JP5237082B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a substrate processing apparatus for performing a series of processes on a semiconductor substrate, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, a substrate for an optical disk, etc. (hereinafter simply referred to as “substrate”).

Conventionally, as this type of apparatus, there is a substrate processing apparatus that forms a resist film on a substrate and develops the substrate exposed by a separate exposure machine. This apparatus is configured by arranging a coating cell for forming a coating film such as a resist film and a developing cell for developing a substrate. Each cell includes a single main transport mechanism and various processing units. The processing unit of the coating cell includes a plurality of resist film coating processing units that apply a resist film material to a substrate, and a plurality of heat treatment units that heat-treat the substrate. The processing unit of the development cell includes a plurality of development processing units that supply a developing solution to the substrate, a plurality of heat treatment units, and the like. The main transport mechanism of each cell causes the various processing units provided in the cell to sequentially transport the substrates at regular transport cycles. As a result, a plurality of types of processing are performed on the substrate in a predetermined order. The main transport mechanism further transfers the substrate on which a plurality of types of processing has been performed to the main transport mechanism of another adjacent cell (see, for example, Patent Document 1).
JP 2003-324139 A

However, the conventional example having such a configuration has the following problems.
In other words, in the conventional apparatus, when one processing unit fails, for example, the main transport mechanism cannot transport the substrate to the processing unit. Further, since there is no suitable transport destination for the substrate that was to be carried into this processing unit, the main transport mechanism remains in the state where the substrate is held. In this state, the main transport mechanism cannot move to the next transport operation and stops.

  Even if the next transfer operation can be performed, the number of processing units capable of processing the substrate changes after that, and therefore the time required for at least one of the types of processing changes. For this reason, there is an inconvenience that even if the main transport mechanism continues to operate in the transport cycle as it is, the substrate cannot actually be transported efficiently.

  Specifically, the case where a plurality of resist film coating units are used in parallel will be described as an example. When three resist film coating units that can process in 60 seconds per substrate are used, a total of one substrate can be processed every 20 seconds. Therefore, when only the resist film coating unit is viewed, if the substrate W in any resist film coating unit is replaced every 20 seconds, that is, if the transport cycle is 20 seconds, the main transport mechanism is efficient. The substrate can be transported well.

  However, if there are two resist film coating processing units, one substrate can be processed every 30 seconds as a whole. In such a case, even if the main transport mechanism accesses the resist film coating unit every 20 seconds, a substrate cannot be transported efficiently.

  Furthermore, although the inconvenience described above is caused by fluctuations in the number of processing units used, the present invention is not limited to this. For example, in the case where a plurality of coating cells are provided and a process of forming a coating film such as a resist film is performed in parallel in each coating cell, the same inconvenience occurs depending on the variation in the number of coating cells used.

  The present invention has been made in view of such circumstances, and even when the number of processing units that actually process a substrate fluctuates, multiple types of processing can be efficiently performed on the substrate in a predetermined order. It is an object of the present invention to provide a substrate processing apparatus capable of performing the above.

In order to achieve such an object, the present invention has the following configuration.
That is, according to the first aspect of the present invention, in the substrate processing apparatus for performing a plurality of types of processing on the substrate in a predetermined order, the processing is provided for each type of processing and a plurality of processing is provided for at least one of the types. A processing unit that can transport a substrate to each processing unit, a use processing unit that actually processes a substrate among the processing units, and a standby processing unit that does not actually process a substrate. A control unit that operates the transfer unit with each use processing unit as a substrate transfer destination for each transfer cycle according to the number, and performs the plurality of types of processing on the substrate in the predetermined order ; and The control unit forcibly transports the substrate to the processing unit that is out of the transport destination when the transport destination is updated during the operation of the transport unit and there is a processing unit that is out of the transport destination before and after the update. Determine whether it is possible When it is judged not to be transportable causes inconvenience to transport the substrate to the processing section which deviates from the conveying destination in the conveyance cycle in progress when updated.

[Operation / Effect] According to the first aspect of the present invention, the control unit distinguishes each processing unit into a use processing unit and a standby processing unit, and a transfer unit according to a transfer cycle and a transfer destination according to only the use processing unit. To control. As a result, the transfer cycle can always be maintained in an appropriate period, and the transfer destination can be limited to only the processing unit that actually processes the substrate. Accordingly, not only when all of the processing units included in the substrate processing apparatus are use processing units, but also when a part of the processing unit included in the substrate processing apparatus is a use processing unit, the substrate is efficiently transferred. Thus, a plurality of types of processing can be performed on the substrate in a predetermined order.
In addition, by forcibly transporting the substrate to the processing unit that is out of the transport destination, it is possible to avoid the transport unit from being unable to transport. Note that being able to be forcibly transported means that the transport unit can carry in / out the substrate to / from the processing unit without causing any trouble in the transport unit. Therefore, it has nothing to do with whether or not the processing unit can process the substrate with a certain quality or higher.

In the present invention, it is preferable that the control unit causes the substrate to perform the plurality of types of processing without changing the predetermined order even when the use processing unit is changed . Even when the use processing unit is changed, the order of performing a plurality of types of processing does not change in a predetermined order, so that the substrate can be suitably processed. Note that both the change of the use processing unit to the standby processing unit and the change of the standby processing unit to the use processing unit correspond to the change of the use processing unit.

In the present invention, when the use processing unit is changed, the control unit updates the transfer cycle and the transfer destination to the transfer cycle and the transfer destination corresponding to the changed use processing unit, and the updated transfer cycle and It is preferable to control the transport unit based on the transport destination . The control unit can suitably cope with the change of the use processing unit.

Further, in the present invention, an input unit that receives an instruction for designating an arbitrary processing unit as a use processing unit from a user may be provided, and the control unit may determine the use processing unit based on the command received by the input unit. Is preferred . The use processing unit can be arbitrarily specified.

In the present invention, it is preferable that when the use processing unit is in an abnormal state, the control unit changes the use processing unit to a standby processing unit regardless of a command received by the input unit . Even when the processing unit designated as the use processing unit is in an abnormal state, the processing is automatically changed to the standby processing unit, so that the substrate processing can be continued smoothly.

In the present invention, it is preferable that the control unit determines a processing unit that is not in an abnormal state as a use processing unit . When the processing unit is in an abnormal state, it is automatically determined as a standby processing unit, so that only a processing unit that is not always in an abnormal state is a use processing unit. Therefore, substrate processing can be performed while maintaining high efficiency.

In the present invention, when the transport destination is updated during the operation of the transport section, the control section causes the transport section to transport the substrate only to the updated transport destination from the transport cycle newly started after the update. It is preferable to switch the control . The control unit switches the transport destination of the transport unit from the transport cycle that is newly started after the update. In other words, even if the transport destination is updated while the transport unit is operating, the control unit does not switch the transport destination of the transport unit during the operation of the transport unit. As a result, the operation of the transport unit in each transport cycle can be determined in principle before the start of transport, and the transport unit can be controlled reliably and smoothly.

In the present invention, a buffer unit for placing a substrate is provided, the transport unit can transport the substrate to the buffer unit, and the control unit determines that the substrate cannot be forcibly transported to a processing unit that is out of the transport destination. In this case, it is preferable to place the substrate that was scheduled to be loaded into the processing unit that has been removed from the conveyance destination in the conveyance cycle in progress at the time of the update on the buffer unit . The transfer unit places the substrate, which was scheduled to be loaded into the processing unit removed from the transfer destination, on the buffer unit. As a result, the transfer unit can hold another substrate and can move to the next transfer operation. Therefore, the transport unit can continue the subsequent transport operation.

Further, in the present invention, when the control unit determines that the processing unit can be forcibly transported to a processing unit that has been removed from the transport destination, the control unit is configured to handle the processing unit that has been removed from the transport destination in the ongoing transport cycle when updated. However, it is preferable to continue the substrate conveyance . If it can be forcibly transported to the processing unit that is out of the transport destination, the transport unit continues to transport the substrate to the processing unit. Thereby, changing a conveyance destination in the middle of conveyance operation can be avoided as much as possible.

Further, in the present invention, when the control unit determines that the processing unit can be forcibly transported to a processing unit that has been removed from the transport destination, the control unit also includes a processing unit that has been removed from the transport destination in the ongoing transport cycle when updated. It is preferable to carry out the substrate . If it can be forcibly transported to the processing unit removed from the transport destination, the transport unit causes the substrate to be unloaded from the processing unit. Thereby, it is possible to avoid changing the operation of the transport unit during the transport operation as much as possible.

Further, in the present invention, when the control unit determines that it can be forcibly transported to the processing unit that is out of the transport destination, the control unit also applies to the processing unit that is out of the transport destination during the ongoing transport cycle when updated. It is preferable to carry in the substrate . Thereby, it is possible to avoid changing the operation of the transport unit during the transport operation as much as possible.

In the present invention, a buffer unit for placing a substrate is provided, the transport unit can transport the substrate to the buffer unit, and the control unit can be forcibly transported to a processing unit that is out of the transport destination. When it is determined that there is a substrate, it is preferable that the substrate unloaded from the processing unit removed from the transfer destination in the transfer cycle in progress when updated is placed on the buffer unit . The substrate in the processing unit at the time of changing from the use processing unit to the standby processing unit is placed in the buffer unit. As a result, it is possible to stop further processing on the substrate.

Further, in the present invention, the control unit updates the conveyance cycle during the operation of the conveyance unit, and when the period of the conveyance cycle changes before and after the update, the control unit determines the conveyance cycle in progress when the update is performed. It is preferable to control the said conveyance part based on the conveyance period after an update from the next . The conveyance cycle in progress when updated is the conveyance cycle before the update. Even if the period of the conveyance cycle changes while a certain conveyance cycle is in progress, the control unit does not change from the middle of the conveyance cycle to the updated conveyance cycle in the control of the conveyance unit. Thereby, reliable control of the conveyance part by a control part is realizable.

In the present invention, when the control unit switches from the pre-update conveyance cycle to the updated conveyance cycle in the control of the conveyance unit, a time corresponding to the updated conveyance cycle elapses from the start of the immediately preceding conveyance cycle. When it is done, it is preferable to start the updated conveyance cycle . Even when the period of the transport cycle changes while the transport cycle is in progress, the transport cycle updated from the next of the current transport cycle can be suitably started.

In the present invention, the processing unit includes at least a processing unit for supplying a processing liquid to the substrate and a processing unit for performing a heat treatment on the substrate, and the transport unit is a single unit that transports the substrate to each processing unit. It is preferable that the main transport mechanism is used . The processing for supplying the processing liquid to the substrate and the processing for performing the heat treatment on the substrate can be suitably performed in a predetermined order.

In the present invention, the processing unit that supplies the processing liquid to the substrate is at least one of a resist film coating processing unit that applies the resist film material to the substrate and a development processing unit that supplies the developer to the substrate. It is preferable . At least one of the process of forming a resist film on the substrate and the process of developing the substrate can be suitably performed.

In the present invention, it is preferable that a plurality of cells including the processing unit and the main transport mechanism are provided, and the control unit controls the main transport mechanism of each cell . In each of the plurality of cells, a plurality of types of processing can be performed on the substrate.

In the present invention, the processing unit includes a plurality of processing units, and includes a coating cell that performs a process of forming a resist film on the substrate and a plurality of processing units, and develops the substrate. It is preferable to have at least a development cell for performing the above . The process for forming the resist film and the process for developing can be suitably performed on the substrate.

