JP5269995B2 - 装置の冷却 - Google Patents
装置の冷却 Download PDFInfo
- Publication number
- JP5269995B2 JP5269995B2 JP2011522553A JP2011522553A JP5269995B2 JP 5269995 B2 JP5269995 B2 JP 5269995B2 JP 2011522553 A JP2011522553 A JP 2011522553A JP 2011522553 A JP2011522553 A JP 2011522553A JP 5269995 B2 JP5269995 B2 JP 5269995B2
- Authority
- JP
- Japan
- Prior art keywords
- box
- panel
- refrigerant
- cold
- structures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
- F28D20/023—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat the latent heat storage material being enclosed in granular particles or dispersed in a porous, fibrous or cellular structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20245—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by natural convection; Thermosiphons
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2270/00—Thermal insulation; Thermal decoupling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Description
Claims (12)
- 各々が熱伝導性材料から成る連続気泡発泡体によって少なくとも部分的に形成されている複数の構造体を有しているボックスを具備している複数の離間した電子装置を冷却するための、冷却器であって、前記ボックスは、底に設けられた中空のプレナムチャンバを有し、このプレナムチャンバは、前記複数の構造体が装着された取付け面を有し、この取付け面には、複数の孔が形成され、これら孔を通って冷媒がプレナムチャンバ内から前記複数の構造体の前記連続気泡発泡体中へと流れて、ボックス内の複数の電子装置から前記連続発泡体に伝えられた熱を取り除く、冷却器。
- 前記複数の構造体の各々は、前記冷媒の通路のためのダクトを形成するように配置された、前記連続気泡発泡体から成るパネルを有する、請求項1に記載の冷却器。
- 前記パネルは、前記ボックスの構成部材である、請求項2に記載の冷却器。
- 前記パネルは、前記ボックスの壁の少なくとも一部を形成している、請求項3に記載の冷却器。
- 前記ボックスは、前記連続気泡発泡体から成る別のパネルを更に有しており、このパネルは、このボックスの壁から分離されており、前記ボックス中で電子装置を冷却する、請求項3に記載の冷却器。
- 前記ボックスは、排出筒を更に有し、この排出筒は、装置から熱を取り除くために、冷媒のための補完的な通路を形成するように、このボックスの壁から分離されており且つ連続気泡発泡体によって形成されている、請求項3乃至5のいずれか1に記載の冷却器。
- 前記パネルには、前記冷媒を、前記パネルを通して推進させるための推進手段が設けられている、請求項2に記載の冷却器。
- 前記複数の構造体の少なくとも1つは、冷却される装置の形状に対応するように形成されている、請求項1ないし7のいずれか1に記載の冷却器。
- 前記複数の構造体の少なくとも1つは、前記冷却される装置を少なくとも部分的に囲むように形成されている、請求項8に記載の冷却器。
- 前記複数の構造体の少なくとも1つは、前記連続気泡発泡体によって形成されており蓄熱体を形成するための潜熱蓄積材料を含んでいる囲まれたセクションを更に有しており、この蓄熱体は、前記構造体の、前記冷媒を通すように設定されている部分に、熱的にリンクされている、請求項1乃至9のいずれか1に記載の冷却器。
- 前記冷媒は、1種の気体、もしくは複数種の気体の混合物から成る、請求項1乃至10のいずれか1に記載の冷却器。
- 前記冷媒は、液体から成る、請求項1乃至10のいずれか1に記載の冷却器。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08275044A EP2154466A1 (en) | 2008-08-13 | 2008-08-13 | Equipment cooling |
GB0814776A GB0814776D0 (en) | 2008-08-13 | 2008-08-13 | Equipment cooling |
EP08275044.9 | 2008-08-13 | ||
GB0814776.1 | 2008-08-13 | ||
PCT/GB2009/050996 WO2010018398A2 (en) | 2008-08-13 | 2009-08-10 | Equipment cooling |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011530827A JP2011530827A (ja) | 2011-12-22 |
JP5269995B2 true JP5269995B2 (ja) | 2013-08-21 |
Family
ID=41569052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011522553A Expired - Fee Related JP5269995B2 (ja) | 2008-08-13 | 2009-08-10 | 装置の冷却 |
Country Status (10)
Country | Link |
---|---|
US (1) | US20110132016A1 (ja) |
EP (1) | EP2326902A2 (ja) |
JP (1) | JP5269995B2 (ja) |
KR (1) | KR20110055611A (ja) |
AU (1) | AU2009280952A1 (ja) |
BR (1) | BRPI0917974A2 (ja) |
CA (1) | CA2733413A1 (ja) |
IL (1) | IL211125A0 (ja) |
WO (1) | WO2010018398A2 (ja) |
ZA (1) | ZA201101002B (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITMI20112045A1 (it) * | 2011-11-11 | 2013-05-12 | Celant Tel S R L | Dispositivo per il condizionamento passivo di ambienti, in particolare shelter per telecomunicazioni |
US9916545B1 (en) | 2012-02-29 | 2018-03-13 | Amazon Technologies, Inc. | Portable network interfaces for authentication and license enforcement |
JP6092670B2 (ja) * | 2013-03-15 | 2017-03-08 | 株式会社Uacj | 熱交換器 |
US9787499B2 (en) | 2014-09-19 | 2017-10-10 | Amazon Technologies, Inc. | Private alias endpoints for isolated virtual networks |
US10182513B2 (en) * | 2015-01-16 | 2019-01-15 | Hamilton Sundstrand Space Systems International, Inc. | Phase change material heat sinks |
