JP5223821B2 - Multilayer electronic components - Google Patents

Description

  The present invention relates to a multilayer electronic component.

  As a conventional multilayer electronic component, an element body formed by laminating a plurality of rectangular insulator layers, a coil formed in the element body, and both ends in the element stacking direction are formed. An apparatus including a pair of external electrodes is known (see, for example, Patent Document 1). In this multilayer electronic component, in order to lower the direct current resistance, a coil is configured by connecting a plurality of pairs of coil conductors connected in parallel in series in the stacking direction. Further, a pair of connection conductors connecting the coil ends and the lead conductors have a substantially L-shape. Specifically, as shown in FIG. 6A, the connection conductor extends from the corner of the insulator layer to the center position along the edge of the insulator layer, and bends by 90 ° at the center position. Extends to the center of the layer.

JP 2001-44038 A

  Here, it is required to further reduce the DC resistance of the conventional multilayer electronic component. For this purpose, the connection conductor is changed from an L shape to a linear shape as shown in FIG. 6B, for example. It is possible to do. However, when the connection conductor is substantially L-shaped, the portion indicated by A in FIG. 6 (a) is supported by the coil conductor on the inner layer side, so that a large force is exerted through the lead conductor and through-hole conductor during lamination crimping. The distance between the acting position and the position supported by the coil conductor on the inner layer side is about half the length of one side of the insulator layer (indicated by L1 in FIG. 6). On the other hand, when the connecting conductor is a straight line, the distance between the position where a large force acts via the lead conductor or through-hole conductor during lamination crimping and the position supported by the coil conductor on the inner layer side is the insulator The length is about half the diagonal of the layer (indicated by L2 in FIG. 6) and is longer than L1. Therefore, when the connecting conductor is linear, as shown in FIG. 5B, the lead conductor and the connecting conductor are likely to sink greatly to the inner layer side during lamination and crimping. As a result, the connection conductor may enter the region on the inner peripheral side of the coil, which may affect the coil characteristics.

  An object of the present invention is to provide a multilayer electronic component with improved reliability by suppressing the connection conductor from entering the region on the inner peripheral side of the coil while reducing the direct current resistance.

  The multilayer electronic component according to the present invention includes a combination of an element body formed by laminating a plurality of rectangular insulator layers and a plurality of coil conductors connected in parallel with the insulator layers interposed therebetween. A plurality of sets of coils connected in series to form a spiral coil inside the element body, a pair of external electrodes formed at both ends of the element body in the stacking direction, and at least one external electrode and coil coil Laminated between the ends, the coil conductor is led out in the laminating direction to electrically connect the external electrode and the coil, and is laminated between the lead conductor and the coil end of the coil. A first connection conductor that electrically connects the lead conductor disposed on the side and the coil end disposed on the corner side of the insulator layer, and is laminated between the first connection conductor and the coil end, Parallel to and parallel to the connecting conductor A second connection conductor to be connected; a through-hole conductor for a lead conductor that electrically connects the lead conductor and one end of the first connection conductor; one end of the first connection conductor and one end of the second connection conductor; A first parallel connection through-hole conductor, and a second parallel connection through-hole conductor that electrically connects the other end of the first connection conductor and the other end of the second connection conductor; A through-hole conductor for series connection that electrically connects the other end of the second connection conductor and the coil end, and the first connection conductor and the second connection conductor are centered around the corner of the insulator layer. The first parallel connection through-hole conductor extends linearly to the line side, and has a larger diameter than the lead-out conductor through-hole conductor.

  In the multilayer electronic component according to the present invention, the first connection conductor and the second connection conductor extend linearly from the corner portion side of the insulator layer to the circumferential center line side, and the first parallel connection through-hole conductor is The lead conductor has a larger diameter than the through-hole conductor for the lead conductor. Therefore, since the diameter of the first parallel connection through-hole conductor is larger than that of the lead-through conductor through-hole conductor, the first parallel connection through-hole conductor is It functions as a support member that catches the bite. Thereby, compared with the case where the first parallel connection through-hole conductor having a small diameter is applied, it is possible to suppress sinking of the first connection conductor and the second connection conductor at the time of stacking and crimping. Furthermore, the pressure acting on the second connection conductor can be dispersed by increasing the area of the portion where the first parallel connection through-hole conductor abuts against the second connection conductor. Therefore, the amount of biting of the first parallel connection through-hole conductor with respect to the second connection conductor can be reduced as compared with the case where the first parallel connection through-hole conductor having a small diameter is applied. As described above, according to the multilayer electronic component according to the present invention, the connection conductor is reduced in direct current resistance by making the connection conductor linear, and the connection conductor is prevented from entering the region on the inner peripheral side of the coil. Can be improved.

