JP5256363B2 - Thin film forming equipment - Google Patents

Description

  The present invention relates to a thin film forming apparatus, and more particularly, to a thin film forming apparatus capable of efficiently forming a thin film on specific portions on a large number of substrates.

In various devices such as digital cameras and digital video photographing devices, mobile phones, smart phones, and portable game machines, a technique for forming a thin film on a substrate surface is used.
Some substrates provided in these devices have a thin film formed over the entire surface of the substrate, but many are selectively formed only in a specific region on the substrate.

  As described above, in order to selectively form a thin film only on a specific portion on the substrate, in the substrate held by the substrate holding mechanism disposed in the thin film forming apparatus, a portion where the thin film is not formed (hereinafter, A technique of covering a “non-deposited portion” with a mask is used. However, in the technique of covering the substrate with the mask in this way, generally, each substrate is held by the substrate holding mechanism so that the thin film forming portion on the substrate (hereinafter referred to as “film forming portion”) does not overlap each other. Therefore, the number of substrates held by the substrate holding mechanism cannot be increased. Therefore, it is impossible to form a film on a large number of substrates at a time, and there is a disadvantage that the film formation efficiency is lowered.

  To solve the above problem, a technique has been proposed in which a thin film is formed in a state where the substrates are overlapped so that the non-deposition portion is not covered with a mask but is covered with another substrate. (Patent Document 1).

  Patent Document 2 proposes a technique in which a plurality of substrates are inclined and arranged using a first pin and a second pin, and a thin film is formed in the vicinity of the end of the substrate. As described above, the substrates arranged obliquely to each other do not need to have a mask at the time of film formation because the substrates act as a mask to each other, and are arranged so that the substrates overlap each other. Substrate can be processed at once.

JP-A 63-266071 JP-A-7-34222

However, in the technique disclosed in Patent Document 1, it is necessary to attach an adhesion-preventing plate that covers the non-film-deposited portion on the substrate that is finally placed on the substrate holder. In addition, the technique disclosed in Patent Document 2 requires that the board be locked to the first pin and the second pin, respectively, and thus the installation work of the board is complicated and the work time is increased. There is.
Therefore, the techniques of Patent Document 1 and Patent Document 2 have a problem that the work time for forming a thin film becomes long and the cost for film forming work increases.

  Furthermore, since the substrate holding mechanism disclosed in Patent Document 1 and Patent Document 2 inevitably has a configuration in which the end portion (the end portion including the side surface) of the substrate is exposed, the shape and size of the film forming portion can be reduced. It is difficult to set in detail. Therefore, there is a disadvantage that the shape and size of the film forming portion that can be formed on the substrate are limited.

An object of the present invention is to simplify and improve the efficiency of forming a thin film only on a specific portion on a large number of substrates, thereby shortening the work time when forming the thin film and reducing the cost of the film forming operation. An object is to provide a thin film forming apparatus.
Another object of the present invention is to provide a thin film forming apparatus capable of finely setting the shape and size of a film forming part when forming a film forming part only on a specific part on a substrate.

According to the thin film forming apparatus of the present invention, the subject has a substrate holding mechanism for holding a plurality of substrates, and is a thin film forming apparatus for forming a thin film on the plurality of substrates, wherein the substrate holding mechanism is A substrate holding member for holding a plurality of substrates; a support member for supporting the substrate holding member; and a rotating member for rotating the support member, wherein the substrate holding member holds the plurality of substrates, and A plurality of holding surfaces disposed between a film forming source for releasing a thin film material and the plurality of substrates, a plurality of step portions formed between the plurality of holding surfaces, and the plurality of holding surfaces Each of the plurality of openings formed on the substrate holding member, and the substrate holding member is configured as an assembly of holding jigs divided in the rotation direction of the rotating member. The plurality of holding surfaces and the rotation of the rotating member. Angle between the axis formed by holding the substrate holding member so as to be variable, with a portion of the non-deposition portion of the thin film is not formed among the plurality of substrate overlaps with other substrate, the thin film is formed When the film forming portion is exposed and the end portions of the plurality of substrates are in contact with the stepped portions, the film forming portion is exposed to the film forming source side through the opening. This can be solved by mounting a plurality of the substrates.

In order to improve the efficiency of the technique of forming a thin film only on a specific part on the substrate, conventionally, the film forming process is performed in a state where the substrates are stacked and held so that the non-film forming part is covered with another substrate. It was. At this time, there is a problem in that the non-film-formation portion is disposed so as to be covered with another substrate, and the operation of holding the substrate so that the film-formation portion is exposed is complicated.
With respect to such problems, according to the thin film forming apparatus of the present invention, a substrate holding mechanism that easily holds a plurality of substrates simply by abutting (mounting) the substrate on the holding surface and the stepped portion. Can be held. The holding surface of the substrate holding mechanism is provided between the film forming source and the substrate, and the holding surface is provided with an opening in a portion corresponding to the film forming portion, so that only the film forming portion of the substrate is provided. It is exposed and does not require complicated installation work. In other words, it is possible to simplify the operation of covering the non-film formation portion of the substrate with another substrate and holding the substrate so that the film formation portion is exposed. Therefore, when the substrate is held, it is not necessary to perform complicated work, so that efficiency can be improved. As a result, it is possible to shorten the work time when forming the thin film, and it is possible to reduce the cost in the film forming work.
In addition, since the opening portion is provided on the holding surface, only the film forming portion of the substrate can be exposed, so that the holding surface (substrate holding member) serves as a mask. Accordingly, since the shape and size of the film forming portion can be controlled depending on the shape and size of the opening, it is possible to perform a more precise film forming operation.
Further, the substrate holding mechanism further includes a rotating member that rotates the support member (that is, the substrate holding mechanism), whereby the substrate holding member can also be rotated, so that the thin film formed on the plurality of substrates can be uniformly formed. It can be formed with an appropriate film quality and film thickness.
In the substrate holding member, by changing the angle formed by the holding surface that holds the substrate and the horizontal plane, the film thickness of the thin film formed on the substrate can be corrected. As a result, a thin film having a more uniform thickness can be formed on a plurality of substrates, and materials necessary for film formation can be reduced.

At this time, it is preferable that the substrate holding member is divided into 2 or more and 12 or less in the rotation direction of the rotating member.
Then, by dividing the substrate holding member into two to twelve in the rotation direction of the substrate holding mechanism, the substrate holding member has an appropriate size and can be easily attached to the support member. Therefore, the working efficiency in the film forming operation is improved, and the working time can be shortened.

Further, it is preferable that the substrate holding member is formed in an annular shape in plan view, and a plurality of the substrate holding members are arranged adjacent to each other in the radial direction of the substrate holding member.
In this way, by providing a plurality of substrate holding members formed in an annular shape (doughnut shape) in a state of being adjacent in the radial direction, the number of substrates that can be held by the substrate holding mechanism can be further increased. Therefore, since the number of substrates that can be formed in a batch can be increased, the efficiency of the film forming operation is dramatically improved.

At this time, the substrate holding member has an angle formed by a first imaginary line passing through the film formation portion and the film formation source and a perpendicular to the film formation surface of the film formation portion between 0 ° and 45 °. It is preferable to hold the plurality of substrates as described above.
When forming a thin film on a substrate, the thickness (film thickness) of the thin film depends on the relative position between the film formation surface and the film formation source that releases the thin film material. More specifically, the film thickness depends on the angle at which the thin film material enters from the film formation source with respect to the film formation surface.
Therefore, the angle at which the thin film material is incident on the film formation surface from the film formation source, that is, the angle formed by the imaginary line passing through the film formation surface of the substrate and the film formation source, and the perpendicular to the film formation surface is within the above range. Thus, it is easy to control the thickness of the thin film formed on the substrate, and a thin film having a more uniform thickness can be formed on a plurality of substrates.

