JP6797676B2 - Coil parts - Google Patents

Description

The present invention relates to a coil component having an insulator portion and a coil portion provided inside the insulator portion.

Conventionally, coil components have been mounted on electronic devices and the like, and in particular, coil components used in portable devices have a chip shape and are surface-mounted on a circuit board built in the portable device or the like. As an example of the prior art, for example, in Patent Document 1, a spiral conductor having at least one end connected to an external electrode is built in an insulating resin made of a cured product, and the direction of the spiral of the conductor is mounted. A chip coil formed so as to be parallel to a substrate surface is disclosed. Similarly, Patent Document 2 discloses a laminated coil component formed so that the axial direction of the coiled conductor is parallel to the substrate surface.

Further, Patent Document 3 includes an insulator made of resin, a coiled inner conductor provided in the insulator, and an external electrode electrically connected to the inner conductor, and the insulator has a length L. , Width W and height H are rectangular, and the relationship L> W ≧ H is established for L, W, and H, and the external electrode has a length on one surface perpendicular to the height direction H of the insulator. A coil component is disclosed in which one conductor is formed in the vicinity of both ends of the one surface in the direction L, and the inner conductor has a coil shaft substantially parallel to the width direction W of the insulator.

Japanese Unexamined Patent Publication No. 2006-324489 Japanese Unexamined Patent Publication No. 2006-32430 Japanese Unexamined Patent Publication No. 2014-232815

In recent years, as electronic devices have become smaller and thinner, coil components mounted on the electronic devices have been further miniaturized. However, as the coil components are miniaturized, the characteristics of the coil components are significantly deteriorated. Therefore, there is a demand for a technique that can satisfy the characteristic requirements while reducing the size of the coil parts.

In view of the above circumstances, an object of the present invention is to provide a coil component having high characteristics while achieving miniaturization.

In order to achieve the above object, the coil component according to one embodiment of the present invention includes an insulator portion and a coil portion.
The insulator portion has a width direction in the first axial direction, a length direction in the second axial direction, and a height direction in the third axial direction, and is made of a non-magnetic material.
The coil portion has a circumferential portion wound around the first axial direction, and is arranged inside the insulator portion.
The ratio of the height dimension to the length dimension of the insulator portion is the ratio of the height dimension along the second axial direction to the length dimension between the inner peripheral portions of the peripheral portion along the second axial direction. It is 1.5 times or less of the ratio of the height dimension between the inner peripheral parts of.

The ratio of the height dimension between the inner peripheral portions of the peripheral portion along the third axial direction to the length dimension between the inner peripheral portions of the peripheral portion along the second axial direction is typically. Is 0.6 or more and 1.0 or less.

The ratio of the area partitioned by the inner peripheral portion of the peripheral portion to the area of the insulating portion as viewed from the first axial direction is typically 0.22 or more and 0.45 or less.

The insulator portion is typically made of a ceramic or resin material.

The ratio of the area partitioned by the inner peripheral portion of the peripheral portion to the area of the insulating portion as viewed from the first axial direction is 0.22 or more and 0.65 or less.

The insulator portion is made of a ceramic or resin material.

The insulator portion may have a rectangular parallelepiped shape. In this case, the coil component further includes an external electrode arranged only on one surface of the insulator portion, which is electrically connected to the coil portion.

The coil portion and the external electrode may be electrically connected by a connecting via conductor connected to the end portion of the coil portion.

The cross section of the via conductor orthogonal to the third axis may have a cross section shape larger than the cross section of the end portion of the coil portion orthogonal to the third axis.

The external electrode may have an inner surface portion of the insulator portion facing the one surface, and a plurality of protrusions provided on the inner surface portion and immersed in the one surface.

According to the present invention, it is possible to provide a coil component having high characteristics while achieving miniaturization.