  In the multilayer electronic component according to the present invention, it is preferable that the first parallel connection through-hole conductor is thinner than the thickness of the lead conductor through-hole conductor. Thus, by reducing the thickness of the first parallel connection through-hole conductor, the first parallel connection through-hole conductor can be formed into a flat shape. Since it becomes difficult to bite into the second connection conductor at the time of laminated crimping, it is possible to further suppress the second connection conductor from entering the region on the inner peripheral side of the coil.

  ADVANTAGE OF THE INVENTION According to this invention, it can suppress that a connection conductor enters into the area | region of the inner peripheral side of a coil, reducing DC resistance, and can improve the reliability of a multilayer electronic component.

1 is a perspective view of a multilayer electronic component according to an embodiment. It is an expansion | deployment perspective view of the element | base_body of the multilayer electronic component which concerns on this embodiment. It is sectional drawing along the III-III line | wire shown in FIG. It is the figure which looked at the extraction conductor, the 1st connection conductor, the 2nd connection conductor, the through-hole conductor for extraction conductors, the 1st parallel connection through-hole conductor, and the 2nd parallel connection through-hole conductor from the direction orthogonal to the lamination direction. . It is the schematic which shows the mode of the extraction conductor at the time of lamination | stacking crimping | compression-bonding, and each through-hole conductor of the conventional multilayer electronic component and the connection conductor of the conventional multilayer electronic component made linear. It is a perspective view which shows the shape of the conventional substantially L-shaped connection conductor and the linear connection conductor. It is the schematic which shows the mode of the through-hole conductor for lead conductors, the 1st connection conductor, the through-hole conductor for 1st parallel connection, and the 2nd connection conductor at the time of lamination | stacking crimping | compression-bonding. It is a figure which shows the structure of the multilayer electronic component which concerns on a modification, Comprising: It is a figure corresponding to FIG.

  Hereinafter, preferred embodiments of a multilayer electronic component according to the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view of the multilayer electronic component according to the present embodiment. FIG. 2 is an exploded perspective view of an element body of the multilayer electronic component according to the present embodiment. FIG. 3 is a cross-sectional view taken along line III-III shown in FIG.

  The multilayer electronic component 1 according to this embodiment is a multilayer chip inductor mounted on the surface of a circuit board (not shown), and a plurality of insulator layers are laminated as shown in FIGS. A rectangular parallelepiped element body 2 formed by the above, a coil 3 wound in the element body 2 so that the circumferential center line RL extends in the stacking direction, and both ends of the element body 2 in the stacking direction of the insulator layers It comprises a pair of external electrodes 4 and 5 formed respectively on the part.

  The external electrode 4 is provided so as to cover one end surface 2 a of the element body 2. Further, the external electrode 4 is formed so as to cover a part of the four side surfaces 2c, 2d, 2e, 2f adjacent to the end surface 2a so as to go around from the end surface 2a. The external electrode 5 is provided so as to cover one end surface 2 b of the element body 2. Further, the external electrode 5 is formed so as to cover a part of the four side surfaces 2c, 2d, 2e, 2f adjacent to the end surface 2b so as to go around from the end surface 2b. The portion of the external electrode 4 that extends from the end surface 2a to the side surfaces 2c, 2d, 2e, and 2f and the portion of the external electrode 5 that extends from the end surface 2b to the side surfaces 2c, 2d, 2e, and 2f This is the part where contact is made and soldering is performed. Thus, any one of the side surfaces 2c, 2d, 2e, and 2f is disposed so as to face the surface of the circuit board, and the circumferential center line RL of the coil 3 is parallel to the surface of the circuit board. The external electrodes 4 and 5 are formed by applying a conductive paste containing Ag or glass as a main component by a dipping method or the like after the element body 2 is fired, followed by plating.

  The element body 2 is configured by laminating a plurality of rectangular insulator layers 10. Specifically, a predetermined conductor pattern such as a coil conductor is printed and a through hole is formed on the surface of a ferrite green sheet made of a ferrite material mainly composed of Fe, Ni, Cu, and Zn. Thereafter, a plurality of ferrite green sheets are laminated and pressure-bonded by applying pressure in the laminating direction to obtain a sheet laminate. And the element | base_body 2 is formed by baking after the said sheet | seat laminated body is cut into the unit shape of the element | base_body 2. As shown in FIG. As for the size of the element body 2 after firing, the length in the stacking direction is 0.90 to 0.95 mm, and the size of the side perpendicular to the stacking direction is 0.45 to 0.50 mm. Moreover, the thickness of the insulator layer 10 after baking is set to 0.010 to 0.015 mm.

