JP5248418B2 - 多層配線基板の製造方法 - Google Patents

多層配線基板の製造方法 Download PDF

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Publication number
JP5248418B2
JP5248418B2 JP2009142473A JP2009142473A JP5248418B2 JP 5248418 B2 JP5248418 B2 JP 5248418B2 JP 2009142473 A JP2009142473 A JP 2009142473A JP 2009142473 A JP2009142473 A JP 2009142473A JP 5248418 B2 JP5248418 B2 JP 5248418B2
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layer
wiring
insulating layer
metal foil
wiring layer
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JP2009142473A
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Japanese (ja)
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JP2010287851A5 (enExample
JP2010287851A (ja
Inventor
達哉 中村
隆之 千野
山田　　智子
克幸 田中
大三 藤中
茂次 村松
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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JP2009142473A 2009-06-15 2009-06-15 多層配線基板の製造方法 Active JP5248418B2 (ja)

Priority Applications (1)

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JP2009142473A JP5248418B2 (ja) 2009-06-15 2009-06-15 多層配線基板の製造方法

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JP2009142473A JP5248418B2 (ja) 2009-06-15 2009-06-15 多層配線基板の製造方法

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JP2010287851A JP2010287851A (ja) 2010-12-24
JP2010287851A5 JP2010287851A5 (enExample) 2012-06-07
JP5248418B2 true JP5248418B2 (ja) 2013-07-31

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065000B2 (ja) 1984-04-17 1994-01-19 ゲウエルクシヤフト・アイゼンヒユツテ・ウエストフアーリア 掘進機においてずりを積込みコンベヤ上に積込むための積込み装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101548421B1 (ko) * 2013-08-27 2015-08-28 삼성전기주식회사 다층인쇄회로기판의 제조방법
JP6521377B2 (ja) * 2015-08-21 2019-05-29 株式会社アルバック 樹脂基板の加工方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2865809B2 (ja) * 1990-06-01 1999-03-08 日立精工株式会社 プリント基板の盲穴加工方法
JP4212006B2 (ja) * 1996-05-28 2009-01-21 パナソニック電工株式会社 多層プリント配線板の製造方法
JP2000022337A (ja) * 1998-06-30 2000-01-21 Matsushita Electric Works Ltd 多層配線板及びその製造方法
JP2001189548A (ja) * 1999-12-28 2001-07-10 Tdk Corp 電子部品用基板の製造方法
JP2002206181A (ja) * 2000-12-29 2002-07-26 Shigetaka Ooto 両面銅箔が張られたテープ、フレキシブル材料から２メタルレイヤーｔｂｇａまたはｆｐｃｂ（ｆｐｗｂ）のリールツーリールによる製造方法
JP4791648B2 (ja) * 2001-04-26 2011-10-12 日本シイエムケイ株式会社 プリント配線板の非貫通孔加工方法
JP2004031710A (ja) * 2002-06-27 2004-01-29 Shinko Electric Ind Co Ltd 配線基板の製造方法
JP4456834B2 (ja) * 2003-03-05 2010-04-28 新光電気工業株式会社 レーザ加工方法およびこれに用いるキャリア付金属箔
JP4855186B2 (ja) * 2006-09-04 2012-01-18 日本メクトロン株式会社 両面フレキシブルプリント配線板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065000B2 (ja) 1984-04-17 1994-01-19 ゲウエルクシヤフト・アイゼンヒユツテ・ウエストフアーリア 掘進機においてずりを積込みコンベヤ上に積込むための積込み装置

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JP2010287851A (ja) 2010-12-24

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