JP5233925B2 - Non-contact IC tag label with hologram - Google Patents

Description

  The present invention relates to a contactless IC tag label with a hologram. In particular, it has a non-contact communication function with the external reader in the normal use state attached to the adherend, but when trying to peel off from the adherend, the antenna of the IC tag is damaged and the communication function is lost. The present invention relates to a non-contact IC tag label with a hologram.

  In recent years, non-contact IC tags have been used in many fields. As an example, there is an example in which an IC tag is used as a means for proving the authenticity of an article while holding information. That is, the authenticity of the article is proved by attaching the IC tag in a label form to the article itself or the opening of the package of the article and reading the information stored in the memory of the IC tag. If the package is opened or only the IC tag label is peeled off from the adherend, the IC tag chip and antenna are damaged together with the label, and the IC tag cannot be reused.

Conventionally, as an IC tag label that is destroyed when attempting to peel off from an adherend, an IC tag label in which cuts 21 extending in the direction perpendicular to the end portions are formed at a plurality of locations on the outer periphery of the IC tag label 101 as shown in FIG. 101 is disclosed (for example, Patent Documents 1 and 2).
If the IC tag label 101 is peeled off from the adherend, the base material is broken from the tip of the cut 21 toward the center of the IC tag label 101, and the antenna is broken.
Furthermore, an IC tag label having a plurality of perforations that cross the antenna is also disclosed on the entire surface of the IC tag label (for example, Patent Document 3). It is said that the antenna can be used because it is partly connected rather than completely broken, and when the IC tag label is peeled off from the adherend, it has a plurality of perforations, so the antenna is easy Is broken.

  Further, as hologram labels that are destroyed when they are peeled off from the adherend, those in which a brittle layer is partially provided or those in which a hologram forming layer is laminated on a substrate that has been subjected to a surface treatment in a pattern are disclosed. (For example, Patent Documents 4 and 5). When these hologram labels are peeled off from the adherend, the hologram is destroyed only partly from the adherend due to the difference in peel strength depending on the presence or absence of a brittle layer or the presence or absence of surface treatment.

JP 2006-159830 A Japanese Patent Laid-Open No. 2008-301912 JP 2006-293462 A JP 08-328455 A JP 09-073261 A

  However, the IC tag label with a cut in the outer periphery as described above has a problem that the label is damaged when the IC tag label is attached to the adherend. Also, when the perforation crosses the antenna line, a complicated process is required to form the perforation without completely breaking the antenna, and the antenna itself is scratched from the beginning. Therefore, there has been a problem that it is easily damaged before being attached to an article and used.

  Accordingly, an object of the present invention is to provide a non-contact IC tag label with a hologram excellent in design, in which the communication function is destroyed by unauthorized peeling without being damaged during or before use. .

  The non-contact IC tag label with a hologram of the present invention has a hologram effect in which a hologram forming layer having a hologram pattern is laminated on one surface of a transparent plastic substrate, and a reflective thin film layer is formed on at least a part of the hologram pattern surface. A brittle release layer is laminated on the entire surface of the hologram forming layer on which the reflective thin film layer surface and the reflective thin film layer are not formed, and a non-contact IC tag is formed on a part of the brittle release layer surface. A non-contact IC tag label with a hologram, which is bonded by a first pressure-sensitive adhesive layer and has a second pressure-sensitive adhesive layer laminated on the entire surface of the non-contact IC tag and a brittle release layer, the antenna and IC chip of the non-contact IC tag A plurality of cuts that reach at least the outer edge of the IC tag base material are formed from a position that does not intersect or contact with the outer edge of the transparent plastic base material. It is characterized in that.

  According to the non-contact IC tag label with a hologram, the article (adhered body) to which the label is affixed is provided with a decorative property and anti-counterfeit effect by the hologram, and performs non-contact communication with an external reader using the non-contact IC tag. Can manage goods. Furthermore, when an attempt is made to peel off the label from the article (adhered body) for the purpose of reuse, the layers on both sides are easily separated by the brittle release layer, and the hologram forming layer and the non-contact IC tag are separated. . Furthermore, when an attempt is made to peel off the IC tag, the cut formed in the outer edge of the IC tag base material extends to the antenna, the antenna is disconnected, and the non-contact communication function of the IC tag is impaired. Therefore, reuse of the IC tag can be prevented. Further, since the cut is formed so as not to cross or contact the antenna and the IC chip, it is possible to prevent damage before or during use of the label.