Further, in the present invention, there are a plurality of rows of cells configured such that a single coating cell and a single development cell can deliver a substrate to each other, and the transport unit is a substrate between each coating cell. It is preferable to include an indexer transport mechanism that transports the substrate and an interface transport mechanism that transports the substrate between the development cells . Since a plurality of cell rows each including a single coating cell and a single development cell are provided, the substrates can be processed in parallel in each cell row. Further, since the transport unit includes separate transport mechanisms (indexer transport mechanism and interface transport mechanism) for the coating cell and the development cell, the substrate can be transported suitably to each of the coating cell and the development cell. it can.

  The present specification also discloses an invention relating to the following substrate processing apparatus.

(1) In the substrate processing apparatus according to any one of claims 1 to 19 , the transfer period includes a unit processing time for each type, with a processing time per substrate required for each type of processing as a unit processing time for each type. A substrate processing apparatus that sets the longest type-specific processing time or slightly longer than the type-specific processing time divided by the number of use processing units that perform processing of a corresponding type.

  According to the substrate processing apparatus as described in said (1), it can be set as the conveyance period which considered the number according to the kind of process part. By operating the transport unit in such a transport cycle, it is possible to efficiently perform a plurality of types of processing on the substrate.

  Here, “unit processing time for each type” refers to the preparation time and waiting time that occur before and after each type of process processing, the time for the transfer unit to leave the substrate in each processing unit, etc. It is the time added appropriately according to.

  (2) The substrate processing apparatus according to claim 3, wherein the control unit updates the transfer period and the transfer destination simultaneously with the change of the use processing unit.

  According to the substrate processing apparatus as described in said (2), the control part can respond to the change of a use process part suitably and rapidly.

  (3) The substrate processing apparatus according to claim 6, wherein the control unit changes the use processing unit to a standby processing unit when the use processing unit is in an abnormal state.

  According to the substrate processing apparatus as described in said (3), even if a use process part changes to an abnormal state, it can avoid suitably that the process with respect to a board | substrate is delayed by it.

  (4) The substrate processing apparatus according to claim 5 or 6, wherein when the standby processing unit is no longer in an abnormal state, the control unit changes the standby processing unit to a use processing unit.

  According to the substrate processing apparatus described in the above (4), the processing capacity of the apparatus can always be maximized by automatically changing the standby processing unit that can process the substrate appropriately to the use processing unit. it can.

  (5) The substrate processing apparatus according to claim 5 or 6, wherein the abnormal state is a state in which the substrate cannot be processed with a certain quality or more.

  According to the substrate processing apparatus as described in said (5), the quality of the process performed to a board | substrate can be ensured more than fixed.

  (6) The substrate processing apparatus according to claim 5 or 6, wherein the abnormal state is at least one of a supply amount of a processing liquid to the substrate and a temperature at which the substrate is heat-treated.

  According to the substrate processing apparatus as described in said (6), the quality of the process performed to a board | substrate can be ensured suitably.

  (7) The substrate processing apparatus according to claim 5 or 6, further comprising a detection unit that detects that the processing unit is in an abnormal state, and the control unit uses the processing based on a detection result of the detection unit. A substrate processing apparatus for determining a part.

  According to the substrate processing apparatus as described in said (7), the control part can change a use processing part exactly.

  (8) In the substrate processing apparatus according to any one of claims 1 to 6, when the control unit updates the transfer destination during the operation of the transfer unit, the control unit starts from the first transfer period newly started after the update. A substrate processing apparatus for switching the control of the transfer unit so that the substrate is transferred only to the updated transfer destination.

  According to the substrate processing apparatus described in (8) above, the control unit switches the control of the transport unit from the first transport cycle that starts anew after being updated. In other words, even if the conveyance destination is updated when the conveyance unit is operating, the control unit does not switch the control of the conveyance unit during the operation of the conveyance unit. As a result, the operation of the transport unit in each transport cycle can be determined in principle before the start of transport, and the transport unit can be controlled reliably and smoothly. Further, since the control of the transport unit is switched in the first transport cycle that starts newly after the update, the operation of the transport unit can be changed quickly.

(9) In the substrate processing apparatus according to any one of claims 1 to 13 , when the control unit switches from the conveyance cycle before the update to the conveyance cycle after the update in the control of the conveyance unit, the immediately preceding conveyance is performed. A substrate processing apparatus that starts an updated transfer cycle when a time corresponding to the transfer cycle before the update has elapsed from the start of the cycle period.

  According to the substrate processing apparatus described in (9) above, even when the period of the conveyance cycle changes while the conveyance cycle is in progress, the period of the conveyance cycle that is in progress is not changed, so that it is surely switched to the updated conveyance cycle. be able to.

(10) In the substrate processing apparatus according to claim 17, processes performed in two or more cells are different from each other, and the control unit sequentially transports and processes the same substrate to a plurality of cells performing different processes. Substrate processing equipment.

  According to the substrate processing apparatus described in (10), a plurality of types of processing can be performed in each cell on the same substrate.

(11) The substrate processing apparatus according to claim 18 , wherein the coating cell includes a resist film coating processing unit for coating a resist film material on the substrate, and a heat treatment unit for performing heat treatment on the substrate, and the developing cell. A substrate processing apparatus having a development processing unit for supplying a developing solution to a substrate and a heat treatment unit for performing heat treatment on the substrate.

  According to the substrate processing apparatus as described in said (11), the process which forms a resist film can be suitably performed to a board | substrate in a coating cell. In the development cell, the developing process can be suitably performed on the substrate.

(12) In the substrate processing apparatus according to (19 ), the rows of cells are arranged so as to be vertically aligned with each other, and the coating cells and the developing cells that constitute each row of cells are: A substrate processing apparatus arranged in a horizontal direction.

  According to the substrate processing apparatus described in (12), since the cell rows are arranged in the vertical direction, the installation area can be reduced.

  According to the substrate processing apparatus of the present invention, the control unit distinguishes each processing unit into a use processing unit and a standby processing unit, and controls the transport unit according to a transport cycle and a transport destination according to only the use processing unit. As a result, the transfer cycle can always be maintained in an appropriate period, and the transfer destination can be limited to only the processing unit that actually processes the substrate. Accordingly, not only when all of the processing units included in the substrate processing apparatus are use processing units, but also when a part of the processing unit included in the substrate processing apparatus is a use processing unit, the substrate is efficiently transferred. Thus, a plurality of types of processing can be performed on the substrate in a predetermined order.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a plan view showing a schematic configuration of a substrate processing apparatus according to an embodiment. FIGS. 2 and 3 are schematic side views showing the arrangement of processing units of the substrate processing apparatus. FIGS. FIG. 3 is a vertical sectional view taken along arrows aa, bb, cc, dd, and dd in FIG. 1.

  The embodiment is a substrate processing apparatus 10 that forms a resist film on a substrate (for example, a semiconductor wafer) W and develops the exposed substrate W. Hereinafter, the substrate processing apparatus 10 is appropriately abbreviated as “apparatus 10”. The apparatus 10 includes an indexer section (hereinafter referred to as “ID section”) 1, processing blocks Ba and Bb, and an interface section (hereinafter referred to as “IF section”) 5.

  The ID unit 1, the processing block Ba, the processing block Bb, and the IF unit 5 are provided so as to be arranged in a line in this order. The alignment direction is preferably the horizontal direction (horizontal direction). The ID unit 1, the processing block Ba, the processing block Bb, and the IF unit 5 are adjacent to each other. The IF unit 5 is further provided with an exposure unit EXP that is an external device separate from the apparatus 10.

  The processing block Ba includes a plurality (two) of application cells C1 and C3 in the vertical direction. The processing block Bb includes a plurality (two) of developing cells C2 and C4 in the vertical direction. FIG. 1 shows a coating cell C1 on the upper side of the processing block Ba and a developing cell C2 on the upper side of the processing block Bb. Although the layout of the coating cell C3 and the developing cell C4 in plan view is omitted, it is substantially the same as the coating cell C1 and the developing cell C2, respectively.

  The coating cell C1 includes a coating processing unit 31, a heat treatment unit 41, and the like, and performs a process of forming a resist film on the substrate W. The development cell C2 includes a development processing unit DEV, a heat treatment unit 42, and the like, and performs processing for developing the substrate W.

  The coating cell C1 and the developing cell C2 are adjacent to each other in the lateral direction, and can transfer the substrate W to each other. Thus, the “cell row” is constituted by the coating cell C1 and the developing cell C2. Similarly, the coating cell C3 and the developing cell C4 are adjacent to each other in the lateral direction, and can transfer the substrate W to each other. The coating cell C3 and the developing cell C4 constitute a “column of cells”. These multiple (two) cell rows are arranged in the vertical direction. Hereinafter, the coating cells C1 and C3 and the development cells C2 and C4 are simply abbreviated as “cell C” unless otherwise distinguished.

The ID unit 1 includes an ID transport mechanism T _ID that transports the substrate W between the coating cells C1 and C3. Each cell C1, C2, C3, C4 respectively is provided with a single main transport mechanism _{T 1, T 2, T 3} , T 4. IF section 5 is provided with an IF's transport mechanisms _{T IF} for transporting wafers W between the respective developing cell C2, C4.

  An outline of each operation of the ID unit 1, each cell C, and the IF unit 5 will be described. The ID unit 1 transports the substrate W to the coating cells C1 and C3. The coating cell C1 performs a process of forming a resist film on the substrate W and transports it to the developing cell C2. Similarly, the coating cell C3 performs a process of forming a resist film on the substrate W and transports it to the developing cell C4. Each of the developing cells C2 and C4 transports the substrate W to the IF 5. The IF unit 5 transports the substrate W to the exposure machine EXP. The exposure machine EXP exposes the substrate W and transports the substrate W to the IF unit 5 again. The IF unit 5 transports the substrate W to the developing cells C2 and C4. The development cell C2 performs a process of developing the substrate W and transports it to the coating cell C1. Similarly, the developing cell C4 performs a process of developing the substrate W and transports it to the coating cell C3. The coating cells C1 and C3 transport the substrate W to the ID unit 1. Below, the structure of each part of a present Example is demonstrated in detail.

[ID part 1]
The ID unit 1 takes out the substrate W from the cassette Ca that accommodates a plurality of substrates W, and accommodates the substrate W in the cassette Ca. The ID unit 1 includes a cassette mounting table 9 on which the cassette Ca is mounted. The cassette mounting table 9 is configured so that four cassettes Ca can be arranged in a row.

The ID transport mechanism T _ID transports the substrate W to each cassette Ca and transports the substrate W to a placement unit PASS ₁ and a placement unit PASS ₃ to be described later. The ID transport mechanism T _ID includes a movable table 21 that horizontally moves the side of the cassette mounting table 9 in the direction in which the cassette Ca is arranged, a lifting shaft 23 that expands and contracts in the vertical direction with respect to the movable table 21, and the lifting shaft 23. And a holding arm 25 that holds the substrate W by moving back and forth in the turning radius direction.

[Processing block Ba]
Placed parts PASS ₁ and PASS ₃ for placing the substrate W are provided between the application part C1 and C3 of the ID part 1 and the processing block Ba. A substrate W transferred between the _ID transport mechanism T _ID and the main transport mechanism T ₁ is temporarily placed on the platform PASS ₁ . Similarly, the substrate W transferred between the _ID transport mechanism T _ID and the main transport mechanism T ₃ is temporarily placed on the placement unit PASS ₃ . In the cross-sectional view, the placement portion PASS ₁ is disposed at a height position near the lower portion of the coating cell C1, and the placement portion PASS ₃ is disposed at a height near the upper portion of the coating cell C3. As described above, since the positions of the placement unit PASS ₁ and the placement unit PASS ₃ are relatively close, the ID transport mechanism T _ID moves between the placement unit PASS ₁ and the placement unit PASS ₃ with a small ascending / descending amount. be able to.