The support member preferably supports the substrate holding member so that the plurality of openings formed in the plurality of holding surfaces are positioned on a virtual dome having a rotation axis of the rotating member as a central axis. It is.
As described above, the opening provided in the substrate holding member is disposed so as to be positioned on the virtual dome having the rotation axis of the rotation member (that is, the rotation axis of the substrate holding mechanism) as the central axis. A thin film having a more uniform thickness can be formed on a plurality of substrates.

Furthermore, the substrate holding member disposed adjacent to each other in the radius direction, the opening formed in the substrate holding member of the hand is, with respect to the deposition source, the other of the substrate holding member It is preferable to be disposed at a position that is not shielded by.
In this way, the substrate holding members that are formed in an annular shape and are arranged adjacent to each other in the radial direction are arranged so that the opening provided in the substrate holding member is exposed to the film forming source. The In the substrate holding mechanism in which the annularly formed substrate holding members are arranged adjacent to each other in the radial direction, the thickness of the thin film formed on the substrate is affected by the adjacent substrate holding members. It is easy to receive. Accordingly, since the opening provided in the substrate holding member is provided at a position that is not shielded by the other substrate holding member with respect to the film forming source, the thickness of the thin film formed on the substrate is influenced by the substrate holding member. It becomes difficult to receive, and a film thickness can be made more uniform.

The support member is formed in an annular shape in plan view, supports the plurality of substrate holding members disposed in at least one of the rotational direction and the radial direction, and is disposed adjacent to each other in the radial direction. The substrate holding member has a radial direction of the other substrate holding member with respect to a second imaginary line passing through the outer periphery of the opening formed on the holding surface of the one substrate holding member and the film forming source. It is preferable that the end of each is disposed at a position separated by 20 mm or more.
In the substrate holding mechanism in which the annularly formed substrate holding members are arranged adjacent to each other in at least one of the rotational direction and the radial direction, the thicknesses of the thin films formed on the substrate are arranged adjacent to each other. It is easily affected by the substrate holding member. Therefore, by setting the opening of one substrate holding member at a position 20 mm or more away from at least one end in the rotation direction and the radial direction of the other substrate holding member, the thickness of the thin film formed is It becomes difficult to be affected by the substrate holding member, and the film thickness can be made more uniform.

At this time, the plurality of stepped portions are formed along a direction inclined with respect to the radial direction, the plurality of substrates are made of a rectangular plate material, and the length of the radially inner edge of the plurality of substrates is When the length is L and the distance from the center point of each edge of the plurality of substrates to the rotation axis of the rotating member is r, the substrate holding member has a value of (L / 2) / r of 0. It is preferable to hold the plurality of substrates so as to be 0.05 or more and 0.75 or less.
As described above, when the substrate on which the thin film is formed is particularly rectangular, the number of substrates held by the substrate holding member can be increased by configuring the substrate holding member as described above. Therefore, since the number of substrates that can be formed in a batch can be increased, the efficiency of the film forming operation is dramatically improved.

The substrate holding member may be configured such that an angle formed by an edge of one of the plurality of substrates held in an overlapping manner and an edge of the other substrate is 0 ° or more and 90 ° or less. It is preferable to hold the plurality of substrates.
As described above, when the rectangular substrate is held by the substrate holding member, the number of substrates held by the substrate holding member can be increased by being arranged in the above positional relationship. Therefore, since the number of substrates that can be formed in a batch can be increased, the efficiency of the film forming operation is dramatically improved.

Furthermore, it is preferable that the height of the plurality of stepped portions be higher by 0.05 mm or more than the thickness of the plurality of substrates.
Thus, by forming the height of the stepped portion with which the edge of the substrate abuts higher by 0.05 mm or more than the thickness of the substrate, damage to the substrate surface can be suppressed when the substrates are stacked. Therefore, a high-quality substrate with a thin film can be manufactured.

According to the thin film forming apparatus of the present invention, a plurality of substrates can be easily held on the substrate holding member without performing complicated operations. Therefore, it is not necessary to perform a complicated operation when holding the substrate, so that the film forming operation can be made efficient. As a result, it is possible to shorten the work time when forming the thin film, and it is possible to reduce the cost in the film forming work. In addition, since the thin film forming apparatus of the present invention can hold a large number of substrates on the substrate holding member, the number of substrates that can be formed in a batch can be increased, and the efficiency of the film forming operation is further improved. .
Furthermore, since the holding surface of the substrate holding member of the substrate holding mechanism is provided with an opening for exposing the film forming portion, the holding surface (substrate holding member) serves as a mask. Accordingly, since the shape and size of the film forming portion can be controlled depending on the shape and size of the opening, it is possible to perform a more precise film forming operation.
Furthermore, the thin film forming apparatus of the present invention can form a thin film so that the film thickness becomes more uniform by configuring the substrate holding member provided in the substrate holding mechanism as described above. As a result, materials required for film formation can be reduced.

It is a schematic diagram which shows the thin film forming apparatus which concerns on one Embodiment of this invention. It is a top view of the board | substrate hold | maintained at the board | substrate holding mechanism which concerns on one Embodiment of this invention. It is a top view of the substrate holding mechanism concerning one embodiment of the present invention. It is a perspective view of the holding jig which constitutes the substrate holding member concerning one embodiment of the present invention. It is a top view of a holding jig. It is a top view which shows the state which mounted the 1st board | substrate in the holding jig. It is a top view which shows the state which mounted all the board | substrates on the holding jig. It is sectional explanatory drawing which shows the state which mounted the board | substrate in the holding jig. It is sectional explanatory drawing which shows the state which mounted the board | substrate in the holding jig. It is explanatory drawing which shows the positional relationship of the supporting member to which the board | substrate holding member which concerns on one Embodiment of this invention was fixed, and the film-forming source. It is a graph which shows the reflectance of the anti-reflective film which concerns on Example 1 of this invention. It is a graph which shows the reflectance of the anti-reflective film which concerns on the comparative example 1 of this invention. It is a graph which shows the reflectance of the anti-reflective film which concerns on the comparative example 2 of this invention. It is explanatory drawing of the board | substrate holding member which concerns on other embodiment of this invention. It is a perspective view of the board | substrate holding member which concerns on other embodiment of this invention.

  Embodiments of the present invention will be described below with reference to the drawings. It should be noted that members, arrangements, and the like described below do not limit the present invention, and it goes without saying that various modifications can be made in accordance with the spirit of the present invention.

  1 to 13 relate to one embodiment of the present invention, FIG. 1 is a schematic view showing a thin film forming apparatus, FIG. 2 is a plan view of a substrate held by a substrate holding mechanism, and FIG. 3 is a substrate holding mechanism. FIG. 4 is a perspective view of a holding jig constituting a substrate holding member according to an embodiment of the present invention, FIG. 5 is a plan view of the holding jig, and FIG. 6 is a first substrate in the holding jig. FIG. 7 is a plan view showing a state where all the substrates are placed on the holding jig, FIG. 8 is a cross-sectional explanatory view showing a state where the substrates are placed on the holding jig, and FIG. 9 is an explanatory cross-sectional view showing a state where the substrate is placed on the holding jig, and FIG. 10 is an explanatory view showing the positional relationship between the support member to which the substrate holding member according to the embodiment of the present invention is fixed and the film forming source. FIG. 11 is a graph showing the reflectance of the antireflection film according to Example 1 of the present invention. FIG. 12 is an antireflection film according to Comparative Example 1 of the present invention. FIG. 13 is a graph showing the reflectance, FIG. 13 is a graph showing the reflectance of the antireflection film according to another comparative example 2 of the present invention, and FIGS. 14 and 15 are according to another embodiment of the present invention. FIG. 14 is an explanatory view of the substrate holding member, and FIG. 15 is a perspective view of the substrate holding member.

