JP5270996B2 - シリコン単結晶引上装置 - Google Patents
シリコン単結晶引上装置 Download PDFInfo
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- JP5270996B2 JP5270996B2 JP2008195999A JP2008195999A JP5270996B2 JP 5270996 B2 JP5270996 B2 JP 5270996B2 JP 2008195999 A JP2008195999 A JP 2008195999A JP 2008195999 A JP2008195999 A JP 2008195999A JP 5270996 B2 JP5270996 B2 JP 5270996B2
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- 239000013078 crystal Substances 0.000 title claims abstract description 73
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 56
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 56
- 239000010703 silicon Substances 0.000 title claims abstract description 56
- 239000002019 doping agent Substances 0.000 claims abstract description 71
- 239000000155 melt Substances 0.000 claims abstract description 58
- 230000003028 elevating effect Effects 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 238000005304 joining Methods 0.000 claims description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052785 arsenic Inorganic materials 0.000 claims description 4
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 26
- 230000007246 mechanism Effects 0.000 description 25
- 239000007789 gas Substances 0.000 description 18
- 229910052786 argon Inorganic materials 0.000 description 13
- 239000000463 material Substances 0.000 description 10
- 239000012159 carrier gas Substances 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 238000010926 purge Methods 0.000 description 5
- 239000010453 quartz Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000002994 raw material Substances 0.000 description 4
- 238000000859 sublimation Methods 0.000 description 4
- 230000008022 sublimation Effects 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000007770 graphite material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/02—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt
- C30B15/04—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt adding doping materials, e.g. for n-p-junction
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1004—Apparatus with means for measuring, testing, or sensing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
- Y10T117/1056—Seed pulling including details of precursor replenishment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
- Y10T117/1068—Seed pulling including heating or cooling details [e.g., shield configuration]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
- Y10T117/1072—Seed pulling including details of means providing product movement [e.g., shaft guides, servo means]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1076—Apparatus for crystallization from liquid or supercritical state having means for producing a moving solid-liquid-solid zone
- Y10T117/1088—Apparatus for crystallization from liquid or supercritical state having means for producing a moving solid-liquid-solid zone including heating or cooling details