It is a schematic perspective perspective view of the electronic component which concerns on one Embodiment of this invention. It is a schematic perspective side view of the said electronic component. It is a schematic perspective top view of the said electronic component. It is a schematic perspective side view which shows the electronic component upside down. It is a schematic top view of each electrode layer which comprises the said electronic component. It is the schematic sectional drawing of the element unit area which shows the basic manufacturing flow of the said electronic component. It is the schematic sectional drawing of the element unit area which shows the basic manufacturing flow of the said electronic component. It is the schematic sectional drawing of the element unit area which shows the basic manufacturing flow of the said electronic component. It is a schematic diagram explaining the high frequency characteristic of a coil component. It is a schematic side view which showed the dimension of each part of the said electronic component. It is the schematic top view which showed the dimension of each part of the said electronic component. It is a schematic perspective perspective view and the appearance perspective view which show the 1st structural example of the electronic component which concerns on other embodiment of this invention. FIG. 12 is a schematic perspective side view and an external side view of the electronic component shown in FIG. It is a schematic perspective top view of the electronic component shown in FIG. It is a schematic perspective side view which shows the electronic component shown in FIG. 12 upside down. It is a schematic top view of each electrode layer constituting the electronic component shown in FIG. It is a schematic perspective perspective view which shows the 2nd structural example of the said electronic component. It is a schematic perspective side view of the electronic component shown in FIG. It is a schematic perspective top view of the electronic component shown in FIG. It is a schematic perspective perspective view which shows the 3rd structural example of the said electronic component. It is a schematic perspective side view of the electronic component shown in FIG. It is a schematic perspective top view of the electronic component shown in FIG. It is a schematic perspective side view of the electronic component which concerns on one Embodiment of this invention and the modification. FIG. 5 is a schematic perspective side view of electronic components having side margins different from each other according to the first configuration example. It is a figure which shows the inductance (L value) characteristic of each electronic component shown in FIG. 23 and FIG. It is a figure which shows the Q value characteristic of each electronic component shown in FIG. 23 and FIG. It is a figure which compares the formable region of the internal conductor part by the difference of the structure of the electronic component which concerns on embodiment of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<First Embodiment>
[Basic configuration]
FIG. 1 is a schematic perspective perspective view of an electronic component according to an embodiment of the present invention, FIG. 2 is a schematic perspective side view thereof, and FIG. 3 is a schematic perspective top view thereof.
In each figure, the X-axis, Y-axis, and Z-axis directions indicate three axial directions that are orthogonal to each other.

The electronic component 100 of this embodiment is configured as a coil component for surface mounting. The electronic component 100 includes an insulator portion 10, an internal conductor portion 20, and an external electrode 30.

The insulator portion 10 has a top surface 101, a bottom surface 102, a first end surface 103, a second end surface 104, a first side surface 105, and a second side surface 106, and has a width direction and a Y-axis direction in the X-axis direction. It is formed in a rectangular parallelepiped shape having a length direction and a height direction in the Z-axis direction. The insulator portion 10 is designed, for example, to have a width dimension of 0.05 to 0.2 mm, a length dimension of 0.1 to 0.4 mm, and a height dimension of 0.05 to 0.4 mm. In the present embodiment, the width dimension is about 0.2 mm, the length dimension is about 0.35 mm, and the height dimension is about 0.2 mm.

The insulator portion 10 has a main body portion 11 and a top surface portion 12. The main body portion 11 incorporates an internal conductor portion 20 and constitutes a main portion of the insulator portion 10. The top surface portion 12 constitutes the top surface 101 of the insulator portion 10. The top surface portion 12 may be configured as a printing layer for displaying, for example, the model number of the electronic component 100.

The main body portion 11 and the top surface portion 12 are made of an insulating material mainly composed of resin. As the insulating material constituting the main body 11, a resin that is cured by heat, light, a chemical reaction, or the like is used, and examples thereof include polyimide, epoxy resin, and liquid crystal polymer. On the other hand, the top surface portion 12 may be made of a resin film or the like in addition to the above materials. Alternatively, the insulator portion 10 may be made of a ceramic material such as glass.

For the insulator portion 10, a composite material containing a filler in the resin may be used. Typical examples of the filler include ceramic particles such as silica, alumina, and zirconia. The shape of the ceramic particles is not particularly limited and is typically spherical, but the shape is not limited to this and may be needle-shaped, scaly-shaped, or the like.

The inner conductor portion 20 is provided inside the insulator portion 10. The inner conductor portion 20 has a plurality of columnar conductors 21 and a plurality of connecting conductors 22, and the coil portion 20L is composed of the plurality of columnar conductors 21 and the connecting conductors 22.