  The substrate holding mechanism 3, which is a characteristic element of the present invention, is provided in the thin film forming apparatus 100 in order to form a thin film on a plurality of substrates S at once. A thin film is not formed over the entire surface of the substrate S, but a thin film is formed only in a specific region, and includes a film forming part S1 and a non-film forming part S2 where no thin film is formed. ing. The substrate holding mechanism 3 has the following configuration in order to process a large number of substrates S collectively when forming a thin film on the substrate S having the film forming portion S1 and the non-film forming portion S2.

<Structure of thin film forming apparatus>
A thin film forming apparatus 100 in FIG. 1 is a vacuum vapor deposition apparatus that forms a thin film on the surface of a substrate S, and FIG. 1 is a schematic cross-sectional view showing a part of the thin film forming apparatus 100.

  The thin film forming apparatus 100 forms a thin film on the surface of the substrate S by using a thin film material by setting the inside of the vacuum vessel 1 to a vacuum state and heating and evaporating a thin film material such as metal. The thin film forming apparatus 100 includes a vacuum container 1, a substrate holding mechanism 3, and a film forming source 4.

The vacuum vessel 1 is made of a known metal material such as aluminum or stainless steel, and is a substantially cylindrical hollow vessel body for forming a thin film on the substrate S therein. A vacuum pump 2 is connected to the vacuum container 1, and the inside of the vacuum container 1 can be in a vacuum state of about 1 × 10 ⁻² to 1 × 10 ⁻⁵ Pa. The vacuum vessel 1 includes a gas introduction pipe (not shown) for introducing gas into the inside and a pressure gauge (not shown).

<Configuration of substrate holding mechanism>
The substrate holding mechanism 3 is provided inside the vacuum container 1 and holds a plurality of substrates S in order to form a film on the plurality of substrates S simultaneously. As shown in FIGS. 1 and 3, it is formed in a mountain shape in a side view and a circular dome shape in a plan view. The arrows in FIG. 3 indicate the rotation direction of the rotating member 60.

  The substrate holding mechanism 3 includes annular substrate holding members 10, 20, 30, 40 arranged concentrically, a support member 50 that supports the substrate holding members 10, 20, 30, 40, and a rotation that rotates the support member 50. A member 60 is provided.

The rotating member 60 includes a known rotating motor or the like, and is provided at the center of the substrate holding mechanism 3 and has a rotation axis X that extends in the vertical direction at the center of the substrate holding mechanism 3.
The rotation member 60 rotates about the rotation axis X, whereby the support member 50 and the substrate holding members 10, 20, 30, and 40 rotate in the horizontal direction.

Support member 50, as shown in FIGS. 1 and 3, consists of rod-shaped body of the elongated end is fixed to the rotary member 60, so that the other end is disposed below the outside than the rotating member 60 It is arranged.

A fixing plate 51 a for fixing the substrate holding members 10, 20, 30, 40 is attached to a part of the support member 50. The fixing plate 51a is made of a metallic material , and includes a planar plate portion and a support member mounting portion that is continuous from the plate portion and is bent with respect to the plate portion. The angle between the plate portion and the support member mounting portion is equal to the angle formed by the support member 50 and the substrate holding members 10, 20, 30, 40, and the support member mounting portion is fixed to the support member 50 by bolting or welding or the like. Thus, the plate portion is configured to be parallel to the mounting surface of the substrate holding members 10, 20, 30, 40.
By attaching the support member mounting portion of the fixing plate 51 a to the support member 50 and fixing the substrate holding members 10, 20, 30, 40 with the bolts 51, the substrate holding members 10, 20, 30, 40 are attached to the support member 50. Supported.

  As shown in FIG. 1, as many fixing plate members 51 a as the number of substrate holding members 10, 20, 30, and 40 attached to the support member 50 are provided on the support member 50. In this embodiment, since the substrate holding members 10, 20, 30, and 40 are provided in a total of four rows, each support member 50 is provided with four fixing plate members 51 a.

The support members 50 are provided in the same number as the number of divisions of the substrate holding members 10, 20, 30, and 40, and are fixed to the rotating member 60 so as to have a constant angular interval with respect to the rotation axis X. The rotating member 60 and the supporting member 50 have a shape like an umbrella bone as a whole. In the present embodiment, five support members 50 are provided.
The end of the support member 50 on the rotating member 60 side is fixed to the rotating member 60.

The substrate holding members 10, 20, 30, and 40 are members that hold a plurality of substrates S, and are made of aluminum that is easy to process and relatively lightweight.
As shown in FIG. 3, the substrate holding members 10, 20, 30 and 40 are formed in an annular shape having concentric and different diameters.
The substrate holding members 10, 20, 30, and 40 are each divided into the same number as the number of support members 50 in the circumferential direction, and are configured as a collection of holding jigs equal to the number of support members 50. The plurality of holding jigs constituting one substrate holding member are formed from the same shape.
In the present embodiment, the substrate holding members 10, 20, 30, and 40 are each divided into five in the rotation direction of the rotating member 60, but may be divided in other numbers. At this time, the substrate holding members 10, 20, 30, and 40 are preferably divided into 2 or more and 12 or less in the circumferential direction.

  As described above, the substrate holding members 10, 20, 30, and 40 are divided to reduce the weight as compared with the case where the substrate holding members 10, 20, 30, and 40 are integrally formed. The substrate holding members 10, 20, 30, 40 are attached to the support member 50 by being lifted by an operator with a large number of substrates S placed thereon, so that the substrate holding members 10, 20, 30, 40 are reduced in weight. This makes it easier to attach the substrate holding members 10, 20, 30, and 40, and the working efficiency is improved.

  On the other hand, when the substrate holding members 10, 20, 30, and 40 are divided more than 12, the work time for fixing the substrate holding members 10, 20, 30, and 40 to the support member 50 becomes long, and the working efficiency is lowered. Therefore, it is not preferable. Further, when viewed as a whole of each substrate holding member 10, 20, 30, 40, the area where the substrate S does not overlap each other, the area taken by the thick portions 11i, 11j, and the like becomes wider. , 30, 40, the number of substrates S that can be stacked is reduced, the number of substrates S that can be processed per batch is reduced, and the efficiency of the film formation process is reduced.

<Configuration of holding jig>
The holding jigs 11 to 15 are elements constituting the substrate holding member 10. That is, the substrate holding member 10 is divided into holding jigs 11 to 15 having a circular arc shape in plan view.
The substrate holding members 10, 20, 30, and 40 are different in that their diameters are different, but their basic structures are substantially the same. The holding jigs 11 to 15 are obtained by equally dividing the substrate holding member 10 and have the same configuration. Below, the holding jig 11 which comprises the board | substrate holding member 10 is demonstrated.

  The holding jig 11 constitutes the substrate holding member 10 formed in an annular shape, and is formed in an arc shape in plan view. The plurality of substrates S are held on the substrate holding member 10 (holding jig 11) by being placed on the holding jig 11, and at this time, the holding jig 11 is placed next to the substrate S to be held. The plurality of substrates S are held such that at least a part of the non-film-deposited portions S2 overlap each other and the film-formed portions S1 are exposed.