Between the processing blocks Ba and Bb, placement units PASS ₂ and PASS ₄ for placing the substrate W are also provided. The placement portion PASS ₂ is disposed between the coating cell C1 and the development cell C2, and the placement portion PASS ₄ is disposed between the coating cell C3 and the development cell C4. The main transport mechanism T ₁ and the main transport mechanism T ₂ deliver the substrate W via the placement unit PASS ₂ , and the main transport mechanism T ₃ and the main transport mechanism T ₄ transfer the substrate W via the placement unit PASS _4. Deliver.

There are a plurality of mounting parts PASS ₁ (two in this embodiment), and the plurality of mounting parts PASS ₁ are arranged close to each other in the vertical direction. Of the two placement units PASS _1, the substrate W passing from the _ID transport mechanism T _ID to the main transport mechanism T ₁ is placed on one placement unit PASS _1A , and the other placement unit PASS _1B is placed on the other placement unit PASS _1B . substrate W to pass from the main transport mechanism _{T 1} to the ID's transport mechanism _{T ID} is placed. There are also a plurality (two) of the placement units PASS _{2 to} PASS ₄ and later-described placement units PASS ₅ and PASS ₆ , and one of the placement units PASS is selected according to the direction in which the substrate W is delivered. . In addition, sensors (not shown) for detecting the presence or absence of the substrate W are attached to the placement units PASS _1A and PASS _1B , respectively, and based on the detection signal of each sensor, the ID transport mechanism T _ID and the main transport mechanism. to control the transfer of a substrate W by T _1. Similar sensors are also attached to the placement portions PASS _{2 to} PASS ₆ , respectively.

  Further, buffer units BF2 and BF4 on which the substrate W is placed are provided between the processing blocks Ba and Bb. The buffer unit BF2 is provided between the coating cell C1 and the development cell C2. The buffer unit BF4 is provided between the coating cell C3 and the development cell C4.

The buffer units BF2 and BF4 are arranged at positions close to the placement units PASS ₂ and PASS ₄ , respectively. In this embodiment, the lower buffer portion BF2 is mounting portion PASS _2, the buffer portion BF4 are stacked below the placing portion PASS _4.

Each buffer unit BF2, BF4 can place a plurality of substrates W thereon. Buffer BF2 is provided with a cabinet capable of housing the substrate W in multiple stages, and opposite sides to the main transport mechanism T ₁ and the main transport mechanism T ₂ is opened. Both the main transport mechanism T ₁ and a main transport mechanism T _2, placing the substrate W to the shelf, and are allowed to take out the substrate W placed on the shelf. Buffer BF4 also has the same configuration as the buffer unit BF2, both the main transport mechanism T ₃ and main transport mechanism T ₄ is configured to transfer the substrate to the buffer unit BF4.

  The buffer units BF2 and BF4 are not limited to the configuration described above. That is, as long as the substrate W can be temporarily placed, the substrate W may be held at any position such as the peripheral edge or the lower surface of the substrate W. For example, like the mounting part PASS, a plurality of projecting support pins may be provided, and the substrate W may be configured to be mounted in a substantially horizontal posture by these support pins.

The coating cell C1 will be described. The main transport mechanism T _1, provided the street parallel to the conveying direction transporting space A ₁ to substantially the center of the coating cell C1 in a plan view so as to be movable. Coating units 31 described above are arranged on one side of the transporting space A _1, a heat treatment unit 41 described above are arranged on one side of the transporting space A _1. The coating processing unit 31 applies a processing liquid to the substrate W. The heat treatment unit 41 performs heat treatment on the substrate W.

The coating units 31 are arranged vertically and horizontally, respectively facing the transporting space A _1. In the present embodiment, a total of four coating processing units 31 are arranged in two rows and two stages along the transport path of the substrate W.

  The coating processing unit 31 includes an antireflection film coating processing unit BARC that applies an antireflection film material to the substrate W, and a resist film coating processing unit RESIST that applies a resist film material to the substrate W. In this specification, the processing performed in the antireflection film coating processing unit BARC is appropriately described as antireflection film material coating processing, and the processing performed in the resist film coating processing unit RESIST is appropriately described as resist film material coating processing. Describe.

  There are a plurality (two) of antireflection film coating processing units BARC, and they are arranged side by side so as to be at substantially the same height in the lower stage. There are also a plurality of resist film coating processing units RESIST, and they are arranged side by side so as to be at substantially the same height in the upper stage. There are no partition walls or partition walls between the antireflection coating application units BARC. That is, all the antireflection coating application units BARC are only accommodated in a common chamber, and the atmosphere around each antireflection coating application unit BARC is not blocked (communicated). Similarly, the atmosphere around each resist film coating unit RESIST is not blocked from each other.

  Reference is made to FIGS. FIG. 8A is a plan view of the coating processing unit, and FIG. 8B is a cross-sectional view of the coating processing unit. Each coating processing unit 31 includes a rotation holding unit 32 that rotatably holds the substrate W, a cup 33 provided around the substrate W, a supply unit 34 that supplies a processing liquid to the substrate W, and the like.

  The supply unit 34 has a plurality of nozzles 35, a gripping unit 36 that grips one nozzle 35, and moves the gripping unit 36 so that the one nozzle 35 is displaced from the processing position above the substrate W and the top of the substrate W. And a nozzle moving mechanism 37 for moving between the standby positions. One end of a processing liquid pipe 38 is connected to each nozzle 35 in communication. The processing liquid pipe 38 is provided movably (flexibly) so as to allow movement of the nozzle 35 between the standby position and the processing position. The other end of each processing liquid pipe 38 is connected to a processing liquid supply source (not shown). Specifically, in the case of the antireflection film coating processing unit BARC, the processing liquid supply source supplies different types of antireflection film processing liquids to the nozzles 35. In the case of the resist film coating processing unit RESIST, the processing liquid supply source supplies different types of resist film materials to the nozzles 35.

  The nozzle moving mechanism 37 includes a first guide rail 37a and a second guide rail 37b. The first guide rails 37a are arranged in parallel with each other with the two cups 33 arranged side by side. The second guide rail 37 b is slidably supported by the two first guide rails 37 a and is installed on the two cups 33. The grip portion 36 is slidably supported by the second guide rail 37b. Here, the directions guided by the first guide rail 37a and the second guide rail 37b are both substantially horizontal directions and are substantially orthogonal to each other. The nozzle moving mechanism 37 further includes a drive unit (not shown) that slides and moves the second guide rail 37b and slides the grip portion 36. When the driving unit is driven, the nozzle 35 held by the holding unit 36 is moved to a position above the two rotation holding units 32 corresponding to the processing position.

Heat-treating units 41 are a plurality, are arranged vertically and horizontally, each facing the transporting space A _1. In this embodiment, three heat treatment units 41 can be arranged in the horizontal direction, and five heat treatment units 41 can be stacked in the vertical direction. Each heat treatment unit 41 includes a plate 43 on which the substrate W is placed. The heat treatment unit 41 includes a cooling unit CP for cooling the substrate W, a heating / cooling unit PHP for continuously performing the heating process and the cooling process, and a vapor atmosphere of hexamethyldisilazane (HMDS) for improving the adhesion between the substrate W and the film. It includes an adhesion processing unit AHL for heat treatment. The heating / cooling unit PHP has two plates 43 and a local transport mechanism (not shown) that moves the substrate W between the two plates 43. There are a plurality of various heat treatment units CP, PHP, and AHL, which are arranged at appropriate positions. In this specification, processing performed in the heating / cooling unit PHP is appropriately described as heating / cooling processing.

The main transport mechanism T ₁ will be described in detail. Please refer to FIG. FIG. 9 is a perspective view of the main transport mechanism. The main transport mechanism T ₁ has a fourth guide rail 52 for guiding the third guide rail 51 and the lateral two guiding in the vertical direction. Third guide rails 51 are fixed opposite each other at one side of the transporting space A _1. In this embodiment, it is arranged on the coating processing unit 31 side. The fourth guide rail 52 is slidably attached to the third guide rail 51. A base portion 53 is slidably provided on the fourth guide rail 52. The base 53 extends transversely, substantially to the center of the transporting space A _1. The main transport mechanism T _1, and further comprising a fourth guide rail 52 is moved in the vertical direction, drive members (not shown) for moving the base portion 53 in the lateral direction. When the drive unit is driven, the base unit 53 is moved to each position of the coating processing unit 31 and the heat treatment unit 41 arranged vertically and horizontally.

The base 53 is provided with a turntable 55 that can rotate about the vertical axis Q. On the turntable 55, two holding arms 57a and 57b for holding the substrate W are provided so as to be movable in the horizontal direction. The two holding arms 57a and 57b are arranged at positions close to each other in the vertical direction. Further, a drive unit (not shown) that rotates the turntable 55 and moves the holding arms 57a and 57b is provided. When this driving unit is driven, the turntable 55 is opposed to the respective coating processing units 31, the respective heat treatment units 41 and the placement units PASS ₁ and PASS _2, and is held with respect to these coating processing units 31 and the like. The arms 57a and 57b are advanced and retracted.

The coating cell C3 will be described. In addition, about the same structure as the application | coating cell C1, detailed description is abbreviate | omitted by attaching | subjecting the same code | symbol. The main transport mechanism T ₃ and processing unit in plan view with the layout of the coating cell C3 (arrangement) is substantially the same as those of the coating cell C1. Therefore, the arrangement of the various treating units of coating cell C3 as seen from the main transport mechanism T ₃ is substantially the same as the arrangement of the various treating units of the coating cell C1 as seen from the main transport mechanism T _1. The coating processing unit 31 and the heat treatment unit 41 of the coating cell C3 are respectively stacked below the coating processing unit 31 and the heat treatment unit 41 of the coating cell C1.

In the following, when distinguishing the resist film coating processing units RESIST and the like provided in the coating cells C1 and C3, subscripts “1” or “3” are respectively attached (for example, provided in the coating cell C1). The resist film coating processing unit RESIST is referred to as “resist film coating processing unit RESIST ₁ ”).

Other configurations of the processing block Ba will be described. As shown in FIGS. 4 and 5, a first blowing unit 61 that blows clean gas and a discharge unit 62 that sucks gas are provided in the transport spaces A ₁ and A ₃ , respectively. The first blowout unit 61 and exhaust unit 62 is a flat box having substantially the same area as the transporting space A ₁ in plan view. A first outlet 61 a and a discharge outlet 62 a are formed on one surface of the first outlet unit 61 and the discharge unit 62, respectively. In the present embodiment, the first outlet 61a and the outlet 62a are constituted by a large number of small holes f (see FIG. 9). The first blow-out unit 61 is arranged in the upper part of the transport spaces A ₁ and A ₃ with the first blow-out opening 61a facing downward. Further, the discharge unit 62 is disposed below the transport spaces A ₁ and A _{3 with} the discharge port 62a facing upward. Atmosphere atmosphere transporting space A ₃ of the transporting space A ₁ and is blocked off by the exhaust unit 62 of the transporting space A ₁ and the first blowout unit 61 of the transporting space A _3. Therefore, the atmospheres of the coating cells C1 and C3 are cut off from each other.