  In the non-contact IC tag label with a hologram, an adhesive strength between the brittle release layer and the hologram forming layer is stronger than an adhesive strength between the hologram forming layer and the first pressure-sensitive adhesive layer, and the second adhesive The adhesive strength between the agent layer and the adherend is weaker, and the non-contact IC tag is left on the adherend side when the non-contact IC tag label with hologram is peeled off from the adherend. According to this non-contact IC tag label with a hologram, when attempting to peel off the label from the adherend, only the plastic substrate is peeled off by the brittle release layer. Furthermore, when an attempt is made to peel off the IC tag remaining on the adherend, the label is broken so that the notch formed at least on the outer edge of the IC tag base material extends to the antenna and the antenna is disconnected, and the IC tag is not cut. The contact communication function is impaired. Therefore, reuse of the IC tag can be prevented.

  In the non-contact IC tag label with a hologram, the hologram forming layer is formed on the entire surface of the plastic substrate, and the non-contact IC tag is formed on a portion of the hologram forming layer where the reflective thin film layer is not formed. It is good to comprise so that it may adhere | attach by the 1st adhesive layer. According to this non-contact IC tag label with a hologram, since the non-contact IC tag is formed in a portion of the hologram forming layer where the reflective thin film layer is not formed, the reflective thin film layer affects the non-contact communication function. Can be prevented.

  In the non-contact IC tag label with a hologram, the plurality of cuts are formed so as to reach a position 1-5 mm away from the outer edge of the plastic substrate without contacting the outer edge of the plastic substrate. It is good to configure. According to this non-contact IC tag label with a hologram, since the cut is not in contact with the outer edge of the plastic substrate, it is possible to prevent damage before and during use of the label. When attempting to peel off the label from the adherend, the label is broken so that the cut is enlarged and the antenna is disconnected. Further, since the cut is formed up to the reflective thin film layer of the hologram forming layer, the hologram reproduction portion is reliably damaged.

  According to the non-contact IC tag label with a hologram of the present invention, it has a normal non-contact IC tag function in normal use as well as a decorative property and anti-counterfeiting effect by the hologram, but when the label is peeled off from an article to which the label is attached The multiple cuts formed on the label reach the antenna and the antenna is disconnected, making non-contact communication impossible. This prevents the label from being reused not only in appearance but also in communication function. it can.

(A) is a top view of the non-contact IC tag label with a hologram, (B) is sectional drawing in the XX line. (A) is a top view of the modification of the non-contact IC tag label with a hologram, (B) is sectional drawing in the XX line. It is a figure which shows the example of the conventional notched IC tag label.

  Hereinafter, a preferred non-contact IC tag label with a hologram of the present invention will be described in detail with reference to the drawings.

[Embodiment]
FIG. 1A is a plan view showing an IC tag label (non-contact IC tag label with hologram) 1A, and FIG. 1B is a sectional view taken along line XX.
As shown in FIG. 1A, the IC tag label 1A of the present embodiment has a hologram forming layer 3 that exhibits a hologram effect on a part of the surface of the label-shaped transparent plastic substrate 2, and exhibits the hologram effect. The non-contact IC tag 9A is provided in a part of the portion that does not occur.
A plurality of cuts k are formed in the IC tag label 1A. The cuts k are formed in various forms, mainly those that cut only the IC tag base 6A and those that extend further from the IC tag base 6A and reach the edge of the IC tag label 1.
However, each of the cuts k is characterized in that it does not cross or contact the antenna 7A and the IC chip 8A of the non-contact IC tag 9A.

As shown in FIG. 1B, the plastic substrate 2 of the hologram forming layer 3 has a reflective thin film layer 4 partially formed on the opposite hologram pattern surface. A brittle release layer 5 is formed on the entire surface of the reflective thin film layer 4 and the hologram pattern surface where the layer is not formed. Then, the non-contact IC tag 9A is bonded to a portion where the reflective thin film layer 4 is not formed on the surface of the brittle peeling layer 5.
In the non-contact IC tag 9A, the antenna 7A and the IC chip 8A are formed on one surface of the IC tag base 6A, and the other surface is bonded to the surface of the brittle release layer 5 by the first pressure-sensitive adhesive layer 10. . Further, the IC tag (non-contact IC tag) 9A, a second adhesive layer 11 for bonding the IC tag label 1A to an article is laminated on the entire surface of the (non-contact IC label with a hologram) 1A IC tag label . Further, release paper (not shown) for protecting the second pressure-sensitive adhesive layer 11 is laminated until it is attached to the article.

