JP5257677B2 - 樹脂封止電気部品 - Google Patents
樹脂封止電気部品 Download PDFInfo
- Publication number
- JP5257677B2 JP5257677B2 JP2008299304A JP2008299304A JP5257677B2 JP 5257677 B2 JP5257677 B2 JP 5257677B2 JP 2008299304 A JP2008299304 A JP 2008299304A JP 2008299304 A JP2008299304 A JP 2008299304A JP 5257677 B2 JP5257677 B2 JP 5257677B2
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- Japan
- Prior art keywords
- resin
- case
- side wall
- terminal
- case side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920005989 resin Polymers 0.000 title claims description 41
- 239000011347 resin Substances 0.000 title claims description 41
- 238000003780 insertion Methods 0.000 claims description 15
- 230000037431 insertion Effects 0.000 claims description 15
- 230000005611 electricity Effects 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
Claims (3)
- ケース(1)に電気素子(9)を収納し樹脂(8)を充填するとともに外部接続用端子(5)を有底ケース(1)の開口部(4)からケース側壁(2)の上端面(2a)を跨いで外部に導出した樹脂封止電気部品であって、前記外部接続用端子(5)と前記ケース側壁(2)の上端面(2a)が交差する部分のケース側壁(2)に、前記ケース(1)の上端面(2a)に開口すると共に、底部側に凹入する樹脂受け溝部(7)を設け、毛細管現象によって前記外部接続用端子(5)とケース側壁(2)との間に吸い上げられた樹脂(8)を、毛細管現象によって前記樹脂受け溝部(7)内に導くことを特徴とする樹脂封止電気部品。
- 前記ケース側壁(2)の上端面(2a)おいては、外部接続用端子(5)が嵌入する嵌入凹部(6)を切欠き形成したことを特徴とする請求項1記載の樹脂封止電気部品。
- 前記樹脂受け溝部(7)の開口幅寸法が、前記嵌入凹部(6)の切欠き幅寸法より大であることを特徴とする請求項2記載の樹脂封止電気部品。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008299304A JP5257677B2 (ja) | 2008-11-25 | 2008-11-25 | 樹脂封止電気部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008299304A JP5257677B2 (ja) | 2008-11-25 | 2008-11-25 | 樹脂封止電気部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010129573A JP2010129573A (ja) | 2010-06-10 |
JP5257677B2 true JP5257677B2 (ja) | 2013-08-07 |
Family
ID=42329801
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008299304A Active JP5257677B2 (ja) | 2008-11-25 | 2008-11-25 | 樹脂封止電気部品 |
Country Status (1)
Country | Link |
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JP (1) | JP5257677B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7015999B2 (ja) * | 2016-07-21 | 2022-02-04 | パナソニックIpマネジメント株式会社 | コンデンサ |
JP6964437B2 (ja) * | 2017-05-31 | 2021-11-10 | 新電元工業株式会社 | 電子モジュール |
JP7300897B2 (ja) * | 2019-06-11 | 2023-06-30 | ニチコン株式会社 | ケースモールド型コンデンサ |
CN115483027B (zh) * | 2022-09-27 | 2023-07-14 | 成都宏明电子股份有限公司 | 能够通过引出片对电容器芯组定位的表贴式薄膜电容器 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59169030U (ja) * | 1983-04-28 | 1984-11-12 | 株式会社 指月電機製作所 | コンデンサ |
JPS6185132U (ja) * | 1984-11-09 | 1986-06-04 | ||
JPH0723952Y2 (ja) * | 1991-05-31 | 1995-05-31 | 株式会社指月電機製作所 | 樹脂封止構造 |
JP3812196B2 (ja) * | 1998-12-25 | 2006-08-23 | 松下電器産業株式会社 | コンデンサ |
JP2003100547A (ja) * | 2001-09-25 | 2003-04-04 | Nippon Chemicon Corp | 樹脂封止型電子部品 |
JP4940665B2 (ja) * | 2006-01-16 | 2012-05-30 | パナソニック株式会社 | ケースモールド型コンデンサ |
JP4676346B2 (ja) * | 2006-01-31 | 2011-04-27 | 日本特殊陶業株式会社 | 超音波センサユニット |
-
2008
- 2008-11-25 JP JP2008299304A patent/JP5257677B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2010129573A (ja) | 2010-06-10 |
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