The plurality of columnar conductors 21 are formed in a substantially cylindrical shape having an axial center parallel to the Z-axis direction. The plurality of columnar conductors 21 are composed of two conductor groups facing each other in the substantially Y-axis direction. The first columnar conductors 211 forming one of the conductor groups are arranged at predetermined intervals in the X-axis direction, and the second columnar conductors 212 forming the other conductor group are also arranged in the X-axis direction. Are arranged at predetermined intervals.

The substantially cylindrical shape includes not only a pillar having a circular cross-sectional shape in the direction perpendicular to the axis (direction perpendicular to the axis) but also a pillar having an elliptical or oval cross-sectional shape. Alternatively, the oval means, for example, a major axis / minor axis ratio of 3 or less.

The first and second columnar conductors 211 and 212 have the same diameter and the same height, respectively. In the illustrated example, five first and second columnar conductors 211 and 212 are provided, respectively. As will be described later, the first and second columnar conductors 211 and 212 are configured by laminating a plurality of via conductors in the Z-axis direction.

It should be noted that the substantially same diameter is for suppressing an increase in resistance, and means that the variation in dimensions when viewed in the same direction is within, for example, 10%. Approximately the same height means the stacking accuracy of each layer. It means that the height variation is within the range of ± 1 μm, for example.

The plurality of connecting conductors 22 are formed parallel to the XY plane and are composed of two conductor groups facing each other in the Z-axis direction. The first connecting conductors 221 constituting one of the conductor groups extend along the Y-axis direction and are arranged at intervals in the X-axis direction, and are arranged between the first and second columnar conductors 211 and 212. Connect individually. The second connecting conductor 222 constituting the other conductor group extends at a predetermined angle with respect to the Y-axis direction and is arranged at intervals in the X-axis direction, and the first and second columnar conductors 211 and 212 are arranged. Connect individually between. In the illustrated example, the first connecting conductor 221 is composed of five connecting conductors and the second connecting conductor 222 is composed of four connecting conductors.

In FIG. 1, the first connecting conductor 221 is connected to the upper end of a predetermined set of columnar conductors 211 and 212, and the second connecting conductor 222 is connected to the lower end of a predetermined set of columnar conductors 211 and 212. Will be done. More specifically, the first and second columnar conductors 211 and 212 and the first and second connecting conductors 221 and 222 form the peripheral portions Cn (C1 to C5) of the coil portion 20L, and these peripheral portions Cn. Are connected to each other in a rectangular spiral around the X-axis. As a result, inside the insulator portion 10, a coil portion 20L having an axial center (coil shaft) in the X-axis direction and having a rectangular opening shape is formed.

In the present embodiment, the peripheral portion Cn is composed of five peripheral portions C1 to C5. The opening shapes of the peripheral portions C1 to C5 are formed to have substantially the same shape.

The inner conductor portion 20 further includes a drawer portion 23 and a comb tooth block portion 24, through which the coil portion 20L is connected to the external electrodes 30 (31, 32).

The drawer unit 23 has a first drawer unit 231 and a second drawer unit 232. The first drawer portion 231 is connected to the lower end of the first columnar conductor 211 forming one end of the coil portion 20L, and the second drawer portion 232 is the second columnar conductor forming the other end of the coil portion 20L. It is connected to the lower end of 212. The first and second drawer portions 231 and 232 are arranged on the same XY plane as the second connecting conductor 222, and are formed parallel to the Y-axis direction.

The comb tooth block portion 24 has first and second comb tooth block portions 241,242 arranged so as to face each other in the Y-axis direction. The first and second comb tooth block portions 241,242 are arranged with the tips of the respective comb tooth portions facing upward in FIG. A part of the comb tooth block portions 241,242 is exposed on both end faces 103 and 104 and the bottom surface 102 of the insulator portion 10. The first and second drawer portions 231 and 232 are connected between the predetermined comb tooth portions of the first and second comb tooth block portions 241,242 (see FIG. 3). Conductor layers 301 and 302 forming the base layer of the external electrode 30 are provided on the bottoms of the first and second comb tooth block portions 241,242, respectively (see FIG. 2).

The external electrode 30 constitutes an external terminal for surface mounting, and has first and second external electrodes 31 and 32 facing each other in the Y-axis direction. The first and second external electrodes 31 and 32 are formed in a predetermined region on the outer surface of the insulator portion 10.