As shown in FIG. 1, the IC tag label 1 </ b> A has a reflective thin film layer 4 formed on a part of a hologram pattern surface of a hologram forming layer 3 having a hologram pattern composed of fine irregularities, and a hologram is formed by reflected light from the part. Can be reproduced to obtain a hologram effect.
The reflective thin film layer 4 is obtained by depositing a metal on the entire surface of the hologram forming layer 3 having the hologram pattern and then removing unnecessary portions by a process such as paster processing. A hologram pattern composed of fine irregularities is also formed on the portion of the hologram forming layer 3 where the reflective thin film layer 4 is not formed. However, since there is no reflective thin film layer 4, no reflected light is generated. Further, if the first pressure-sensitive adhesive layer 10 or the second pressure-sensitive adhesive layer 11 laminated on the hologram forming layer 3 is made of a material having a refractive index substantially equal to that of the resin material of the hologram forming layer 3, diffracted light is also generated. It will not occur.

  The brittle release layer 5 is a layer for adjusting the peel strength between the hologram forming layer 3 provided on the plastic substrate 2 and other layers. When the IC tag label 1A is peeled from the adherend by adjusting the strength of the adhesive strength with the layer to which the brittle release layer 5, the first pressure-sensitive adhesive layer 10, and the second pressure-sensitive adhesive layer 11 are in contact. It is possible to adjust which layer is peeled and which layer structure is destroyed.

The IC tag (non-contact IC tag) 9A is obtained by mounting an IC chip 8A on an antenna 7A formed on an IC tag base 6A. The first pressure-sensitive adhesive layer 10 is laminated on the surface opposite to the surface on which the antenna 7A or the like of the IC tag base 6A is formed, and the IC tag 9A is attached to the hologram forming layer 3 via the first pressure-sensitive adhesive layer 10. It adheres to the part where the reflective thin film layer 4 is not formed. Therefore, although the formation surface of the antenna 7A and the like is a surface covered with the second pressure-sensitive adhesive layer 11, the top and bottom may be reversed. In that case, the 1st adhesive layer 10 will be laminated | stacked on formation surfaces, such as the antenna 7A of IC tag base material 6A.
In the IC tag 9A, the antenna 7A may be a half-wave dipole antenna shape as shown in FIG. 1A, and may be an UHF band or GHz band IC tag, or an HF band IC tag. Often, it can be appropriately selected according to the management purpose of the article. The antenna 7A may be formed by etching after laminating a metal foil such as copper or aluminum on the IC tag base 6A.

  The IC tag label 1A has a plurality of cuts k penetrating or semi-penetrating through the transparent plastic substrate 2 and penetrating or semi-penetrating to the second pressure-sensitive adhesive layer 11 when viewed in cross section. Yes. The incision k penetrates or semi-penetrates the end of the IC tag base 6A and, when viewed in a plane, at least the outer edge of the IC tag base 6A from a position that does not hook the antenna 7A or the IC chip 8A. It is formed to reach the position. The cut k may be further extended to the vicinity of the outer edge of the plastic substrate 2, and even in that case, the depth is set to 1 to 5 mm inside from the outer edge of the plastic substrate 2. Thereby, normally, the non-contact communication function of the IC tag is not impaired, and an accident in which the IC tag label 1A is accidentally broken can be prevented before being attached to the adherend or when being attached.

