the light guide plate 10 before bending, which is disposed in the lighting device, and FIG. 3B is a schematic view showing the ultrasonic processing section 20A of the processing tool 20, and FIG. 4 is a light guide plate before bending that is disposed in the lighting device. 1 is a perspective view showing an ultrasonic processing apparatus 30 for embossing that forms a concave pattern mark provided in FIG.

  The processing tool 20 is an ultrasonic processing horn, and supports the ultrasonic processing unit 20A in which processing dots are arranged in a matrix on the rectangular front end surface of the ultrasonic processing horn, and the ultrasonic processing unit 20A. It is comprised from the support part 20B. In the ultrasonic processing section 20A, each processing dot is formed in a quadrangular pyramid shape. FIG. 2B shows an ultrasonic processing unit 20A in which processing dots are arranged in a matrix of 4 rows and 4 columns as an example.

  The ultrasonic processing apparatus 30 includes a machine base 31, a work table 32, a moving mechanism 33, a vacuum pump 34, an ultrasonic oscillator 35, and the like. As the ultrasonic machining apparatus 30, for example, an ultrasonic machining apparatus that has been filed for a utility model registration by the same applicant as the present invention and has been registered as registration No. 3140292 can be used. By attaching the support portion 20B of the processing tool 20 to such an ultrasonic processing device 30 and applying ultrasonic vibration to the ultrasonic processing portion 20A of the processing tool 20, the front surface or the back surface of the processing member 5, or The light guide plate 10 is manufactured by forming concave pattern marks on both sides.

  Specifically, in the ultrasonic processing apparatus 30, the ultrasonic processing unit 20 </ b> A of the processing tool 20 is pressed against one main surface of the processing member 5, thereby providing the ultrasonic processing unit 20 </ b> A on one main surface of the processing member 5. Reflective dots reflecting the processed dots are formed. In addition, the reflective dot is formed in the predetermined range of one main surface of the processing member 5 by moving the processing tool 20 relative to the processing member 5 and repeating the formation of the reflective dots. Further, at least one direction of the extending direction of the quadrangular pyramid ridge line of the processing dots is substantially parallel to the incident direction of the light incident from the side surface of the light guide plate 10 formed by processing the processing member 5. Similarly, the ultrasonic processing portion 20 </ b> A of the processing tool 20 is pressed against one main surface of the processing member 5. Note that a more specific method for forming the concave pattern trace in consideration of the shape error of the processed member 5 will be described later with reference to FIG.

  Next, the manufacturing method of the light-guide plate 10 before the bending process arrange | positioned at an illuminating device is demonstrated. Specifically, the formation of the concave pattern marks provided on the light guide plate 10 in consideration of the shape error of the processed member 5 will be specifically described with reference to FIG.

  FIG. 5 is a schematic view showing an embossing state for forming a concave pattern mark provided on the light guide plate 10 before bending, which is disposed in the lighting device, and FIGS. 5A to 5E. FIG. 4 is a schematic diagram sequentially illustrating a state in which a processing start reference height of the processing member 5 is measured before embossing, and then the processing member 5 is embossed in accordance with the processing start reference height.

  As shown in FIG. 5 (a), the processing start reference height H 1 of the surface of the processing member 5 is set to the movable probe D disposed in a measurement unit (not shown) of the ultrasonic processing apparatus 30. Detect by contacting the surface. For the processed member 5, for example, a transparent methacrylic resin plate having a predetermined shape is used. The probe D is not limited to a mechanical configuration. For example, the probe D emits measurement light from a measurement unit (not shown) of the ultrasonic processing apparatus 30 and receives reflected light from the surface of the processing member 5. It is good also as a structure.

  Similarly, as shown in FIG. 5B, after the processing tool 20 mounted on the ultrasonic processing apparatus 30 is moved to a position above the surface portion 10A where the processing start reference height H1 is detected, With reference to the processing start reference height H1, ultrasonic vibration is applied to the ultrasonic processing portion 20A provided at the tip of the processing tool 20, and ultrasonic processing is performed from the processing start reference height H1 of the surface portion 10A to a predetermined depth. Lower part 20A. Further, the processing start reference height H2 of the surface of the processing member 5 which is the next ultrasonic processing location is detected by the movable probe D disposed in the measurement unit of the ultrasonic processing apparatus 30.

