WO2010018398A3 - Equipment cooling - Google Patents

Equipment cooling Download PDF

Info

Publication number
WO2010018398A3
WO2010018398A3 PCT/GB2009/050996 GB2009050996W WO2010018398A3 WO 2010018398 A3 WO2010018398 A3 WO 2010018398A3 GB 2009050996 W GB2009050996 W GB 2009050996W WO 2010018398 A3 WO2010018398 A3 WO 2010018398A3
Authority
WO
WIPO (PCT)
Prior art keywords
open cell
heat
foam
convection cooling
coolant
Prior art date
Application number
PCT/GB2009/050996
Other languages
French (fr)
Other versions
WO2010018398A2 (en
Inventor
Nicholas Chandler
Murray James Todd
David Eatly
Original Assignee
Bae Systems Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP08275044A external-priority patent/EP2154466A1/en
Priority claimed from GB0814776A external-priority patent/GB0814776D0/en
Priority to AU2009280952A priority Critical patent/AU2009280952A1/en
Priority to JP2011522553A priority patent/JP5269995B2/en
Priority to BRPI0917974A priority patent/BRPI0917974A2/en
Priority to CA2733413A priority patent/CA2733413A1/en
Application filed by Bae Systems Plc filed Critical Bae Systems Plc
Priority to EP09785464A priority patent/EP2326902A2/en
Priority to US13/058,316 priority patent/US20110132016A1/en
Publication of WO2010018398A2 publication Critical patent/WO2010018398A2/en
Publication of WO2010018398A3 publication Critical patent/WO2010018398A3/en
Priority to IL211125A priority patent/IL211125A0/en
Priority to ZA2011/01002A priority patent/ZA201101002B/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F28D20/023—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat the latent heat storage material being enclosed in granular particles or dispersed in a porous, fibrous or cellular structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20245—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by natural convection; Thermosiphons
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2270/00—Thermal insulation; Thermal decoupling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Convection cooling channels are provided by means of an at least partially enclosed open cell metalfoam structure for removing heat from equipment. In particular, an electronic equipment box (100) is provided having walls (120, 125, 130, 135) comprising sections of open cell aluminium foam, clad with aluminium, through which air or other types of coolant may pass to remove heat from heat- generating components mounted thereon. Other types of equipment, such as electric motors,may be surrounded by customised sections of open cell metal foam, appropriately clad,through which a coolant may be channelled. The foam cell size may be adjusted according to desired coolant flow rate and weight considerations. Convection cooling structures may be combined with latent heat storage bodies comprising similar open cell metal foam structures containing wax, operating in tandem with the present convection cooling structures in a heat management solution.
PCT/GB2009/050996 2008-08-13 2009-08-10 Equipment cooling WO2010018398A2 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
US13/058,316 US20110132016A1 (en) 2008-08-13 2009-08-10 Equipment cooling
EP09785464A EP2326902A2 (en) 2008-08-13 2009-08-10 Equipment cooling
JP2011522553A JP5269995B2 (en) 2008-08-13 2009-08-10 Equipment cooling
BRPI0917974A BRPI0917974A2 (en) 2008-08-13 2009-08-10 equipment refrigeration appliance
CA2733413A CA2733413A1 (en) 2008-08-13 2009-08-10 Equipment cooling
AU2009280952A AU2009280952A1 (en) 2008-08-13 2009-08-10 Equipment cooling
IL211125A IL211125A0 (en) 2008-08-13 2011-02-08 Equipment cooling
ZA2011/01002A ZA201101002B (en) 2008-08-13 2011-02-08 Equipment cooling

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP08275044A EP2154466A1 (en) 2008-08-13 2008-08-13 Equipment cooling
GB0814776.1 2008-08-13
GB0814776A GB0814776D0 (en) 2008-08-13 2008-08-13 Equipment cooling
EP08275044.9 2008-08-13

Publications (2)

Publication Number Publication Date
WO2010018398A2 WO2010018398A2 (en) 2010-02-18
WO2010018398A3 true WO2010018398A3 (en) 2010-04-15

Family

ID=41569052

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2009/050996 WO2010018398A2 (en) 2008-08-13 2009-08-10 Equipment cooling

Country Status (10)