[Modification]
Here, a modified example of the IC tag label 1A of the above-described embodiment will be described.
FIG. 2A is a plan view showing an IC tag label 1B according to this modification, and FIG. 2B is a cross-sectional view taken along the line XX. As shown in FIGS. 2 (A) and 2 (B), the IC tag label 1B of this modification example is formed by forming a resist film with ink added with an ultraviolet absorber and forming a metal vapor deposition layer into a donut shape by etching. Thus, the IC tag 9B is adhered to a portion where the central metal vapor deposition layer is not formed, thereby forming a circular label shape. The hatched annular portion exhibits the hologram effect. The resist film to which the ultraviolet absorber is added is left as it is on the IC tag label 1B to form the ultraviolet absorbing layer 12. Thereby, the light resistance of a label can be improved.
The IC tag 9B is obtained by mounting an IC chip 8B on a wound-coil antenna 7B formed on an IC tag base 6B. Similar to the IC tag 9A of the first embodiment, the following manufacturing method <3> It adheres to the hologram forming layer 3 in the step.
The cuts k are formed in the base material 6B and the plastic base material 2 of the non-contact IC tag 9B, as in the first embodiment. Any of the cuts k are not allowed to cross or contact the antenna 7B and the IC chip 8B of the non-contact IC tag 9B, and the same extends to the inside of the plastic substrate 2 from 1 to 5 mm. .

[material]
<1> Substrate A transparent plastic film is used for the plastic substrate 2 and the IC tag substrate 6. For example, various single films or composite films listed below can be used, and the thickness is preferably about 20 μm to 200 μm. PET (polyethylene terephthalate), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyester resins such as polyethylene naphthalate, polyamide resins such as nylon 6, polyvinyl chloride, vinyl chloride-vinyl acetate Copolymer, polycarbonate, polyimide, cellulose diacetate, cellulose triacetate, polystyrene, ABS resin, polyacrylate, polypropylene, polyurethane, and the like.
The IC tag base 6 is not limited to a transparent plastic film, but may be an opaque plastic film, paper, or synthetic paper. Furthermore, an identification number, a name, or the like may be printed on the surface of the IC tag base 6 on which the first pressure-sensitive adhesive layer 10 is provided so that the user can visually recognize it through the plastic base 2.

<2> Brittle release layer The brittle release layer 5 is made of a resin whose adhesive strength is adjusted so that the IC tag label 1A may be damaged by peeling between the layers when the IC tag label affixed to the article is peeled off. Use. For example, the following various resins can be used, which are applied to the plastic substrate 2 by a known method such as roll coating, gravure coating, die coating, comma coating, and dried. Specifically, synthetic rubber resins such as acrylic resin, chlorinated rubber resin, butyl rubber, polychloroprene, styrene-butadiene copolymer resin, vinyl chloride-vinyl acetate copolymer resin, cellulose resin, chlorinated polypropylene resin, urethane resin Alternatively, a resin such as a silicone resin, a resin mixed with silicone oil or fatty acid amide, or a fragile resin mixed with an inorganic filler for adjusting the adhesive strength is used. When an inorganic filler is mixed, the transparency is lowered. Therefore, the addition amount is adjusted so as to maintain the visibility of the hologram.
The brittle release layer 5 has an adhesive strength that is weaker than the adhesive strength of the second adhesive layer 11 to be described later and an interlayer peel strength of the reflective thin film layer 4 formed on the hologram forming layer 3. Adjust to be stronger. As a result, when the IC tag label affixed to the article is peeled off, when the IC tag label 1A is separated by the layer of the brittle release layer 5, the reflective thin film layer 4 is destroyed and the hologram effect is impaired, and reuse is possible. Is impossible.

<3> Hologram formation layer The hologram formation layer 3 has a thermoplastic resin, a curable resin, or a cured portion and an uncured resin that can reproduce the concavo-convex structure of the hologram by casting or injection molding. The photosensitive resin composition which can shape | mold a part is used. Specifically, for example, thermoplastic resins such as polyvinyl chloride, acrylic (polymethyl methacrylate), polystyrene, or polycarbonate, unsaturated polyester, melamine, epoxy resin, polyester (meth) acrylate, urethane (meth) acrylate, A thermosetting resin such as epoxy (meth) acrylate, polyether (meth) acrylate, polyol (meth) acrylate, melamine (meth) acrylate, or triazine-based acrylate, or a mixture thereof can be used. Moreover, what has a radically polymerizable unsaturated group and has thermoformability, and the ionizing radiation curable resin composition which added the radically polymerizable unsaturated monomer can also be used. As the ionizing radiation curable resin, for example, an epoxy-modified acrylate resin, a urethane-modified acrylate resin, an acrylic-modified polyester, or the like can be applied, and a urethane-modified acrylate resin is preferably used. If necessary, a photopolymerization initiator, a plasticizer, a stabilizer, a surfactant and the like are further added to the resin material as described above, and the resin material is used after being dispersed or dissolved in a solvent. Moreover, you may color so that the visibility of a hologram may not be impaired.

