CN113207271B - Phase-change energy-storage type radiator - Google Patents
Phase-change energy-storage type radiator Download PDFInfo
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- CN113207271B CN113207271B CN202110658953.7A CN202110658953A CN113207271B CN 113207271 B CN113207271 B CN 113207271B CN 202110658953 A CN202110658953 A CN 202110658953A CN 113207271 B CN113207271 B CN 113207271B
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- phase change
- metal foam
- change material
- organic phase
- cold plate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Abstract
The invention relates to and discloses a phase-change energy-storage type radiator, comprising: the device comprises a top cover, a packaging base body, a cold plate and a phase change module; the phase change module comprises a metal foam unit and a phase change material; the top cover, the packaging substrate and the cold plate are assembled into an internal space for filling the phase change module; the cold plate is in contact with the heat dissipation surface of the electronic device. The invention promotes the mixing of cold and hot fluids by utilizing the strong disturbance caused by the falling of the metal foam units embedded in the organic phase-change material, thereby strengthening the convection action in the heat exchange process, and simultaneously, because of the high thermal conductivity of the metal foam units, the metal foam units are added into the radiator to obviously increase the heat conduction action in the heat exchange process, and finally, the purpose of the synergistic increase of the heat conduction action and the convection action is achieved, thereby comprehensively improving the heat exchange performance of the phase-change energy storage radiator and prolonging the effective protection time of electronic devices. The invention can improve the operation reliability of the electronic device while optimizing the weight and the volume of the radiator.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a phase-change energy storage type heat radiator.
Background
With the progress of science and technology, electronic components are developed to integration, light weight and miniaturization, so that the heat flux density of electronic equipment is increased sharply, and the heat dissipation problem is increasingly prominent. If a large amount of heat can not be timely dissipated through a reasonable mode, the temperature of the electronic device can be rapidly increased, the normal use of the electronic equipment is further influenced, and even the electronic device is completely failed. For special application fields such as missile loading, the method not only causes great economic loss, but also has great influence on combat missions and even national defense safety.
At present, the thermal design of missile-borne electronic equipment mainly takes sensible heat energy storage and phase change energy storage as main components. The sensible heat energy storage is to store energy by utilizing the temperature rise of a metal component of the missile-borne system, the energy storage density is low, a large heat storage system is needed to meet the heat dissipation requirement, and due to the limitation of the weight and the volume of the missile-borne system, the sensible heat energy storage heat dissipation technology can not meet the heat dissipation requirement of missile-borne electronic equipment gradually. The phase change energy storage technology can absorb a large amount of heat when the temperature of the phase change material is basically kept unchanged, and the energy storage capacity per unit mass of the phase change material is far greater than that of sensible heat energy storage, so that the phase change material is concerned. The core of the phase-change energy storage technology is a phase-change material, and an ideal phase-change material has the characteristics of proper phase-change temperature, larger phase-change enthalpy, safety, no toxicity, no corrosiveness and the like, and can be divided into an organic phase-change material and an inorganic phase-change material according to the physical and chemical properties of the phase-change material at present. The inorganic phase-change material comprises phase-change materials such as fused salt, metal and alloy, wherein the phase-change temperature of the fused salt is high, and the unit volume mass of the metal and the alloy is large, so that the inorganic phase-change material is not suitable for being applied to the heat dissipation field of the missile-borne electronic equipment. The organic phase change material represented by paraffin has the advantages of large latent heat of fusion, stable physicochemical property, no toxicity, no corrosivity and appropriate phase change temperature, and can meet the heat dissipation requirement of electronic equipment. However, the heat conductivity coefficient of organic phase change materials such as paraffin is low, which seriously reduces the heat storage rate, so that the enhancement of the heat exchange performance of the organic phase change materials becomes an important research direction in recent years. The phase-change heat exchange process in the phase-change energy-storage type radiator is mainly under the combined action of heat conduction and convection, and fins are added in the phase-change material only to mainly improve the heat conduction effect; the method of adding porous material, nano particles and the like greatly inhibits the convection effect while improving the heat conduction effect. For application fields with special requirements on the volume and weight of a radiator, such as missile loading, a heat dissipation enhancing device capable of simultaneously improving heat conduction and convection is urgently needed.
Disclosure of Invention
The invention aims to provide a phase-change energy-storage type radiator to improve the thermal protection performance.
In order to achieve the above object, the present invention provides a phase change energy storage type heat sink, comprising:
the phase change module comprises a top cover, a packaging base body, a cold plate and a phase change module; the phase change module comprises a metal foam unit and a phase change material; the top cover, the packaging substrate and the cold plate are assembled into an inner space, and the inner space is used for filling the phase change module; the cold plate is in contact with a heat dissipating surface of the electronic device.
Optionally, the material of the package substrate is a polytetrafluoroethylene material.