Country Link
US (1) US20110132016A1 (en)
EP (1) EP2326902A2 (en)
JP (1) JP5269995B2 (en)
KR (1) KR20110055611A (en)
AU (1) AU2009280952A1 (en)
BR (1) BRPI0917974A2 (en)
CA (1) CA2733413A1 (en)
IL (1) IL211125A0 (en)
WO (1) WO2010018398A2 (en)
ZA (1) ZA201101002B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20112045A1 (en) * 2011-11-11 2013-05-12 Celant Tel S R L DEVICE FOR PASSIVE CONDITIONING OF ENVIRONMENTS, IN PARTICULAR SHELTER FOR TELECOMMUNICATIONS
US9916545B1 (en) 2012-02-29 2018-03-13 Amazon Technologies, Inc. Portable network interfaces for authentication and license enforcement
JP6092670B2 (en) * 2013-03-15 2017-03-08 株式会社Uacj Heat exchanger
US9787499B2 (en) 2014-09-19 2017-10-10 Amazon Technologies, Inc. Private alias endpoints for isolated virtual networks
US10182513B2 (en) * 2015-01-16 2019-01-15 Hamilton Sundstrand Space Systems International, Inc. Phase change material heat sinks
US9693487B2 (en) 2015-02-06 2017-06-27 Caterpillar Inc. Heat management and removal assemblies for semiconductor devices
US10021196B1 (en) 2015-06-22 2018-07-10 Amazon Technologies, Inc. Private service endpoints in isolated virtual networks
US11530877B2 (en) * 2016-08-01 2022-12-20 Lockheed Martin Corporation Heat exchange using phase change material
CN110608580A (en) * 2019-09-19 2019-12-24 深圳市翔通光电技术有限公司 Cooling device
FR3105708A1 (en) * 2019-12-20 2021-06-25 Valeo Systemes Thermiques Box intended to receive an electrical component
CN113207271B (en) * 2021-06-15 2022-07-12 中国石油大学(华东) Phase-change energy-storage type radiator

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5847926A (en) * 1992-07-07 1998-12-08 International Business Machines Corporation Lightweight packaging
WO1999011586A2 (en) * 1997-09-02 1999-03-11 Lockheed Martin Energy Research Corporation Thermally conductive carbon foam
DE20320095U1 (en) * 2003-12-23 2004-04-01 Willy Voit Gmbh & Co. Kg Housing for electronic components or switches is made from an aluminum-silicon cast alloy containing additions of iron
US20050082037A1 (en) * 2003-10-20 2005-04-21 Thayer John G. Porous media cold plate
US20070284095A1 (en) * 2006-02-16 2007-12-13 Jinliang Wang Hybrid heat exchangers

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63222500A (en) * 1987-03-11 1988-09-16 株式会社東芝 Vibration-proof cooling structure of electronic equipment
WO1999006782A1 (en) * 1997-07-31 1999-02-11 Motorola Inc. Apparatus and method for cooling an electronic component using a porous material
US6673328B1 (en) * 2000-03-06 2004-01-06 Ut-Battelle, Llc Pitch-based carbon foam and composites and uses thereof
US6196307B1 (en) * 1998-06-17 2001-03-06 Intersil Americas Inc. High performance heat exchanger and method
US6462949B1 (en) * 2000-08-07 2002-10-08 Thermotek, Inc. Electronic enclosure cooling system
US7112131B2 (en) * 2003-05-13 2006-09-26 American Power Conversion Corporation Rack enclosure
US7033267B2 (en) * 2003-05-13 2006-04-25 American Power Conversion Corporation Rack enclosure
US7992626B1 (en) * 2004-01-30 2011-08-09 Parker-Hannifin Corporation Combination spray and cold plate thermal management system
US7306027B2 (en) * 2004-07-01 2007-12-11 Aavid Thermalloy, Llc Fluid-containing cooling plate for an electronic component
US7438124B2 (en) * 2005-10-04 2008-10-21 Delphi Technologies, Inc. Evaporative cooling system for a data-communications cabinet

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5847926A (en) * 1992-07-07 1998-12-08 International Business Machines Corporation Lightweight packaging
WO1999011586A2 (en) * 1997-09-02 1999-03-11 Lockheed Martin Energy Research Corporation Thermally conductive carbon foam
US20050082037A1 (en) * 2003-10-20 2005-04-21 Thayer John G. Porous media cold plate
DE20320095U1 (en) * 2003-12-23 2004-04-01 Willy Voit Gmbh & Co. Kg Housing for electronic components or switches is made from an aluminum-silicon cast alloy containing additions of iron
US20070284095A1 (en) * 2006-02-16 2007-12-13 Jinliang Wang Hybrid heat exchangers

Also Published As

Publication number Publication date
ZA201101002B (en) 2012-04-25
EP2326902A2 (en) 2011-06-01
IL211125A0 (en) 2011-04-28
JP2011530827A (en) 2011-12-22
KR20110055611A (en) 2011-05-25
WO2010018398A2 (en) 2010-02-18
CA2733413A1 (en) 2010-02-18
BRPI0917974A2 (en) 2015-11-17
US20110132016A1 (en) 2011-06-09
AU2009280952A1 (en) 2010-02-18
JP5269995B2 (en) 2013-08-21

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