JP5288018B2 - 硬化性樹脂組成物、及び、硬化物 - Google Patents

硬化性樹脂組成物、及び、硬化物 Download PDF

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Publication number
JP5288018B2
JP5288018B2 JP2012073522A JP2012073522A JP5288018B2 JP 5288018 B2 JP5288018 B2 JP 5288018B2 JP 2012073522 A JP2012073522 A JP 2012073522A JP 2012073522 A JP2012073522 A JP 2012073522A JP 5288018 B2 JP5288018 B2 JP 5288018B2
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group
fluorine
carbon atoms
bond
structural unit
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Japanese (ja)
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JP2012214753A (ja
Inventor
恒雄 山下
義人 田中
知弘 吉田
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Daikin Industries Ltd
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Daikin Industries Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C09J133/16—Homopolymers or copolymers of esters containing halogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/14—Homopolymers or copolymers of vinyl fluoride
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Light Receiving Elements (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2012073522A 2011-03-30 2012-03-28 硬化性樹脂組成物、及び、硬化物 Active JP5288018B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012073522A JP5288018B2 (ja) 2011-03-30 2012-03-28 硬化性樹脂組成物、及び、硬化物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011076471 2011-03-30
JP2011076471 2011-03-30
JP2012073522A JP5288018B2 (ja) 2011-03-30 2012-03-28 硬化性樹脂組成物、及び、硬化物

Publications (2)

Publication Number Publication Date
JP2012214753A JP2012214753A (ja) 2012-11-08
JP5288018B2 true JP5288018B2 (ja) 2013-09-11

Family

ID=46931256

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JP2012073522A Active JP5288018B2 (ja) 2011-03-30 2012-03-28 硬化性樹脂組成物、及び、硬化物

Country Status (3)

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JP (1) JP5288018B2 (fr)
TW (1) TW201307466A (fr)
WO (1) WO2012133548A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104201115A (zh) * 2014-09-12 2014-12-10 苏州晶方半导体科技股份有限公司 晶圆级指纹识别芯片封装结构及封装方法
KR101908186B1 (ko) * 2016-06-15 2018-10-15 삼성에스디아이 주식회사 윈도우 필름용 조성물, 이로부터 형성된 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치
KR101924174B1 (ko) * 2018-04-04 2019-02-22 (주)유티아이 근적외선 필터 및 그 필터의 제조방법
EP4089447A4 (fr) * 2020-01-08 2024-01-24 Daikin Ind Ltd Film protecteur pour afficheur

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3765839B2 (ja) * 1994-07-28 2006-04-12 大日本インキ化学工業株式会社 樹脂組成物
JP2008274306A (ja) * 1998-05-26 2008-11-13 Jsr Corp 組成物
JP3666575B2 (ja) * 2000-06-29 2005-06-29 信越化学工業株式会社 硬化性フルオロポリエーテルゴム組成物
ATE323726T1 (de) * 2000-08-29 2006-05-15 Daikin Ind Ltd Härtbares fluoropolymer, härtbare harzzusammensetzungen diese enthaltend und antireflexionsfilm
CN100338108C (zh) * 2002-03-14 2007-09-19 大金工业株式会社 含氟共聚物、含氟共聚物制造方法、含氟共聚物固化用组合物和固化物
US9127114B2 (en) * 2006-10-12 2015-09-08 Daikin Industries, Ltd. Curable fluorine-containing polymer composition
JP5448388B2 (ja) * 2008-08-19 2014-03-19 株式会社カネカ 上塗り塗料用硬化性樹脂組成物
JP5282635B2 (ja) * 2009-04-10 2013-09-04 信越化学工業株式会社 含フッ素硬化性組成物及びその製造方法

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TW201307466A (zh) 2013-02-16
JP2012214753A (ja) 2012-11-08
WO2012133548A1 (fr) 2012-10-04

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