The first blowing units 61 in the transfer spaces A ₁ and A ₃ are connected to the same first gas supply pipe 63 in communication. The first gas supply pipe 63 is provided at a lateral position of the placement parts PASS ₂ and PASS ₄ from the upper part of the transport space A _{1 to} the lower part of the transport space A ₃ and horizontally below the transport space A _2. Is bent. The other end of the first gas supply pipe 63 is connected to a gas supply source (not shown). Similarly, the discharge units 62 of the transfer spaces A ₁ and A ₃ are connected to the same first gas discharge pipe 64. The first gas discharge pipe 64 is provided at a lateral position of the placement parts PASS ₂ and PASS ₄ from the lower part of the transfer space A _{1 to} the lower part of the transfer space A ₃ , and in the horizontal direction below the transfer space A _2. Is bent. Then, by sucking / discharging gas from the discharge port 62a causes blown gas from the first outlet 61a of the transporting space A _1, A _3, flows from top to bottom in the transport space A _1, A ₃ An air flow is formed, and each of the transfer spaces A ₁ and A ₃ is individually kept clean.

  As shown in FIGS. 1, 6, and 8 </ b> A, each coating processing unit 31 of the coating cells C <b> 1 and C <b> 3 is formed with a pit portion PS penetrating in the vertical direction. A second gas supply pipe 65 for supplying clean gas and a second gas discharge pipe 66 for exhausting gas are provided in the vertical hole PS in the vertical direction. Each of the second gas supply pipe 65 and the second gas discharge pipe 66 is branched at a predetermined height position of each coating processing unit 31 and drawn out in a substantially horizontal direction from the pothole portion PS. The plurality of branched second gas supply pipes 65 are connected to a second blowing unit 67 that blows gas downward. The plurality of branched second gas discharge pipes 66 are connected to the bottom of each cup 33, respectively. The other end of the second gas supply pipe 65 is connected in communication with the first gas supply pipe 63 below the coating cell C3. The other end of the second gas exhaust pipe 66 is connected in communication with the first gas exhaust pipe 64 below the coating cell C3. Then, while the gas is blown out from the second blowing unit 67 and the gas is discharged through the second gas discharge pipe 66, the atmosphere in each cup 33 is always kept clean, and the substrate held in the rotation holding unit 32. W can be processed suitably.

  In addition, piping and electric wiring (both not shown) through which the processing liquid is passed are installed in the hole portion PS. Thus, since the piping, wiring, etc. attached to the coating processing unit 31 of the coating cells C1, C3 can be accommodated in the pothole PS, the length of the piping, wiring, etc. can be shortened.

The processing block Ba includes one housing 75 that houses the main transport mechanisms T ₁ and T ₃ , the coating processing unit 31, and the heat treatment unit 41 described above. A processing block Bb, which will be described later, also includes a housing 75 that accommodates main transport mechanisms T ₂ and T ₄ and each processing unit included in the processing block Bb. The housing 75 of the processing block Ba and the housing 75 of the processing block Bb are separate bodies. As described above, the processing block 3 is provided with the housing 75 that accommodates the main transport mechanism T and each processing unit together, so that the processing unit 3 can be easily manufactured and assembled by arranging the processing blocks Ba and Bb. Can do.

[Processing block Bb]
The developing cell C2 will be described. In addition, about the same structure as the application | coating cell C1, detailed description is abbreviate | omitted by attaching | subjecting a same sign. Transporting space A ₂ in developing cell C2 is formed as an extension of the transporting space A _1.

The development cell C2 is provided with a development processing unit DEV that supplies a developer to the substrate W, a heat treatment unit 42 that performs heat treatment on the substrate W, and an edge exposure unit EEW that exposes the peripheral edge of the substrate W. Developing units DEV are arranged at one side of the transporting space A _2, heat-treating units 42 and edge exposing unit EEW are arranged at the other side of the transporting space A _2. Here, the development processing unit DEV is preferably disposed on the same side as the coating processing unit 31. Further, it is preferable that the heat treatment unit 42 and the edge exposure unit EEW are aligned with the heat treatment unit 41. In this specification, processing performed in the development processing unit DEV is appropriately described as development processing, and processing performed in the edge exposure unit EEW is appropriately described as edge exposure.

Developing units DEV is four, which are arranged two horizontally along the transporting space A ₂ are stacked in upper and lower stages. As shown in FIGS. 1 and 6, each development processing unit DEV includes a rotation holding unit 77 that holds the substrate W in a rotatable manner, and a cup 79 provided around the substrate W. Two development processing units DEV arranged side by side are provided without being partitioned by a partition wall or the like. Further, a supply unit 81 that supplies a developing solution to the two development processing units DEV is provided. The supply unit 81 has two slit nozzles 81a having slits or small hole arrays for discharging the developer. The length in the longitudinal direction of the slit or small hole array is preferably equivalent to the diameter of the substrate W. The two slit nozzles 81a are preferably configured to discharge different types or concentrations of developing solutions. The supply unit 81 further includes a moving mechanism 81b that moves each slit nozzle 81a. Thereby, each slit nozzle 81a is movable above the two rotation holding portions 77 arranged in the horizontal direction.

Heat-treating units 42 are a plurality, more aligned with are horizontally along the transporting space A _2, are stacked in a vertical direction. The heat treatment unit 42 includes a heating unit HP that heats the substrate W, a cooling unit CP that cools the substrate W, and a heating / cooling unit PHP that performs heating / cooling processing.

There are a plurality of heating / cooling units PHP. Each heating / cooling unit PHP is stacked in the vertical direction in the row closest to the IF unit 5, and one side portion of the heating / cooling unit PHP faces the IF unit 5 side. The heating / cooling unit PHP provided in the developing cell C2 has a transport port for the substrate W formed on the side thereof. For the heating / cooling unit PHP, an IF transport mechanism _{TIF, which} will be described later, transports the substrate W through the transport port. The heating / cooling unit PHP disposed in the developing cell C2 performs post-exposure heating (PEB) processing. Therefore, the heating / cooling process performed in the heating / cooling unit PHP provided in the developing cell C2 is particularly referred to as a PEB process. Similarly, the heating / cooling process performed on the developing cell C4 by the heating / cooling unit PHP is particularly described as a PEB process.

  The edge exposure unit EEW is single and is provided at a predetermined position. The edge exposure unit EEW includes a rotation holding unit (not shown) that rotatably holds the substrate W, and a light irradiation unit (not shown) that exposes the periphery of the substrate W held by the rotation holding unit. .

Further, a placement portion PASS ₅ is stacked on the upper side of the heating / cooling unit PHP. The main transport mechanism T ₂ and an IF transport mechanism T _{IF, which} will be described later, deliver the substrate W via the placement unit PASS ₅ .

The main transport mechanism T ₂ is disposed substantially at the center of the transporting space A ₂ in plan view. The main transport mechanism T ₂ has the same structure as the main transport mechanism T _1. The main transport mechanism T ₂ transports the substrate W between the placement unit PASS ₂ , the various heat treatment units 42, the edge exposure unit EEW, and the placement unit PASS ₅ .

The development cell C4 will be briefly described. The relationship between the development cell C2 and the development cell C4 is the same as the relationship between the coating cells C1 and C3. The processing units of the development cell C4 are a development processing unit DEV, a heat treatment unit 42, and an edge exposure unit EEW. The heat treatment unit 42 of the development cell C4 includes a heating unit HP, a cooling unit CP, and a heating / cooling unit PHP. On the upper side of the heating / cooling unit PHP of the developing cell C4, a placement unit PASS ₆ is stacked. The main transport mechanism T ₄ and an IF transport mechanism T _{IF, which} will be described later, deliver the substrate W via the placement unit PASS ₆ . The heating / cooling unit PHP provided in the developing cell C4 also performs a post-exposure heating (PEB) process on the exposed substrate W.

In the following, when distinguishing the development processing units DEV, edge exposure units EEW, and the like provided in the development cells C2 and C4, subscripts “2” and “4” are respectively attached (for example, the development cells C2 are assigned to the development cells C2). The provided heating unit HP is described as “heating unit HP ₂ ”).

The transport spaces A ₂ and A ₄ of the developing cells C 2 and C ₄ are also provided with configurations corresponding to the first blowing unit 61 and the discharge unit 62, respectively. Further, the development processing units DEV of the development cells C2 and C4 are respectively provided with configurations corresponding to the second blowing unit 67, the second gas discharge pipe 66, and the like.

[IF unit 5]
The IF unit 5 delivers the substrate W between the developing cells C2 and C4 of the processing block Bb and the exposure apparatus EXP. IF section 5 is provided with an IF's transport mechanisms _{T IF} for transporting the substrate W. The IF transport mechanism _TIF includes a first transport mechanism _TIFA and a second transport mechanism _TIFB that can transfer the substrate W to each other. The first transport mechanism _TIFA transports the substrate W to the development cells C2 and C4. As described above, _the first transport mechanism _{T IFA} in this embodiment, a part PASS _5, PASS ₆ mounting of the developing cell C2, C4, the substrate W with respect to each of the heating and cooling units PHP for developing cell C3, C4 Transport. The second transport mechanism T _IFB transports the substrate W to the exposure machine EXP.

As shown in FIG. 1, the first transport mechanism T _IFA and the second transport mechanism T _IFB are provided side by side in a lateral direction substantially orthogonal to the transport direction of the processing block Ba and the processing block Bb. The first transport mechanism _TIFA is disposed on the side of the developing cells C2 and C4 where the heat treatment unit 42 and the like are located. The second transport mechanism _TIFB is disposed on the side of the development cells C2 and C4 where the development processing unit DEV is located. Further, between the first and second transport mechanisms T _IFA , T _IFB , a placement unit PASS-CP for placing and cooling the substrate W, a placement unit PASS ₇ for placing the substrate W, and the substrate W Is provided in the buffer unit BFIF. The buffer unit BFIF can place or accommodate a plurality of substrates W. The first and second transport mechanisms T _IFA and T _IFB deliver the substrate W via the placement unit PASS-CP and the placement unit PASS ₇ . The buffer unit BFIF, exclusively the first transport mechanism _{T IFA} accesses.

As shown in FIG. 7, the first transport mechanism _TIFA is fixedly provided with a base 83, a lifting shaft 85 that expands and contracts vertically with respect to the base 83, and a swing with respect to the lifting shaft 85. And a holding arm 87 that moves back and forth in the turning radius direction and holds the substrate W. The second transport mechanism T _IFB also includes a base 83, a lifting shaft 85, and a holding arm 87.

  Next, the control system of the apparatus 10 will be described. FIG. 10 is a control block diagram of the substrate processing apparatus according to the embodiment. As illustrated, the apparatus 10 includes a control unit 90 and an input unit 101.

  The input unit 101 receives a command for designating a processing unit that actually processes an arbitrary processing unit on the substrate W from the user. Here, the processing units are all the processing units provided in each cell C described above (specifically, the coating processing unit 31, the heat treatment unit 41, the development processing unit DEV, the heat treatment unit 42, and the edge exposure unit). EEW). Further, in the following, when the processing unit 90 or the like distinguishes each processing unit into a processing unit that actually processes the substrate W and a processing unit that does not actually process the substrate W, the former is referred to as a “use processing unit”. The latter is referred to as a “standby processing unit”. The input unit 101 includes a pointing device represented by a mouse, a keyboard, a joystick, a trackball, a touch panel, and the like.

  The control unit 90 includes a main controller 91 and first to seventh controllers 93, 94, 95, 96, 97, 98, 99. The command received by the input unit 101 is input to the main controller 91. The main controller 91 comprehensively controls the first to seventh controllers 93 to 99.