  As shown in FIGS. 2 and 3, a conductor pattern printed on a ferrite green sheet is laminated inside the element body 2 to draw out the coil 3 and the coil ends 3a and 3b in the laminating direction. 4, 5 and the lead conductors 11, 12, 13 and lead conductors 14, 15, 16 electrically connecting the coil 3 and the coil ends 3a, 3b and the lead conductors 13, 16 are respectively electrically connected. One connection conductors 21 and 22 and second connection conductors 23 and 24 connected in parallel to the first connection conductors 21 and 22 are configured. The conductors are connected to each other by through-hole conductors in the stacking direction.

  The coil 3 is a coil formed in a spiral shape inside the element body 2 by connecting a plurality of sets of a pair of coil conductors connected in parallel across the insulator layer 10 in the stacking direction. Thus, the direct current resistance can be lowered by making the coil have a double structure. Specifically, the coil 3 includes a pair 41 of a pair of coil conductors 30 and 31 connected in parallel, a pair 42 of a pair of coil conductors 32 and 33 connected in parallel, and a pair of coil conductors 34 and 35 connected in parallel. , A pair of coil conductors 36 and 37 connected in parallel, and a pair 45 of a pair of coil conductors 38 and 39 connected in parallel are connected in series in the stacking direction. The insulator layer 10 has edges 10a, 10b, 10c, and 10d in four directions. In FIG. 2, only the insulator layer 10 on the uppermost side and the insulator layer 10 on the lowermost side are only Although the reference numerals of the edge portions 10a, 10b, 10c, and 10d are shown, the following description will be made assuming that the edge portions of the other insulator layers 10 also correspond to the edge portions 10a, 10b, 10c, and 10d.

  One coil conductor 30 constituting the set 41 is a U-shaped conductor pattern that extends along the edges 10a, 10b, and 10c of the insulator layer 10 and opens at the edge 10d. The other coil conductor 31 constituting the set 41 is formed on the insulator layer 10 on the lower side of the coil conductor 30 and has the same shape as the coil conductor 30 when viewed from the stacking direction. That is, the coil conductor 31 is a U-shaped conductor pattern that extends along the edges 10a, 10b, and 10c of the insulator layer 10 and opens at the edge 10d. The conductor end 30a located on the corner side between the edge 10a and the edge 10d of the insulator layer 10 and the conductor end 30b located on the corner side between the edge 10c and the edge 10d. Each of the conductor end portions 30a and 30b is electrically connected to the conductor end portions 31a and 31b of the other coil conductor 31 through the parallel connection through-hole conductors 51 and 52, respectively. It is connected. Thereby, one coil conductor 30 and the other coil conductor 31 constituting the set 41 are connected in parallel in the stacking direction. Further, a through hole is formed in the conductor end 31 b of the other coil conductor 31, and the conductor end 31 b passes through the conductor end 32 a of the coil conductor 32 of the set 42 and the through-hole conductor 53 for series connection. Are electrically connected. Thereby, the set 41 and the set 42 are connected in series in the stacking direction. The conductor end 30a of the coil conductor 30 of the set 41 constitutes the coil end 3a of the coil 3 itself.

  One coil conductor 32 constituting the set 42 is a U-shaped conductor pattern that extends along the edges 10a, 10b, and 10d of the insulator layer 10 and opens at the edge 10c. The other coil conductor 33 constituting the set 42 is formed in the insulator layer 10 on the lower side of the coil conductor 32 and has the same shape as the coil conductor 32 when viewed from the stacking direction. That is, the coil conductor 33 is a U-shaped conductor pattern that extends along the edges 10a, 10b, and 10d of the insulator layer 10 and opens at the edge 10c. The conductor end 32a located on the corner side between the edge 10c and the edge 10d of the insulator layer 10 and the conductor end 32b located on the corner side between the edge 10b and the edge 10c. Each of the conductor end portions 32a and 32b is electrically connected to the other coil conductor 33 via the conductor end portions 33a and 33b and the parallel connection through-hole conductors 54 and 55, respectively. It is connected. As a result, one coil conductor 32 and the other coil conductor 33 constituting the set 42 are connected in parallel in the stacking direction. Further, a through hole is formed in the conductor end portion 33 b of the other coil conductor 33, and the conductor end portion 33 b is connected to the conductor end portion 34 a of the coil conductor 34 of the set 43 and the series connection through hole conductor 56. Are electrically connected. Thereby, the set 42 and the set 43 are connected in series in the stacking direction.