  Similarly, as shown in FIG. 5C, after moving the processing tool 20 mounted on the ultrasonic processing apparatus 30 to a position above the surface portion 10A where the processing start reference height H2 is detected, Using the processing start reference height H2 as a reference, ultrasonic vibration is applied to the ultrasonic processing portion 20A provided at the tip of the processing tool 20, and ultrasonic processing is performed from the processing start reference height H2 of the surface portion 10A to a predetermined depth. Lower part 20A. Further, the machining start reference height H3 of the surface of the machining member 5 which is the next ultrasonic machining location is detected by the movable probe D disposed in the measurement unit of the ultrasonic machining apparatus 30.

  Similarly, as shown in FIG. 5D, after moving the processing tool 20 mounted on the ultrasonic processing apparatus 30 to a position above the surface portion 10A where the processing start reference height H3 is detected, Using the processing start reference height H3 as a reference, ultrasonic vibration is applied to the ultrasonic processing portion 20A provided at the tip of the processing tool 20, and ultrasonic processing is performed from the processing start reference height H3 of the surface portion 10A to a predetermined depth. Lower part 20A. Further, the machining start reference height H4 of the surface of the machining member 5 which is the next ultrasonic machining location is detected by the movable probe D disposed in the measurement unit of the ultrasonic machining apparatus 30.

  Further, as shown in FIG. 5E, the processing tool 20 mounted on the ultrasonic processing apparatus 30 is moved to a position above the surface portion 10A where the processing start reference height H4 is detected, and then the processing is performed. With reference to the start reference height H4, ultrasonic vibration is applied to the ultrasonic processing unit 20A provided at the tip of the processing tool 20, and the ultrasonic processing unit from the processing start reference height H4 of the surface portion 10A to a predetermined depth. Lower 20A.

  Next, the effect of the method for forming the concave pattern marks provided on the light guide plate 10 before bending that is provided in the lighting device described above will be specifically described with reference to FIGS. 6 and 7.

  FIG. 6 is a schematic diagram showing the side surface portion 10C of the light guide plate 10 before bending, which is disposed in the lighting device, and FIG. 6 (a) is a guide when the processed member 5 has no curvature or unevenness in thickness. FIG. 6B is a schematic diagram showing the side surface portion 10 </ b> C of the light guide plate 10 when the processed member 5 has a curve or a thickness unevenness. FIG. 7 is a schematic view showing the side surface portion 40A of the light guide plate 40 when the processed member 5 has a curve or thickness unevenness in the manufacture of the conventional light guide plate 40.

  As shown in FIG. 6A, when the processed member 5 has no curvature or unevenness in thickness, the surface portion 10A of the light guide plate 10 can be detected without detecting the processing start reference height of the surface portion 10A for each processing. Regardless of the position, the surface portion concave pattern mark 10B having a constant depth can be formed with respect to the surface portion 10A. Similarly, the back surface concave pattern mark 10E having a certain depth can be formed on the back surface portion 10D regardless of the position of the back surface portion 10D of the light guide plate 10.

  However, as shown in FIG. 6 (b), when the processed member 5 has a curve or thickness unevenness, if the processing start reference height of the surface portion 10A is not detected for each processing, the surface portion 10A is not detected. The surface portion concave pattern mark 10B having a certain depth cannot be formed. Similarly, unless the processing start reference height of the back surface portion 10D is detected for each processing, the back surface concave pattern mark 10E having a certain depth cannot be formed on the back surface portion 10D.

  Here, the processing member 5 that becomes the substrate for the light guide plate 10 is, for example, a resin plate, specifically, a methacrylic resin plate or the like. Since the methacrylic resin plate is manufactured by an extrusion manufacturing method, the individual difference in the thickness of the methacrylic resin plate is about ± 1 mm when the standard value is 8 mm. Further, even in a single methacrylic resin plate, the thickness unevenness is large. Specifically, the difference between the maximum thickness and the minimum thickness is about 0.4 mm. In addition, a methacrylic resin board may deform | transform so that it may warp by absorbing a water | moisture content. As described above, the methacrylic resin plate has a large error in the thickness component due to individual differences in thickness, thickness unevenness, warping, and the like. On the other hand, the depth of the front surface concave pattern mark 10B formed on the front surface part 10A of the light guide plate 10 and the depth of the back surface concave pattern mark 10E formed on the back surface part 10D of the light guide plate 10 are 0.3 mm to 0 respectively. Often set to 5 mm.