Optionally, the cold plate is made of a red copper material.
Optionally, the contact surface of the cold plate, which is in contact with the heat dissipation surface of the electronic device, is coated with heat-conducting silicone grease.
Optionally, the phase change material is selected as an organic phase change material.
Optionally, the metal foam unit and the organic phase change material are filled in a layered manner to obtain the phase change module.
Optionally, the metal foam unit and the organic phase change material are filled in a layered manner to obtain a phase change module, specifically:
filling for the first time: uniformly placing a certain number of metal foam units on the cold plate, injecting the organic phase change material in a vacuum environment, wherein 4/5 and 1/5 metal foam units with the height being the height of the metal foam units are not embedded with the organic phase change material, so that the metal foam units placed on the next layer can be in contact with the metal foam units placed on the previous layer, and performing secondary filling when the organic phase change material is solidified into a pasty state;
and (3) filling for the second time: uniformly placing a certain number of metal foam units on the organic phase change material placed on the first layer, enabling the metal foam units placed on the second layer to be in contact with the metal foam units placed on the first layer, injecting the organic phase change material under a vacuum environment, wherein the injection height is 4/5 of the height of the metal foam units, filling the organic phase change material for the next time in the same mode after the organic phase change material is solidified until the set height of the inner space is filled with the organic phase change material and the metal foam units, and forming a phase change module.
Optionally, the set height is greater than 0 and less than the height of the interior space.
According to the specific embodiment provided by the invention, the invention discloses the following technical effects:
the invention promotes the mixing of cold and hot fluids by utilizing the strong disturbance caused by the falling of the metal foam units embedded in the organic phase-change material, thereby strengthening the convection action in the heat exchange process, and simultaneously, because of the high thermal conductivity of the metal foam units, the metal foam units are added into the radiator to obviously increase the heat conduction action in the heat exchange process, and finally, the purpose of the synergistic increase of the heat conduction action and the convection action is achieved, thereby comprehensively improving the heat exchange performance of the phase-change energy storage radiator and prolonging the effective protection time of electronic devices. The invention can improve the operation reliability of the electronic device while optimizing the weight and the volume of the radiator.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise.
FIG. 1 is a view showing the construction of a radiator according to the present invention;
FIG. 2 is a top view of the heat sink with the top cover removed in accordance with the present invention;
FIG. 3 is a front cross-sectional view of the heat sink of the present invention;
FIG. 4 is a right side sectional view of the heat sink of the present invention
Description of the symbols:
1. top cover, 2, organic phase change material, 3, packaging substrate, 4, cold plate, 5, metal foam unit, 6, expansion space.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention aims to provide a phase-change energy-storage type radiator to improve the thermal protection performance.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Phase Change Material (PCM): refers to a substance that absorbs or releases energy by changing the state of the substance at a substantially constant temperature. Phase change materials are generally classified into organic phase change materials and inorganic phase change materials.
Phase Change Heat Storage type radiator (Phase Change Heat Storage Heat Sink): the phase-change material is used for absorbing heat in the phase-change process to realize the storage and utilization of energy, thereby completing the heat dissipation device.
The Convection heat transfer (Convection) depends on the flow of the fluid to transfer heat, and the action strength of the Convection heat transfer is closely related to the flow condition of the fluid. The Natural Convection Heat exchange process comprises Natural Convection Heat exchange (Natural Convection Heat Transfer) and Forced Convection Heat exchange (Forced Convection Heat Transfer), wherein the Natural Convection Heat exchange is a Heat exchange process generated under the motion caused by buoyancy lift force due to the fact that the density is different due to the temperature difference inside fluid. Forced convection heat transfer is a heat transfer process resulting from fluid movement induced by a pump, fan or other external power source.
Metal Foam (Metal Foam): the porous metal medium is a porous metal medium with high porosity and strong heat conductivity, has a large specific surface area, can greatly enhance the heat exchange performance, and is widely researched in the field of application of phase change energy storage technology.
The invention mainly utilizes the violent disturbance caused by the fact that metal foam embedded in the organic phase-change material falls down due to self gravity after the organic phase-change material is melted to enhance the convection effect, and meanwhile, because the metal foam unit has larger heat conductivity coefficient, the heat conduction effect can be obviously enhanced by embedding the metal foam unit in the organic phase-change material, and finally, the purpose of comprehensively improving the heat exchange performance of the radiator is achieved.
As shown in fig. 1 to 4, the present invention discloses a phase change energy storage type heat sink, which comprises:
the device comprises a top cover 1, a packaging base body 3, a cold plate 4 and a phase change module; the phase change module comprises a metal foam unit 5 and a phase change material; the top cover 1, the packaging base body 3 and the cold plate 4 are assembled into an inner space which is used for filling the phase change module; the cold plate 4 is in contact with the heat sink surface of the electronic device.
