JP5292974B2 - ウェーハの洗浄装置及びその方法 - Google Patents

ウェーハの洗浄装置及びその方法 Download PDF

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JP5292974B2
JP5292974B2 JP2008197412A JP2008197412A JP5292974B2 JP 5292974 B2 JP5292974 B2 JP 5292974B2 JP 2008197412 A JP2008197412 A JP 2008197412A JP 2008197412 A JP2008197412 A JP 2008197412A JP 5292974 B2 JP5292974 B2 JP 5292974B2
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wafer
base
pure water
cleaning
horizontally
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Japanese (ja)
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JP2010034441A5 (https=
JP2010034441A (ja
Inventor
憲治 沖田
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Sumco Corp
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Sumco Corp
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  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2008197412A 2008-07-31 2008-07-31 ウェーハの洗浄装置及びその方法 Active JP5292974B2 (ja)

Priority Applications (1)

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JP2008197412A JP5292974B2 (ja) 2008-07-31 2008-07-31 ウェーハの洗浄装置及びその方法

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Application Number Priority Date Filing Date Title
JP2008197412A JP5292974B2 (ja) 2008-07-31 2008-07-31 ウェーハの洗浄装置及びその方法

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JP2010034441A JP2010034441A (ja) 2010-02-12
JP2010034441A5 JP2010034441A5 (https=) 2011-09-15
JP5292974B2 true JP5292974B2 (ja) 2013-09-18

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5818751B2 (ja) * 2012-07-18 2015-11-18 三菱電機株式会社 太陽電池製造装置およびこれを用いた太陽電池の製造方法
KR101399836B1 (ko) * 2012-12-24 2014-06-27 주식회사 케이씨텍 화학 기계적 연마 공정이 행해진 웨이퍼의 웨팅 장치 및 방법
CN104319252A (zh) * 2014-11-03 2015-01-28 苏州同冠微电子有限公司 单片硅片清洗机台
CN117066242B (zh) * 2023-10-13 2024-02-02 济南晶博电子有限公司 一种硅片清洗装置及其使用方法
CN118417229A (zh) * 2024-05-31 2024-08-02 西安奕斯伟材料科技股份有限公司 硅片清洗方法及设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10223593A (ja) * 1997-02-07 1998-08-21 Sumiere S Ii Z Kk 枚葉式ウェハ洗浄装置
JPH11265846A (ja) * 1998-03-17 1999-09-28 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2003017452A (ja) * 2001-07-02 2003-01-17 Ebara Corp 基板処理方法及び基板処理装置

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JP2010034441A (ja) 2010-02-12

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