  Preferably, the material of the hologram forming layer 3 is (1) an isocyanate having three or more isocyanate groups in the molecule, and (2) at least one hydroxyl group and at least two (meth) acryloyloxy groups in the molecule. Ionizing radiation curable resin containing urethane (meth) acrylate oligomer, which is a reaction product of polyfunctional (meth) acrylates having polyhydric acid, or (3) polyhydric alcohols having at least two hydroxyl groups in the molecule, reaction It is advisable to include functional silicone and polyethylene wax. More preferably, a (meth) acrylate oligomer is included. The composition is applied to a substrate and dried to activate a fine relief structure or the like for exhibiting a hologram function, and then cured with ionizing radiation. The ionizing radiation curable resin is also called a crosslinkable resin and can be used in other layers as well.

<4> Reflective Thin Film Layer The reflective thin film layer 4 is formed by evaporating a metal material on the hologram forming layer 3. Aluminum can be used as the metal material, but gold, silver, copper, brass, titanium, chromium, nickel, nickel chromium, stainless steel, and the like can be used as necessary. The thickness of the reflective thin film layer 4 is preferably 10 nm to 1000 nm, and more preferably 30 nm to 500 nm.

<5> Adhesive Layer A known adhesive is used for the first adhesive layer 10 and the second adhesive layer 11. Specifically, for example, natural rubber, butyl rubber, polyisoprene, polyisobutylene, polychloroprene, styrene-butadiene copolymer resin and other synthetic rubber resins, silicone resins, acrylic resins, polyvinyl acetate, ethylene-acetic acid A rosin resin such as vinyl acetate resin, urethane resin, acrylonitrile, hydrocarbon resin, alkylphenol resin, rosin, rosin triglyceride, hydrogenated rosin and the like with vinyl copolymer can be used. Dissolve or disperse the material resin in a solvent, add an additive such as a pigment as appropriate, and apply and dry by a method such as a known roll coat, gravure coat, die coat, or comma coat to a thickness of 5 μm to 50 μm. .
The second pressure-sensitive adhesive layer 11 is a weak pressure-sensitive adhesive that adheres with such a strength that it can be easily peeled once it is bonded. If the adhesive strength (180 degree peel adhesive strength) with the IC tag substrate 6 is 2.4 to 80 CN / cm, it is considered to be weakly tacky. Various materials such as rubber-based, urethane-based, and acrylic-based materials are usually used for the weak-adhesive pressure-sensitive adhesive.

<6> Release Paper The release paper may be a known one. For example, a release layer is formed on one surface of a base material such as high-quality paper, coated paper, impregnated paper, or plastic film using a release material. Examples of the releasable material include silicone resin, organic resin-modified silicone resin, fluororesin, aminoalkyd resin, and polyester resin. These resins may be emulsion type, solvent type or solventless type. The release paper having the same size as the IC tag label 1A or an area larger than the IC tag label 1A is used so that the surface on which the release layer is formed and the second pressure-sensitive adhesive layer 11 are in contact with each other.

[Production method]
Next, the manufacturing method of an IC tag label is demonstrated.

<1> Formation of Hologram Effect Portion (Hologram Reproduction Portion) First, the resin material of the hologram forming layer 3 is applied to one side of a continuous sheet-like transparent plastic substrate 2 by gravure coating, roll coating, reverse roll coating, die coating, comma. After applying and drying by a coating method such as a coat, a hologram pattern is formed. The coating thickness of the hologram forming layer 3 after drying is about 1.0 to 10 μm.
Subsequently, a hologram pattern is formed on the entire surface of the coating film surface of the hologram forming layer 3 by embossing a relief shape. The relief shape is not particularly limited as long as it has functions such as light diffusion, light scattering, light reflection, and light diffraction having a fine uneven shape.
As a method for creating a relief shape, for example, in addition to a hologram and a diffraction grating created by using a hologram photographing / recording means, a CGH (computer generaton) created by an electron beam drawing apparatus based on optical calculations such as interference and diffraction. A rated hologram) and a diffraction grating. Relief-shaped embossing is performed by using an original plate on which diffraction gratings and interference fringes are recorded in a concave-convex shape as a press die, and overlaying the press die on the surface of the hologram forming layer 3 and heat-pressing them with a heating roll. The concavo-convex shape can be shaped (also referred to as replication) on the hologram forming layer 3 as a hologram pattern.