  Therefore, in the processing of the methacrylic resin plate of the processing member 5 serving as the substrate for the light guide plate 10, the processing start reference height is detected after being detected by the movable probe D attached to the measurement unit of the ultrasonic processing apparatus 30. As a reference, it is essential to lower the ultrasonic processing unit 20A from the surface of the methacrylic resin plate to a predetermined depth while applying ultrasonic vibration to the ultrasonic processing unit 20A provided at the tip of the processing tool 20. It is.

  When the processing start reference height of the surface of the methacrylic resin plate is not detected, the surface portion concave pattern trace having a certain depth in the surface portion 40A of the light guide plate 40 as in the conventional light guide plate 40 shown in FIG. 40B cannot be formed. Similarly, the back surface concave pattern mark 40E having a certain depth cannot be formed on the back surface portion 40D of the light guide plate 40.

  Next, the optical specification of the light guide plate 10 before bending that is disposed in the lighting device will be described. Specifically, the optical specifications relating to the concave pattern marks formed on both surfaces of the light guide plate 10 will be specifically described with reference to FIG.

  Note that FIG. 8 shows a front surface concave pattern mark 10B formed at a pitch P1 on the front surface portion 10A of the light guide plate 10 before bending and disposed on the lighting device, and a back surface concave portion formed at a pitch P1 on the back surface portion 10D. FIG. 8A is a schematic diagram showing the state in which the pattern mark 10E is transmitted, and FIG. 8A shows a state in which the back surface concave pattern mark 10E is formed on the same surface facing the front surface concave pattern mark 10B. FIG. 8B shows a state in which the back surface concave pattern mark 10E is formed eccentrically by a half pitch P2 in the X direction with respect to the front surface concave pattern mark 10B. Similarly, FIG. In contrast, the back surface concave pattern mark 10E is formed with a half pitch P2 eccentricity in the Y direction. Similarly, FIG. Half-pitch in Y direction It shows the state of being formed by Ji P2 eccentric.

  Here, LED light is irradiated to the front surface concave pattern mark 10B formed on the front surface part 10A of the light guide plate and the back surface concave pattern mark 10E formed on the back surface part 10D, respectively. Specifically, in each of FIGS. 8A to 8D, the incident light L1 of LED light is irradiated from the horizontal direction X of FIG. Similarly, in each of FIGS. 8A to 8D, the incident light L2 of LED light is irradiated from the vertical direction Y of FIG. Hereinafter, with respect to the optical characteristics related to the specification of the concave pattern mark, the condition that the front surface concave pattern mark 10B and the back surface concave pattern mark 10E shown in FIG. Optical characteristics under three conditions in which the back surface concave pattern mark 10E is decentered by a half pitch P2 with respect to the front surface concave pattern mark 10B shown in FIGS.

  First, as shown in FIG. 8B, the optical characteristics under the condition that the back surface concave pattern mark 10E is formed by decentering by a half pitch P2 in the X direction with respect to the front surface concave pattern mark 10B. ) And explain. Under this condition, the density at which the concave pattern marks formed on the light guide plate 10 in the X direction visible from the surface portion 10A side of the light guide plate 10 can be seen is twice that in the case of FIG. . For this reason, compared with the case of FIG. 8A, the bright spot due to the concave pattern trace visible from the surface portion 10A side of the light guide plate 10 is doubled in the X direction, so the difference in light brightness is small. Further, the density of the concave pattern marks formed in the light guide plate 10 in the Y direction that can be visually recognized from the surface portion 10A side of the light guide plate 10 is the same as in the case of FIG. For this reason, compared with the case of Fig.8 (a), the difference of the brightness of light is the same in the Y direction.

