JP5303326B2 - 接着フィルム、ダイシング−ダイボンディングテープ及び半導体装置の製造方法 - Google Patents

接着フィルム、ダイシング−ダイボンディングテープ及び半導体装置の製造方法 Download PDF

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Publication number
JP5303326B2
JP5303326B2 JP2009068086A JP2009068086A JP5303326B2 JP 5303326 B2 JP5303326 B2 JP 5303326B2 JP 2009068086 A JP2009068086 A JP 2009068086A JP 2009068086 A JP2009068086 A JP 2009068086A JP 5303326 B2 JP5303326 B2 JP 5303326B2
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Japan
Prior art keywords
adhesive film
semiconductor chip
film
dicing
weight
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JP2009068086A
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English (en)
Japanese (ja)
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JP2010028087A (ja
JP2010028087A5 (enrdf_load_stackoverflow
Inventor
篤 中山
英亮 石澤
明伸 早川
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to JP2009068086A priority Critical patent/JP5303326B2/ja
Publication of JP2010028087A publication Critical patent/JP2010028087A/ja
Publication of JP2010028087A5 publication Critical patent/JP2010028087A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
JP2009068086A 2008-06-18 2009-03-19 接着フィルム、ダイシング−ダイボンディングテープ及び半導体装置の製造方法 Active JP5303326B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009068086A JP5303326B2 (ja) 2008-06-18 2009-03-19 接着フィルム、ダイシング−ダイボンディングテープ及び半導体装置の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008158971 2008-06-18
JP2008158971 2008-06-18
JP2009068086A JP5303326B2 (ja) 2008-06-18 2009-03-19 接着フィルム、ダイシング−ダイボンディングテープ及び半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2010028087A JP2010028087A (ja) 2010-02-04
JP2010028087A5 JP2010028087A5 (enrdf_load_stackoverflow) 2012-03-01
JP5303326B2 true JP5303326B2 (ja) 2013-10-02

Family

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Family Applications (1)

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JP2009068086A Active JP5303326B2 (ja) 2008-06-18 2009-03-19 接着フィルム、ダイシング−ダイボンディングテープ及び半導体装置の製造方法

Country Status (1)

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JP (1) JP5303326B2 (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6013709B2 (ja) * 2010-06-08 2016-10-25 日東電工株式会社 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム、及び、半導体装置の製造方法
JP5792592B2 (ja) * 2011-11-02 2015-10-14 積水化学工業株式会社 半導体装置の製造方法、半導体装置、接着フィルム、及び、接着フィルムの貼り合わせ方法
WO2016031554A1 (ja) 2014-08-29 2016-03-03 古河電気工業株式会社 接着フィルム
KR101974257B1 (ko) 2014-08-29 2019-04-30 후루카와 덴키 고교 가부시키가이샤 접착 필름 및 접착 필름을 이용한 반도체 패키지
JP5901715B1 (ja) 2014-09-05 2016-04-13 古河電気工業株式会社 フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージ及びその製造方法
JP2019178304A (ja) * 2018-03-30 2019-10-17 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
US11634614B2 (en) * 2018-07-11 2023-04-25 Resonac Corporation Method for manufacturing semiconductor device, heat-curable resin composition, and dicing-die attach film

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4309710B2 (ja) * 2003-07-11 2009-08-05 住友ベークライト株式会社 半導体用接着フィルム、ダイシングフィルムおよび半導体装置
JP4625342B2 (ja) * 2005-02-03 2011-02-02 積水化学工業株式会社 電子部品装置及び電子部品装置の製造方法
JP4691401B2 (ja) * 2005-06-22 2011-06-01 株式会社巴川製紙所 半導体装置用接着剤組成物および半導体装置用接着シート
JP5046366B2 (ja) * 2005-10-20 2012-10-10 信越化学工業株式会社 接着剤組成物及び該接着剤からなる接着層を備えたシート
JP2007270125A (ja) * 2006-03-08 2007-10-18 Hitachi Chem Co Ltd 接着シート、一体型シート、半導体装置、及び半導体装置の製造方法

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JP2010028087A (ja) 2010-02-04

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