JP5293791B2 - レーザー加工装置およびレーザー加工装置を用いた被加工物の加工方法 - Google Patents

レーザー加工装置およびレーザー加工装置を用いた被加工物の加工方法 Download PDF

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Publication number
JP5293791B2
JP5293791B2 JP2011210487A JP2011210487A JP5293791B2 JP 5293791 B2 JP5293791 B2 JP 5293791B2 JP 2011210487 A JP2011210487 A JP 2011210487A JP 2011210487 A JP2011210487 A JP 2011210487A JP 5293791 B2 JP5293791 B2 JP 5293791B2
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Japan
Prior art keywords
laser
light
workpiece
optical path
irradiation
Prior art date
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Expired - Fee Related
Application number
JP2011210487A
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English (en)
Japanese (ja)
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JP2013071135A (ja
Inventor
規由 栗山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2011210487A priority Critical patent/JP5293791B2/ja
Priority to TW101119010A priority patent/TWI564103B/zh
Priority to CN201210247791.9A priority patent/CN103008888B/zh
Priority to KR1020120092698A priority patent/KR101335039B1/ko
Publication of JP2013071135A publication Critical patent/JP2013071135A/ja
Application granted granted Critical
Publication of JP5293791B2 publication Critical patent/JP5293791B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2011210487A 2011-09-27 2011-09-27 レーザー加工装置およびレーザー加工装置を用いた被加工物の加工方法 Expired - Fee Related JP5293791B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011210487A JP5293791B2 (ja) 2011-09-27 2011-09-27 レーザー加工装置およびレーザー加工装置を用いた被加工物の加工方法
TW101119010A TWI564103B (zh) 2011-09-27 2012-05-28 A laser processing apparatus and a processing method of a processed product using a laser processing apparatus
CN201210247791.9A CN103008888B (zh) 2011-09-27 2012-07-17 激光加工装置及使用激光加工装置的被加工物的加工方法
KR1020120092698A KR101335039B1 (ko) 2011-09-27 2012-08-24 레이저 가공 장치 및 레이저 가공 장치를 사용한 피가공물의 가공 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011210487A JP5293791B2 (ja) 2011-09-27 2011-09-27 レーザー加工装置およびレーザー加工装置を用いた被加工物の加工方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013053284A Division JP5828852B2 (ja) 2013-03-15 2013-03-15 レーザー加工装置およびレーザー加工装置を用いた被加工物の加工方法

Publications (2)

Publication Number Publication Date
JP2013071135A JP2013071135A (ja) 2013-04-22
JP5293791B2 true JP5293791B2 (ja) 2013-09-18

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JP2011210487A Expired - Fee Related JP5293791B2 (ja) 2011-09-27 2011-09-27 レーザー加工装置およびレーザー加工装置を用いた被加工物の加工方法

Country Status (4)

Country Link
JP (1) JP5293791B2 (zh)
KR (1) KR101335039B1 (zh)
CN (1) CN103008888B (zh)
TW (1) TWI564103B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI502834B (zh) * 2013-06-13 2015-10-01 Yung Fu Chen 雙波長雷射裝置及其製造方法
CN103331522B (zh) * 2013-07-01 2015-09-16 苏州东山精密制造股份有限公司 一种导光板图案加工设备
KR101902991B1 (ko) * 2017-02-20 2018-10-02 (주)큐엠씨 레이저 스크라이빙 장치
JP7034621B2 (ja) * 2017-07-25 2022-03-14 浜松ホトニクス株式会社 レーザ加工装置
CN109352189A (zh) * 2018-11-28 2019-02-19 无锡奥特维科技股份有限公司 激光划片装置及其光路变换机构和光路切换方法
KR102148160B1 (ko) * 2019-03-14 2020-08-26 경북대학교 산학협력단 레이저 측정의 시야확보를 위한 구형재귀반사경 구동시스템 및 이를 이용한 시야확보방법
CN110508938A (zh) * 2019-08-13 2019-11-29 江苏屹诚激光装备制造有限公司 一种高精度激光切割装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4574180A (en) * 1984-06-19 1986-03-04 Westinghouse Electric Corp. Beam alignment system for laser welding system
JP2004114075A (ja) * 2002-09-25 2004-04-15 Laser Solutions Co Ltd レーザ加工装置
JP2004188487A (ja) * 2002-12-13 2004-07-08 Hitachi Via Mechanics Ltd レーザ加工装置およびレーザ加工方法
JP2005118814A (ja) * 2003-10-16 2005-05-12 Hitachi Via Mechanics Ltd レーザ加工方法およびレーザ加工装置
JP4338536B2 (ja) * 2004-01-23 2009-10-07 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
CN1690857A (zh) * 2004-04-26 2005-11-02 中国科学院光电技术研究所 采用全息光学元件的激光干涉光刻方法及其光刻系统
US20060261051A1 (en) * 2005-05-19 2006-11-23 Mark Unrath Synthetic pulse repetition rate processing for dual-headed laser micromachining systems
JP2008049361A (ja) * 2006-08-23 2008-03-06 Sumitomo Heavy Ind Ltd ビーム成形方法及び該方法を用いたレーザ加工装置
CN101020277A (zh) * 2007-03-22 2007-08-22 苏州德龙激光有限公司 分布式激光加工系统
JP5657874B2 (ja) * 2009-09-25 2015-01-21 株式会社日立情報通信エンジニアリング レーザ照射装置、レーザ照射方法、アモルファスシリコン膜を改質する方法、シリコン結晶化装置、シリコン結晶化方法
CN101882446A (zh) * 2010-05-25 2010-11-10 中山大学 一种可携式光学体全息图像识别系统
CN102029554B (zh) * 2010-11-22 2013-05-08 浙江大学 基于扫频激光干涉的圆轨迹运动误差快速测量系统

Also Published As

Publication number Publication date
TW201313372A (zh) 2013-04-01
TWI564103B (zh) 2017-01-01
KR101335039B1 (ko) 2013-11-29
CN103008888A (zh) 2013-04-03
CN103008888B (zh) 2016-01-20
KR20130033950A (ko) 2013-04-04
JP2013071135A (ja) 2013-04-22

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