The first controller 93 controls substrate transport by the _ID transport mechanism T _ID . The second controller 94 transports the substrate by the main transport mechanism T ₁ , resist film coating unit RESIST ₁ , antireflection film coating unit BARC ₁ , cooling unit CP ₁ , heating / cooling unit PHP _1, and adhesion processing unit AHL _1. Control the substrate processing at. The third controller 95 controls substrate transport by the main transport mechanism _{T 2,} and substrate treatment in the edge exposing unit EEW _2, developing units DEV _2, heating units HP ₂ and cooling units CP _2. The control of the fourth and fifth controllers 96 and 97 corresponds to the control of the second and third controllers 94 and 95, respectively. The sixth controller 98 controls substrate transport by the first transport mechanism _TIFA and substrate processing in the heating / cooling units PHP ₂ and PHP ₄ . The seventh controller 99 controls substrate transport by the second transport mechanism _TIFB . The first to seventh controllers 93 to 99 described above perform control independently of each other.

  Moreover, this apparatus 10 is equipped with detection part ER1, ER2, ..., ER7 which detects that the conveyance mechanism and processing unit which they control for every 1st thru | or 7th controllers 93-99 are in an abnormal state. . Each of the detection units ER1 to ER7 may be provided for each transport mechanism or for each processing unit. When each of the detection units ER1 to ER7 detects an abnormal state, the detection result is given to the main controller 91 via the corresponding first to seventh controllers 93 to 99.

  Here, the abnormal state refers to a state in which a substrate cannot be processed with a certain quality or more if it is a processing unit. For example, in the case of the resist film coating processing unit RESIST, an abnormality in the supply amount of the processing liquid is exemplified. Further, in the case of the heating / cooling unit PHP and the cooling unit CP, an abnormality in the temperature at which the substrate W is heat-treated is exemplified. In addition, mechanical abnormality of the processing unit is also included, such as when the substrate transfer port of each processing unit cannot be opened and closed, or when the substrate W cannot be rotated and held. In the case of the transport mechanism, there are exemplified cases in which the substrate W cannot be transported physically and the substrate cannot be transported cleanly due to contamination of the holding arm.

  Each of the main controller 91 and the first to seventh controllers 93 to 99 is a central processing unit (CPU) that executes various processes, a RAM (Random-Access Memory) that is a work area for arithmetic processing, It is realized by a storage medium such as a fixed disk for storing various information such as a processing recipe (processing program). In the processing recipe, the number of processing units mounted on the apparatus 10 by type and the processing time required for each processing unit to process one substrate W (“unit processing time by type”) are preliminarily set. It is remembered.

[1. Basic operation of this device]
Next, the operation of the substrate processing apparatus according to the embodiment will be described. First, the basic operation of the apparatus 10 will be described with reference to FIGS. 11 and 12, and then the characteristic operation of the apparatus 10 will be described. FIG. 11 is a flowchart for performing a series of processes on the substrate W, and shows a processing unit or a placement unit on which the substrates W are sequentially transferred. FIG. 12 is a diagram schematically showing the operations that each transport mechanism repeatedly performs, and clearly shows the order of processing units, placement units, cassettes, and the like accessed by the transport mechanism.

[ID transport mechanism T _ID ]
The ID transport mechanism T _ID moves to a position facing the one cassette C, holds one unprocessed substrate W accommodated in the cassette C in the holding arm 25 and carries it out of the cassette C. The ID transport mechanism T _ID turns the holding arm 25 and moves the lifting shaft 23 up and down to move to a position facing the mounting portion PASS ₁ to place the held substrate W on the mounting portion PASS _1A ( This corresponds to step S1a in Fig. 11. Hereinafter, only step symbols will be added. At this time, the substrate W is normally placed on the placement unit PASS _1B , and the substrate W is received and stored in the cassette C (step S23). In addition, when there is no substrate W in the placement unit PASS _1B , step S23 is omitted. Subsequently, the ID transport mechanism T _ID accesses the cassette C, and transports the substrate W accommodated in the cassette C to the placement unit PASS _3A (step S1b). Also here, if the substrate W is placed on the placement part PASS _3B , the substrate W is stored in the cassette C (step S23). The ID transport mechanism T _ID repeatedly performs the above-described operation.

The operation of the _ID transport mechanism T _ID is controlled by the first controller 93. Thereby, the substrate W of the cassette C is sent to the coating cell C1, and the substrate W discharged from the coating cell C1 is accommodated in the cassette C. Similarly, the substrate W of the cassette C is sent to the coating cell C3, and the substrate W discharged from the coating cell C3 is accommodated in the cassette C.

[Main transport mechanisms T ₁ , T ₃ ]
Since the operation of the main transport mechanism T ₃ is substantially the same as operation of the main transport mechanism T _1, a description will be given only the main transport mechanism T _1. The main transport mechanism T ₁ moves to a position facing the placement unit PASS ₁ . At this time, the main transport mechanism _{T 1} holds the substrate W received from the portion PASS _2B placing just before the one holding arm 57 (e.g., 57 b). Substrate on which the main transport mechanism _{T 1} is placed on (step S22), and mounting the other holding arm 57 (e.g. 57a) portion PASS _1A with placing the portion PASS _1B mounting the wafer W held Hold W.

The main transport mechanism _{T 1} accesses the cooling unit CP _1. The cooling unit CP ₁ there are other substrate W already cooling process is completed. With unloaded from the main transport mechanism T ₁ cooling unit CP ₁ holds the other substrate W in an empty (not holding the substrate W) holding arm 57, cooling the wafer W received from the mounting portion PASS _1A It carried into the unit CP _1. Then, the main transport mechanism T ₁ moves holding the cooled wafer W into the film coating units BARC _1. The cooling unit CP ₁ starts cooling processing for the loaded wafer W (step S2). This heat treatment (cooling) has already finished when the main transport mechanism T ₁ into the cooling processing unit CP ₁ next access. In the following description, also in the heat-treating units 41 and coating units 31 of various other, when the main transport mechanism T ₁ is accessed, it is assumed that the substrate W having been subjected to the predetermined processing each already.

When the antireflection film coating unit BARC ₁ is accessed, the main transport mechanism T ₁ unloads the substrate W on which the antireflection film is formed from the antireflection film coating unit BARC ₁ and reflects the cooled substrate W. It is placed on the rotation holding unit 32 of the coating treatment unit BARC ₁ for the prevention film. Thereafter, the main transport mechanism T ₁ holds the substrate W on which the antireflection film is formed and moves to the heating / cooling unit PHP ₁ . The antireflection film coating unit BARC ₁ starts the antireflection film material coating process on the substrate W placed on the rotation holding unit 32 (step S3a).

  Specifically, the rotation holding unit 32 rotates the substrate W in a horizontal posture, holds one nozzle 35 by the holding unit 36, and moves the held nozzle 35 above the substrate W by driving the nozzle moving mechanism 37. Then, the processing liquid for the antireflection film is supplied from the nozzle 35 to the substrate W. The supplied processing liquid spreads over the entire surface of the substrate W and is discarded from the substrate W. The cup 33 collects the discarded processing liquid. In this way, the process of coating and forming the antireflection film on the substrate W is performed.

The main transport mechanism T ₁ accesses the the heating and cooling unit PHP _1, with unloading the wafer W having the heat treatment from the heating and cooling unit PHP _1, turning on the wafer W having antireflection film formed thereon into the heating and cooling unit PHP ₁ . Then, the main transport mechanism _{T 1} holds and moves the wafer W taken out of the heating and cooling unit PHP ₁ to the cooling unit CP _1. In the heating / cooling unit PHP ₁ , the substrates W are sequentially placed on the two plates 43, the substrate W is heated on the one plate 43, and then the substrate W is cooled on the other plate 43 (step S 4 a).

The main transport mechanism T ₁ moved to the cooling unit CP _1, with a wafer W out of the cooling unit CP _1, and loads the wafer W held in the cooling unit CP _1. The cooling unit CP ₁ cools the loaded wafer W (step S5a).

Subsequently, the main transport mechanism T ₁ moves to the resist film coating unit RESIST ₁ . Then, the substrate W on which the resist film is formed is unloaded from the resist film coating processing unit RESIST ₁ , and the held substrate W is loaded into the resist film coating processing unit RESIST ₁ . The resist film coating unit RESIST ₁ applies the resist film material while rotating the substrate W that has been carried in (step S6a).

The main transport mechanism T ₁ further moves to the heating / cooling unit PHP ₁ and the cooling unit CP ₁ . Then, the wafer W having resist film formed thereon is carried into the heating and cooling unit PHP _1, transfers a wafer W to the cooling unit CP ₁ having undergone the processing in the heating and cooling unit portion PHP _1, the processing in the cooling unit CP ₁ The finished substrate W is received. The heating / cooling unit PHP ₁ and the cooling unit CP ₁ each perform a predetermined process on the unprocessed substrate W (steps S7a and S8a).

The main transport mechanism _{T 1} moves to the mounting portion PASS _2, held placed on the portion PASS _2A mounting the substrate W is (Step S9a), are placed on the placing portion PASS _2B substrate W Is received (step S21a).

Thereafter, the main transport mechanism T ₁ accesses the placement unit PASS ₁ again and repeats the above-described operation. This operation is controlled by the second controller 94. As a result, all the substrates W transferred from the cassette C to the placement unit PASS ₁ are transferred between the various processing units in the coating cell C1 along the transfer path described above, and predetermined processing is sequentially performed in each transferred processing unit. Is called.

The main transport mechanism T ₁ transports the substrate W transported to the placement unit PASS ₁ to a predetermined processing unit (cooling unit CP ₁ in the present embodiment) and also transfers the processed substrate W from the processing unit. Take out. Subsequently, the taken-out substrate W is transferred to the next processing unit (antireflection film coating processing unit BARC _{1 in} this embodiment), and the processed substrate W is taken out from this processing unit. In this manner, the substrates W that have been processed in the respective processing units are moved to new processing units, so that the processing is performed in parallel on the plurality of substrates W. Then, the substrate W placed on the placement unit PASS ₁ is placed on the placement unit PASS ₂ in order from the substrate W and discharged to the developing cell C2. Similarly, the substrates W placed on the placement unit PASS ₂ are placed on the placement unit PASS ₁ in order from the substrate W and discharged to the ID unit 1.

[Main transport mechanisms T ₂ , T ₄ ]
Since the operation of the main transport mechanism T ₄ is substantially the same as the operation of the main transport mechanism T _2, a description will be given only the main transport mechanism T _2. The main transport mechanism _{T 2} moves to a position opposed to the receiver PASS _2. At this time, the main transport mechanism T ₂ holds a wafer W received from a cooling unit CP ₂ accessed immediately before. The main transport mechanism _{T 2} places the part PASS _2B mounting the wafer W held (step S21a), for holding a substrate W placed on the placing portion PASS _2A (step S9a).

The main transport mechanism _{T 2} accesses into the edge exposing unit EEW _2. Then, the substrate W that has been subjected to the predetermined processing in the edge exposure unit EEW ₂ is received, and the cooled substrate W is carried into the edge exposure unit EEW ₂ . The edge exposure unit EEW ₂ irradiates the peripheral edge of the substrate W from a light irradiation unit (not shown) while rotating the loaded substrate W. Thereby, the periphery of the substrate W is exposed (step S10a).

The main transport mechanism T ₂ holds the substrate W received from the edge exposure unit EEW ₂ and accesses the placement unit PASS ₅ . Then, the substrate W held is placed on the placement unit PASS _5A (step S11a), and the substrate W placed on the placement unit PASS _5B is held (step S16a).

The main transport mechanism T ₂ moves to one of the cooling units CP _2, the wafer W held by replacing the substrate W in the cooling unit CP _2. The main transport mechanism T ₂ accesses the developing units DEV ₂ holds the wafer W having received cooling treatment. Cooling unit CP ₂ starts treatment of the newly loaded wafer W (step S17a).