As an alternative embodiment, the phase change material of the present invention is preferably an organic phase change material 2; the packaging substrate 3 is made of polytetrafluoroethylene material; the cold plate 4 is made of red copper; the cold plate 4 is in direct contact with the heat dissipation surface of the electronic equipment, and the contact surface is coated with heat-conducting silicone grease to prevent large contact thermal resistance. The metal foam unit 5 is made of metal foam, and the metal foam is made of red copper material; since the metal foam has a porous characteristic, a contact area of the metal with the organic phase change material 2 can be increased, and strong disturbance can be generated when dropping.
The metal foam unit 5 and the organic phase change material 2 are filled in a layered mode to obtain a phase change module, and the method specifically comprises the following steps:
filling for the first time: uniformly placing a certain number of metal foam units 5 on the cold plate 4, injecting the organic phase change material 2 in a vacuum environment, wherein the injection height is 4/5 of the height of the metal foam units 5, that is, 1/5 of the metal foam units 5 are not embedded in the organic phase change material 2, so that the metal foam units 5 placed in the next layer can be in contact with the metal foam units 5 placed in the previous layer, and performing second filling when the organic phase change material 2 is solidified into a pasty state. And (3) filling for the second time: a certain number of the metal foam units 5 are uniformly placed on the organic phase change material 2 placed on the first layer, and the metal foam units 5 placed on the second layer are in contact with the metal foam units 5 placed on the first layer along the height direction, and the metal foam units 5 placed on the second layer need to ensure that the metal foam units can fall down due to the action of gravity. The organic phase change material 2 is also injected under vacuum, at 4/5 the height of the metal foam cells 5. And after the organic phase change material 2 is solidified, performing next filling in the same manner until the whole internal space is filled with the organic phase change material 2 and the metal foam unit 5 at a set height. Fig. 3 and 4 show a front sectional view and a right sectional view of the heat sink after the completion of the loading.
Because the volume grow after organic phase change material 2 absorbs heat and melts, for preventing that the too big and cause of radiator internal pressure from revealing, expansion space 6 is reserved at the radiator top, consequently this application sets up the height that reserves expansion space 6 and equals the internal space height and subtracts the settlement height.
The arrangement positions and the number of the metal foam units 5 are designed according to actual working conditions. Because the smaller the porosity of the metal foam unit 5 is, the larger the mass per unit volume thereof is, the faster the dropping speed is, and the stronger the turbulence degree is. The more the 5 numbers of the metal foam units are, the more the 5 numbers of the metal foam units falling in unit time are, and the stronger the turbulence degree is. Therefore, the turbulent flow strength is regulated and controlled by regulating the porosity and the number of the metal foam units 5.
The working process of the invention is as follows:
the heat that electronic equipment produced passes through heat conduction silicone grease transmit to rapidly cold plate 4, because the red copper that cold plate 4 used has higher coefficient of heat conductivity, the heat can pass through cold plate 4 is rapidly to the storage of radiator inner space organic phase change material 2 and metal foam unit 5 transmission, because the layer metal foam unit 5 from bottom to top contacts each other, consequently in the heat dissipation earlier stage, the heat can be through the heat conduction effect rapid diffusion to the inner space of whole radiator, and the heat is stored in the radiator with the sensible heat form at this stage. The heat is absorbed by the radiator continuously, the temperature of the cold plate 4 rises continuously, when the temperature is higher than the melting point of the organic phase change material 2, the organic phase change material 2 in contact with the cold plate 4 starts to melt, and when the melting height of the organic phase change material 2 is greater than the length of the metal foam unit 5, the metal foam unit 5 falls downwards under the influence of gravity to generate severe disturbance, so that the mixing of cold and hot fluids in the organic phase change material 2 is promoted, the purpose of strengthening the convection effect is achieved, and along with the continuous heat absorption and melting of the organic phase change material 2, the metal foam unit 5 continuously falls downwards, and the convection effect is effectively strengthened in the whole radiating process. Since the metal foam units 5 falling on the bottom of the radiator (i.e. on the cold plate 4) are at a lower temperature than the bottom of the radiator, the falling metal foam units 5 will continue to absorb heat from the bottom of the radiator in the form of sensible heat, further enhancing heat exchange. In addition, the falling metal foam units 5 can be accumulated at the bottom of the radiator, so that the heat conductivity coefficient of the bottom of the radiator is greatly improved, heat emitted by the electronic device is rapidly diffused from the bottom to the inside, and the effective protection time of the electronic device is further prolonged.