Next, the reflective thin film layer 4 is formed on the surface of the hologram forming layer 3 on which the hologram pattern is shaped. This can be formed by supplying a web to a take-up vacuum deposition apparatus and continuously depositing a metal such as aluminum to a thickness of 10 to 1000 nm.
Subsequently, a resist film is formed on the surface of the reflective thin film layer 4. The resist film only needs to be resistant to subsequent acid or alkali treatment, and can be formed by a screen printing method or a gravure printing method using a normal printing ink. The resist film may be formed in a band shape with a constant interval. For example, the resist film may have an annular shape or the like having a hollow portion so that the IC tag 9 is disposed inside the circular or rectangular hollow portion. It may be formed at regular intervals.

Next, an etching process is performed with a weak acid or a weak alkali solution, and the reflective thin film layer 4 that is not protected by the resist film is removed. When the material of the reflective thin film layer 4 is aluminum, it is usually immersed in a 3 to 10% aqueous solution of caustic soda. The remaining resist film may not be removed, and in that case, the IC tag label 1A can be colored or used as a decorative pattern.
Moreover, you may use the ink which added the ultraviolet absorber or the radical scavenger as a resist film. The resist film remaining after the etching is irradiated with ultraviolet rays such as sunlight from the second pressure-sensitive adhesive layer 11 side when the IC tag label 1A is attached to a glass window or the like as the ultraviolet absorbing layer 12 (see FIG. 2B). It can prevent deterioration due to. After etching, it is sufficiently washed with water so that no acid or alkali remains.
<2> Formation of Brittle Peeling Layer Next, the resin material of the brittle peeling layer 5 is applied to the surface of the hologram forming layer 3 on which the reflective thin film layer 4 is formed by the same coating method as described above, and is dried. A brittle release layer 5 is formed. The coating thickness of the brittle release layer 5 after drying is about 0.5 to 5 μm.

<3> Adhesion of non-contact IC tag Next, the IC tag 9A is attached to the surface of the brittle release layer 5 where the reflective thin film layer 4 is not formed via the first adhesive layer 10 at regular intervals. Glue. In this step, the IC tag 9A to which the first pressure-sensitive adhesive layer 10 has been applied is temporarily pasted onto a continuous sheet-like release paper at regular intervals using a labeling machine.
Thereafter, a release paper in which the second pressure-sensitive adhesive layer 11 is previously applied to the release layer forming surface is laminated on the surface of the plastic substrate 2 to which the IC tag 9A is attached via the second pressure-sensitive adhesive layer 11. . Note that release paper may be laminated after applying the second pressure-sensitive adhesive layer 11 over the entire surface to which the IC tag 9A has been applied. Although not shown, a protective layer may be provided on the surface of the IC tag base 6A on which the antenna 7A and the IC chip 8A are formed.

<4> Punching process Finally, the label shape is punched from the continuous sheet and the IC tag label 1A for each unit is cut. Either of these may be performed first or simultaneously. You may make it possible to carry out simultaneously by one type of punching die (punching blade). The cut k is formed so as not to reach the release paper and to have a depth that penetrates at least the IC tag substrate 6A when viewed from the surface of the plastic substrate 2. The punching of the label shape is such that the release paper is not deeply punched, and the continuous sheet-like release paper is further cut for each unit of the IC tag label 1A or for each predetermined unit. can get. The shape of the label can be any shape such as a circle, an ellipse, a rectangle, a polygon, and a star. Moreover, although the length of each notch was various, you may form so that length may become substantially the same.

  Before the second pressure-sensitive adhesive layer 11 and release paper are laminated, only the cut k is formed from the side of the plastic substrate 2 on which the hologram forming layer 3 and the like are formed, and then the second pressure-sensitive adhesive 11 and the release paper are peeled off. It is also possible to carry out the punching of the label shape after laminating the paper. In this case, the plastic substrate 2 can be half-penetrated so that the cut does not reach the outermost surface of the label so that the cut line on the front side is not noticeable.