The main transport mechanism T ₂ takes a wafer W that has been developed from the developing unit DEV _2, and places the cooled wafer W on the spin holder 77 of the developing unit DEV _2. The development processing unit DEV ₂ develops the substrate W placed on the rotation holding unit 77 (step S18a). Specifically, while the rotation holding unit 77 rotates the substrate W in a horizontal posture, the developing solution is supplied to the substrate W from any of the slit nozzles 81a to develop the substrate W.

The main transport mechanism T ₂ accesses one of the heating units HP ₂ holding the wafer W is developed. Then, the substrate W is unloaded from the heating unit HP ₂ and the substrate W to be held is put into the heating unit HP ₂ . Subsequently, the main transport mechanism T ₂ conveys the substrate W out of the heating unit HP ₂ to one of the cooling units CP _2, takes out the substrate W that is already processing completed in this cooling unit CP _2. Each of the heating unit HP ₂ and the cooling unit CP ₂ performs a predetermined process on the unprocessed substrate W (step S19a, step S20a).

Thereafter, the main transport mechanism T ₂ accesses the placement unit PASS ₂ again and repeats the above-described operation. This operation is controlled by the third controller 95. Thereby, the substrate W is delivered to the placement unit PASS _5A in the order of placement on the placement unit PASS _2A . Similarly, the substrates W are discharged to the placement unit PASS _2B in the order in which the substrates W are placed on the placement unit PASS _5B .

[IF transport mechanism T _IF to first transport mechanism T _IFA ]
First transport mechanism _{T IFA} accesses the receiver PASS _5, and receives the substrate W placed on the placing part PASS _5A (step S11a). The first transport mechanism _TIFA holds the received substrate W, moves to the placement unit PASS-CP, and carries it into the placement unit PASS-CP (step S12).
Next, it receives the substrate W from the first transport mechanism _{T IFA} placing part PASS ₇ (step S14), and moves to a position opposed to the heating and cooling units PHP _2. The first transport mechanism _{T IFA} takes out a of the heating and cooling unit PHP ₂ already heated after exposure from (PEB) processing has finished substrate W, and carries the wafer W received from the placing part PASS ₇ of the heating and cooling units PHP ₂ . The heating / cooling unit PHP ₂ heat-treats the unprocessed substrate W (step S15).

The first transport mechanism _{T IFA} transports the wafer W taken out of the heating and cooling unit PHP ₂ to the mounting portion PASS _5B (step S16a). Subsequently, the first transport mechanism _TIFA transports the substrate W placed on the placement unit PASS _6A to the placement unit PASS-CP (steps S11b and S12). Next, the first transport mechanism _TIFA is transported from the placement unit PASS ₇ to the heating / cooling unit PHP ₄ . At this time, the substrate W that has been subjected to post-exposure heating (PEB) processing in the heating / cooling unit PHP ₄ is taken out and placed on the placement unit PASS _4B (steps S14, S15b, and S16b).

Thereafter, the first transport mechanism _TIFA accesses the placement unit PASS ₅ again and repeats the above-described operation. This operation is controlled by the sixth controller 98.

[IF transport mechanism T _IF to second transport mechanism T _IFB ]
The second transport mechanism T _IFB takes out the substrate W from the placement unit PASS-CP and transports it to the exposure apparatus EXP. The exposure machine EXP exposes the substrate W (step S13). Then, when the exposed substrate W delivered from the exposure machine EXP is received, it is transported to the placement unit PASS ₇ .

Thereafter, the second transport mechanism _TIFB accesses the placement unit PASS-CP again and repeats the above-described operation.

[2. Characteristic operation of this device]
Next, a characteristic operation of the present embodiment will be described. Here, a description will be given of the transport operation of the main transport mechanism T ₁ in the coating cell C1 as an example. Further, for simplicity of explanation, the conveyance operation of the main transport mechanism T _1, is described as the step S6a in Fig. 11 to step S8a.

  As a further premise, the coating cell C1 has three resist film coating processing units RESIST used in step S6a, two heating / cooling units PHP used in step S7a, and one cooling unit CP used in step S8a. It shall be equipped with. Hereinafter, in order to distinguish these processing units, they are described as resist film coating processing units RESISTa, “RESISTb, RESISTc. Similarly, they are described as heating / cooling units PHPa, PHPb.

  Further, the processing time required for each resist film coating processing unit RESIST to process one substrate W, that is, the unit time for each type is 60 seconds. Similarly, the unit time by type of each heating / cooling unit PHP is 40 seconds, and the unit time by type of each cooling unit CP is 20 seconds.

Under this premise, each resist film coating processing unit RESIST, each heating / cooling unit PHP, and cooling unit CP correspond to the processing section in the present invention. The main transport mechanism T ₁ is equivalent to the transport unit. The buffer unit BF2 corresponds to the buffer unit in the present invention. However, the processing unit, the transport unit, and the buffer unit in the present invention are not limited to these configurations.

  Please refer to FIG. FIG. 13 is a flowchart showing a processing procedure of the control unit 90.

<Step V1> Setting of Use Processing Unit The user operates the input unit 101 to specify a use processing unit. The control unit 90 determines the designated processing unit as the use processing unit based on the command received by the input unit 101. In addition, a processing unit that is not designated as a use processing unit is determined as a standby processing unit.

<Step V2> Setting of transport cycle and transport destination Processing by type of resist film coating processing unit RESIST is divided by the number of resist film coating processing units RESIST to be processed by type of resist film coating processing unit RESIST. Calculate time. The processing time for each type of the heating / cooling unit PHP and the cooling unit CP is calculated by the same method. Then, the longest processing time by type is set as the conveyance cycle. In addition, various processing units determined as use processing units are set as transport destinations.

  For example, when all the processing units are determined to be use processing units, the processing is as follows. That is, since there are three resist film coating processing units RESIST, the processing time for each type is 20 seconds. Since there are two heating / cooling units PHP, the processing time for each type is 20 seconds. Since there is one cooling unit CP, the processing time for each type is 20 seconds. Accordingly, the control unit 90 sets 20 seconds, which is the longest processing time for each type, as the conveyance cycle. In addition, all the processing units RESISTa, RESISTb, RESISTc, PHPa, PHPb, and CP are set as transport destinations.

Each conveying cycle <Step V3> conveyance control controller 90 is set, as the transport destination only use processing unit, to operate the main transport mechanism T _1.

<Step V4> Is there an abnormal use processing unit?
The control unit 90 monitors whether or not the use processing unit is in an abnormal state based on the detection results of the detection units ER1 to ER7. If there is no use processing unit in an abnormal state, the process returns to step V3 to repeat the above-described transport operation.

Reference is now made to FIG. FIG. 14 is a timing chart illustrating the process steps. 14, reference numeral u1, u2, u3, black triangles which are indicated by the ...... are each carrier period t1, t2, t3, the conveying operation of the main transport mechanism _{T 1} in ... show schematically. 15, the transport operation u1, u2 shown in FIG. 14, u3, a diagram illustrating a specific operation of the main transport mechanism _{T 1} in .... FIG. 14 and FIG. 15 illustrate operations when all processing units are determined to be use processing units and there is no use processing unit in an abnormal state.

  As shown in FIG. 14, the substrate W is transferred to all the processing units RESISTa, RESISTb, RESISTc, PHPa, PHPb, and CP. Each transport operation u is performed every transport cycle (20 seconds).

Focusing on the transport operation u4 in the transport period t4, the transport operation u4 corresponds to the operation in the following sequence by the main transport mechanism T _1. First, the main transport mechanism _{T 1} as well as out the substrate W6 the resist film coating units RESISTa, carries the substrate W9. Subsequently, the substrate W4 is unloaded from the heating / cooling unit PHPa, and the substrate W6 is loaded. Finally, the substrate W3 is unloaded and the substrate W4 is loaded into the cooling unit CP.

  Step V4 will be described again. If there is an abnormal use processor, the process proceeds to step V5.

<Step V5> Change of Use Processing Unit The control unit 90 changes the use processing unit in an abnormal state to a standby processing unit.

<Step V6> Update of conveyance cycle and conveyance destination The control unit 90 updates the conveyance cycle so far to a conveyance cycle obtained based on the number of changed use processing units. Also, the control unit 90 updates the transport destination so that only the changed use processing unit is the transport destination. As a result, the processing unit detected as being in an abnormal state in step V4 is removed from the transport destination.

<Step V7> Can it be forcibly transported?
Subsequently, the control unit 90 determines whether or not the processing unit can be forcibly transported to a processing unit that is out of the transport destination. By "forced transportable", the main transport mechanism T ₁ to the disorder, injury, conveyor portion without depression occurs is that the substrate can load / unload the processing unit. Therefore, it has nothing to do with whether or not the processing unit can process the substrate with a certain quality or higher. Further, when determining whether or not the transfer is possible, in the transfer operation u in the transfer cycle t that is in progress at the time when the transfer destination is updated in Step V6, the substrate W is not transferred to a processing unit that is out of the transfer destination. It is uniformly determined that the conveyance is possible (corresponding to “Operation Example 2” described later).

  When the control unit 90 determines that conveyance is forcibly possible, the process proceeds to step V8. On the other hand, when the controller 90 determines that it cannot be forcibly conveyed, the process proceeds to step V9.

<Step V8> Forced conveyance The controller 90 continues the conveyance operation u in the conveyance cycle t that is in progress at the time when the conveyance destination is updated in step V6. Specifically, the substrate W is unloaded to the processing unit deviated from the transfer destination, and the substrate W is loaded.

<Step V9> Transfer to Buffer Unit The control unit 90 stops the substrate transfer to the processing unit that is out of the transfer destination in the transfer operation u in the transfer cycle t that is in progress at the time when the transfer destination is updated in Step V6. And the board | substrate W which was going to carry in to the processing unit offset from the conveyance destination is mounted in a buffer part.

When the transport operation u in the transport period t in progress at the time the <step V10> updates the transporting destination switching step V6 conveyance control is completed, the control unit 90 switches the conveyance control of the main transport mechanism T _1, Step V3 Proceed to At step V3, it controls the main transport mechanism T ₁ based on the transport cycle and the transport destination is updated.

  Here, operation examples 1 and 2 in steps V4 to V8 and V3 and operation example 3 in steps V4 to V7, V9, and V3 are illustrated.

  As a premise, the heating / cooling unit PHPa is determined to be in an abnormal state (step V4), and the heating / cooling unit PHPa is changed from the use processing unit to the standby processing unit (step V5). In this case, since there is one heating / cooling unit PHP, the processing time for each type is 40 seconds. Since the processing time for each type of the resist film coating processing unit RESIST remains 20 seconds and the processing time for each type of the cooling unit CP remains 20 seconds, the conveyance cycle is updated to 40 seconds (step V6). The transport destination is updated to the processing units RESISTa, RESISTb, RESISTc, PHPb, and CP, and the heating / cooling unit PHPa is removed from the transport destination (step V6).

<Operation Example 1: Steps V4 to V8, V10, V3>
The control unit 90 updates the transfer destination while the transfer period t4 is in progress (step V6), and the case where it is determined that the substrate W can be forcibly transferred to the heating / cooling unit PHPa (step V7) will be described.

In this case, the substrate transport by the main transport mechanism T ₁ is as shown in FIG. 16, FIG. 17. FIG. 16 is a timing chart illustrating the process steps. FIG. 16A shows only the period before the transfer destination is updated, and FIG. 16B shows the period before and after the transfer destination is updated. FIG. 17 is a diagram schematically showing the transport operation u4 and subsequent steps shown in FIG.