  As shown in FIG. 4, the holding jig 11 is a plate-shaped member having a substantially U-shaped cross section (U shape), and two sides in the length direction draw a concentric arc with the rotation axis X as the center. A bottom plate portion 11a made of a curved plate, an inner standing wall portion 11b that rises upward from the radially inner end portion of the bottom plate portion 11a, and an outer standing wall portion that rises upward from the radially outer end portion of the bottom plate portion 11a. 11c and thick portions 11i and 11j provided at both ends in the circumferential direction of the bottom plate portion 11a.

The bottom plate portion 11a is provided adjacent to the lowermost substrate placement portion 11A for placing the first substrate S on the holding jig 11 and in the counterclockwise direction from the lowermost layer substrate placement portion 11A. And a stepped portion 11B formed in a stepped shape. The clockwise direction and the counterclockwise direction may be reversed. In this case, it is configured as an inverted enantiomer for all configurations.
As shown in FIGS. 4 and 5, there is a certain gap between the lowermost substrate placement portion 11A and the stepped portion 11B and the inner standing wall portion 11b and the outer standing wall portion 11c. Exhaust grooves 11k and 11m are formed.

Lowermost substrate placement portion 11A includes a thick portion 11j, and the end portion of the stepped portion 11B, a first wall portion 11n provided on the radially outer side of the holding jig 11 than the inner wall part 11b, It is configured as a region surrounded by the second wall portion 11o provided on the radially inner side of the holding jig 11 with respect to the outer standing wall portion 11c.

  The thick part 11j is provided at the end in the clockwise direction around the rotation axis X of the holding jig 11, and is formed as a wall part extending in the radial direction. The thick portion 11j is provided with two exhaust grooves 11jx extending substantially in the circumferential direction on the inner side and the outer side in the radial direction. The exhaust groove 11jx is composed of a recess extending to both ends in the circumferential direction of the thick portion 11j.

Since the holding jig 11 includes the exhaust grooves 11k, 11m, and 11jx, the air accumulated between the substrate S and the holding jig 11 in a state where the plurality of substrates S are placed as illustrated in FIG. It can be removed smoothly, and the film forming operation can be performed efficiently.
The thick portion 11j is provided with a step 11js in which the inner side in the circumferential direction of the holding jig 11 is lowered. The step 11js is inclined with respect to the end surface so that the rotation axis X side approaches the end surface of the holding jig 11 in the clockwise direction. The step 11js allows the substrate S to be positioned by bringing the end of the substrate S into contact.
The lowermost substrate placement portion 11A is defined by the end of the stepped portion 11B. The end of the stepped portion 11B is the first step of the stepped portion 11B provided adjacent to the lowermost layer substrate placement portion 11A, and has the same height as the thickness of the substrate S, and the lowermost layer substrate placement portion. It is formed as a step which is higher on the stepped portion 11B side than the bottom surface of 11A.

  The first wall portion 11n is provided slightly on the outer peripheral side of the inner standing wall portion 11b, that is, on the inner side of the holding jig 11, is continuous from the end portion on the rotation axis X side of the thick portion 11j, and substantially toward the circumferential direction. It is extended. The first wall portion 11n is formed such that the end portion on the thick portion 11j side is slightly higher than the end portion on the stepped portion 11B side of the lowermost substrate placement portion 11A, and is first installed on the holding jig 11. The first substrate S can be installed with an inclination so that the thick portion 11j side is slightly higher than the end portion on the stepped portion 11B side.

The second wall portion 11o is provided slightly on the inner peripheral side of the outer standing wall portion 11c, that is, on the inner side of the holding jig 11, and is continuous from the end portion on the opposite side of the rotation axis X of the thick portion 11j. It is extended toward.
As shown in FIG. 4, the second wall portion 11o is formed with a stepped portion 11os having an increased thickness on the thick portion 11j side, and the substrate S is brought into contact with the stepped portion 11os by contacting the end portion of the substrate S. It is formed so that it can be positioned.
The second wall portion 11o is formed such that the end portion on the thick portion 11j side is slightly higher than the end portion on the stepped portion 11B side of the lowermost layer substrate placement portion 11A, and is first installed on the holding jig 11. The first substrate S can be installed with an inclination so that the thick portion 11j side is slightly higher than the end portion on the stepped portion 11B side.

Further, the bottom surface of the region surrounded by the thick part 11j of the lowermost layer substrate arrangement part 11A, the end part of the stepped part 11B, the first wall part 11n, and the second wall part 11o is held. It comprises a support surface 11g1 that contacts and supports the lower surface of the first substrate S that is initially placed on the jig 11, and a concave surface 11g2 that is formed lower than the support surface 11g1.
The support surface 11g1 is configured as an inclined surface that is slightly higher on the thick portion 11j side. At the position near the end of the support surface 11g1 on the stepped portion 11B side, the film forming portion S1 of the first substrate S installed on the holding jig 11 is formed at the center in the radial direction of the holding jig 11. An opening 11 f is formed to be exposed to the film source 4.
The concave surface 11g2 is formed at a position lower than the lower surface of the first substrate S that is initially placed on the holding jig 11, and a space is formed between the concave surface 11g2. An open window portion 11h is formed on the concave surface 11g2 in order to measure the film thickness and the like.

  The concave surface 11g2 serves to prevent the surface of the substrate S initially placed on the holding jig 11 from being damaged by friction with the thick portion 11j. Therefore, a decrease in yield due to damage to the substrate S can be suppressed, and a thin film can be formed more efficiently.

The stepped portion 11B is a portion that holds the second and subsequent substrates S installed on the holding jig 11 while being shifted little by little, and is in the vicinity of the film-forming portion S1 of the second and subsequent substrates S. A plurality of holding surfaces 11d for supporting the step, and a step portion 11e provided between the holding surfaces 11d.
The holding surface 11d is a plane that extends over the entire length of the stepped portion 11B in the radial direction, and is formed between a pair of adjacent step portions 11e. The holding surface 11d is a surface parallel to the support surface 11g1 and is inclined so that the stepped portion 11e side between the adjacent stepped portion 11e and the holding surface 11d located at the one step higher level is lowered. The holding surface 11d extends from the end on the inner peripheral side of the stepped portion 11B to the end on the outer peripheral side, and is configured in a substantially rectangular shape in plan view with the inner peripheral side slightly narrower than the outer peripheral side. . The holding surface 11d is provided in a number one smaller than the number of substrates S installed on the holding jig 11.

  The holding surface 11 d is formed with an opening 11 f that is a perfect circle in plan view for exposing the film forming portion S 1 of the substrate S to the film forming source 4. The opening portion 11f is formed side by side so as to be placed on an arc concentric with the inner standing wall portion 11b and the outer standing wall portion 11c. Note that the shape of the opening 11f is determined depending on the shape of the film forming portion S1 of the substrate S, and it is needless to say that the shape may be other than a perfect circle.

  As described above, since the opening 11f is formed in the holding surface 11d of the holding jig 11, the holding jig 11 serves as a mask. Therefore, it is not necessary to separately provide a member for covering the substrate S other than the holding jig 11. In addition, since the shape of the opening 11f can be changed as appropriate, it is easy to precisely control the shape and size of the film forming portion S1.

  The step portion 11e is positioned in contact with the end portions in the counterclockwise direction of each of the second and subsequent substrates S installed on the holding jig 11, and is positioned between a pair of adjacent holding surfaces 11d. Is formed. The step portion 11e is a step having a lower clockwise direction. The step portion 11e extends in a straight line shape in plan view from the inner peripheral end of the stepped portion 11B to the outer peripheral end.

The holding jig 11 has a holding surface 11d that is slightly inclined with respect to a horizontal plane so that one end side is higher than the other end side, and a step portion formed so as to be lowered by one step from the raised portion of the holding surface 11d. 11e are alternately and continuously provided so that the distance between the opening 11f formed in the holding surface 11d and the film forming source 4 can be made uniform. The film can be formed with a uniform film thickness.
As shown in FIG. 5, the step portion 11 e is inclined with an angle with respect to the radial direction RR.