  One coil conductor 34 constituting the set 43 is a U-shaped conductor pattern that extends along the edges 10a, 10c, and 10d of the insulator layer 10 and opens at the edge 10b. The other coil conductor 35 constituting the set 43 is formed on the insulator layer 10 on the lower side of the coil conductor 34 and has the same shape as the coil conductor 34 when viewed from the stacking direction. That is, the coil conductor 35 is a U-shaped conductor pattern that extends along the edges 10a, 10c, and 10d of the insulator layer 10 and opens at the edge 10b. The conductor end 34a located on the corner side between the edge 10b and the edge 10c of the insulator layer 10 and the conductor end 34b located on the corner side between the edge 10a and the edge 10b. Each of the conductor end portions 34a and 34b is electrically connected to the other coil conductor 35 via the conductor end portions 35a and 35b and the parallel connection through-hole conductors 57 and 58, respectively. It is connected. As a result, one coil conductor 34 and the other coil conductor 35 constituting the set 43 are connected in parallel in the stacking direction. Further, a through hole is formed in the conductor end portion 35b of the other coil conductor 35. The conductor end portion 35b is connected to the conductor end portion 36a of the coil conductor 36 of the set 44 and the through-hole conductor 58 for series connection. Are electrically connected. Thereby, the set 43 and the set 44 are connected in series in the stacking direction.

  One coil conductor 36 constituting the set 44 is a U-shaped conductor pattern that extends along the edges 10b, 10c, and 10d of the insulator layer 10 and opens at the edge 10a. The other coil conductor 37 constituting the set 44 is formed on the insulator layer 10 on the lower side of the coil conductor 36 and has the same shape as the coil conductor 36 when viewed from the stacking direction. That is, the coil conductor 37 is a U-shaped conductor pattern that extends along the edges 10b, 10c, and 10d of the insulator layer 10 and opens at the edge 10a. The conductor end 36a located on the corner side between the edge 10a and the edge 10b of the insulator layer 10 and the conductor end 36b located on the corner side between the edge 10a and the edge 10d. Each of the conductor end portions 36a and 36b is electrically connected to the other coil conductor 37 through the conductor end portions 37a and 37b and the parallel connection through-hole conductors 59 and 60, respectively. It is connected. As a result, one coil conductor 36 and the other coil conductor 37 constituting the set 44 are connected in parallel in the stacking direction. Further, a through hole is formed in the conductor end portion 37 b of the other coil conductor 37, and the conductor end portion 37 b passes through the conductor end portion 38 a of the coil conductor 38 of the set 45 and the series connection through hole conductor 61. Are electrically connected. As a result, the set 44 and the set 45 are connected in series in the stacking direction.

  One coil conductor 38 constituting the set 45 is a U-shaped conductor pattern that extends along the edges 10a, 10b, and 10c of the insulator layer 10 and opens at the edge 10d. The other coil conductor 39 constituting the set 45 is formed on the lower insulator layer 10 of the coil conductor 38 and has the same shape as the coil conductor 38 when viewed from the stacking direction. That is, the coil conductor 39 is a U-shaped conductor pattern that extends along the edges 10a, 10b, and 10c of the insulator layer 10 and opens at the edge 10d. The conductor end 38a located on the corner side between the edge 10a and the edge 10d of the insulator layer 10 and the conductor end 38b located on the corner side between the edge 10c and the edge 10d. Each of the conductor end portions 38a and 38b is electrically connected to the conductor end portions 39a and 39b of the other coil conductor 39 via the parallel connection through-hole conductors 62 and 63, respectively. It is connected. As a result, one coil conductor 38 and the other coil conductor 39 constituting the set 45 are connected in parallel in the stacking direction. The conductor end 39b of the coil conductor 39 of the set 45 constitutes the coil end 3b of the coil 3 itself.