More specifically, as shown in FIG. 2, the first and second external electrodes 31 and 32 have an insulator and a first portion 30A that covers both ends of the bottom surface 102 of the insulator layer 10 in the Y-axis direction. It has a second portion 30B that covers both end faces 103 and 104 of the layer 10 over a predetermined height. The first portion 30A is electrically connected to the bottoms of the first and second comb tooth block portions 241,242 via the conductor layers 301 and 302. The second portion 30B is formed on the end faces 103 and 104 of the insulator layer 10 so as to cover the comb tooth portions of the first and second comb tooth block portions 241,242.

The columnar conductor 21, the connecting conductor 22, the drawer portion 23, the comb tooth block portion 24, and the conductor layers 301 and 302 are made of a metal material such as Cu (copper), Al (aluminum), or Ni (nickel). In the embodiment, each is composed of a plating layer of copper or an alloy thereof. The first and second external electrodes 31 and 32 are composed of, for example, Ni / Sn plating.

FIG. 4 is a schematic perspective side view showing the electronic component 100 upside down. As shown in FIG. 4, the electronic component 100 is composed of a film layer L1 and a laminate of a plurality of electrode layers L2 to L6. In the present embodiment, the film layer L1 and the electrode layers L2 to L6 are sequentially laminated in the Z-axis direction from the top surface 101 to the bottom surface 102. The number of layers is not particularly limited and will be described here as 6 layers.

The film layer L1 and the electrode layers L2 to L6 include elements of the insulator portion 10 and the inner conductor portion 20 constituting the respective layers. 5A to 5F are schematic top views of the film layer L1 and the electrode layers L2 to L6 in FIG. 4, respectively.

The film layer L1 is composed of a top surface portion 12 forming a top surface 101 of the insulator portion 10 (FIG. 5A). The electrode layer L2 includes an insulating layer 110 (112) forming a part of the insulator portion 10 (main body portion 11) and a first connecting conductor 221 (FIG. 5B). The electrode layer L3 includes an insulating layer 110 (113) and a via conductor V1 forming a part of columnar conductors 211 and 212 (FIG. 5C). The electrode layer L4 includes an insulating layer 110 (114), a via conductor V1, and a via conductor V2 forming a part of comb tooth block portions 241,242 (FIG. 5D). The electrode layer L5 includes an insulating layer 110 (115), via conductors V1 and V2, drawer portions 231 and 232, and a second connecting conductor 222 (FIG. 5E). The electrode layer L6 includes an insulating layer 110 (116) and a via conductor V2 (FIG. 5F).

The electrode layers L2 to L6 are laminated in the height direction via the joint surfaces S1 to S4 (FIG. 4). Therefore, each of the insulating layers 110 and the via conductors V1 and V2 also have a boundary portion in the height direction. The electronic component 100 is manufactured by a build-up method in which the electrode layers L2 to L6 are laminated while being manufactured in order from the electrode layer L2.

[Basic manufacturing process]
Subsequently, the basic manufacturing process of the electronic component 100 will be described. A plurality of electronic components 100 are simultaneously manufactured at the wafer level, and after manufacturing, each element is individualized (chips).

6 to 8 are schematic cross-sectional views of an element unit region for explaining a part of the manufacturing process of the electronic component 100. As a specific manufacturing method, a resin film 12A (film layer L1) constituting the top surface portion 12 is attached to the support substrate S, and electrode layers L2 to L6 are sequentially produced on the resin film 12A (film layer L1). For the support substrate S, for example, silicon, glass, or a sapphire substrate is used. Typically, a step of producing a conductor pattern constituting the internal conductor portion 20 by an electroplating method and coating the conductor pattern with an insulating resin material to produce an insulating layer 110 is repeatedly performed.

6 and 7 show the manufacturing process of the electrode layer L3.

In this step, first, a seed layer (feeding layer) SL1 for electroplating is formed on the surface of the electrode layer L2 by, for example, a sputtering method (FIG. 6A). The seed layer SL1 is not particularly limited as long as it is a conductive material, and is composed of, for example, Ti (titanium) or Cr (chromium). The electrode layer L2 includes an insulating layer 112 and a connecting conductor 221. The connecting conductor 221 is provided on the lower surface of the insulating layer 112 so as to be in contact with the resin film 12A.

Subsequently, a resist film R1 is formed on the seed layer SL1 (FIG. 6B). By sequentially performing treatments such as exposure and development on the resist film R1, a plurality of openings P1 corresponding to the via conductor V13 forming a part of the columnar conductor 21 (211,212) are formed via the seed layer SL1. The resist pattern to have is formed (FIG. 6C). After that, a death come treatment is performed to remove the resist residue in the opening P1 (FIG. 6D).