The height of the stepped portion 11e is higher than the thickness of the substrate S by 0.05 mm or more. More specifically, the step portion 11e is formed to be higher than the thickness of the substrate S in the range of 0.05 mm to 0.1 mm.
As described above, since the step portion 11e is formed slightly higher than the thickness of the substrate S, the end portion of the substrate S can be easily brought into contact with the step portion 11e. Further, when the substrate S is held on the holding surface 11d, the overlapping substrates S are stacked with a slight gap depending on the height of the stepped portion 11e, so that the surfaces of the substrates S are difficult to contact each other, and the substrate S is caused by friction. It is possible to prevent the surface of the substrate from being damaged.

If the difference between the height of the stepped portion 11e and the thickness of the substrate S is smaller than 0.05 mm, the substrates S are likely to come into contact with each other, which is not preferable. Further, if the difference between the height of the stepped portion 11e and the thickness of the substrate S is larger than 0.1 mm, it is difficult to form a uniform thin film on the plurality of substrates S, which is not preferable.
As shown in FIG. 7, attachment holes 11p and 11q for attaching the holding jig 11 to the fixing plate 51a shown in FIG. 1 are respectively provided at a total of four radial ends at both ends in the circumferential direction of the holding jig 11. Is formed.

  The film forming source 4 is composed of a general vapor deposition apparatus, and a plurality of cylindrical hearth liners are provided, and these hearth liners are arranged in concentric recesses of a disk-shaped hearth. The film formation source 4 is disposed on the lower side inside the vacuum vessel 1 and emits a thin film material toward the substrate S. In FIG. 1, for convenience, only one hearth liner is illustrated as the film formation source 4.

The film forming source 4 is not limited to an apparatus that is evaporated by an electron gun, and may be an apparatus that evaporates a thin film material by resistance heating, for example. Further, depending on the type and number of thin films formed on the substrate S, the number and arrangement of the film forming sources 4 can be changed as appropriate.
Further, for example, when vapor deposition is performed by an ion assist method, neutralization of charges is performed by irradiating an electron beam to an ion source that irradiates positive ions toward the substrate S, a positively charged substrate S or the substrate holding mechanism 3. A neutralizer or the like may be provided.

During film formation, since the temperature of the film formation source 4 becomes very high, a known substrate cooling means is provided in the vicinity of the substrate holding mechanism 3 in order to prevent the substrate S from being heated and deformed. Also good. This substrate cooling means is particularly effective when the substrate S is made of resin.
In addition, although the thin film forming apparatus 100 of this embodiment is an apparatus which forms a thin film by a vacuum evaporation method, you may apply this invention to a sputtering device.

<Board configuration>
As shown in FIG. 2, the substrate S is formed of a rectangular flat plate with four corners having an R shape, and a film forming portion S1 where a thin film is formed on the lower surface and a non-film forming portion S2 where no thin film is formed. And.
The film forming portion S1 is the center in the direction perpendicular to the longitudinal direction of the substrate S, in the vicinity of one of the two opposing short sides of the substrate S, slightly spaced from the short side. Formed. In the present embodiment, the film forming portion S1 is an example of a perfect circle, but may be another shape.

The substrate S is a glass plate having a thickness of about 0.3 to 0.5 mm, and a thin film may be formed on the surface in advance by a technique such as printing for the purpose of decoration or the like. In the present specification, the “film forming portion S1” refers to a specific region where a thin film is formed by the thin film forming apparatus 100, and does not refer to a portion where a thin film has been formed in advance.
In the present embodiment, a rectangular flat plate is used as the shape of the substrate S. However, the present invention is not limited to this, and various modifications can be made.

<Installation of substrate>
The holding jig 11 is provided with the same number of substrates S as the stepped portion 11e.
As shown in FIG. 6, in the first substrate S, one short side is in contact with the step 11js, the other is in contact with the step 11e on the most clockwise side, and the center of one long side is the inner vertical wall. It arrange | positions so that it may contact | abut to the surface of the holding jig 11 of the part 11b at the radial inside, and the both ends of the other long side may contact the surface of the outer standing wall part 11c of the holding jig 11 at the radial direction. At this time, the substrate S is inclined such that the end on the step 11e side is lower than the end on the step 11js side.

As shown in FIG. 7, the second and subsequent substrates S are sequentially installed in a state of being partially overlapped with the substrate S that has been previously installed.
In the second and subsequent substrates S, one short side is arranged on the substrate S that is installed one before, at a position shifted in the counterclockwise direction by the distance of the adjacent stepped portion 11e, and the other is Abutting on the stepped portion 11e, the center of one long side abuts on the radially inner surface of the holding jig 11 of the inner standing wall portion 11b, and both ends of the other long side are holding jigs 11 of the outer standing wall portion 11c. It arrange | positions so that it may contact | abut to the surface of the radial direction outer side.
The substrate S to be installed last comes into contact with the thick portion 11i at the side of the short side that is in the counterclockwise direction.

Thus, since the edge part of the board | substrate S is contact | abutted and hold | maintained at the level | step-difference part 11e, the inner side standing wall part 11b, the outer side standing wall part 11c, the level | step difference 11js, and the thick part 11i, the board | substrate S is on the holding jig 11. It is easily and stably fixed and the holding position is not shifted.
As shown in FIGS. 8 and 9, the substrate S placed in this way is inclined so that the end portion on the stepped portion 11 e side is lower than the other end portion.
Of the plurality of installed substrates S, the lower surface of the portion that does not overlap the previously installed substrate S abuts on the holding surface 11d, and the lower surface of the substrate S is opened from the opening 11f provided on the holding surface 11d. It is exposed below the holding jig 11. The exposed portion is subjected to film forming processing by the film forming source 4 as a film forming portion S1.

One substrate S is held on one holding surface 11d. By sequentially stacking the substrates S on the holding jig 11, the plurality of substrates S are held in a state in which some of them overlap each other and other portions are shifted.
The area of the holding surface 11d is formed to be smaller than the area of the substrate S, and the holding jig 11 holds the substrate S so that the non-film forming portions S2 of the adjacent substrates S overlap each other.

  In adjacent substrates S, short sides in the same direction are not parallel to each other but have an angle of 0 ° to 90 °. Since the holding jig 11 is curved in an arc shape and configured in this manner, a larger number of substrates S can be held by the substrate holding member 10.

  The rectangular substrate S is held by the holding jig 11 so as to have the following relationship. In FIG. 7, among the long sides of the rectangular substrate S, the length of the long side radially inside is L, and the rotation axis that is the center point of the arc drawn by the holding jig 11 from the center point of the long side When the distance to X is r, the length half the length L with respect to the distance r, that is, (L / 2) / r (the value of tan θ1 in θ1 described later) is 0.05 or more and 0.75 or less. A holding jig 11 is formed so that

  In other words, as shown in FIG. 7, among the straight line passing through the center point of the long side on the radially inner side of the substrate S and the rotation axis X, and the vertex of the substrate S and the rotation axis X on the radially inner side, When the angle formed by the straight line passing through is θ1, θ1 is not less than 2.9 ° and not more than 36.9 °. The angle θ1 is formed by a straight line passing through the center point of the long side on the radially inner side and the rotation axis X and a straight line passing through the vertex arranged on the radially inner side and the rotation axis X among the vertices of the substrate S. Indicates an acute angle.