As shown in FIGS. 16B and 17, the transport operation u4 itself in the transport cycle t4 in progress at the time of the update is the same as in FIGS. That is, first, the main transport mechanism _{T 1} as well as out the substrate W6 the resist film coating units RESISTa, carries the substrate W9. Subsequently, the substrate W4 is unloaded from the heating / cooling unit PHPa, and the substrate W6 is loaded. Finally, the substrate W3 is unloaded and the substrate W4 is loaded into the cooling unit CP. As described above, the control unit 90 continues the transfer operation u4 in the transfer period t4 in progress at the time when the transfer destination is updated as it is.

  From the subsequent conveyance cycle t5, the conveyance control based on the updated conveyance destination and conveyance cycle is switched (steps V10 and V3). Specifically, the heating / cooling unit PHPa is removed from the transfer destination after the transfer operation u5. As a result, the substrate W6 remains carried into the heating / cooling unit PHPa. Further, after the first conveyance cycle t5 that starts newly after the conveyance cycle t4 that is in progress at the time of updating the conveyance destination, the conveyance cycle t is changed to 40 seconds. Further, as clearly shown in FIG. 16B, the first transfer cycle t5 to be switched to the updated transfer cycle is started when 20 seconds have elapsed from the start of the immediately preceding transfer cycle t4. That is, even when the conveyance period is updated while the conveyance period t4 is in progress and the period of the conveyance period changes before and after the update, the control unit 90 does not update the conveyance period t4 (20 seconds). Maintain.

<Operation Example 2: Steps V4 to V8, V10, V3>
Another example of operation when it is determined that conveyance is forcibly possible will be described. Based on the above assumptions, the control unit 90 will be described in the case where the transfer destination is updated during the transfer period t5 (step V6). In this case, since the substrate W is not transferred to the heating / cooling unit PHPa in the transfer operation u5 in the transfer cycle t5, it is determined that the substrate can be forcibly transferred (step V7).

In this case, the substrate transport by the main transport mechanism T ₁ 18 is as shown in FIG. 19. FIG. 18 is a timing chart illustrating the processing steps. FIG. 18A shows only a period before the transfer destination is updated, and FIG. 18B shows a period before and after the transfer destination is updated. FIG. 19 is a diagram schematically showing the conveyance operation u5 and subsequent steps shown in FIG.

As shown in FIGS. 18B and 19, the transport operation u <b> 5 itself in the transport cycle t <b> 5 in progress at the time of the update is the same as FIGS. 14 and 15. That is, first, the main transport mechanism _{T 1} as well as out the substrate W7 the resist film coating units RESISTb, carries the substrate W10. Subsequently, the substrate W5 is carried out to the heating / cooling unit PHPb, and the substrate W7 is carried in. Finally, the substrate W4 is unloaded from the cooling unit CP and the substrate W5 is loaded. As described above, the control unit 90 continues the transfer operation u5 in the transfer cycle t5 in progress at the time when the transfer destination is updated.

  From the subsequent conveyance cycle t6, the control is switched to the conveyance control based on the updated conveyance destination and the updated conveyance cycle (steps V10 and V3). Specifically, the heating / cooling unit PHPa is removed from the transfer destination after the transfer operation u6. As a result, the substrate W6 remains carried into the heating / cooling unit PHPa. Further, after the conveyance cycle t6, the conveyance cycle t is changed to 40 seconds. Further, as clearly shown in FIG. 18B, the first transport cycle t6 to be switched to the updated transport cycle is started when 40 seconds have elapsed from the start of the immediately preceding transport cycle t5. That is, when the conveyance period is updated while the conveyance cycle t5 is in progress and the period of the conveyance cycle t changes before and after the update, the updated first conveyance cycle t6 is set as the start of the immediately preceding conveyance cycle t5. Is started when a time corresponding to the updated conveyance cycle t (40 seconds) has elapsed.

<Operation Example 3: Steps V4 to V7, V9, V10, V3>
Next, an example of an operation when it is determined that it cannot be forcibly conveyed will be exemplified. Here, the control unit 90 updates the transfer destination described above during the transfer period t4 (step V6), and determines that the substrate W cannot be forcibly transferred to the heating / cooling unit PHPa (step V7). The case will be explained.

In this case, the substrate transport by the main transport mechanism T ₁ 20 is as shown in FIG. 21. FIG. 20 is a timing chart illustrating processing steps. FIG. 20A shows only a period before the transfer destination is updated, and FIG. 20B shows a period before and after the transfer destination is updated. FIG. 21 is a diagram schematically showing the transport operation u4 and subsequent steps shown in FIG.

As shown in FIG. 18 (b) and FIG. 19, first, the main transport mechanism _{T 1} as well as out the substrate W6 the resist film coating units RESISTa, carries the substrate W9. Subsequently, the transfer of the substrate W6 to the heating / cooling unit PHPa is stopped. Then, the substrate W6 is placed on the buffer unit BF2. Finally, the substrate W3 is unloaded from the cooling unit CP. In this way, the control unit 90 stops loading the substrate W6 into the heating / cooling unit PHPa and loads it into the heating / cooling unit PHPa in the transfer operation u4 in the transfer cycle t4 that is in progress at the time when the transfer destination is updated. The planned substrate W6 is placed on the buffer unit BF2.

  From the subsequent conveyance cycle t5, the conveyance control based on the updated conveyance destination and conveyance cycle is switched (steps V10 and V3). Specifically, the heating / cooling unit PHPa is removed from the transfer destination after the transfer operation u5. As a result, the substrate W6 remains placed on the buffer unit BF2. Further, the transport cycle t5, t6,... Is changed to 40 seconds.

  As described above, according to the substrate processing apparatus according to the first embodiment, the control unit 90 distinguishes each processing unit into the use processing unit and the standby processing unit, and transports according to the transport cycle and the transport destination according to only the use processing unit. Control part. As a result, the transfer cycle can always be maintained in an appropriate period, and the transfer destination can be limited to only the processing units that actually transfer the substrate W. Therefore, not only when all of the processing units included in the coating cell C1 are use processing units, but also when a part of the processing unit included in the coating cell C1 is a use processing unit, the substrate W can be efficiently used. A plurality of types of processing can be performed on the substrate W in a predetermined order by being conveyed.

  Further, in the above-described embodiment, for the convenience of explanation, the focus is on only the coating cell C1, but the same applies to the other cells C2 to C4. Therefore, according to this apparatus 10, not only when all of the processing units included in this apparatus 10 are use processing units, but also when a part of the processing units included in this apparatus 10 is a use processing unit. In addition, the substrate W can be efficiently transported and a plurality of types of processing can be performed on the substrate W in a predetermined order.

In addition, when the control unit 90 changes the use processing unit, the control unit 90 updates the transfer cycle and transfer destination to the transfer cycle and transfer destination according to the changed use processing unit, and updates the transfer cycle and transfer destination. Based on the above, the main transport mechanisms T ₁ to T ₄ are controlled. Thereby, even if it is a case where a use process part is changed, since the order which performs a several kind of process is not changed with the predetermined order, the board | substrate W can be processed suitably.

  Further, when the control unit 90 determines that the processing unit designated as the use processing unit is in an abnormal state, it automatically changes to the standby processing unit (steps V4 and V5), so that the substrate processing can be continued smoothly. Can do.

The control unit 90, when updating the transport destination during the operation of the main transport mechanism T _1, so as to convey the conveyance destination only on the substrate W after the update from the new starting conveying period t after the update, the main transport mechanism switch the control of T _1. Thus, even if updated transport destination when the main transport mechanism T ₁ is operating, the control unit 90 does not switch the transport destination of the main transport mechanism T ₁ in principle in the operation of the main transport mechanism T _1. As a result, the transport operation u in each transport cycle t can be determined in principle before the operation starts. Therefore, it is possible to control the transport unit reliably and smoothly.

However, it updates the transporting destination during the operation of the main transport mechanism T _1, if there is a processing unit out of the transport destination before and after the update, and not possible forcibly transport the substrate to the processing unit out of the transport destination determined When this happens, the transfer of the substrate W to the processing unit is stopped. Thereby the main transport mechanism T ₁ is to avoid falling into non transport. In this case, since the apparatus 10 includes the buffer unit BF2, the substrate W that was to be transported to the processing unit that has been removed from the transport destination is placed on the buffer unit. Thus, it is possible to continue suitably subsequent conveying operation u of the main transport mechanism T _1.

On the other hand, when it is determined that the transportable, the main transport mechanism T ₁ also continues substrate transfer with respect to the processing unit. Thus, it can be avoided as much as possible to change the transport destination in the middle of the conveying operation of the main transport mechanism T _1.

  In addition, since the input unit 101 is provided, the user can arbitrarily designate the use processing unit.

  The present invention is not limited to the above-described embodiment, and can be modified as follows.

  (1) In the above-described embodiment, the input unit 101 is provided, and an instruction for designating an arbitrary processing unit as a use processing unit is received from the user. However, the present invention is not limited to this. For example, the control unit 90 may be configured to set a processing unit that is not in an abnormal state as a use processing unit. In this case, in step V1, the control unit 90 can automatically determine each processing unit as a use processing unit or a standby processing unit based on the detection results of the detection units ER1 to ER7, and the setting work by the user is omitted. can do.

  (2) In the embodiment described above, the longest processing time for each type among the processing times for each type of the resist film coating processing unit RESIST, the heating / cooling unit PHP, and the cooling unit CP is set as the transport cycle (step V2). However, the method for calculating the conveyance period is not limited to this. For example, the conveyance period may be a time obtained by adding a predetermined time to the longest processing time by type.

  (3) In the embodiment described above, when the control unit 90 determines that there is a use processing unit in an abnormal state (step V4), the control unit 90 changes the processing unit set in the use processing unit to a standby processing unit. (Step V5) is configured as described above, but is not limited thereto. For example, the input unit 101 is configured to accept a command for the user to change from the usage processing unit to the standby processing unit, and the control unit 90 changes the usage processing unit based on the command received by the input unit 101. You may comprise. According to this modification, even when the apparatus 10 is processing the substrate W, the user can arbitrarily change the use processing unit.

  The control unit 90 may determine whether or not the processing unit of the standby processing unit is no longer in an abnormal state, and may change the standby processing unit that is no longer in an abnormal state to a use processing unit. Alternatively, the input unit 101 is configured to accept a command for the user to change from the standby processing unit to the usage processing unit, and the control unit 90 changes the standby processing unit to the usage processing unit based on the user's command. You may comprise as follows. According to this modification, all normal processing units can be automatically operated, and the processing capability of the apparatus 10 can be kept high.

  (4) In the above-described embodiment, the operation example 1 is specifically exemplified as the operation example of the steps V4 to V8, V10, and V3. Here, in the operation example 1, it has been described that the substrate W4 unloaded from the heating / cooling unit PHPa deviated from the transfer destination is loaded into the cooling unit CP, but the present invention is not limited to this. For example, the substrate W4 carried out from the heating / cooling unit PHPa may be transferred to the buffer unit BF2, and the cooling process may be stopped on the substrate W4. Thereby, it is possible to prevent the processing quality of the substrate W from being varied.

  (5) In the above-described embodiment, it has been described in the operation example 1 that the substrate W6 is carried into the heating / cooling unit PHPa that is removed from the transfer destination, but the present invention is not limited thereto. For example, even if it is determined that the substrate W can be forcibly transported to the heating / cooling unit PHPa, the substrate W6 scheduled to be carried into the heating / cooling unit PHPa may be changed to be transported to the buffer unit BF2.