Subsequently, the support substrate S is immersed in the Cu plating bath, and a plurality of via conductors V13 made of the Cu plating layer are formed in the opening P1 by applying a voltage to the seed layer SL1 (FIG. 6E). Then, after the resist film R1 and the seed layer SL1 are removed (FIG. 7A), the insulating layer 113 covering the via conductor V13 is formed (FIG. 7B). The insulating layer 113 is cured after printing, coating, or attaching a resin film on the electrode layer L2. After curing, the surface of the insulating layer 113 is polished using a polishing device such as a CMP (chemical mechanical polishing device) or a grinder until the tip of the via conductor V13 is exposed (FIG. 7C). FIG. 7C shows, as an example, a state in which the support substrate S is set on the polishing head H that can rotate upside down, and the insulating layer 113 is polished (CMP) by the revolving polishing pad P. ing.
As described above, the electrode layer L3 is produced on the electrode layer L2 (FIG. 7D).

Although the description of the method of forming the insulating layer 112 has been omitted, typically, the insulating layer 112 is also printed, coated, or affixed in the same manner as the insulating layer 113, and then cured to be CMP (chemical mechanical). It is manufactured by a method of polishing with a target polishing device) or a grinder.

After that, the electrode layer L4 is produced on the electrode layer L3 in the same manner.

First, on the insulating layer 113 (second insulating layer) of the electrode layer L3, a plurality of via conductors (second via conductors) connected to the plurality of via conductors V13 (first via conductors) are formed. .. That is, a seed layer covering the surface of the first via conductor is formed on the surface of the second insulating layer, and a region corresponding to the surface of the first via conductor opens on the seed layer. A resist pattern is formed, and the second via conductor is formed by an electroplating method using the resist pattern as a mask. Subsequently, a third insulating layer covering the second via conductor is formed on the second insulating layer. Then, the surface of the third insulating layer is polished until the tip of the second via conductor is exposed.

In the second via conductor forming step, the via conductor V2 forming a part of the comb tooth block portion 24 (241,242) is also formed at the same time (see FIGS. 4 and 5D). In this case, as the resist pattern, in addition to the formation region of the second via conductor, a resist pattern in which the formation region of the via conductor V2 opens is formed.

8A to 8D show a part of the manufacturing process of the electrode layer L5.

Here, too, first, a seed layer SL3 for electroplating and a resist pattern (resist film R3) having openings P2 and P3 are sequentially formed on the surface of the electrode layer L4 (FIG. 8A). After that, a death come treatment is performed to remove the resist residue in the openings P2 and P3 (FIG. 8B).

The electrode layer L4 has an insulating layer 114 and via conductors V14 and V24. The via conductor V14 corresponds to a via (V1) forming a part of the columnar conductor 21 (211,212), and the via conductor V24 is a via (V2) forming a part of the comb tooth block portion 24 (241,242). ) (See FIGS. 5C and 5D). The opening P2 faces the via conductor V14 in the electrode layer L4 via the seed layer SL3, and the opening P3 faces the via conductor V24 in the electrode layer L4 via the seed layer SL3. The opening P2 is formed in a shape corresponding to each connecting conductor 222.

Subsequently, the support substrate S is immersed in the Cu plating bath, and the via conductor V25 and the connecting conductor 222 made of the Cu plating layer are formed in the openings P2 and P3 by applying a voltage to the seed layer SL3 (FIG. 8C). ). The via conductor V25 corresponds to a via (V2) forming a part of the comb tooth block portion 24 (241,242).

Subsequently, the resist film R3 and the seed layer SL3 are removed to form an insulating layer 115 that covers the via conductor V25 and the connecting conductor 222 (FIG. 8D). After that, even if not shown, the surface of the insulating layer 115 is polished until the tip of the via conductor V25 is exposed, and the steps of forming the seed layer, forming the resist pattern, electroplating, etc. are repeated to obtain FIGS. The electrode layer L5 shown in 5E is produced.

After that, the conductor layers 301 and 302 are formed on the comb tooth block portions 24 (241, 242) exposed on the surface (bottom surface 102) of the insulating layer 115, and then the first and second external electrodes 31 and 32 are formed, respectively. Will be done.

