JP5272196B2 - 切断装置 - Google Patents
切断装置 Download PDFInfo
- Publication number
- JP5272196B2 JP5272196B2 JP2008213858A JP2008213858A JP5272196B2 JP 5272196 B2 JP5272196 B2 JP 5272196B2 JP 2008213858 A JP2008213858 A JP 2008213858A JP 2008213858 A JP2008213858 A JP 2008213858A JP 5272196 B2 JP5272196 B2 JP 5272196B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric element
- cutting
- cutting blade
- cutter
- vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005520 cutting process Methods 0.000 title claims description 107
- 230000010355 oscillation Effects 0.000 claims 1
- 238000003825 pressing Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nonmetal Cutting Devices (AREA)
- Cutting Tools, Boring Holders, And Turrets (AREA)
Description
10:フレーム部,11:カッター保持部,12:共振作用部,
11C:当接面,
2:圧電素子,2A:自由駆動面,
3:切断刃,
A:切断装置
Claims (3)
- 昇降動するカッターホルダに平刃状の切断刃を取り付けた切断装置において、
前記カッターホルダは、
前記切断刃の切断方向に沿って振動する圧電素子が設置されたフレーム部と、
前記切断刃を保持すると共に前記圧電素子の下端が当接する当接面を有し、前記圧電素子の側方に位置する共振作用部を介して前記フレーム部の下方に結合されたカッター保持部とを備え、
前記カッター保持部と前記共振作用部とからなる振動系が共振状態になるように前記圧電素子を振動させ、
前記共振作用部は、高剛性バネ構造を有し、
前記高剛性バネ構造は、前記フレーム部側が基端となり片持ち状に水平に伸びる水平バネ部分と該水平バネ部分から垂直に屈曲して端部が前記カッター保持部に結合される垂直バネ部分とからなることを特徴とする切断装置。 - 前記圧電素子一つに対して、その両側に前記共振作用部を配備したことを特徴とする請求項1記載の切断装置。
- 前記圧電素子は、前記カッター保持部と前記共振作用部とからなる振動系が共振するように、振動周波数が制御可能であること特徴とする請求項1又は2に記載の切断装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008213858A JP5272196B2 (ja) | 2008-08-22 | 2008-08-22 | 切断装置 |
KR1020090076670A KR101598860B1 (ko) | 2008-08-22 | 2009-08-19 | 절단 장치 |
TW098128182A TWI476086B (zh) | 2008-08-22 | 2009-08-21 | 切斷裝置 |
CN2009101673972A CN101653845B (zh) | 2008-08-22 | 2009-08-21 | 切断装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008213858A JP5272196B2 (ja) | 2008-08-22 | 2008-08-22 | 切断装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010046768A JP2010046768A (ja) | 2010-03-04 |
JP5272196B2 true JP5272196B2 (ja) | 2013-08-28 |
Family
ID=41708412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008213858A Active JP5272196B2 (ja) | 2008-08-22 | 2008-08-22 | 切断装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5272196B2 (ja) |
KR (1) | KR101598860B1 (ja) |
CN (1) | CN101653845B (ja) |
TW (1) | TWI476086B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7509496B2 (ja) | 2021-03-31 | 2024-07-02 | 積水ホームテクノ株式会社 | 浴槽可動式浴室 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011179468A (ja) | 2010-03-03 | 2011-09-15 | Dow Corning Toray Co Ltd | 高粘性流体用ディスペンサー |
CN107322650A (zh) * | 2017-07-04 | 2017-11-07 | 张万超 | 一种移动式复合材料分切机 |
CN107520905A (zh) * | 2017-10-11 | 2017-12-29 | 中国科学院生物物理研究所 | 一种超声振动超薄切片刀座 |
KR102068300B1 (ko) * | 2018-07-06 | 2020-01-20 | 삼일테크(주) | Mlcc 패널용 포장필름 커팅 장치 |
CN111227016B (zh) * | 2020-03-19 | 2024-07-30 | 北京黑六牧业科技有限公司 | 一种猪肉冻切分用的加工台 |
KR20220052740A (ko) | 2020-10-21 | 2022-04-28 | (주) 피토 | 블레이드 교환 기능을 갖는 전자부품 절단 장치 |
CN113075488B (zh) * | 2021-04-01 | 2022-03-08 | 巢湖学院 | 一种压电陶瓷检测系统 |
CN113695930A (zh) * | 2021-10-09 | 2021-11-26 | 漳州海力机械制造有限公司 | 一种阀门切割加工装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01122408A (ja) * | 1987-11-06 | 1989-05-15 | Ngk Insulators Ltd | セラミック・グリーンシートの切断加工方法 |
JPH068195A (ja) * | 1992-06-24 | 1994-01-18 | Nec Corp | 切断装置 |
JPH10175205A (ja) * | 1996-12-18 | 1998-06-30 | Murata Mfg Co Ltd | セラミック成形体の切断方法及びそれに用いる切断装置 |
DE19851353C1 (de) * | 1998-11-06 | 1999-10-07 | Schott Glas | Verfahren und Vorrichtung zum Schneiden eines Laminats aus einem sprödbrüchigen Werkstoff und einem Kunststoff |
JP4362797B2 (ja) * | 1999-10-20 | 2009-11-11 | Uht株式会社 | 切断加工装置 |
JP4753650B2 (ja) * | 2005-07-28 | 2011-08-24 | Uht株式会社 | 切断装置および切断装置用カッターホルダ |
JP2007083332A (ja) * | 2005-09-21 | 2007-04-05 | Next I&D株式会社 | 切断装置および切断装置用カッターホルダ |
TWI294338B (en) * | 2006-07-10 | 2008-03-11 | Kuan Chieh Su | Cutting and sawing apparatus |
-
2008
- 2008-08-22 JP JP2008213858A patent/JP5272196B2/ja active Active
-
2009
- 2009-08-19 KR KR1020090076670A patent/KR101598860B1/ko active IP Right Grant
- 2009-08-21 CN CN2009101673972A patent/CN101653845B/zh active Active
- 2009-08-21 TW TW098128182A patent/TWI476086B/zh active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7509496B2 (ja) | 2021-03-31 | 2024-07-02 | 積水ホームテクノ株式会社 | 浴槽可動式浴室 |
Also Published As
Publication number | Publication date |
---|---|
KR101598860B1 (ko) | 2016-03-02 |
TW201008734A (en) | 2010-03-01 |
KR20100023751A (ko) | 2010-03-04 |
CN101653845A (zh) | 2010-02-24 |
TWI476086B (zh) | 2015-03-11 |
CN101653845B (zh) | 2013-06-05 |
JP2010046768A (ja) | 2010-03-04 |
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