  Further, as shown in FIG. 8C, the optical characteristics under the condition that the back surface concave pattern mark 10E is formed by decentering by a half pitch P2 in the Y direction with respect to the front surface concave pattern mark 10B. ) And explain. Under this condition, the density of the concave pattern marks formed on the light guide plate 10 in the Y direction visible from the surface portion 10A side of the light guide plate 10 is twice that in the case of FIG. For this reason, compared with the case of FIG. 8A, since the diffused light by the concave pattern trace visually recognizable from the surface portion 10A side of the light guide plate 10 is doubled in the Y direction, the difference in light brightness is reduced. Further, the density of the concave pattern marks formed on the light guide plate 10 in the X direction visible from the surface portion 10A side of the light guide plate 10 is the same as in the case of FIG. For this reason, compared with the case of Fig.8 (a), the difference of the brightness of light is the same in the X direction.

  Similarly, as shown in FIG. 8D, the optical characteristics under the condition that the back surface concave pattern mark 10E is formed with the half pitch P2 decentered in the X and Y directions with respect to the front surface concave pattern mark 10B. This will be described in comparison with 8 (a). Under these conditions, the density of the concave pattern marks formed on the light guide plate 10 in the X and Y directions visible from the surface portion 10A side of the light guide plate 10 is twice as high as that in the case of FIG. is there. For this reason, compared with the case of FIG. 8A, the diffused light due to the concave pattern traces visible from the surface portion 10A side of the light guide plate 10 is doubled in both the X and Y directions, so the difference in light brightness is different. Get smaller.

  As described above with reference to FIGS. 8A to 8D, by forming the position of the back surface concave pattern mark 10E with respect to the front surface concave pattern mark 10B eccentrically in the X and Y directions, the optical characteristics can be improved. Can be arbitrarily selected. In particular, in the condition shown in FIG. 8D, since the difference in light brightness in the X and Y directions is smaller than in the condition shown in FIG. can get.

  Here, the configuration of the light guide plate 50, which is an application of the configuration of the light guide plate 10 before bending, which is disposed in the lighting device, will be described with reference to FIG. FIG. 9 is a schematic view showing the side surface portion 50C of the light guide plate 50 before bending, in which the depths of the front surface concave pattern mark 50B and the back surface concave pattern mark 50E are different.

  Unlike the front surface concave pattern mark 10B and the back surface concave pattern mark 10E formed on the light guide plate 10 with a substantially uniform depth, the light guide plate 50 gradually increases the depth of the concave pattern marks on the front surface and the back surface part. It is characterized by being different. Specifically, when the light guide plate 50 is viewed from the side surface portion 50C, the concave pattern marks on the front surface and the back surface on the right side of FIG. 9 are stepped in comparison with the depth of the concave pattern marks on the front surface and the back surface on the left side in FIG. A concave pattern mark is formed so as to be deeper. Here, when the incident light L3 of the LED light is irradiated from the left side of FIG. 9 of the side surface portion 50C, the light density is high if it is close to the light source due to optical characteristics, and the light density is low if it is far away. By changing the reflection area of the concave pattern trace from small to large, the extraction of diffused light is averaged. That is, the light guide plate 50 can average the extraction of diffused light more than the light guide plate 10. This concave pattern trace processing is effective when a one-side light source is used.

  Furthermore, the configuration of the light guide plate 60 before bending, which is an application of the configuration of the light guide plate 50 described above, will be described with reference to FIG. 10 is a schematic diagram showing the light guide plate 60 in which the depths of the front surface concave pattern mark 60B and the back surface concave pattern mark 60E are different from each other, and the side part of the reflective tape 61 bonded to the light guide plate 60. .

  Unlike the front surface concave pattern mark 10B and the back surface concave pattern mark 10E formed on the light guide plate 10 with a substantially uniform depth, the light guide plate 60 gradually increases the depth of the concave pattern marks on the front surface and the back surface part. It is characterized in that a reflective tape 61 made of a metal formed in a thin film shape having a high reflectivity with respect to light in the visible light region, for example, is adhered to one side of the side surface portion of the light guide plate 60. Yes. Specifically, regarding the structure of the light guide plate 60, the depth of the front surface concave pattern mark 60B of the front surface part 60A and the depth of the back surface concave pattern mark 60E of the back surface part 60D are from the side surface part 60C ′ on the left side of FIG. The right side surface portion 60C ″ is formed so as to be deeper in stages. However, in the side surface portion 60C '' at the right end in FIG. 10, both the depth of the front surface concave pattern mark 60B of the front surface portion 60A and the depth of the back surface concave pattern mark 60E of the back surface portion 60D are formed to be relatively shallow. Has been. Specifically, for example, in the surface portion concave pattern trace 60B of the surface portion 60A shown in FIG. 10, the depth of the concave pattern trace is the shallowest in the concave pattern trace T1, the deepest in the concave pattern trace T5, and the concave. The pattern mark T1 <T2 <T3 <T4 <T5.