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Description
以下、本発明のシリコン単結晶引上装置1の実施形態について具体的に説明する。図1は、本実施形態のシリコン単結晶引上装置1を説明する概略図である。図2は、本実施形態に係る試料室20と、遮蔽手段24と、試料管としてのドープ管21と、昇降手段25と、供給管22との位置関係を示す断面の概略図である。図1及び図2に示すように、本実施形態のシリコン単結晶引上装置1は、CZ法による結晶成長に用いることのできる引上炉(チャンバ)2を備えている。
試料室20は、成長させるシリコン単結晶6に、ドープさせる昇華性ドーパント(不純物)23を収容するものである。試料室20は、引上炉2のフランジ部に、後述する遮蔽手段24を介して外付けされるものである。ここで、試料室20に収容する昇華性ドーパント23としては、シリコン単結晶6にN型の電気的特性を与えるためのN型用のドーパントである、砒素As、赤燐P、又はアンチモンSbが挙げられる。特に、砒素As及び赤燐Pは、昇華可能な昇華性ドーパントであるため、これらを昇華性ドーパント23として用いることにより、比較的低い温度で固相から気相に気化させることができる。
遮蔽手段24は、引上炉2と試料室20とを熱的に遮断するものであり、引上炉2と試料室20の間に設けられるものである。遮蔽手段24を設けることで、引上炉2内の輻射熱及び雰囲気が遮蔽手段24で熱的に遮断されるため、所望のタイミングで所望量の昇華性ドーパント23を気化することができ、例えば結晶成長中に遮蔽手段24を開放して試料室20から昇華性ドーパント23を投入することも可能になる。
なお、ドープ開始のタイミングは上記のタイミングに制限されるものではない。例えば、単結晶を引き上げる前に、すなわち、石英坩堝31内の多結晶素材が溶解した後から種結晶が融液に着液するまでの間に、ドープを開始してもよい。
昇降手段25は、ドープ管21を、後述する供給管22に接続するように昇降させるものである。昇降手段25は、ドープ管21が摺動可能なガイドレール25b(第1ガイドレール25c及び第2ガイドレール25d)及びガイドレール25bに沿ってドープ管21を昇降させるワイヤ機構25aを備える。
図3に示すように、ドープ管21は、管状の本体214と、ドープ管21の長手方向の一方の端部に、該長手方向に沿って突出する凸部211とを備える。ドープ管21の長手方向の一方の端部とは、ドープ管21をガイドレール25bに配置したときに、ドープ管21の引上炉2の内部側に位置する側の端部(以下、下端部という)である。凸部211は、ドープ管21の本体214の端面215の略中央部から突出し、略球状の形状を有する。「略球状の形状」とは、完全な球状ではないが、大部分が球状の曲面を備えていることを意味する。
図4(a)に示すように、供給管22は、昇降手段25により降下したドープ管21と接続し、融液5等からの輻射熱が与えられることによって気化した昇華性ドーパント23を融液5に導くものである。供給管22は、ドープ管21から排出される昇華性ドーパント23を引上炉2の内部に供給する。
図1に示すように、引上炉2には、上方から下方に向かって、パージチューブ14が設けられる。パージチューブ14は、引上炉2の上方から下向きに延び、供給管22の接合部から、供給管22に沿ってさらに融液5の上面まで延びる。パージチューブ14は、ドープ管21がガイドレール25bに沿って昇降する際、ガイドレール25bから擦れて生じる粉体としてのカーボン粉を融液5に混入させない。
2 引上炉
5 融液
14 パージチューブ
20 試料室
21 試料管(ドープ管)
211 凸部
22 供給管
221 凹部
222 接合部
23 昇華性ドーパント
24 遮蔽手段
25 昇降手段
25a ワイヤ機構
25b ガイドレール
25c 第1ガイドレール
25d 第2ガイドレール
251 駆動装置
252 ドラム部材(巻き取りドラム)
253 溝
254a、254b テーパー
26 ワイヤ
Claims (6)
- ドープされたシリコン単結晶をチョクラルスキー法により融液から引き上げるシリコン単結晶引上装置であって、
引上炉と、
前記引上炉に外付けされ昇華性ドーパントを収容する試料室と、
前記試料室の内部と前記引上炉の内部との間を昇降可能な試料管と、
前記試料管を昇降させる昇降手段と、
前記引上炉の内部に設けられ、前記試料管から排出される前記昇華性ドーパントを前記融液に供給する供給管と、
前記試料管と前記供給管とを接合する接合手段と、を含み、
前記接合手段は、前記試料管の一端に設けられる凸部又は凹部のいずれか一方と、前記供給管の一端に設けられる凸部又は凹部のいずれか他方と、からなり、前記凸部と前記凹部との接触面が曲面となるように形成され、前記凸部が前記凹部に嵌合して接合されるボールジョイント構造により構成され、
前記試料管と前記供給管との間には、流路が形成されることを特徴とするシリコン単結晶引上装置。 - 前記接合手段は、前記試料管の一端から突出する凸部と、前記供給管の一端に設けられ前記凸部が嵌合可能に形成された凹部と、からなる請求項1に記載のシリコン単結晶引上装置。
- 前記接合手段は、前記試料管の一端に設けられる凹部と、前記供給管の一端に設けられ前記凹部が嵌合可能に形成された凸部と、からなる請求項1に記載のシリコン単結晶引上装置。
- 前記凸部の外面は略球状を有し、前記凹部の内面は、前記凸部の外面に対応する湾曲形状を有する請求項1から3のいずれかに記載のシリコン単結晶引上装置。
- 前記昇降手段は、前記試料管が摺動可能なガイドレールを備え、
前記試料管は、前記ガイドレールに案内されて前記凸部を前記凹部に嵌合する請求項1から4のいずれかに記載のシリコン単結晶引上装置。 - 前記昇華性ドーパントは砒素又は赤燐である請求項1から5のいずれかに記載のシリコン単結晶引上装置。
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JP2008195999A JP5270996B2 (ja) | 2008-07-30 | 2008-07-30 | シリコン単結晶引上装置 |
PCT/JP2009/063440 WO2010013719A1 (ja) | 2008-07-30 | 2009-07-28 | シリコン単結晶引上装置 |
