JP5250181B2 - 半導体装置の作製方法 - Google Patents

半導体装置の作製方法 Download PDF

Info

Publication number
JP5250181B2
JP5250181B2 JP2005134751A JP2005134751A JP5250181B2 JP 5250181 B2 JP5250181 B2 JP 5250181B2 JP 2005134751 A JP2005134751 A JP 2005134751A JP 2005134751 A JP2005134751 A JP 2005134751A JP 5250181 B2 JP5250181 B2 JP 5250181B2
Authority
JP
Japan
Prior art keywords
laser
semiconductor film
region
laser beam
length
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005134751A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005347741A (ja
JP2005347741A5 (enExample
Inventor
幸一郎 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2005134751A priority Critical patent/JP5250181B2/ja
Publication of JP2005347741A publication Critical patent/JP2005347741A/ja
Publication of JP2005347741A5 publication Critical patent/JP2005347741A5/ja
Application granted granted Critical
Publication of JP5250181B2 publication Critical patent/JP5250181B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Thin Film Transistor (AREA)
  • Recrystallisation Techniques (AREA)
JP2005134751A 2004-05-06 2005-05-06 半導体装置の作製方法 Expired - Fee Related JP5250181B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005134751A JP5250181B2 (ja) 2004-05-06 2005-05-06 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004137374 2004-05-06
JP2004137374 2004-05-06
JP2005134751A JP5250181B2 (ja) 2004-05-06 2005-05-06 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2005347741A JP2005347741A (ja) 2005-12-15
JP2005347741A5 JP2005347741A5 (enExample) 2008-04-24
JP5250181B2 true JP5250181B2 (ja) 2013-07-31

Family

ID=35499781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005134751A Expired - Fee Related JP5250181B2 (ja) 2004-05-06 2005-05-06 半導体装置の作製方法

Country Status (1)

Country Link
JP (1) JP5250181B2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100541722C (zh) 2004-03-26 2009-09-16 株式会社半导体能源研究所 激光辐照方法和激光辐照装置
WO2006118312A1 (en) 2005-05-02 2006-11-09 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and laser irradiation method
CN101331592B (zh) 2005-12-16 2010-06-16 株式会社半导体能源研究所 激光照射设备、激光照射方法和半导体装置的制造方法
JP5137388B2 (ja) * 2005-12-16 2013-02-06 株式会社半導体エネルギー研究所 レーザ照射装置、レーザ照射方法及び半導体装置の作製方法
US20090046757A1 (en) * 2007-08-16 2009-02-19 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus, laser irradiation method, and manufacturing method of semiconductor device
US8598050B2 (en) * 2008-06-26 2013-12-03 Ihi Corporation Laser annealing method and apparatus
JP2010212530A (ja) * 2009-03-12 2010-09-24 Fuji Electric Systems Co Ltd 半導体素子の製造方法
JP5595021B2 (ja) * 2009-12-03 2014-09-24 住友重機械工業株式会社 レーザ処理装置
KR102388723B1 (ko) * 2015-08-07 2022-04-21 삼성디스플레이 주식회사 레이저 어닐링 장치 및 이를 이용한 디스플레이 장치 제조방법
KR102463885B1 (ko) * 2015-10-21 2022-11-07 삼성디스플레이 주식회사 레이저 어닐링 장치 및 이를 이용한 디스플레이 장치 제조방법
WO2018189900A1 (ja) * 2017-04-14 2018-10-18 堺ディスプレイプロダクト株式会社 光照射装置
KR102836621B1 (ko) * 2020-09-01 2025-07-21 삼성디스플레이 주식회사 광학계 및 이를 포함하는 레이저 조사 장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4443646B2 (ja) * 1998-06-04 2010-03-31 東芝モバイルディスプレイ株式会社 多結晶半導体膜の製造方法
JP4397571B2 (ja) * 2001-09-25 2010-01-13 株式会社半導体エネルギー研究所 レーザ照射方法およびレーザ照射装置、並びに半導体装置の作製方法
US6962860B2 (en) * 2001-11-09 2005-11-08 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device
JP4503246B2 (ja) * 2002-06-25 2010-07-14 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4813743B2 (ja) * 2002-07-24 2011-11-09 株式会社 日立ディスプレイズ 画像表示装置の製造方法
JP2004103628A (ja) * 2002-09-05 2004-04-02 Hitachi Ltd レーザアニール装置及びtft基板のレーザアニール方法
JP2005217209A (ja) * 2004-01-30 2005-08-11 Hitachi Ltd レーザアニール方法およびレーザアニール装置
JP4610201B2 (ja) * 2004-01-30 2011-01-12 住友重機械工業株式会社 レーザ照射装置

Also Published As

Publication number Publication date
JP2005347741A (ja) 2005-12-15

Similar Documents

Publication Publication Date Title
JP5072197B2 (ja) レーザ照射装置およびレーザ照射方法
US8525075B2 (en) Laser irradiation apparatus
JP5745714B2 (ja) レーザアニール方法
US7279372B2 (en) Manufacturing method of semiconductor device
JP4209606B2 (ja) 半導体装置の作製方法
US10369658B2 (en) Laser irradiation method and laser irradiation apparatus
JP5250181B2 (ja) 半導体装置の作製方法
KR20040031622A (ko) 레이저 조사방법 및 레이저 조사장치, 및 반도체장치의제조방법
JP5244832B2 (ja) 半導体装置の作製方法
JP2003289080A (ja) 半導体装置の作製方法
JP2003224084A (ja) 半導体製造装置
JP4481040B2 (ja) 半導体装置の作製方法
JP2004146823A (ja) レーザ照射装置及び前記レーザ照射装置を用いた半導体装置の作製方法
US7433568B2 (en) Optical element and light irradiation apparatus
JP2005311346A (ja) レーザアニール方法及び装置
JP2003282594A (ja) 半導体装置及び半導体装置の生産システム

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080312

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080312

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090908

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111025

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111111

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120612

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120723

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121106

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121214

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130409

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130415

R150 Certificate of patent or registration of utility model

Ref document number: 5250181

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160419

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees