JP5250479B2 - 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 - Google Patents

光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 Download PDF

Info

Publication number
JP5250479B2
JP5250479B2 JP2009120087A JP2009120087A JP5250479B2 JP 5250479 B2 JP5250479 B2 JP 5250479B2 JP 2009120087 A JP2009120087 A JP 2009120087A JP 2009120087 A JP2009120087 A JP 2009120087A JP 5250479 B2 JP5250479 B2 JP 5250479B2
Authority
JP
Japan
Prior art keywords
group
compound
carboxyl group
resin
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009120087A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010266819A (ja
Inventor
信人 伊藤
聖夫 有馬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Priority to JP2009120087A priority Critical patent/JP5250479B2/ja
Priority to TW099115672A priority patent/TWI483982B/zh
Priority to PCT/JP2010/003311 priority patent/WO2010134314A1/ja
Priority to CN201080022004XA priority patent/CN102428407B/zh
Priority to KR1020117024478A priority patent/KR101344659B1/ko
Publication of JP2010266819A publication Critical patent/JP2010266819A/ja
Application granted granted Critical
Publication of JP5250479B2 publication Critical patent/JP5250479B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2009120087A 2009-05-18 2009-05-18 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 Active JP5250479B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009120087A JP5250479B2 (ja) 2009-05-18 2009-05-18 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
TW099115672A TWI483982B (zh) 2009-05-18 2010-05-17 A photohardenable thermosetting resin composition, a dry film and a cured product, and a printed circuit board
PCT/JP2010/003311 WO2010134314A1 (ja) 2009-05-18 2010-05-17 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
CN201080022004XA CN102428407B (zh) 2009-05-18 2010-05-17 光固化性热固化性树脂组合物、其干膜和固化物以及使用它们的印刷电路板
KR1020117024478A KR101344659B1 (ko) 2009-05-18 2010-05-17 광경화성 열경화성 수지 조성물, 그의 드라이 필름 및 경화물, 및 이들을 이용한 인쇄 배선판

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009120087A JP5250479B2 (ja) 2009-05-18 2009-05-18 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013001286A Division JP5523592B2 (ja) 2013-01-08 2013-01-08 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Publications (2)

Publication Number Publication Date
JP2010266819A JP2010266819A (ja) 2010-11-25
JP5250479B2 true JP5250479B2 (ja) 2013-07-31

Family

ID=43126007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009120087A Active JP5250479B2 (ja) 2009-05-18 2009-05-18 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Country Status (5)

Country Link
JP (1) JP5250479B2 (zh)
KR (1) KR101344659B1 (zh)
CN (1) CN102428407B (zh)
TW (1) TWI483982B (zh)
WO (1) WO2010134314A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011215392A (ja) * 2010-03-31 2011-10-27 Fujifilm Corp 感光性組成物、並びに、感光性積層体、永久パターン形成方法、及びプリント基板
JP5968291B2 (ja) * 2013-09-30 2016-08-10 太陽インキ製造株式会社 プリント配線板用白色硬化型組成物、これを用いた硬化塗膜及びプリント配線板
JP6087896B2 (ja) * 2014-04-01 2017-03-01 太陽インキ製造株式会社 硬化性樹脂組成物、永久被膜形成用硬化性樹脂組成物、ドライフィルムおよびプリント配線板
WO2015151341A1 (ja) * 2014-04-01 2015-10-08 太陽インキ製造株式会社 硬化性樹脂組成物、永久被膜形成用硬化性樹脂組成物、ドライフィルムおよびプリント配線板
JP2015196764A (ja) * 2014-04-01 2015-11-09 太陽インキ製造株式会社 硬化性樹脂組成物、永久被膜形成用組成物、ドライフィルムおよびプリント配線板
JP5798218B1 (ja) * 2014-06-25 2015-10-21 太陽インキ製造株式会社 硬化性樹脂組成物、永久被膜形成用組成物、ドライフィルムおよびプリント配線板
CN105467753B (zh) * 2014-07-31 2020-01-14 太阳油墨（苏州）有限公司 光固化性热固化性树脂组合物、干膜、固化物、及印刷电路板
JP2015173269A (ja) * 2015-04-03 2015-10-01 太陽インキ製造株式会社 プリント配線板用白色硬化型組成物、これを用いた硬化塗膜及びプリント配線板
CN109400844A (zh) * 2018-09-19 2019-03-01 江苏三木化工股份有限公司 一种生物基可光固化预聚物及其制备方法
JP7457614B2 (ja) * 2020-09-17 2024-03-28 三菱製紙株式会社 ソルダーレジストパターンの形成方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1165116A (ja) * 1997-06-09 1999-03-05 Jsr Corp 感放射線性樹脂組成物
US6583198B2 (en) * 1997-11-28 2003-06-24 Hitachi Chemical Company, Ltd. Photo curable resin composition and photosensitive element
JP3247091B2 (ja) * 1997-11-28 2002-01-15 日立化成工業株式会社 光硬化性樹脂組成物及びこれを用いた感光性エレメント
JP4328593B2 (ja) * 2003-09-18 2009-09-09 太陽インキ製造株式会社 カルボキシル基含有感光性樹脂を含有する組成物
JP2009014745A (ja) * 2006-03-16 2009-01-22 Fujifilm Holdings Corp 感光性組成物、感光性フィルム、感光性積層体、永久パターン形成方法、及びプリント基板
JP5513711B2 (ja) * 2007-10-01 2014-06-04 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
JP2010266819A (ja) 2010-11-25
TWI483982B (zh) 2015-05-11
CN102428407A (zh) 2012-04-25
KR20120024547A (ko) 2012-03-14
KR101344659B1 (ko) 2013-12-24
WO2010134314A1 (ja) 2010-11-25
CN102428407B (zh) 2013-09-04
TW201120118A (en) 2011-06-16

Similar Documents

Publication Publication Date Title
JP5099851B2 (ja) 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5475350B2 (ja) 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5250479B2 (ja) 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5356934B2 (ja) 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5619443B2 (ja) 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5520509B2 (ja) 硬化性樹脂組成物
WO2011122027A1 (ja) 光硬化性熱硬化性樹脂組成物
JP2011027770A (ja) 光硬化性樹脂組成物
JP5107960B2 (ja) ソルダーレジスト組成物、それを用いたドライフィルム及びプリント配線板
JP5216682B2 (ja) 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5523592B2 (ja) 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5439256B2 (ja) 光硬化性熱硬化性樹脂組成物
JP5422319B2 (ja) 感光性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP2011053421A (ja) 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
WO2010113478A1 (ja) 硬化性樹脂組成物およびプリント配線板
JP5514340B2 (ja) 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
WO2011034124A1 (ja) 感光性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5385680B2 (ja) 硬化性樹脂組成物
JP5356935B2 (ja) 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5385663B2 (ja) 硬化性樹脂組成物
JP5439255B2 (ja) 光硬化性熱硬化性樹脂組成物
JP2011065088A (ja) 感光性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120410

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20120910

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121109

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130108

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130326

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130415

R150 Certificate of patent or registration of utility model

Ref document number: 5250479

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160419

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250