  Not only the holding jigs 11 to 15 constituting the substrate holding member 10, but also all holding jigs constituting the substrate holding members 20, 30, 40 having different diameters are formed so as to satisfy this relationship. Accordingly, the substrate holding members 10, 20, 30, and 40 can hold a large number of substrates S. By setting the values of tan θ1 and θ1 to the above relationship, a large amount of substrates S can be processed at a time, and the thin film forming operation can be performed very efficiently.

The holding jigs constituting the holding jigs 11 to 15 and the substrate holding members 20, 30, and 40 are bolted to the plate portion of the fixing plate material 51 a attached to the support member 50 with bolts 51. , Installed as shown in FIG.
At this time, the substrate holding members 10, 20, 30, and 40 are formed in an annular shape, and are supported by the support member 50 so that the center thereof is on the rotation axis X of the rotation member 60. The substrate holding members 10, 20, 30, 40 are supported by the support member 50 such that the substrate holding members 30, 20, 10 are gradually lowered from the innermost substrate holding member 40 toward the outside. Has been.

  The substrate holding members 10, 20, 30, and 40 having different diameters are arranged in a stepped manner so that a part thereof overlaps in the vertical direction. The inner ends of the substrate holding members 10, 20, and 30 are arranged radially inward from the outer ends of the substrate holding members 20, 30, and 40 disposed on the inner side of the substrate holding members 10, 20, and 30, respectively. It is installed.

  In the present embodiment, the substrate holding members 10, 20, 30, and 40 are shown as an example of a configuration in which four substrate holding members are provided in the radial direction. However, other numbers may be used as a matter of course. is there. Thus, by making the number of substrate holding members adjacent in the radial direction plural, the number of substrates S to be formed can be increased, and the film forming operation can be performed efficiently.

<Position relationship of substrate holding member>
With reference to FIG. 10, the mutual positional relationship of the substrate holding members 10, 20, 30, and 40 will be described. FIG. 10 is an explanatory diagram showing the positional relationship between the support member 50 to which the substrate holding members 10, 20, 30 and 40 are fixed and the film forming source 4.

The substrate holding members 10, 20, 30, and 40 are formed such that the substrate holding mechanism 3 is formed in a dome shape, and the diameter of the substrate holding member disposed below is larger. The openings 11f, 21f, 31f, and 41f that expose the film forming portion S1 of the substrate S are located on the surface of the virtual dome with the rotation axis X of the rotating member 60 as an axis, and a thin film having a uniform thickness on the substrate S. Can be formed.
In FIG. 10, the virtual dome on which the openings 11f, 21f, 31f, and 41f are mounted is shown as an example of a truncated cone shape. However, the openings 11f, 21f, and 31f are formed on the surface of the hemispherical dome having a predetermined curvature. , 41f may be arranged.

  Further, the holding surfaces (11d, etc.) of the substrate holding members 10, 20, 30, 40 are not limited to a horizontal state, and the angle formed between the holding surface (11d, etc.) and the rotation axis X is variable. It may be configured. 10 shows a configuration in which the angle between the holding surface 11d of only the substrate holding member 10 and the rotation axis X is variable, the substrate holding members 20, 30, and 40 are also the same. The angle may be variable.

  At this time, an angle θ2 formed by the first virtual line V1 passing through the center point of the film forming portion S1 of the substrate S and the end of the hearth liner of the film forming source 4 and the perpendicular P of the center point of the film forming portion S1 is An acute angle of 0 ° to 45 ° is preferred. In FIG. 10, for simplification, only the substrate S placed so as to face the opening 11 f is illustrated among the plurality of substrates S provided on the substrate holding member 10.

  If θ2 is greater than 45 °, the thin film material is obliquely incident on the film forming portion S1, so that the density of the formed thin film is lowered and the refractive index of the thin film is lowered. As a result, it is difficult to obtain desired spectral characteristics in the thin film formed on the substrate S.

By setting the angle θ2 to 0 ° or more and 45 ° or less, the thickness of the thin film formed on the substrate S can be easily controlled, and a thin film having a more uniform thickness can be formed on a plurality of substrates.
10 shows a configuration in which only the substrate holding member 10 is disposed with the holding surface 11d inclined with respect to the horizontal plane, the other substrate holding members 20, 30, 40 are also the same. Of course, it may be in a state of being inclined.

  The openings 21f, 31f, 41f of the substrate holding members 20, 30, 40 disposed on the radially inner side are at least the radial directions of the substrate holding members 10, 20, 30 disposed adjacent to the radially outer side. It arrange | positions inside the edge part inside.

Then, the substrate holding member 20, 30, 40 and the substrate holding member disposed adjacent to each other in the radial direction 10, 20 and 30 has an opening 21f formed in the substrate holding member 20, 30, 40 of the inner side , 31f, 41f are disposed at positions exposed to the film forming source 4 without being shielded by the radially inner ends of the outer substrate holding members 10, 20, 30. By setting it as this structure, the film thickness of the thin film formed on the board | substrate S can be made constant.

  More specifically, the substrate holding members 20, 30, 40 and the substrate holding members 10, 20, 30 that are disposed adjacent to each other in the radial direction are connected to the inner substrate holding members 20, 30, 40 in a side view. The radially inner ends of the outer substrate holding members 10, 20, 30 are side-viewed with respect to the second imaginary line V <b> 2 that passes through the outer peripheral ends of the formed openings 21 f, 31 f, 41 f and the film forming source 4. In a position separated by 20 mm or more. In FIG. 10, V2 and V3 are shown only for the substrate holding members 20 and 30.

  That is, in FIG. 10, among the substrate holding members 20, 30, 40 and the substrate holding members 10, 20, 30 arranged adjacent to each other in the radial direction, the substrate holding members 20, 30 arranged on the radially inner side. , 40 of the opening portions 21f, 31f, 41f of the substrate holding members 20, 30, 40, and the straight line passing through the radially outer end of the hearth liner of the film forming source 4 V2 is a straight line that is parallel to the imaginary line V2 and passes through the upper ends of the inner standing wall portions 11b of the substrate holding members 10, 20, and 30 disposed outside the substrate holding members 20, 30, and 40. When the virtual line V3 is used, the distance I between the virtual line V2 and the virtual line V3 is preferably 20 mm or more.

  In the substrate holding mechanism 3 in which the substrate holding members 10, 20, 30, and 40 having different diameters are arranged concentrically, the thickness of the thin film formed on the substrate S is the substrate holding arranged adjacent to each other. Although it is easily affected by the members 10, 20, 30, and 40, since it is configured in this way, the thickness of the thin film formed is less affected by the outer substrate holding members 10, 20, and 30, The film thickness can be made more uniform.

The procedure for placing the substrate S on the holding jig 11 is as follows.
First, the first substrate S is covered so that the concave surface 11g2 is covered, and one of the short sides is in contact with the step 11js of the thick portion 11j, and the other is in contact with the step 11e closest to the thick portion 11j. Put.

  Next, the second substrate S is overlaid on the first substrate S, and next to the step portion 11e with which the first substrate S abuts, the step portion 11e in the counterclockwise direction is counterclockwise. The end of the short side in the rotating direction is brought into contact. At this time, the film-forming portion S1 of the second substrate S does not overlap the first substrate S, and the non-film-forming portion S2 of the second substrate S becomes the first substrate S. Make sure they overlap.

After the plurality of substrates S are sequentially placed on the holding jig 11 in the above-described procedure to obtain the state shown in FIGS. 7 to 9, the holding jig 11 is fixed to the fixing plate material 51 a with the bolts 51. Thereby, the attachment of the holding jig 11 to the support member 50 is completed. The holding jigs 12 to 15 and the substrate holding members 20, 30, 40 are attached to the support member 50 in the same procedure. Thereby, the substrate S is placed on the substrate holding members 10, 20, 30, and 40 of the substrate holding mechanism 3 of FIG.
Thereafter, the substrate holding mechanism 3 on which the substrate S is placed is introduced into the vacuum vessel 1 to form a thin film.
Thus, since the holding jig 11 can expose and hold only the film forming portion S1 with respect to the film forming source 4, the substrate S including the film forming portion S1 and the non-film forming portion S2 is Can be mass produced in batch. Therefore, the time required for the film forming operation can be shortened, and the cost for the film forming operation can be reduced.