US9693487B2 (en) | 2015-02-06 | 2017-06-27 | Caterpillar Inc. | Heat management and removal assemblies for semiconductor devices |
US10021196B1 (en) | 2015-06-22 | 2018-07-10 | Amazon Technologies, Inc. | Private service endpoints in isolated virtual networks |
US11530877B2 (en) * | 2016-08-01 | 2022-12-20 | Lockheed Martin Corporation | Heat exchange using phase change material |
CN110608580A (zh) * | 2019-09-19 | 2019-12-24 | 深圳市翔通光电技术有限公司 | 一种降温装置 |
FR3105708A1 (fr) * | 2019-12-20 | 2021-06-25 | Valeo Systemes Thermiques | Boîtier destiné à recevoir un composant électrique |
CN113207271B (zh) * | 2021-06-15 | 2022-07-12 | 中国石油大学(华东) | 一种相变储能式散热器 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63222500A (ja) * | 1987-03-11 | 1988-09-16 | 株式会社東芝 | 電子機器の耐振冷却構造 |
EP0579010A1 (en) * | 1992-07-07 | 1994-01-19 | International Business Machines Corporation | Lightweight packaging |
WO1999006782A1 (en) * | 1997-07-31 | 1999-02-11 | Motorola Inc. | Apparatus and method for cooling an electronic component using a porous material |
WO1999011586A2 (en) * | 1997-09-02 | 1999-03-11 | Lockheed Martin Energy Research Corporation | Thermally conductive carbon foam |
US6673328B1 (en) * | 2000-03-06 | 2004-01-06 | Ut-Battelle, Llc | Pitch-based carbon foam and composites and uses thereof |
US6196307B1 (en) * | 1998-06-17 | 2001-03-06 | Intersil Americas Inc. | High performance heat exchanger and method |
US6462949B1 (en) * | 2000-08-07 | 2002-10-08 | Thermotek, Inc. | Electronic enclosure cooling system |
US7112131B2 (en) * | 2003-05-13 | 2006-09-26 | American Power Conversion Corporation | Rack enclosure |
US7033267B2 (en) * | 2003-05-13 | 2006-04-25 | American Power Conversion Corporation | Rack enclosure |
US7044199B2 (en) * | 2003-10-20 | 2006-05-16 | Thermal Corp. | Porous media cold plate |
DE20320095U1 (de) * | 2003-12-23 | 2004-04-01 | Willy Voit Gmbh & Co. Kg | Gehäuse aus Aluminium-Druckguß |
US7992626B1 (en) * | 2004-01-30 | 2011-08-09 | Parker-Hannifin Corporation | Combination spray and cold plate thermal management system |
US7306027B2 (en) * | 2004-07-01 | 2007-12-11 | Aavid Thermalloy, Llc | Fluid-containing cooling plate for an electronic component |
US7438124B2 (en) * | 2005-10-04 | 2008-10-21 | Delphi Technologies, Inc. | Evaporative cooling system for a data-communications cabinet |
US7331381B2 (en) * | 2006-02-16 | 2008-02-19 | Allcomp, Inc. | Hybrid heat exchangers |
-
2009
- 2009-08-10 WO PCT/GB2009/050996 patent/WO2010018398A2/en active Application Filing
- 2009-08-10 JP JP2011522553A patent/JP5269995B2/ja not_active Expired - Fee Related
- 2009-08-10 AU AU2009280952A patent/AU2009280952A1/en not_active Abandoned
- 2009-08-10 BR BRPI0917974A patent/BRPI0917974A2/pt not_active IP Right Cessation
- 2009-08-10 EP EP09785464A patent/EP2326902A2/en not_active Withdrawn
- 2009-08-10 US US13/058,316 patent/US20110132016A1/en not_active Abandoned
- 2009-08-10 CA CA2733413A patent/CA2733413A1/en not_active Abandoned
- 2009-08-10 KR KR1020117005543A patent/KR20110055611A/ko not_active Application Discontinuation
-
2011
- 2011-02-08 IL IL211125A patent/IL211125A0/en unknown
- 2011-02-08 ZA ZA2011/01002A patent/ZA201101002B/en unknown
Also Published As
Publication number | Publication date |
---|---|
ZA201101002B (en) | 2012-04-25 |
EP2326902A2 (en) | 2011-06-01 |
CA2733413A1 (en) | 2010-02-18 |
WO2010018398A2 (en) | 2010-02-18 |
JP2011530827A (ja) | 2011-12-22 |
AU2009280952A1 (en) | 2010-02-18 |
US20110132016A1 (en) | 2011-06-09 |
KR20110055611A (ko) | 2011-05-25 |
BRPI0917974A2 (pt) | 2015-11-17 |
WO2010018398A3 (en) | 2010-04-15 |
IL211125A0 (en) | 2011-04-28 |
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