  A first connection conductor 21 and a second connection conductor 23 are formed on the insulator layer 10 on the outer layer side of the coil conductor 30 of the coil 3. The first connection conductor 21 extends from the conductor end (other end) 21a on the corner side between the edge 10a and the edge 10d of the insulator layer 10 to the center position of the insulator layer 10, that is, the coil 3 This is a conductor pattern extending linearly toward the conductor end (one end) 21b on the circuit center line RL. The second connection conductors 23 are disposed one by one between the first connection conductor 21 and the coil conductor 30, and have the same shape as the first connection conductor 21 when viewed from the stacking direction. doing. In other words, the second connection conductor 23 is connected to the central position of the insulator layer 10, that is, the coil, from the conductor end (other end) 23 a on the corner portion between the edge 10 a and the edge 10 d of the insulator layer 10. 3 is a conductor pattern that extends linearly toward the conductor end (one end) 23b on the third center line RL. A through hole is formed in the conductor end portion 21b of the first connection conductor 21, and is electrically connected to the conductor end portion 23b of the second connection conductor 23 via the first parallel connection through hole conductor 65. Yes. Also, a through hole is formed in the conductor end 21a of the first connection conductor 21, and is electrically connected to the conductor end 23a of the second connection conductor via the second parallel connection through hole conductor 66. ing. Thereby, the first connection conductor 21 and the second connection conductor 23 are connected in parallel in the stacking direction. Further, a through hole is formed in the conductor end 23 a of the second connection conductor 23, and is electrically connected to the coil end 3 a of the coil 3 through a series connection through hole conductor 67. Thus, the first connection conductor 21 and the second connection conductor 23 and the coil 3 are connected in series.

  A first connection conductor 22 and a second connection conductor 24 are formed on the insulator layer 10 on the outer layer side of the coil conductor 39 of the coil 3. The first connection conductor 22 extends from the conductor end (other end) 22a on the corner portion between the edge 10c and the edge 10d of the insulator layer 10 to the center position of the insulator layer 10, that is, the coil 3. This is a conductor pattern extending linearly toward the conductor end (one end) 22b on the circuit center line RL. The second connecting conductors 24 are disposed one by one between the first connecting conductor 22 and the coil conductor 39, and have the same shape as the first connecting conductor 22 when viewed from the stacking direction. doing. In other words, the second connection conductor 24 is connected to the central position of the insulator layer 10, that is, the coil from the conductor end (other end) 24 a on the corner portion between the edge 10 c and the edge 10 d of the insulator layer 10. 3 is a conductor pattern that extends linearly toward the conductor end (one end) 24b on the third center line RL. A through hole is formed in the conductor end 24b of the second connection conductor 24, and is electrically connected to the conductor end 22b of the first connection conductor 22 via the first parallel connection through hole conductor 68. Yes. A through hole is formed in the conductor end 24a of the second connection conductor 24, and is electrically connected to the conductor end 22a of the first connection conductor via the second parallel connection through hole conductor 69. ing. Thus, the first connection conductor 22 and the second connection conductor 24 are connected in parallel in the stacking direction. Further, a through hole is formed in the coil end 3 b of the coil 3, and is electrically connected to the conductor end 24 a of the second connection conductor 24 through the series connection through hole conductor 70. Thus, the first connection conductor 22 and the second connection conductor 24 and the coil 3 are connected in series.

  Lead conductors 11, 12, and 13 are formed on the insulator layer 10 on the outer layer side of the first connection conductor 21, respectively. The lead conductors 11, 12, and 13 are arranged at the center position of each insulator layer 10, that is, on the rotation center line RL of the coil 3. The lead conductor 11 provided on the outermost insulator layer 10 is in contact with the external electrode 4. A through hole is formed in each of the lead conductors 11, 12, and 13 and is electrically connected to the conductor end portion 21 b of the first connection conductor 21 via the lead conductor through hole conductor 71. Thereby, the external electrode 4 and the lead conductors 11, 12, 13, the first connection conductor 21, the second connection conductor 23, and the coil 3 are electrically connected.

  In the insulator layer 10 on the outer layer side of the first connection conductor 22, lead conductors 14, 15, and 16 are formed, respectively. The lead conductors 14, 15, and 16 are arranged at the center position of each insulator layer 10, that is, on the circumferential center line RL of the coil 3. The lead conductor 14 provided on the lower surface of the outermost insulator layer 10 is in contact with the external electrode 5. Through-holes are formed in the lead conductors 15 and 16 and the conductor end portions 22b of the first connection conductors 22, respectively, and the conductor end portions 22b of the first connection conductors 22 and the lead-out conductors 14 through the lead-through conductor through-hole conductors 72. , 15, 16 are electrically connected. Thereby, the external electrode 5 and the lead conductors 14, 15, 16, the first connection conductor 22, the second connection conductor 24, and the coil 3 are electrically connected.

  Each conductor pattern and through-hole conductor are formed by printing and baking a conductive paste mainly composed of Ag on a ferrite green sheet. The thickness of each conductor pattern after firing is set to 5 to 20 μm, more preferably 10 to 15 μm.

