JP5293791B2 - レーザー加工装置およびレーザー加工装置を用いた被加工物の加工方法 - Google Patents
レーザー加工装置およびレーザー加工装置を用いた被加工物の加工方法 Download PDFInfo
- Publication number
- JP5293791B2 JP5293791B2 JP2011210487A JP2011210487A JP5293791B2 JP 5293791 B2 JP5293791 B2 JP 5293791B2 JP 2011210487 A JP2011210487 A JP 2011210487A JP 2011210487 A JP2011210487 A JP 2011210487A JP 5293791 B2 JP5293791 B2 JP 5293791B2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- light
- workpiece
- optical path
- irradiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011210487A JP5293791B2 (ja) | 2011-09-27 | 2011-09-27 | レーザー加工装置およびレーザー加工装置を用いた被加工物の加工方法 |
TW101119010A TWI564103B (zh) | 2011-09-27 | 2012-05-28 | A laser processing apparatus and a processing method of a processed product using a laser processing apparatus |
CN201210247791.9A CN103008888B (zh) | 2011-09-27 | 2012-07-17 | 激光加工装置及使用激光加工装置的被加工物的加工方法 |
KR1020120092698A KR101335039B1 (ko) | 2011-09-27 | 2012-08-24 | 레이저 가공 장치 및 레이저 가공 장치를 사용한 피가공물의 가공 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011210487A JP5293791B2 (ja) | 2011-09-27 | 2011-09-27 | レーザー加工装置およびレーザー加工装置を用いた被加工物の加工方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013053284A Division JP5828852B2 (ja) | 2013-03-15 | 2013-03-15 | レーザー加工装置およびレーザー加工装置を用いた被加工物の加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013071135A JP2013071135A (ja) | 2013-04-22 |
JP5293791B2 true JP5293791B2 (ja) | 2013-09-18 |
Family
ID=47958294
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011210487A Expired - Fee Related JP5293791B2 (ja) | 2011-09-27 | 2011-09-27 | レーザー加工装置およびレーザー加工装置を用いた被加工物の加工方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5293791B2 (zh) |
KR (1) | KR101335039B1 (zh) |
CN (1) | CN103008888B (zh) |
TW (1) | TWI564103B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI502834B (zh) * | 2013-06-13 | 2015-10-01 | Yung Fu Chen | 雙波長雷射裝置及其製造方法 |
CN103331522B (zh) * | 2013-07-01 | 2015-09-16 | 苏州东山精密制造股份有限公司 | 一种导光板图案加工设备 |
KR101902991B1 (ko) * | 2017-02-20 | 2018-10-02 | (주)큐엠씨 | 레이저 스크라이빙 장치 |
JP7034621B2 (ja) * | 2017-07-25 | 2022-03-14 | 浜松ホトニクス株式会社 | レーザ加工装置 |
CN109352189A (zh) * | 2018-11-28 | 2019-02-19 | 无锡奥特维科技股份有限公司 | 激光划片装置及其光路变换机构和光路切换方法 |
KR102148160B1 (ko) * | 2019-03-14 | 2020-08-26 | 경북대학교 산학협력단 | 레이저 측정의 시야확보를 위한 구형재귀반사경 구동시스템 및 이를 이용한 시야확보방법 |
CN110508938A (zh) * | 2019-08-13 | 2019-11-29 | 江苏屹诚激光装备制造有限公司 | 一种高精度激光切割装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4574180A (en) * | 1984-06-19 | 1986-03-04 | Westinghouse Electric Corp. | Beam alignment system for laser welding system |
JP2004114075A (ja) * | 2002-09-25 | 2004-04-15 | Laser Solutions Co Ltd | レーザ加工装置 |
JP2004188487A (ja) * | 2002-12-13 | 2004-07-08 | Hitachi Via Mechanics Ltd | レーザ加工装置およびレーザ加工方法 |
JP2005118814A (ja) * | 2003-10-16 | 2005-05-12 | Hitachi Via Mechanics Ltd | レーザ加工方法およびレーザ加工装置 |
JP4338536B2 (ja) * | 2004-01-23 | 2009-10-07 | 住友重機械工業株式会社 | レーザ加工装置及びレーザ加工方法 |
CN1690857A (zh) * | 2004-04-26 | 2005-11-02 | 中国科学院光电技术研究所 | 采用全息光学元件的激光干涉光刻方法及其光刻系统 |
US20060261051A1 (en) * | 2005-05-19 | 2006-11-23 | Mark Unrath | Synthetic pulse repetition rate processing for dual-headed laser micromachining systems |
JP2008049361A (ja) * | 2006-08-23 | 2008-03-06 | Sumitomo Heavy Ind Ltd | ビーム成形方法及び該方法を用いたレーザ加工装置 |
CN101020277A (zh) * | 2007-03-22 | 2007-08-22 | 苏州德龙激光有限公司 | 分布式激光加工系统 |
JP5657874B2 (ja) * | 2009-09-25 | 2015-01-21 | 株式会社日立情報通信エンジニアリング | レーザ照射装置、レーザ照射方法、アモルファスシリコン膜を改質する方法、シリコン結晶化装置、シリコン結晶化方法 |
CN101882446A (zh) * | 2010-05-25 | 2010-11-10 | 中山大学 | 一种可携式光学体全息图像识别系统 |
CN102029554B (zh) * | 2010-11-22 | 2013-05-08 | 浙江大学 | 基于扫频激光干涉的圆轨迹运动误差快速测量系统 |
-
2011
- 2011-09-27 JP JP2011210487A patent/JP5293791B2/ja not_active Expired - Fee Related
-
2012
- 2012-05-28 TW TW101119010A patent/TWI564103B/zh not_active IP Right Cessation
- 2012-07-17 CN CN201210247791.9A patent/CN103008888B/zh not_active Expired - Fee Related
- 2012-08-24 KR KR1020120092698A patent/KR101335039B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TW201313372A (zh) | 2013-04-01 |
KR101335039B1 (ko) | 2013-11-29 |
KR20130033950A (ko) | 2013-04-04 |
CN103008888A (zh) | 2013-04-03 |
JP2013071135A (ja) | 2013-04-22 |
CN103008888B (zh) | 2016-01-20 |
TWI564103B (zh) | 2017-01-01 |
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