(Example 1 and Comparative Examples 1 and 2)
The substrate S was held by the substrate holding mechanism 3 configured as described above, and an antireflection film (AR film) was formed by laminating thin films having different refractive indexes, and the effect of the distance I was evaluated.
The film forming conditions of each layer constituting the antireflection film are as follows, and are common to Example 1 and Comparative Examples 1 and 2.

Substrate: Glass substrate High refractive index dielectric material: TiO ₂
Low refractive index dielectric material: SiO ₂
TiO ₂ deposition rate: 0.2 nm / sec
SiO ₂ deposition rate: 0.3 nm / sec
Ion source conditions during evaporation of TiO ₂ / SiO ₂
Introduced gas: 50 sccm of oxygen
Ion acceleration voltage: 1000V
Ion current: 500 mA
Neutralizer conditions
Neutralizer current: 1000mA

  When an antireflection film is formed under the above film forming conditions and the distance I between the virtual line V2 and the virtual line V3 is 20 mm (FIG. 11: Example 1), and 5 mm (FIG. 12: Comparative Example 1); When the thickness was 10 mm (FIG. 13: Comparative Example 2), the reflectances of the antireflection films formed with and without the adjacent substrate holding members were compared.

Example 1
If the distance I was 20mm (Figure 11), if there is an adjacent substrate holding member, as compared with the case where there is no adjacent substrate holding member, there is no significant difference in the reflectance of the antireflection film to be formed It was shown that. In FIG. 11, “when there is an adjacent substrate holding member” indicated by a solid line means that the distance I is 20 mm with respect to one of the substrate holding members adjacent in the radial direction. 2 shows a state in which the other substrate holding member is disposed.
The antireflection effect of the antireflection film, that is, the reflectance, tends to depend on the thickness of the antireflection film. Therefore, FIG. 11 shows that when the substrate holding member is arranged so that the distance I is 20 mm, the formed thin film can be formed with a uniform thickness without being affected by the adjacent substrate holding member. Has been.

(Comparative Example 1)
When the distance I is 5 mm (FIG. 12), when there is an adjacent substrate holding member, there is a large difference in the reflectance of the formed antireflection film compared to the case where there is no adjacent substrate holding member. It was shown that. In FIG. 12, the “when there is an adjacent substrate holding member” indicated by a solid line means that the distance I is 5 mm with respect to one of the substrate holding members adjacent in the radial direction. 2 shows a state in which the other substrate holding member is disposed.
The antireflection effect of the antireflection film, that is, the reflectance, tends to depend on the thickness of the antireflection film. Therefore, FIG. 12 shows that when the substrate holding member is arranged so that the distance I is 5 mm, the formed thin film is affected by the adjacent substrate holding member.

(Comparative Example 2)
Moreover, in the comparative example 2 of this invention shown in FIG. 13, the distance I was 10 mm. In Comparative Example 2, even when there is an adjacent substrate holding member with a distance I of 10 mm and when there is no adjacent substrate holding member, the reflectance of the antireflection film to be formed is slightly It was shown that there was a difference. Note that “when there is an adjacent substrate holding member” means that the other substrate holding member is 10 mm away from one of the substrate holding members adjacent in the radial direction so that the distance I is 10 mm. It shows the state of arrangement.
FIG. 13 also shows that when the substrate holding member is arranged so that the distance I is 10 mm, the formed thin film is affected by the adjacent substrate holding member.

  Therefore, it was shown that the substrate holding members 10, 20, 30, and 40 adjacent to each other have an influence on the film thickness of the thin film to be formed when the distance I is at least in the range of 5 mm to 10 mm. Further, it is also shown that as the distance I increases, the influence of the adjacent substrate holding members 10, 20, 30, and 40 on the thin film to be formed decreases. Therefore, when the distance I is further larger than 10 mm, the influence on the thin film is expected to be small.

And Example 1 showed that the board | substrate holding member 10,20,30,40 which adjoined had little influence with respect to the film thickness of the thin film formed, when the distance I was 20 mm.
Therefore, with respect to the distance I, the radial end portions of the adjacent substrate holding members are disposed at positions separated by 20 mm or more, so that the reflectance and film thickness of the thin film formed on the substrate S are uniform. It can be.

<Other embodiments>
Next, a substrate holding mechanism according to another embodiment will be described.
The substrate holding mechanism of this embodiment includes the rotating member 60 and the support member 50 shown in FIGS. 1 to 10 and a substrate holding member. Since the rotation member 60 and the support member 50 are the same as those in the embodiment shown in FIGS.
The substrate holding member is used in place of the substrate holding members 10, 20, 30, 40, and a substrate holding member 10 ′ fixed to the outermost side of the support member 50 is shown in FIG. 14.
The substrate holding member 10 ′ is formed of a substantially fan-shaped substantially plate body in plan view, and is configured to be able to fix the holding jigs 11 ′ to 13 ′ on the plate body.

  The substrate holding member 10 ′ has a configuration in which at least a portion where the opening 11 f ′ is formed among the portions to which the holding member 11 ′ is attached is opened so that the film forming portion S 1 of the substrate S is exposed. . The substrate holding member 10 ′ includes a bolt hole 10 h ′ for bolting to a fixing plate (not shown) attached to the support member 50.

  As shown in FIG. 15, the holding jig 11 ′ is a plate body having a substantially rectangular shape in plan view and a substantially U-shaped cross section (U shape). A pair of long side ends of the holding jig 11 ′ are provided with a frame portion 11 r ′ that is slightly thicker than the inner side, and abuts against a pair of long side ends of the substrate S. This suppresses the substrate S from falling off the holding jig 11 ′ in the short side direction.

  The holding jig 11 ′ is formed between a plurality of holding surfaces 11 d ′ holding the substrate S and a plurality of stepped portions 11 e ′ formed between the plurality of holding surfaces 11 d ′ and in contact with the end portions on the short side of the substrate S. And an opening portion 11f ′ formed in a portion corresponding to the film forming portion S1 of the holding surface 11d ′ when the end portion of the substrate S is in contact with and held by the step portion 11e ′. .

  The holding jig 11 ′ includes a plurality of holding surfaces 11 d ′ for holding the substrate S. A step portion 11e ′ is formed between the adjacent holding surfaces 11d ′.

  The plurality of holding surfaces 11d ′ and the plurality of stepped portions 11e ′ are formed in a step shape in a sectional view, and one substrate S is held on one holding surface 11d ′. Therefore, by sequentially stacking the substrates S on the holding jig 11 ′, the plurality of substrates S are held with their portions overlapping each other and the other portions shifted.

  The step portions 11e ′ are parallel to each other, and the plurality of substrates S are held in a straight line when the end portion of the short side of the substrate S abuts on the step portions 11e ′.

  Therefore, since the edge part of the board | substrate S is contact | abutted and hold | maintained at level | step-difference part 11e 'and the frame part 11r', respectively, the board | substrate S is easily and stably fixed on the holding jig 11 ', and its holding | maintenance The position will not shift.

  The height of the step portion 11e ′ is preferably formed to be slightly higher than the thickness of the substrate S. With this configuration, it is possible to suppress the surface of the substrate S from being damaged even when the plurality of substrates S are stacked.