  A PET film having a thickness of 25 μm and a width of 110 mm is used as the transparent plastic substrate 2, and the thickness after drying the following ionizing radiation curable resin composition A on one surface by the gravure reverse coating method is about 2 μm. And dried at 100 degrees Celsius (hereinafter simply referred to as “degrees”).

[Production procedure of ionizing radiation curable resin composition]
First, “ionizing radiation curable resin composition M” was produced by the following procedure. A reactor equipped with a stirrer, reflux condenser, dropping funnel and thermometer was charged with 206.1 g of ethyl acetate and 133.5 g of a trimer of isophorone diisocyanate (HULS product, VESTANAT T1890, melting point 110 ° C.) at 80 ° C. The solution was heated to dissolve. After air was blown into the solution, 0.38 g of hydroquinone monomethyl ether, 249.3 g of pentaerythritol triacrylate (product of Osaka Organic Chemical Industry Co., Ltd., Viscoat 300) and 0.38 g of dibutyltin diurarate were charged. After reacting at 80 degrees for 5 hours, 688.9 g of ethyl acetate was added and cooled.

The “ionizing radiation curable resin composition M”, a film-forming resin (acrylic oligomer), a reactive silicone, a polyethylene wax, a photopolymerization initiator and a solvent are blended in the following composition to form an ionizing radiation curable resin. Composition A was prepared.
[Ionizing radiation curable resin composition A]
"Ionizing radiation curable resin composition M" 25 parts by mass methacrylate oligomer (manufactured by Nippon Synthetic Chemical Co., Ltd., trade name: Murasaki 6630B) 5 parts by weight of reactive silicone (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: X-22-2445) 2 parts by mass polyethylene wax (average particle size 2.0 μm) 0.3 parts by mass photopolymerization initiator (Ciba, trade name Irgacure 907) 0.9 parts by mass ethyl acetate 70 parts by mass

  Next, a press die that is duplicated by the 2P method from the diffraction grating by the two-beam interference method to the hologram forming layer 3 surface is attached to the embossing roller of the duplicating apparatus, and heated between the opposing rollers. (Embossed) to form a hologram pattern consisting of a fine uneven pattern. Immediately after shaping, it was cured by irradiating with ultraviolet rays using a high-pressure mercury lamp.

Next, the reflective thin film layer 4 made of aluminum was vapor-deposited on the entire surface of the hologram forming layer 3 so as to have a thickness of 50 nm using a take-up vacuum vapor deposition apparatus. Then, a gravure is applied to a part of the reflective thin film layer 4 using an alkali-resistant ink and resist (made by The Inktec Co., Ltd.) made of an acrylic resin so that the thickness after drying becomes about 1.5 μm. A resist film was formed by printing in a strip shape having a width of 34.5 mm by a printing method.
Next, the reflective thin film layer 4 formed with the resist film is passed through a NaOH solution having a concentration of 6 to 8% for a short time of about 20 seconds to dissolve and remove the aluminum vapor deposition layer in a portion where the resist film is not formed. did. Thereafter, the plastic substrate 2 was thoroughly washed with water and dried so that no alkaline solution remained.

Next, on the entire surface of the reflective thin film layer surface and the hologram forming layer surface on which the reflective thin film layer is not formed, a brittle release layer 5 forming composition (acrylic resin-based composition manufactured by Showa Ink Co., Ltd.) is added to toluene and methyl ethyl ketone. Was applied by gravure printing so that the solid content was 12% by mass and the thickness after drying was about 1 μm.

  Prepared separately from the above steps, an IC tag 9 having a half-wavelength dipole antenna 7 on an IC tag base 6 having a width of 18 mm and a length of 95 mm made of PET having a thickness of 25 μm (a weakly adhesive first sheet on a continuous sheet of release paper) No. 1 pressure-sensitive adhesive layer 10) was sequentially adhered to a 34 mm width portion of the hologram forming layer 3 from which the reflective thin film layer 4 was removed by a labeling machine. Next, a pressure sensitive adhesive (Nippon Carbide, Nissetsu PE-118 + CK101) was applied with a comma coater so that the film thickness after drying was 30 μm, dried at 100 degrees to volatilize the solvent, and the second The pressure-sensitive adhesive layer 11 was formed, and a continuous sheet-like release paper having a width of 110 mm was further bonded.