  4 shows the lead conductors 11, 12, 13, the first connection conductor 21, the second connection conductor 23, the lead conductor through-hole conductor 71, the first parallel connection through-hole conductor 65, and the second parallel connection through-hole conductor. It is the figure which looked at 66 from the direction orthogonal to the lamination direction. In FIG. 4, the insulator layer 10 is omitted. As shown in FIG. 4, since each through hole is formed by a laser or the like, the lead conductor through hole conductor 71, the first parallel connecting through hole conductor 65, and the second parallel connecting through hole conductor 66 are arranged in the stacking direction. It becomes the shape which makes a taper toward. In the present embodiment, the center axes of the lead conductor through-hole conductor 71 and the first parallel connection through-hole conductor 65 coincide with the center line RL of the coil 3. That is, the central axis of the lead-through conductor 71 and the first parallel connection through-hole conductor 65 coincide with each other. The center axes of the lead conductor through-hole conductor 72 and the first parallel connection through-hole conductor 68 (not shown) also coincide with the center line RL of the coil 3.

  The diameter of the through-hole conductor 71 for the lead conductor can be set to φ30 to 60 μm, and in this embodiment is set to φ50 μm. On the other hand, the diameter of the first parallel connection through-hole conductor 65 is larger than the diameter of the lead conductor through-hole conductor 71, and the diameter can be set to 40 to 90 μm. In this embodiment, it is set to φ75 μm. If the diameter of the first parallel connection through-hole conductor 65 is larger than the diameter of the lead conductor through-hole conductor 71 when the diameter of the lead-through conductor 71 is set to be small, the first parallel connection through-hole conductor 65 is satisfied. It can be set smaller than the dimension in the present embodiment. Moreover, the diameter of the through-hole conductor 71 for lead conductors and the diameter of the first parallel connection through-hole conductor 65 are set larger than the conductor width of each coil conductor. The diameter of the second parallel connection through-hole conductor 66 is smaller than the diameter of the lead conductor through-hole conductor 71 and the first parallel connection through-hole conductor 65, and the diameter can be set to 20 to 40 μm. In this embodiment, it is set to φ30 μm. In addition, the diameter of the through-hole conductor in this embodiment has shown the diameter in the position of the narrowest part (diameter of the end surface on the coil side). Further, in the present embodiment, the thickness of the first parallel connection through-hole conductor 65 between the first connection conductor 21 and the second connection conductor 23 (indicated by t1 in the figure), the lead conductor 13 and the first connection The thickness of the through-hole conductor 71 for the lead conductor (indicated by t2 in the figure) between the conductor 21 and the conductor 21 is the same, and can be set to about 10 to 40 μm, more preferably about 20 to 30 μm. it can. The same relationship applies to the lead-through conductor 72, the first parallel connection through-hole conductor 68, and the second parallel connection through-hole conductor 69, which are not shown in FIG.

  Next, operations and effects of the multilayer electronic component 1 according to the present embodiment will be described with reference to FIGS. 5, 6, and 7.

  FIG. 5 shows a state of the lead conductor, the connection conductor, and each through-hole conductor at the time of stacking and pressing of the conventional multilayer electronic component 100 and the multilayer electronic component 200 in which the connection conductor of the conventional multilayer electronic component 100 is linear. FIG. 2A is a schematic diagram illustrating a state in which the multilayer electronic component 100 according to the related art is laminated and crimped, and FIG. Is shown. FIG. 6 is a perspective view showing the shapes of the conventional substantially L-shaped connection conductor 101 and the straight connection conductor 21, and FIG. 6A shows the shape of the first connection conductor 101 of the conventional multilayer electronic component 100. (B) has shown the shape of the 1st connection conductor 21 of the multilayer electronic component 200 and the multilayer electronic component 1 which concerns on this embodiment. FIG. 7 is a schematic view showing a state of the through-hole conductor for the lead conductor, the first connection conductor, the first parallel-connection through-hole conductor, and the second connection conductor at the time of laminated crimping, and (a) is a laminated electron The state at the time of the lamination | stacking crimping | compression-bonding of the component 200 is shown, (b) has shown the mode at the time of the lamination | stacking crimping | compression-bonding of the multilayer electronic component 1 which concerns on this embodiment. 5 and 7 are schematic diagrams, and in order to clarify the operation and effect of the present invention and the difference from the conventional multilayer electronic component, and to facilitate the understanding of the explanation, the sinking amount of each conductor And the amount of bite are partially exaggerated or omitted.