  Regarding the effect relating to the optical characteristics of the light guide plate 60, when the incident light L4 of LED light is irradiated from the side surface portion 60C ′ on the left side of FIG. Since the light density is lowered, the extraction of diffused light is averaged at the front surface portion 60A and the back surface portion 60D by changing the reflection area of the concave pattern trace from the small side to the large side from the left side of FIG. Here, the incident light L4 of the LED light is reflected by the side surface portion 60C ″ by the reflective tape 61 bonded to the side surface portion 60C ″ of the light guide plate 60, and the reflected light L5 is generated. Since the reflected light L5 is converted into diffused light by the concave pattern trace, the rate at which the LED light is converted into diffused light increases. Such reflected light L5 affects the diffused light at the concave pattern marks in the vicinity of the side surface portion 60C ″. Therefore, the side surface portion 60C ″ is formed so that both the depth of the front surface concave pattern mark 60B of the front surface portion 60A and the depth of the back surface concave pattern mark 60E of the back surface portion 60D are relatively shallow. As described above, in the configuration in which the reflective tape 61 is adhered to one side of the side surface portion of the light guide plate 60, it is possible to take out uniform diffused light corresponding to the required light emitting surface size. That is, the light guide plate 60 can average the extraction of diffused light more than the light guide plate 50.

  Next, the configuration of the light guide plate 100 and the LED unit 110 after bending that constitute the lighting device will be described with reference to FIG. FIG. 11 is a perspective view showing the light guide plate 100 and the LED unit 110 after bending, which constitute the lighting device.

  The light guide plate 100 has a predetermined configuration relative to the light guide plate 10 described above with reference to FIGS. 1 to 8, the light guide plate 50 described above with reference to FIG. 9, or the light guide plate 60 described with reference to FIG. After being heated to a temperature, it is bent to a predetermined radius of curvature as shown in FIG. 11, for example, by pressing it with a constant pressure in contact with a concave jig (not shown) having a predetermined radius of curvature. To do. The light guide plate is heated within a range that does not significantly affect the shape of the concave pattern marks formed on the light guide plate by embossing using, for example, an oven or a high-temperature bath. Specifically, when methacrylic resin is used as the material of the light guide plate, the light guide plate is heated to around 120 ° C. and then bent to a predetermined radius of curvature.

  Further, an LED unit 110 that is an LED light source composed of one or more white LEDs is disposed so as to face the side surface portion 100 </ b> C of the light guide plate 100. Here, when white LED light is incident on the light guide plate 100 by applying a drive current to the white LED, the white LED light is irradiated to the concave pattern marks formed on the front surface portion 100A and the back surface portion 100D of the light guide plate 100. As a result, diffused light is generated. The diffused light is emitted to the front surface portion 100A and the back surface portion 100D of the light guide plate 100.

  The LED unit 110 is disposed on the right or left side of the curved light guide plate 100 in FIG. When the LED unit 110 is disposed in this way, if a concave pattern mark is formed only on the surface portion 100A of the light guide plate 100, the difference in brightness of light within the surface of the light guide plate 100 increases. However, if concave pattern traces are also formed on the back surface portion 100D of the light guide plate 100, the difference in light brightness in the surface of the light guide plate 100 is reduced.

  Finally, the illumination device according to the present invention will be described with reference to FIGS. 12 is a perspective view showing an example of the lighting device 200 of the present invention, and FIG. 13 is a side view showing an example of the lighting device 200 of the present invention.

  The lighting device 200 includes a light guide plate 100, an LED unit 110, an LED unit fixing member 120, a light guide plate fixing member 130, a light guide plate biasing member 140, a biasing screw 150, and a mounting screw 160. Hereinafter, the configuration of the illumination device 200 will be described with reference to FIGS. 12 and 13. The LED unit fixing member 120 is made of, for example, aluminum, and is formed, for example, by bending a plate shape into a substantially U-shape. With such an LED unit fixing member 120, the light guide plate 100 and the LED unit 110 are integrally fixed in a state where the LED unit 110 is housed.