Next, a punching blade (cutting die) is used to punch from the surface side of the transparent plastic substrate 2 to the second pressure-sensitive adhesive layer 11 to a depth at which the release paper is not cut, and a width of 101.6 mm and a length of A substantially rectangular label outline of 68.5 mm and 33 cuts k as shown in FIG. 1A were formed. Each incision k is a length from a position that does not intersect with the antenna 7 and the IC chip 8 of the IC tag 9 (a position that is 1 to 2 mm away) to a position that reaches at least the outer edge of the IC tag base 6. The length from the outer edge of the plastic substrate 2 to a position 1 to 5 mm inside.
Thereafter, the label-shaped punching remaining portion was removed, and the continuous sheet-like release paper was cut into pieces each having a length of 81 mm including 1 unit of the IC tag label 1.

From the transparent plastic substrate 2 side, the IC tag label 1 produced as described above reproduced a hologram on the portion where the reflective thin film layer 4 was formed, and showed an excellent appearance.
When data was written to the IC tag 9 of the IC tag label 1 with an IC tag reader / writer for UHF band and then attached to the adherend, and then read with a reader, the data could be read reliably. On the other hand, in order to peel off from the adherend, when the end portion of the plastic substrate 2 is picked and pulled, the label breaks between the layers of the brittle release layer 5 and the tearing force due to the enlargement of the cut k is reflected and reflected. The thin film layer 4 was destroyed and the hologram effect was impaired. At this time, the IC tag 9 remained on the adherend because the adhesive force of the second adhesive layer 11 was stronger than the adhesive force of the first adhesive layer 10. Furthermore, when an attempt was made to peel off the IC tag 9 from the adherend, the cut k was enlarged and the antenna 7 was cut, making non-contact communication impossible.

  INDUSTRIAL APPLICABILITY The present invention can be used for distribution management of products, product authentication, and the like as a tag, label, or slip attached to or attached to an article or an article storage case in the distribution field, delivery management, factory process management, or the like.

1,1A, 1B ... IC tag label (IC tag label with hologram)
2 ... Plastic substrate 3 ... Hologram forming layer 4 ... Reflective thin film layer 5 ... Brittle release layer 6, 6A, 6B ... IC tag substrate 7, 7A, 7B ... Antenna 8, 8A, 8B ... IC chip 9, 9A , 9B ... IC tag (non-contact IC tag)
DESCRIPTION OF SYMBOLS 10 ... 1st adhesive layer 11 ... 2nd adhesive layer 12 ... Ultraviolet absorption layer

Claims (4)

A hologram forming layer having a hologram pattern is laminated on one surface of a transparent plastic substrate, and a reflective thin film layer is formed on at least a part of the hologram pattern surface to constitute a hologram effect portion. A brittle release layer is laminated on the entire surface of the hologram forming layer surface on which the layer surface and the reflective thin film layer are not formed, and a non-contact IC tag is adhered to a part of the brittle release layer surface by the first pressure-sensitive adhesive layer. A non-contact IC tag label with a hologram in which a second pressure-sensitive adhesive layer is laminated on the entire surface of a contact IC tag and a brittle release layer,
A plurality of cuts reaching at least the outer edge of the IC tag base material are formed from a position where the antenna and the IC chip of the non-contact IC tag do not intersect or contact the outer edge of the transparent plastic base material. Characteristic non-contact IC tag label with hologram. The adhesive strength between the brittle release layer and the hologram forming layer is stronger than the adhesive strength between the brittle release layer and the first pressure-sensitive adhesive layer, and between the second pressure-sensitive adhesive layer and the adherend. 2. The non-contact IC tag label with hologram according to claim 1, wherein the non-contact IC tag label with hologram is left on the adherend side when the non-contact IC tag label with hologram is peeled off from the adherend, which is weaker than the adhesive strength. . The hologram forming layer is formed on the entire surface of the plastic substrate, and the non-contact IC tag is adhered to the portion of the hologram forming layer where the reflective thin film layer is not formed by the first pressure-sensitive adhesive layer. The non-contact IC tag label with a hologram according to claim 1, wherein the non-contact IC tag label has a hologram. The plurality of cuts are formed so as not to contact the outer edge of the plastic substrate but to reach a position 1-5 mm away from the outer edge of the plastic substrate. The non-contact IC tag label with a hologram according to claim 3.

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