  As shown in FIGS. 5A and 6A, the conventional multilayer electronic component 100 is different from the first connecting conductor 101 and the second connecting conductor 102 in the shape of the first connecting conductor 101 and the first parallel connecting through hole. This is different from the multilayer electronic component 1 according to the present embodiment in that the diameter of the conductor 103 is the same as the diameter of the through-hole conductor 71 for the lead conductor. As shown in FIG. 6A, the first connection conductor 101 and the second connection conductor 102 have a shape bent in an L shape, and from the conductor end portion 101 a on the corner portion side of the insulator layer 10. It extends to the center along the edge, bends 90 °, and extends to the conductor end 101b at the center of the insulator layer 10. Further, as shown in FIGS. 5B and 6B, the multilayer electronic component 200 includes a first connection conductor 101 and a second connection conductor 102 that are substantially L-shaped in the conventional multilayer electronic component 100. As in the multilayer electronic component 1 according to this embodiment, the linear first connection conductor 21 and the second connection conductor 23 are replaced. The multilayer electronic component 200 is different from the multilayer electronic component 1 according to the present embodiment in that the first parallel connection through hole conductor 103 having the same diameter as the lead conductor through hole conductor 71 is applied. Yes.

  In the multilayer electronic component 200, the direct current resistance can be lowered by changing the connection conductor from a substantially L-shaped shape to a linear connection conductor. However, when the connecting conductor is made linear, the connecting conductor enters the region on the inner peripheral side of the coil 3, and there is a possibility that the coil characteristics may be affected.

  Specifically, when the connection conductors 101 and 102 are substantially L-shaped as in the conventional multilayer electronic component 100, the portion indicated by A in FIG. 6A is supported by the coil conductor on the inner layer side. Therefore, the distance between the position where a large force acts via the lead conductors 11, 12, 13 and the through-hole conductors 71, 103 at the time of laminated crimping and the position supported by each coil conductor on the inner layer side is an insulator. The length is about half of one side of the layer 10 (indicated by L1 in FIG. 6). On the other hand, when the connection conductors 21 and 23 are linear like the multilayer electronic component 200, the conductor end 21a in FIG. 6B is supported by the coil conductor on the inner layer side. Further, the distance between the position where a large force acts via the through-hole conductor and the position supported by the coil conductor on the inner layer side is approximately half the length of the diagonal line of the insulator layer 10 (L2 in FIG. 6). It is longer than L1. Therefore, as compared with the conventional multilayer electronic component 100 shown in FIG. 5A, in the case of the multilayer electronic component 200 in which the connecting conductors 21 and 23 are linear, as shown in FIG. At the time of crimping, the lead conductors 11, 12, 13, the connection conductors 21, 23, and the through-hole conductors 71, 103 greatly sink to the inner layer side.

  Further, in the multilayer electronic component 200, the first parallel connection through-hole conductor 103 has the same diameter as the lead conductor through-hole conductor 71, and as shown in FIG. The first parallel connection through-hole conductor 103 can easily bite into the conductor end 23 b of the second connection conductor 23. When firing is performed in this state, the second connection conductor 23 and the like sink to the inner layer side from the position on the outermost layer side of the coil 3 (indicated by the alternate long and short dash line CL in the figure). There is a possibility of obtaining a multilayer electronic component that has entered the region. As described above, in the multilayer electronic component 200 in which the connection conductor of the conventional multilayer electronic component 100 is simply linear, the connection conductor or the like enters the region on the inner peripheral side of the coil 3, so that the coil characteristics are reduced. There was a possibility of affecting.

  On the other hand, in the multilayer electronic component 1 according to the present embodiment, the first connection conductor 21 and the second connection conductor 23 are located on the circuit center line RL side from the conductor end portions 21a and 23a on the corner portion side of the insulator layer 10. In addition to extending linearly to the conductor end portions 21b and 23b, the first parallel connection through-hole conductor 65 has a larger diameter than the lead conductor through-hole conductor 71.

  According to the multilayer electronic component 1 according to the present embodiment, the diameter of the first parallel connection through-hole conductor 65 is made larger than that of the lead-through conductor through-hole conductor 71 as shown in FIG. Therefore, the first parallel connection through-hole conductor 65 functions as a support member that receives the bite of the lead-out conductor through-hole conductor 71 at the time of laminating and crimping. Accordingly, the conductor end 21b of the first connection conductor 21 and the conductor end 23b of the second connection conductor 23 are compared with the case where the first parallel connection through-hole conductor 103 shown in FIG. Sinking can be suppressed. Furthermore, the pressure acting on the conductor end 23b can be dispersed by increasing the area of the portion where the first parallel connection through-hole conductor 65 abuts against the conductor end 23b of the second connection conductor 23. Therefore, compared with the case where the first parallel connection through-hole conductor 103 shown in FIG. 7A is applied, the amount of penetration of the first parallel connection through-hole conductor 65 with respect to the conductor end 23b of the second connection conductor 23 is increased. Can be reduced. When fired in this state, it is possible to obtain the multilayer electronic component 1 in which the connecting conductor does not bite into the inner peripheral region of the coil 3. As described above, according to the multilayer electronic component 1 according to the present embodiment, the connection conductor is prevented from entering the region on the inner peripheral side of the coil 3 while reducing the DC resistance by making the connection conductor linear. , Reliability can be improved.