  In the lighting device 200, the light guide plate fixing member 130 is a fixing member for fixing the light guide plate 100 to the wall surface, and is made of, for example, aluminum, and is formed by bending the plate shape into an L shape, for example. Similarly, the light guide plate urging member 140 is made of, for example, rubber having a certain stretchability, and is formed of, for example, a plate-shaped portion. Here, in a state where the light guide plate urging members 140 are in contact with both sides of one end of the light guide plate 100, the light guide plate fixing members 130 are brought into contact with the light guide plate urging members 140, respectively. In this state, the light guide plate fixing member 130 and the through hole provided in the light guide plate 100 are bolted through the biasing screw 150. Further, the lighting device 200 is bolted to the wall surface through the mounting screw 160 in the through hole provided in the light guide plate fixing member 130 so that a predetermined irradiation light characteristic can be obtained in the space under the ceiling.

  Here, as the light guide plate 100 provided in the illumination device 200, a light guide plate that is curved at a certain angle in accordance with desired irradiation light characteristics is used. Further, a plurality of light guide plates 100 curved at an arbitrary angle may be freely selected and used by being attached to the lighting device. The light guide plate 100, the LED unit 110, and the LED unit fixing member 120 may be integrated and detachable from the lighting device. In addition, the light guide plate 100 can be bent at an arbitrary angle after being heated to a predetermined temperature by, for example, a household dryer.

  When only the floor surface is illuminated, a reflector 170 made of a metal having a plate shape with high reflectivity with respect to light in the visible light region, for example, is introduced as in the illumination device 210 shown in FIG. It is good also as a structure arrange | positioned using the screw etc. which are not shown in figure so that it may contact | abut on the upper surface of the optical plate 100. FIG. Furthermore, it is good also as a structure which joins and provides the reflection sheet 180 to the end surface on the opposite side to the incident end surface of LED light which concerns on the light-guide plate 100. FIG. The reflective sheet 180 has the same specifications as the reflective tape 61 described above with reference to FIG. With such a configuration, the diffused light emitted from the upper surface of the light guide plate 100 and the diffused light emitted from the end surface opposite to the incident end surface of the light guide plate 100 are respectively transmitted from the reflective plate 170 and the reflective sheet 180. After being reflected and incident on the light guide plate 100, the incident light is emitted from the lower surface of the light guide plate 100. Therefore, compared with the case where both the ceiling surface and the floor surface are illuminated, the amount of irradiation light related to the diffused light reaching the floor surface can be increased.

  As mentioned above, according to the illuminating device which is provided on the wall surface of the indoor facility or the like according to the first embodiment and is used as indirect illumination, the position of the back surface concave pattern trace with respect to the front surface concave pattern trace of the light guide plate 100 is set in the X and Y directions By decentering the optical characteristics, the optical characteristics relating to the difference in brightness of light can be arbitrarily selected. For example, by forming the position of the back surface concave pattern trace with respect to the front surface concave pattern trace with a half-pitch P2 eccentricity in the X and Y directions, it is possible to reduce the difference in light intensity in both the X and Y directions. In particular, in a lighting device provided with a curved light guide plate 100, if the concave pattern trace is not formed only on the surface portion 100A of the light guide plate 100, the difference in brightness of light within the surface of the light guide plate 100 increases. If the concave pattern trace is also formed on the back surface portion 100D of the light guide plate 100, the difference in light brightness in the surface of the light guide plate 100 is reduced.

  Therefore, according to the illuminating device provided with the light guide plate 100, the LED light can be changed from the surface light emission to the three-dimensional light emission in a state in which the difference in light brightness is suppressed, so that the space is expanded. It can be used as indirect lighting or decorative lighting. Furthermore, according to the illuminating device provided with the light guide plate 100, the ceiling is irradiated with the emitted light by arranging the end surface opposite to the LED light incident end surface of the light guide plate 100 so as to bend toward the ceiling. Can be used as indirect lighting. Further, the light emitted from one surface of the light guide plate 100 is emitted upward to illuminate the ceiling surface, or the light emitted from the other surface of the light guide plate 100 is emitted downward to illuminate the floor surface. Can do.