[Structure of the present embodiment]
With the miniaturization of parts in recent years, it tends to be difficult to secure coil characteristics. That is, the characteristics of the coil component largely depend on the size, shape, etc. of the built-in coil portion, and typically, the larger the opening of the coil portion, the higher the inductance characteristic can be obtained.
However, the miniaturization of parts causes restrictions on the size of the insulator portion, and as a result, the effective area of the coil portion is reduced, resulting in a decrease in inductance characteristics.
Therefore, in the present embodiment, by optimizing the dimensional ratio of the opening of the coil portion, the characteristics of the coil component are improved while the size is reduced.

9A to 9C are schematic views for explaining the high frequency characteristics of the coil component. The coil component 200 shown in FIG. 9A has a rectangular parallelepiped-shaped insulator portion 210 and a coil portion 220C arranged inside the insulator portion 210. Here, in order to facilitate understanding, the peripheral portion Cn of the coil portion 220C is represented by a simple rectangular annular region provided with diagonal lines (hatching) (the same applies to FIG. 10). Reference numeral 230 is an external electrode.

In a typical miniaturization method for coil parts, the height of the insulator portion 210 is lowered, so that the upper side (hereinafter referred to as A side) and the lower side (hereinafter referred to as B side) of the peripheral portion Cn are close to each other. To do. When the A side and the B side of the orbiting portion Cn come close to each other, the influence between the magnetic fluxes (magnetic fields) formed on the A side and the B side becomes large. That is, as shown in FIG. 9B, the magnetic flux ΦA formed by the current IA flowing on the A side is in the opposite direction to the ΦB formed by the current IB flowing on the B side, so that the closer the A side and the B side are, the closer they are. Mutual interference (cancellation) between the magnetic flux ΦA and the magnetic flux ΦB becomes large. As a result, the magnetic flux ΦT of the entire opening of the peripheral portion Cn also becomes small, and the inductance as designed cannot be obtained.

Therefore, in the present embodiment, as shown in FIG. 9C, by increasing the distance between the A side and the B side, mutual interference between the magnetic fluxes ΦA and ΦB formed on both sides is suppressed, and the magnetic flux of the entire peripheral portion Cn is suppressed. The ΦT is increased to increase the inductance. Further, the fact that the inductance can be increased leads to the fact that the line length can be shortened at the same time, and as a result, the resistance can be suppressed to be low, so that the Q value can be increased.

The separation distance between the A side and the B side of the peripheral portion Cn can be realized by increasing the height of the insulator portion 210. As a result, the mounting area of the coil component does not increase, so that the coil characteristics can be improved while reducing the size of the coil component.

In the coil component 200 in which the above typical miniaturization method is used, the dimensional ratio (hd / ld) of the inner peripheral surface of the conductor corresponding to the opening (core) of the peripheral portion must be reduced due to the restriction of the external dimensions of the chip component. No (see FIG. 9A). On the other hand, the present embodiment is characterized in that the external dimensions of the chip parts are reviewed and the dimensional ratio (hd / ld) is increased without changing the size (part volume) of the insulator portion 10. As a result, the inductance can be increased efficiently, and as a result, a coil component having a high Q value can be obtained.

Specifically, in the coil component 100 of the present embodiment, as shown in FIG. 10, the ratio (Ha / La) of the height dimension (Ha) to the length dimension (La) of the insulator portion 10 is in the Y-axis direction. 1.5 of the ratio (hd / ld) of the height dimension (hd) between the inner circumferences of the circumference Cn along the Z-axis direction to the length dimension (ld) between the inner circumferences of the circumference Cn along It is configured to be less than double. As a result, the Q value of the coil component 100 can be efficiently increased.