  The present invention is not limited to the embodiment described above.

  For example, in the above-described embodiment, the thickness of the first parallel connection through-hole conductor 65 and the thickness of the lead conductor through-hole conductor 71 are the same. The thickness of the conductor 65 may be made thinner than the thickness of the lead conductor through-hole conductor 71. As shown in FIG. 8, the dimension indicated by t1 in the figure can be made smaller than the dimension indicated by t2 in the figure. Thus, by reducing the thickness of the first parallel connection through-hole conductor 65, the first parallel connection through-hole conductor 65 can be formed into a flat shape, whereby the first parallel connection through-hole conductor 65 is formed. Since the conductor 65 is less likely to bite into the second connection conductor 23 at the time of laminated crimping, it is possible to further suppress the second connection conductor 23 from entering the region on the inner peripheral side of the coil 3. In addition, the range of the dimension t1 and the dimension t2 can be set in the range of 10-40 micrometers, more preferably 20-30 micrometers similarly to the above-mentioned embodiment, Each dimension is set so that the relationship of t1 <t2 may be satisfied. Is done.

  In the above-described embodiment, the configuration in which the first parallel connection through-hole conductor has a smaller diameter than the through-conductor for the lead conductor is applied to both end sides of the element body 2 in the stacking direction. Even if it is applied only to at least one end side, the effect of the present invention can be obtained.

  DESCRIPTION OF SYMBOLS 1 ... Laminated type electronic component, 2 ... Element body, 3 ... Coil, 3a, 3b ... Coil end, 4, 5 ... External electrode, 10 ... Insulator layer, 11, 12, 13, 14, 15, 16 ... Lead conductor 21, 22 ... first connection conductor, 21 a, 22 a ... conductor end (other end) 21 b, 22 b ... conductor end (one end), 23, 24 ... second connection conductor, 23 a, 24 a ... conductor end (Other end part), 23b, 24b ... conductor end part (one end part), 30, 31, 32, 33, 34, 35, 36, 37, 38, 39 ... coil conductor, 41, 42, 43, 44, 45 ... A set of a plurality of coil conductors, 65 and 68 ... First through-hole conductor for parallel connection, 66 and 69 ... Second through-hole conductor for parallel connection, 67 and 70 ... Through-hole conductor for series connection, 71 and 72 ... Through-hole conductor for conductor.

Claims (2)

An element body formed by laminating a plurality of rectangular insulator layers;
A plurality of sets of coil conductors connected in parallel across the insulator layer are connected in series in the stacking direction to form a coil formed in a spiral shape within the element body,
A pair of external electrodes respectively formed at both ends of the element body in the stacking direction;
A lead conductor that is laminated between at least one of the external electrodes and a coil end of the coil, and draws out the coil end in the lamination direction to electrically connect the external electrode and the coil;
The lead conductor, which is laminated between the lead conductor and the coil end of the coil and is arranged on the side of the center line of the coil, and the coil end arranged on the corner side of the insulator layer are electrically connected. A first connecting conductor that connects electrically,
A second connection conductor laminated between the first connection conductor and the coil end, parallel to the first connection conductor and connected in parallel;
A through-hole conductor for a lead conductor that electrically connects the lead conductor and one end of the first connection conductor;
A first parallel connection through-hole conductor for electrically connecting the one end of the first connection conductor and one end of the second connection conductor;
A second parallel connection through-hole conductor for electrically connecting the other end of the first connection conductor and the other end of the second connection conductor;
A series connection through-hole conductor for electrically connecting the other end of the second connection conductor and the coil end;
The first connection conductor and the second connection conductor extend linearly from the corner side of the insulator layer to the circumferential centerline side,
The multilayer electronic component according to claim 1, wherein the first parallel connection through-hole conductor has a larger diameter than the lead conductor through-hole conductor.   2. The multilayer electronic component according to claim 1, wherein the first parallel connection through-hole conductor is thinner than a thickness of the lead conductor through-hole conductor.

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