BRPI0917974A2 - aparelho de refrigeração de equipamento - Google Patents

aparelho de refrigeração de equipamento

Info

Publication number
BRPI0917974A2
BRPI0917974A2 BRPI0917974A BRPI0917974A BRPI0917974A2 BR PI0917974 A2 BRPI0917974 A2 BR PI0917974A2 BR PI0917974 A BRPI0917974 A BR PI0917974A BR PI0917974 A BRPI0917974 A BR PI0917974A BR PI0917974 A2 BRPI0917974 A2 BR PI0917974A2
Authority
BR
Brazil
Prior art keywords
refrigeration appliance
equipment refrigeration
equipment
appliance
refrigeration
Prior art date
Application number
BRPI0917974A
Other languages
English (en)
Inventor
David Eatly
Murray James Todd
Nicholas Chandler
Original Assignee
Bae Systems Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP08275044A external-priority patent/EP2154466A1/en
Priority claimed from GB0814776A external-priority patent/GB0814776D0/en
Application filed by Bae Systems Plc filed Critical Bae Systems Plc
Publication of BRPI0917974A2 publication Critical patent/BRPI0917974A2/pt

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F28D20/023—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat the latent heat storage material being enclosed in granular particles or dispersed in a porous, fibrous or cellular structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20245—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by natural convection; Thermosiphons
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2270/00—Thermal insulation; Thermal decoupling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage
BRPI0917974A 2008-08-13 2009-08-10 aparelho de refrigeração de equipamento BRPI0917974A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP08275044A EP2154466A1 (en) 2008-08-13 2008-08-13 Equipment cooling
GB0814776A GB0814776D0 (en) 2008-08-13 2008-08-13 Equipment cooling
PCT/GB2009/050996 WO2010018398A2 (en) 2008-08-13 2009-08-10 Equipment cooling

Publications (1)

Publication Number Publication Date
BRPI0917974A2 true BRPI0917974A2 (pt) 2015-11-17

Family

ID=41569052

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0917974A BRPI0917974A2 (pt) 2008-08-13 2009-08-10 aparelho de refrigeração de equipamento

Country Status (10)

Country Link
US (1) US20110132016A1 (pt)
EP (1) EP2326902A2 (pt)
JP (1) JP5269995B2 (pt)
KR (1) KR20110055611A (pt)
AU (1) AU2009280952A1 (pt)
BR (1) BRPI0917974A2 (pt)
CA (1) CA2733413A1 (pt)
IL (1) IL211125A0 (pt)
WO (1) WO2010018398A2 (pt)
ZA (1) ZA201101002B (pt)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20112045A1 (it) * 2011-11-11 2013-05-12 Celant Tel S R L Dispositivo per il condizionamento passivo di ambienti, in particolare shelter per telecomunicazioni
US9916545B1 (en) 2012-02-29 2018-03-13 Amazon Technologies, Inc. Portable network interfaces for authentication and license enforcement
JP6092670B2 (ja) * 2013-03-15 2017-03-08 株式会社Uacj 熱交換器
US9787499B2 (en) 2014-09-19 2017-10-10 Amazon Technologies, Inc. Private alias endpoints for isolated virtual networks
US10182513B2 (en) * 2015-01-16 2019-01-15 Hamilton Sundstrand Space Systems International, Inc. Phase change material heat sinks
US9693487B2 (en) 2015-02-06 2017-06-27 Caterpillar Inc. Heat management and removal assemblies for semiconductor devices
US10021196B1 (en) 2015-06-22 2018-07-10 Amazon Technologies, Inc. Private service endpoints in isolated virtual networks
US11530877B2 (en) * 2016-08-01 2022-12-20 Lockheed Martin Corporation Heat exchange using phase change material
CN110608580A (zh) * 2019-09-19 2019-12-24 深圳市翔通光电技术有限公司 一种降温装置
FR3105708A1 (fr) * 2019-12-20 2021-06-25 Valeo Systemes Thermiques Boîtier destiné à recevoir un composant électrique
CN113207271B (zh) * 2021-06-15 2022-07-12 中国石油大学(华东) 一种相变储能式散热器

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63222500A (ja) * 1987-03-11 1988-09-16 株式会社東芝 電子機器の耐振冷却構造
EP0579010A1 (en) * 1992-07-07 1994-01-19 International Business Machines Corporation Lightweight packaging
WO1999006782A1 (en) * 1997-07-31 1999-02-11 Motorola Inc. Apparatus and method for cooling an electronic component using a porous material
US6673328B1 (en) * 2000-03-06 2004-01-06 Ut-Battelle, Llc Pitch-based carbon foam and composites and uses thereof
WO1999011586A2 (en) * 1997-09-02 1999-03-11 Lockheed Martin Energy Research Corporation Thermally conductive carbon foam
US6196307B1 (en) * 1998-06-17 2001-03-06 Intersil Americas Inc. High performance heat exchanger and method
US6462949B1 (en) * 2000-08-07 2002-10-08 Thermotek, Inc. Electronic enclosure cooling system
US7033267B2 (en) * 2003-05-13 2006-04-25 American Power Conversion Corporation Rack enclosure
US7112131B2 (en) * 2003-05-13 2006-09-26 American Power Conversion Corporation Rack enclosure
US7044199B2 (en) * 2003-10-20 2006-05-16 Thermal Corp. Porous media cold plate
DE20320095U1 (de) * 2003-12-23 2004-04-01 Willy Voit Gmbh & Co. Kg Gehäuse aus Aluminium-Druckguß
US7992626B1 (en) * 2004-01-30 2011-08-09 Parker-Hannifin Corporation Combination spray and cold plate thermal management system
US7306027B2 (en) * 2004-07-01 2007-12-11 Aavid Thermalloy, Llc Fluid-containing cooling plate for an electronic component
US7438124B2 (en) * 2005-10-04 2008-10-21 Delphi Technologies, Inc. Evaporative cooling system for a data-communications cabinet
US7331381B2 (en) * 2006-02-16 2008-02-19 Allcomp, Inc. Hybrid heat exchangers

Also Published As

Publication number Publication date
EP2326902A2 (en) 2011-06-01
KR20110055611A (ko) 2011-05-25
US20110132016A1 (en) 2011-06-09
CA2733413A1 (en) 2010-02-18
AU2009280952A1 (en) 2010-02-18
ZA201101002B (en) 2012-04-25
JP2011530827A (ja) 2011-12-22
WO2010018398A2 (en) 2010-02-18
IL211125A0 (en) 2011-04-28
WO2010018398A3 (en) 2010-04-15
JP5269995B2 (ja) 2013-08-21

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 6A E 7A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2384 DE 13-09-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.