In conclusion, the purpose of enhancing the convection effect is achieved by the fact that the metal foam units 5 embedded in the phase-change material fall downwards due to self gravity to cause severe disturbance, and meanwhile, the falling low-temperature metal foam units 5 can further absorb heat from a high-temperature heat source in a sensible heat mode, so that the heat exchange effect is enhanced. Since the metal foam unit 5 has a large thermal conductivity and a large specific surface area, the heat conduction effect can be significantly enhanced by embedding the metal foam unit into the organic phase change material 2. Finally, the cooperation improvement of the convection effect and the heat conduction effect is realized, and the purpose of prolonging the effective protection time of the electronic equipment is achieved. The invention has very wide application prospect in cooling short-time heat dissipation devices such as missile-borne electronic equipment and the like, and can be used as a standby heat dissipation device when active heat dissipation occurs in an emergency.
The principles and embodiments of the present invention have been described herein using specific examples, which are provided only to assist in understanding the core concepts of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.
Claims (5)
1. A phase change energy storage heat sink, the heat sink comprising:
the phase change module comprises a top cover, a packaging base body, a cold plate and a phase change module; the phase change module comprises a metal foam unit and a phase change material; the top cover, the packaging base body and the cold plate are assembled into an inner space, and the inner space is used for filling the phase change module; the cold plate is in contact with a heat dissipation surface of the electronic device;
the phase change material is preferably an organic phase change material;
the metal foam unit and the organic phase-change material are filled in a layered mode to obtain a phase-change module, and the method specifically comprises the following steps:
filling for the first time: uniformly placing a certain number of metal foam units on the cold plate, injecting the organic phase change material in a vacuum environment, wherein the injection height is 4/5 of the height of the metal foam units, namely 1/5 of the metal foam units are not embedded into the organic phase change material, so that the metal foam units placed on the next layer can be in contact with the metal foam units placed on the previous layer, and performing secondary filling when the organic phase change material is solidified into a pasty state;
and (3) filling for the second time: and uniformly placing a certain number of metal foam units on the organic phase change material placed on the first layer, and enabling the metal foam units placed on the second layer to be in contact with the metal foam units placed on the first layer along the height direction, wherein the metal foam units placed on the second layer are required to be ensured to fall downwards under the action of gravity. Injecting 4/5 the organic phase change material into the metal foam unit under vacuum condition; and filling the organic phase change material for the next time in the same way after the organic phase change material is solidified until the whole internal space is filled with the organic phase change material and the metal foam unit at a set height.
2. The phase-change energy-storage heat sink as claimed in claim 1, wherein the packaging substrate is made of teflon.
3. The phase-change energy-storage heat sink as claimed in claim 1, wherein the cold plate is made of red copper.
4. The phase change energy storage heat sink as recited in claim 1 wherein the contact surface of the cold plate with the heat dissipating surface of the electronic device is coated with a thermally conductive silicone grease.
5. The phase change energy storage heat sink of claim 1, wherein the set height is greater than 0 and less than the height of the interior space.
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| CN202110658953.7A CN113207271B (en) | 2021-06-15 | 2021-06-15 | Phase-change energy-storage type radiator |
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| CN202110658953.7A CN113207271B (en) | 2021-06-15 | 2021-06-15 | Phase-change energy-storage type radiator |
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| CN113207271B true CN113207271B (en) | 2022-07-12 |
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| CN104236358A (en) * | 2014-09-22 | 2014-12-24 | 中国科学院光电研究院 | Phase-changing heat storage device of detector |
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| US20110132016A1 (en) * | 2008-08-13 | 2011-06-09 | Bae Systems Plc | Equipment cooling |
| CN103374333B (en) * | 2012-04-13 | 2016-04-27 | 南京德朔实业有限公司 | Composite phase change material |
| CN103269571B (en) * | 2013-04-25 | 2016-04-20 | 上海卫星工程研究所 | A kind of energy storage of response fast heating panel |
| CN103234377A (en) * | 2013-05-16 | 2013-08-07 | 上海交通大学 | Phase change heat storage device based on gradient metal foam |
| CN104837316A (en) * | 2015-04-22 | 2015-08-12 | 湘潭大学 | Radiator plate based on composite phase change material |
| CN107172868A (en) * | 2017-07-17 | 2017-09-15 | 河北建筑工程学院 | Housing of electronic equipment and preparation method thereof |
| CN108302766B (en) * | 2018-02-05 | 2020-01-03 | 东南大学 | Fractal grid metal foam reinforced phase change energy storage system |
| CN108682664B (en) * | 2018-05-30 | 2020-05-19 | 重庆大学 | Power module based on phase-change material and manufacturing method thereof |
| CN211376630U (en) * | 2020-02-25 | 2020-08-28 | 广州市香港科大霍英东研究院 | Heat dissipation device and electronic equipment |
| CN112351650A (en) * | 2020-10-30 | 2021-02-09 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Design method of missile-borne transient thermal control electronic module composite phase change cold plate |
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| CN104236358A (en) * | 2014-09-22 | 2014-12-24 | 中国科学院光电研究院 | Phase-changing heat storage device of detector |
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