  (6) In the above-described embodiment, in the operation example 1 and the operation example 3, from the first transfer cycle t5 newly started after the transfer cycle t4 in progress at the time of update of the transfer cycle, the updated transfer cycle t ( 40 seconds). Similarly, in the operation example 2, it has been described that the first transfer cycle t6 newly started after the transfer cycle t5 that is in progress when the transfer cycle is updated is changed to the updated transfer cycle t (40 seconds). However, switching to the updated transfer cycle t (40 seconds) may not be from the first transfer cycle that starts newly after the transfer cycle t in progress at the time of update of the transfer cycle. For example, when the transfer cycle t changes during the transfer cycle t4, the transfer cycle t6 or the transfer cycle t after that may be switched to the updated transfer cycle t (40 seconds). Good.

  Similarly, in the operation example 1 and the operation example 3, the transfer destination is switched to the updated transfer destination after the transfer period t5 next to the transfer period t4 in progress at the time when the transfer destination is updated. However, the present invention is not limited to this. In other words, when the transport destination changes during the progress of the transport cycle t4, the transport cycle may be changed to the updated transport destination from the transport cycle t6 or the subsequent transport cycle t.

(7) In the above-described embodiment, the control unit 90 controls each processing unit by distinguishing between the use processing unit and the standby processing unit, but the present invention is not limited to this. For example, the application cells C1 and C3 and the development cells C2 and C4 may be controlled separately from the use processing unit and the standby processing unit. In this case, the substrate transport of the _ID transport mechanism T _ID is controlled depending on whether each of the coating cells C1 and C3 is a use processing unit, and the IF transport mechanism is determined depending on whether each of the development cells C2 and C4 is a use processing unit. Change to control substrate transport of _TIF . Thereby, the control unit 90 performs a process of forming a resist film on the substrate W by the coating cells C1 and C3 and a process of developing the substrate W by the development cells C2 and C4 even if the use processing unit is changed. Control to perform in this order. In the case of this modification, each of the cells C1 to c4 corresponds to a processing unit in the present invention. Further, the ID transport mechanism T _ID and the IF transport mechanism T _IF correspond to the transport unit in the present invention.

  (8) In the above-described embodiment, the order of a plurality of types of processing is illustrated in each of the cells C1 to C4. However, the order is not limited to this, and may be appropriately changed.

  (9) In the above-described embodiment, the number of each processing unit by type and the unit processing time by type of each processing unit unit are exemplified, but the present invention is not limited to this. If there are a plurality of processing units of any type, the processing units of other types may be single. In addition, all types of processing units may be plural.

  (10) In the above-described embodiment, the configuration includes a plurality of cells C1 to C4, but is not limited thereto. A device including only a single cell C may be used.

  (11) In the above-described embodiment, the application cell C1 and the development cell C2 are provided, and the application cell C3 and the development cell C4 are provided. The column of the cell C may be single or three or more.

  (12) In the above-described embodiment, the process of forming a resist film on the substrate W, the post-exposure heating (PEB) process, and the development process are performed. However, the present invention is not limited to this. For example, the apparatus may be changed to an apparatus that performs other processes such as a cleaning process on the substrate W.

  (13) The configurations described in the above-described embodiments and the modifications (1) to (12) may be appropriately combined.

It is a top view which shows schematic structure of the substrate processing apparatus which concerns on an Example. It is a schematic side view which shows arrangement | positioning of the processing unit which a substrate processing apparatus has. It is a schematic side view which shows arrangement | positioning of the processing unit which a substrate processing apparatus has. It is each vertical sectional view of the aa arrow in FIG. It is each vertical sectional view of the bb arrow in FIG. It is each vertical sectional view of cc arrow in FIG. It is each vertical sectional view of the dd arrow in FIG. (A) is a top view of a coating processing unit, (b) is sectional drawing of a coating processing unit. It is a perspective view of a main conveyance mechanism. It is a control block diagram of the substrate processing apparatus which concerns on an Example. It is a flowchart of a series of processes performed on a substrate. It is a figure which shows typically the operation | movement which each conveyance mechanism repeats, respectively. It is a flowchart which shows the process sequence of a control part. It is a timing chart which illustrates the process of processing. It is a figure which shows the specific operation | movement procedure of the main conveyance mechanism in each conveyance operation | movement shown in FIG. It is a timing chart which illustrates the process of processing, (a) shows only the period before the update of a conveyance destination, and (b) shows the period before and behind the update of a conveyance destination. It is a figure which shows the specific operation | movement procedure of the main conveyance mechanism in each conveyance operation | movement shown in FIG.16 (b). It is a timing chart which illustrates the process of processing, (a) shows only the period before the update of a conveyance destination, and (b) shows the period before and behind the update of a conveyance destination. It is a figure which shows the specific operation | movement procedure of the main conveyance mechanism in each conveyance operation | movement shown in FIG.18 (b). It is a timing chart which illustrates the process of processing, (a) shows only the period before the update of a conveyance destination, and (b) shows the period before and behind the update of a conveyance destination. It is a figure which shows the specific operation | movement procedure of the main conveyance mechanism in each conveyance operation | movement shown in FIG.20 (b).

1 ... Indexer part (ID part)
5 ... Interface part (IF part)
DESCRIPTION OF SYMBOLS 31 ... Coating processing unit 41, 42 ... Heat processing unit 90 ... Control part 101 ... Input part C1, c3 ... Coating cell C2, C4 ... Development cell Ba, Bb ... Processing block RESIST ... Resist film coating processing unit HP ... Heating unit CP , CPa, CPb ... cooling unit DEV ... developing unit EEW ... edge exposing unit T _ID ... ID's transport mechanism _{T 1, T 2, T 3} , T 4 ... carrying the main transport mechanism T _IF ... IF mechanism T _IFA ... first 1 transport mechanism T _IFB ... 2nd transport mechanism PASS, PASS-CP ... placement part BF2, BF4, BFIF ... buffer part ER1 to ER7 ... detection part A ₁ , A ₂ , A ₃ , A ₄ ... transport space EXP ... exposure Machine C ... Cassette W ... Substrate t ... Transfer cycle u ... Transfer operation

Claims (19)

In a substrate processing apparatus for performing a plurality of types of processing on a substrate in a predetermined order,
Provided for each type of processing, and at least for any type, a plurality of processing units,
A transport unit capable of transporting a substrate to each processing unit;
Distinguishing between the use processing unit that actually processes the substrate among the processing units and the standby processing unit that does not actually process the substrate, only each use processing unit is provided for each transfer cycle according to the number of use processing units. A control unit that operates the transfer unit as a transfer destination, and causes the substrate to perform the plurality of types of processing in the predetermined order;
Equipped with a,
The control unit is a case where the transport destination is updated during the operation of the transport unit, and when there is a processing unit that deviates from the transport destination before and after the update,
Determine whether the substrate can be forcibly transported to the processing section that is out of the transport destination,
A substrate processing apparatus that, when it is determined that transfer is not possible, stops transferring a substrate to a processing unit that has been removed from the transfer destination in an ongoing transfer cycle when updated . The substrate processing apparatus according to claim 1,
The said control part is a substrate processing apparatus which performs the said multiple types of process to a board | substrate, even if it is a case where a use process part is changed, without changing the said predetermined order. In the substrate processing apparatus of Claim 1 or Claim 2,
When the use processing unit is changed, the control unit updates the transfer cycle and the transfer destination to the transfer cycle and the transfer destination according to the changed use processing unit, and based on the updated transfer cycle and the transfer destination, A substrate processing apparatus for controlling a transfer unit. In the substrate processing apparatus in any one of Claims 1-3,
Provided with an input unit that accepts an instruction to specify an arbitrary processing unit as a use processing unit from a user,
The substrate processing apparatus, wherein the control unit determines a use processing unit based on a command received by the input unit. The substrate processing apparatus according to claim 4,
When the use processing unit is in an abnormal state, the control unit changes the use processing unit to a standby processing unit regardless of a command received by the input unit. In the substrate processing apparatus in any one of Claims 1-3,
The said control part is a substrate processing apparatus which determines the process part which is not in an abnormal state to a use process part. In the substrate processing apparatus in any one of Claims 1-6,
When the transfer unit is updated during the operation of the transfer unit, the control unit switches the control of the transfer unit so that the substrate is transferred only to the updated transfer destination from the transfer period newly started after the update. apparatus. In the substrate processing apparatus in any one of Claims 1-7 ,
A buffer unit for mounting the substrate;
The transport unit can transport the substrate to the buffer unit;
When the control unit determines that it cannot be forcibly transported to the processing unit removed from the transport destination, the substrate that was scheduled to be transported to the processing unit out of the transport destination in the ongoing transport cycle when it is updated. A substrate processing apparatus to be placed on the buffer unit. In the substrate processing apparatus in any one of Claims 1-8 ,
When the control unit determines that it can be forcibly transported to a processing unit that is out of the transport destination, it continues to transport the substrate to the processing unit that is out of the transport destination in the ongoing transport cycle when updated. A substrate processing apparatus. In the substrate processing apparatus in any one of Claims 1-9 ,
When the control unit determines that the processing unit can be forcibly transported to a processing unit that is out of the transport destination, the substrate processing is performed so that the substrate is also unloaded from the processing unit out of the transport destination in the ongoing transport cycle when updated. apparatus. In the substrate processing apparatus in any one of Claims 1-10 ,
When the control unit determines that it can be forcibly transported to a processing unit that is out of the transport destination, the substrate processing is performed to bring the substrate into the processing unit that is out of the transport destination in the ongoing transport cycle when updated. apparatus. The substrate processing apparatus according to any one of claims 1 to 11 ,
A buffer unit for mounting the substrate;
The transport unit can transport the substrate to the buffer unit;
When the control unit determines that the processing unit can be forcibly transported to the processing unit removed from the transport destination, the buffer unit transfers the substrate unloaded from the processing unit out of the transport destination in the ongoing transport cycle when updated. A substrate processing apparatus to be placed on the substrate. The substrate processing apparatus according to any one of claims 1 to 12 ,
When the transfer period is updated during the operation of the transfer unit and the transfer period changes before and after the update, the control unit transfers the updated transfer from the next transfer period in progress when the update is performed. The substrate processing apparatus which controls the said conveyance part based on a period. The substrate processing apparatus according to claim 13 ,
In the control of the transport unit, when switching from the transport cycle before the update to the transport cycle after the update, the control unit is updated when the time corresponding to the transport cycle after the update has elapsed from the start of the previous transport cycle. The substrate processing apparatus which starts the conveyance cycle. In the substrate processing apparatus in any one of Claims 1-14 ,
As the processing unit, at least a processing unit that supplies a processing liquid to the substrate, and a processing unit that performs a heat treatment on the substrate,
The said conveyance part is a substrate processing apparatus comprised by the single main conveyance mechanism which conveys a board | substrate to each processing unit. The substrate processing apparatus according to claim 15, wherein
The processing unit for supplying a processing liquid to a substrate is at least one of a resist film coating processing unit for applying a resist film material to the substrate and a developing processing unit for supplying a developing liquid to the substrate. The substrate processing apparatus according to claim 15 or 16 ,
A plurality of cells comprising the processing unit and the main transport mechanism;
The control unit is a substrate processing apparatus that controls the main transport mechanism of each cell. In the substrate processing apparatus in any one of Claims 1-14 ,
As the processing unit,
A coating cell configured to include a plurality of processing units and performing a process of forming a resist film on the substrate;
A development cell configured to include a plurality of processing units and performing processing for developing a substrate;
A substrate processing apparatus having at least The substrate processing apparatus according to claim 18, wherein
A plurality of rows of cells configured such that a single coating cell and a single development cell can pass a substrate to each other;
The substrate processing apparatus is configured to include an indexer transport mechanism that transports a substrate to and from each coating cell, and an interface transport mechanism that transports a substrate to and from each development cell.

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