  In the holding surface 11 d ′, an opening 11 f ′ that exposes the film forming portion S 1 of the substrate S to the film forming source 4 is formed. The opening 11f ′ is a long hole formed integrally with the plurality of holding surfaces 11d ′. However, the opening 11f ′ may not be formed in a long hole shape, but may be formed separately for each holding surface 11d ′.

At one end side in the longitudinal direction of the holding jig 11 ′ and at the position on the rotation axis X side when the substrate holding member 10 ′ is assembled, the flat surface portion 11 s ′ in which the surface on the substrate S mounting side is formed in a flat shape. It has.
The flat surface portion 11s ′ supports the non-film-forming portion S2 of the substrate S that is first disposed on the holding jig 11 ′.
Since the holding jigs 12 'and 13' have the same configuration as the holding jig 11 ', description thereof is omitted.

  In the present embodiment, the plurality of holding jigs 11 ′, 12 ′, and 13 ′ can cover the widest possible area on the substrate holding member 10 ′, and the openings 11 f ′ overlap each other. It is arranged so that it does not become.

The same number of substrate holding members 10 ′ to which the holding jigs 11 ′ to 13 ′ are fixed are used as the supporting members 50. The same number of substrate holding members 10 ′ as the supporting members 50 are bolted to fixing plates (not shown) in bolt holes 10 h ′ so as to be installed and fixed between the supporting members 50 shown in FIGS. 1 to 10. , Supported as a dome as a whole.
In this embodiment, since five support members 50 are provided, five substrate holding members 10 ′ are provided, but the number may be other than this.

The procedure for placing the substrate S on the holding jig 11 ′ is as follows.
First, the first substrate S is placed on the flat surface portion 11s ′ so that the end portion of one short side is brought into contact with the step portion 11e ′ formed closest to the flat surface portion 11s ′.

  Next, the second substrate S is stacked on the first substrate S, and the second substrate is placed on the step portion 11e ′ adjacent to the step portion 11e ′ with which the first substrate S is in contact. The end of one short side of S is brought into contact. At this time, the film formation portion S1 of the second substrate S does not overlap the first substrate S, and the non-film formation portion S2 of the second substrate S overlaps the other substrate S, Placed.

After the third and subsequent substrates S are sequentially placed on the holding jig 11 ′ in the same procedure, the holding jig 11 ′ is fixed by a bolt (not shown) through a bolt hole 10 h ′. Fix to the board. Thereby, attachment to the support member 50 of the 1st holding jig 11 'is completed. The remaining four holding jigs 11 ′ are attached to the support member 50 in the same procedure. Accordingly, the five holding jigs 11 ′ are attached between the five support members 50, and have an umbrella shape as a whole.
Thereafter, the substrate holding mechanism 3 on which the substrate S is placed is introduced into the vacuum vessel 1 to form a thin film.

DESCRIPTION OF SYMBOLS 100 Thin film formation apparatus 1 Vacuum container 2 Vacuum pump 3 Substrate holding mechanism 4 Film formation source 10, 20, 30, 40, 10 'Substrate holding member 10h' Bolt hole 11, 12, 13, 14, 15, 11 ', 12' , 13 ′ Holding jig 11 </ b> A Lowermost layer substrate arrangement portion 11 </ b> B Stepped portion 11 a Bottom plate portion 11 b Inner standing wall portion 11 c Outer standing wall portion 11 d, 11 d ′ Holding surface 11 e, 11 e ′ Step portion 11 f, 21 f, 31 f, 41 f, 11 f ′ Opening Part 11g1 Support surface 11g2 Concave surface 11h Window part 11i, 11j Thick part 11k, 11m Exhaust groove 11js Step 11jx Exhaust groove 11n First wall part 11o Second wall part 11os Step part 11p, 11q Mounting hole 11r 'Frame part 11s ′ Flat portion 50 Support member 51 Bolt 51a Fixing plate 60 Rotating member I Distance P Normal S Substrate S1 Film forming portion S2 Non-forming Film part V1, V2, V3 Virtual line X Rotation axis (central axis)

Claims (10)

A thin film forming apparatus having a substrate holding mechanism for holding a plurality of substrates and forming a thin film on the plurality of substrates,
The substrate holding mechanism is
A substrate holding member for holding the plurality of substrates;
A support member for supporting the substrate holding member;
A rotating member that rotates the support member,
The substrate holding member is
A plurality of holding surfaces disposed between the plurality of substrates and a film forming source that holds the plurality of substrates and releases the material of the thin film;
A plurality of step portions formed between the plurality of holding surfaces;
A plurality of openings respectively formed in the plurality of holding surfaces;
The substrate holding member is configured as an assembly of holding jigs divided in the rotation direction of the rotating member,
The support member holds the substrate holding member such that an angle formed by the plurality of holding surfaces of the substrate holding member and a rotation axis of the rotating member is variable,
Of the plurality of substrates, a part of the non-film-formation portion where the thin film is not formed overlaps with another substrate, and the film-formation portion where the thin film is formed is exposed, and an end portion of the plurality of substrates is the stepped portion. A thin film forming apparatus, wherein a plurality of the substrates can be mounted so that the film forming portion is exposed to the film forming source side through the opening when in contact with each other.   The thin film forming apparatus according to claim 1, wherein the substrate holding member is divided into 2 or more and 12 or less in a rotation direction of the rotating member.   3. The thin film according to claim 1, wherein the substrate holding member is formed in an annular shape in plan view, and a plurality of the substrate holding members are arranged adjacent to each other in a radial direction of the substrate holding member. Forming equipment. The substrate holding member is configured such that an angle formed between a first imaginary line passing through the film formation portion and the film formation source and a perpendicular to the film formation surface of the film formation portion is 0 ° to 45 °. the thin-film formation apparatus according to any one of claims 1 to 3, characterized in that for holding the plurality of substrates. The support member supports the substrate holding member such that the plurality of openings formed in the plurality of holding surfaces are positioned on a virtual dome having a rotation axis of the rotation member as a central axis. The thin film forming apparatus according to any one of claims 1 to 4 . The substrate holding member disposed adjacent to each other in the radius direction, the opening formed in the substrate holding member of the hand is, with respect to the deposition source, shielding by the other of said substrate holding member the thin-film formation apparatus according to any one of claims 3 to 5, characterized in that disposed in the non position. The support member is formed in an annular shape in plan view, and supports the substrate holding member disposed in plural in at least one of the rotational direction and the radial direction,
The substrate holding members disposed adjacent to each other in the radial direction are second imaginary paths that pass through the outer periphery of the opening formed on the holding surface of one of the substrate holding members and the film forming source. The thin film forming apparatus according to any one of claims 3 to 6 , wherein the radial end portion of the other substrate holding member is disposed at a position separated by 20 mm or more with respect to the line. The plurality of step portions are formed along a direction inclined with respect to the radial direction,
The plurality of substrates are made of a rectangular plate, and the length of the radially inner edge of each of the plurality of substrates is L, and from the center point of each edge of the plurality of substrates to the rotation axis of the rotating member. When the distance of r is r,
Said substrate holding member, (L / 2) / r any one of claims 3 to 7 values, characterized in that for holding the plurality of substrates such that 0.05 to 0.75 of The thin film forming apparatus described in 1. The substrate holding member includes a plurality of the plurality of substrates so that an angle formed by an edge of one of the substrates and an edge of the other of the substrates is 0 ° or more and 90 ° or less. The thin film forming apparatus according to claim 8 , wherein the substrate is held. The thin film forming apparatus according to any one of claims 1 to 9 , wherein the height of the plurality of stepped portions is formed to be higher by 0.05 mm or more than the thickness of the plurality of substrates. .

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