JP5277843B2 - パッケージ本体及び電子デバイス - Google Patents

パッケージ本体及び電子デバイス Download PDF

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Publication number
JP5277843B2
JP5277843B2 JP2008252605A JP2008252605A JP5277843B2 JP 5277843 B2 JP5277843 B2 JP 5277843B2 JP 2008252605 A JP2008252605 A JP 2008252605A JP 2008252605 A JP2008252605 A JP 2008252605A JP 5277843 B2 JP5277843 B2 JP 5277843B2
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Japan
Prior art keywords
package
package body
solder
mounting
electronic component
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JP2008252605A
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Japanese (ja)
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JP2009188375A (ja
JP2009188375A5 (enrdf_load_html_response
Inventor
洋二 永野
英雄 棚谷
達也 安齊
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Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2008252605A priority Critical patent/JP5277843B2/ja
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  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2008252605A 2008-01-07 2008-09-30 パッケージ本体及び電子デバイス Expired - Fee Related JP5277843B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008252605A JP5277843B2 (ja) 2008-01-07 2008-09-30 パッケージ本体及び電子デバイス

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008000368 2008-01-07
JP2008000368 2008-01-07
JP2008252605A JP5277843B2 (ja) 2008-01-07 2008-09-30 パッケージ本体及び電子デバイス

Related Child Applications (1)

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JP2012276590A Division JP2013062876A (ja) 2008-01-07 2012-12-19 パッケージ本体及び電子デバイス

Publications (3)

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JP2009188375A JP2009188375A (ja) 2009-08-20
JP2009188375A5 JP2009188375A5 (enrdf_load_html_response) 2011-11-17
JP5277843B2 true JP5277843B2 (ja) 2013-08-28

Family

ID=41071284

Family Applications (2)

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JP2008252605A Expired - Fee Related JP5277843B2 (ja) 2008-01-07 2008-09-30 パッケージ本体及び電子デバイス
JP2012276590A Withdrawn JP2013062876A (ja) 2008-01-07 2012-12-19 パッケージ本体及び電子デバイス

Family Applications After (1)

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JP2012276590A Withdrawn JP2013062876A (ja) 2008-01-07 2012-12-19 パッケージ本体及び電子デバイス

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JP (2) JP5277843B2 (enrdf_load_html_response)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5277843B2 (ja) * 2008-01-07 2013-08-28 セイコーエプソン株式会社 パッケージ本体及び電子デバイス
JP5819287B2 (ja) * 2010-04-01 2015-11-24 株式会社大真空 表面実装型の電子部品用パッケージのベース、および表面実装型の電子部品用パッケージ
JP6133854B2 (ja) * 2012-05-30 2017-05-24 京セラ株式会社 配線基板および電子装置
JP6747101B2 (ja) * 2016-06-29 2020-08-26 日本電気硝子株式会社 気密パッケージ及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3685683B2 (ja) * 2000-04-19 2005-08-24 日本電波工業株式会社 表面実装用の水晶発振器
JP3864417B2 (ja) * 2003-09-29 2006-12-27 株式会社大真空 電子部品用パッケージ
JP2009141455A (ja) * 2007-12-04 2009-06-25 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶デバイス
JP5277843B2 (ja) * 2008-01-07 2013-08-28 セイコーエプソン株式会社 パッケージ本体及び電子デバイス

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Publication number Publication date
JP2009188375A (ja) 2009-08-20
JP2013062876A (ja) 2013-04-04

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