  Moreover, according to the illuminating device which is provided on the wall surface of the indoor facility or the like according to the first embodiment and used as indirect illumination, by pressing the ultrasonic processing portion 20A of the processing tool 20 against one main surface of the processing member 5 A light guide plate 100 obtained by bending a light guide plate 10 or the like in which a plurality of reflective dots reflecting matrix-like processed dots are formed at one time on one main surface of the processing member 5 is used. In the light guide plate 100 that can handle a small amount and a wide variety, flexible dot processing using an ultrasonic multihorn can be supported, and the tact for manufacturing can be greatly shortened.

  In the above-described first embodiment, the light guide plate curved into a predetermined shape has been described as an optical device provided in the lighting device. However, the present invention is not limited to such an embodiment, and the present invention is not limited thereto. The present invention can be changed as appropriate without departing from the gist of the invention. Moreover, LED arrange | positioned in an LED unit is not limited to white LED, For example, it is good also as LED which consists of one color in white, red, blue, and green, or the combination of these LED of each color.

5 Processing member 10 Light guide plate 10A Surface portion 10B Surface portion concave pattern mark 10C Side surface portion 10D Back surface portion 10E Back surface portion concave pattern mark 20 Processing tool 20A Ultrasonic processing section 20B Support section 30 Ultrasonic processing apparatus 31 Machine base 32 Worktable 33 Moving mechanism 34 Vacuum pump 35 Ultrasonic oscillator 40 Light guide plate 40A Surface portion 40B Surface portion concave pattern mark 40C Side surface portion 40D Back surface portion 40E Back surface portion concave pattern mark 50 Light guide plate 50A Surface portion 50B Surface portion concave pattern mark 50C Side surface portion 50D Back surface 50E Back surface concave pattern mark 60 Light guide plate 60A Surface part 60B Surface part concave pattern mark 60C ', 60C''Side surface part 60D Back surface part 60E Back surface part concave pattern mark 61 Reflective tape 100 Light guide plate 100A Surface part 100C Side surface part 100D Back surface Part 110 LED unit 120 LED unit fixing member 130 Light plate fixing member 140 Light guide plate urging member 150 Biasing screw 160 Mounting screw 170 Reflecting plate 180 Reflecting sheet 200 Illuminating device 210 Illuminating device D Probes H1, H2, H3, H4 Processing start reference height P1 Pitch P2 Half pitch L1, L2 , L3, L4 Incident light L5 Reflected light T1, T2, T3, T4, T5 Concave pattern trace

Claims (8)

A light guide plate that is heated and curved to a predetermined curvature after reflection dots reflecting the shape of the processing dots are formed by pressing the matrix processing dots provided on the ultrasonic processing horn,
An LED light source for causing LED light to enter the light guide plate;
A fixing member for fixing the light guide plate to the wall surface;
The illuminating device, wherein the light guide plate is disposed so that an end surface of the LED light emitted from the LED light source is opposite to an incident end surface of the LED light toward the light guide plate. The lighting device according to claim 1, wherein one of the opposing main surfaces of the light guide plate is disposed toward the ceiling surface and the other is directed toward the floor surface. The lighting device according to claim 1, wherein the reflective dots of the light guide plate are formed on one or both of the opposing main surfaces of the light guide plate. The illuminating device according to claim 1, wherein the reflective dots of the light guide plate are formed with different depths on one or both of the opposing main surfaces of the light guide plate. The reflective dots of the light guide plate are respectively formed on both opposing main surfaces of the light guide plate so as to be the same face-to-face or non-face-to-face. Lighting equipment. The at least one direction of the extension direction of the quadrangular pyramid ridgeline of the processed dots of the light guide plate is substantially parallel to the incident direction of light incident from the side surface of the light guide plate substrate. The lighting device described in 1. The lighting device according to claim 1, wherein the processed dots of the light guide plate have a quadrangular pyramid shape. A reflector disposed in contact with one of the opposing main surfaces of the light guide plate;
The lighting device according to claim 1, further comprising: a reflection sheet disposed in contact with an end surface opposite to an end surface of the LED light emitted from the LED light source on the light guide plate.