US13/056,017 US8920561B2 (en) | 2008-07-30 | 2009-07-28 | Silicon single crystal pull-up apparatus that pulls a doped silicon single crystal from a melt |
EP09802962A EP2330234B1 (en) | 2008-07-30 | 2009-07-28 | Silicon single crystal pull-up apparatus |
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JP2008195999A JP5270996B2 (ja) | 2008-07-30 | 2008-07-30 | シリコン単結晶引上装置 |
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JP2010030853A JP2010030853A (ja) | 2010-02-12 |
JP2010030853A5 JP2010030853A5 (ja) | 2011-09-15 |
JP5270996B2 true JP5270996B2 (ja) | 2013-08-21 |
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EP (1) | EP2330234B1 (ja) |
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WO (1) | WO2010013719A1 (ja) |
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JP5329143B2 (ja) * | 2008-07-30 | 2013-10-30 | Sumco Techxiv株式会社 | シリコン単結晶引上装置 |
US10202704B2 (en) | 2011-04-20 | 2019-02-12 | Gtat Ip Holding Llc | Side feed system for Czochralski growth of silicon ingots |
EP2699716B1 (en) * | 2011-04-20 | 2019-12-18 | GTAT IP Holding LLC | Side feed system for czochralski growth of silicon ingots |
KR101390798B1 (ko) | 2012-01-06 | 2014-05-02 | 주식회사 엘지실트론 | 융액에 도펀트를 투입하기 위한 장치 |
WO2014175120A1 (ja) * | 2013-04-24 | 2014-10-30 | Sumco Techxiv株式会社 | 単結晶の製造方法およびシリコンウェーハの製造方法 |
JP6631460B2 (ja) | 2016-10-03 | 2020-01-15 | 株式会社Sumco | シリコン単結晶の製造方法およびシリコン単結晶 |
JP6702141B2 (ja) * | 2016-11-01 | 2020-05-27 | 信越半導体株式会社 | 単結晶引上げ装置 |
US11585010B2 (en) * | 2019-06-28 | 2023-02-21 | Globalwafers Co., Ltd. | Methods for producing a single crystal silicon ingot using boric acid as a dopant and ingot puller apparatus that use a solid-phase dopant |
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JPS606920B2 (ja) * | 1982-11-12 | 1985-02-21 | 工業技術院長 | ガリウム砒素単結晶製造装置 |
JPS59190292A (ja) | 1983-04-08 | 1984-10-29 | Shin Etsu Handotai Co Ltd | 半導体シリコン単結晶の抵抗率制御方法 |
JPS61227986A (ja) * | 1985-03-30 | 1986-10-11 | Shin Etsu Handotai Co Ltd | 単結晶シリコン棒の製造方法 |
DE4106589C2 (de) | 1991-03-01 | 1997-04-24 | Wacker Siltronic Halbleitermat | Kontinuierliches Nachchargierverfahren mit flüssigem Silicium beim Tiegelziehen nach Czochralski |
JPH09227275A (ja) * | 1996-02-28 | 1997-09-02 | Sumitomo Sitix Corp | ドープ剤添加装置 |
WO2001086033A1 (en) | 2000-05-10 | 2001-11-15 | Memc Electronic Materials, Inc. | Method and device for feeding arsenic dopant into a silicon crystal growing process |
US6312517B1 (en) | 2000-05-11 | 2001-11-06 | Memc Electronic Materials, Inc. | Multi-stage arsenic doping process to achieve low resistivity in silicon crystal grown by czochralski method |
JP2005247671A (ja) | 2004-03-08 | 2005-09-15 | Toshiba Ceramics Co Ltd | 単結晶引上装置 |
JP4356517B2 (ja) * | 2004-05-28 | 2009-11-04 | 株式会社Sumco | シリコン単結晶引上装置およびシリコン単結晶の製造方法 |
JP5329143B2 (ja) * | 2008-07-30 | 2013-10-30 | Sumco Techxiv株式会社 | シリコン単結晶引上装置 |
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