Here, the "length dimension (ld) between the inner peripheral portions of the peripheral portion Cn along the Y-axis direction" is the distance between the facing surfaces of the first and second columnar conductors 211 and 212 constituting the peripheral portion Cn. The length of the distance in the Y-axis direction projected onto the YZ plane.
Further, the "height dimension (hd) between the inner peripheral portions of the peripheral portion Cn along the Z-axis direction" is defined as the distance between the facing surfaces of the first and second connecting conductors 211 and 222 constituting the peripheral portion Cn. The length in the Z-axis direction in which the distance is projected onto the YZ plane.
Regarding the measurement of dimensions, cross-section polishing and milling are performed from the Z-axis direction (height direction) to the surface passing through the center of the insulator in the height direction, and the observation with a scanning electron microscope (SEM) is performed at a magnification of about 200 times. The distance between the columnar conductor 211 of 1 and the second columnar conductor 212 is measured and used as the length dimension (ld) between the inner peripheral portions of the peripheral portion Cn. Further, cross-section polishing and milling are performed from the X-axis direction (width direction) to the surface passing through the center of the insulator portion in the width direction, and the distance between the first connecting conductor 221 and the second connecting conductor 222 is measured by SEM. It is the height dimension (hd) between the inner peripheral portions of the peripheral portion Cn. The dimensions of the other parts are also measured using the above observation samples.

The opening size ratio (hd / ld) of the peripheral portion Cn is not particularly limited, and in the present embodiment, it is 0.6 or more and 1.2 or less. As a result, a high inductance value and Q value can be secured more stably.

Further, the ratio (Sd / Sa) of the area (Sd) partitioned by the inner peripheral portion of the peripheral portion Cn to the area (Sa) of the insulator portion 12 viewed from the coil axis direction (X-axis direction) is not particularly limited. In this embodiment, it is 0.22 or more and 0.45 or less (22% or more and 45% or less). As a result, the inductance value of the coil component 100 can be efficiently increased.

Further, according to the present embodiment, since the first and second comb tooth block portions 241,242 are arranged with the tips of the respective comb tooth portions facing upward in FIG. 1, the insulator accompanying the increase in height The lack of rigidity of the portion 10 can be compensated. Thereby, the reliability of the coil component 100 can be improved.

<Experimental example>
Hereinafter, an example of an experiment conducted by the present inventors will be described with reference to FIGS. 10 and 11. The opening of the peripheral portion Cn is called the core portion.

(Experimental Example 1)
A coil component sample having a glass insulator portion and a coil portion having the following dimensions of each portion was prepared.

-Insulator: Length (La) 370 μm, Width (Wa) 200 μm, Height (Ha) 215 μm
-Coil part: Conductor dimension (lc) 35 μm in the Y-axis direction, conductor dimension (wc) 10 μm in the X-axis direction, conductor dimension (hc) 35 μm in the Z-axis direction, distance between peripheral parts adjacent in the X-axis direction (conductor) Distance g) 20 μm, core dimension (ld) 200 μm in the Y-axis direction, core dimension (wd) 130 μm in the X-axis direction in the entire circumference Cn, core dimension (hd) 85 μm in the Z-axis direction
-Side margin: Y-axis direction dimension (lb) 50 μm, X-axis direction dimension (wb) 30 μm, Z-axis direction dimension (hb) 30 μm

When the inductance (L value) (measurement frequency 500 MHz) and Q value (measurement frequency 1.8 GHz) of the prepared sample were measured using an RF impedance analyzer (E4991A manufactured by Agilent), the L value was 2.6 nH. The Q value was 27.

(Experimental Example 2)
Insulator part length (La) 350 μm, width (Wa) 200 μm, height (Ha) 230 μm, core part dimensions Y-axis direction (ld) 180 μm, X-axis direction (wd) 130 μm, Z-axis direction (hd) A sample was prepared under the same conditions as in Experimental Example 1 except that the thickness was 100 μm.
When the inductance (L value) and Q value of the prepared sample were measured under the same conditions as in Experimental Example 1, the L value was 2.7 nH and the Q value was 28.

(Experimental Example 3)
Insulator part length (La) 320 μm, width (Wa) 200 μm, height (Ha) 250 μm, core part dimensions Y-axis direction (ld) 150 μm, X-axis direction (wd) 130 μm, Z-axis direction (hd) A sample was prepared under the same conditions as in Experimental Example 1 except that the thickness was 120 μm.
When the inductance (L value) and Q value of the prepared sample were measured under the same conditions as in Experimental Example 1, the L value was 2.8 nH and the Q value was 29.

(Experimental Example 4)
Insulator part length (La) 305 μm, width (Wa) 200 μm, height (Ha) 265 μm, core part dimensions Y-axis direction (ld) 135 μm, X-axis direction (wd) 130 μm, Z-axis direction (hd) A sample was prepared under the same conditions as in Experimental Example 1 except that the thickness was 135 μm.
When the inductance (L value) and Q value of the prepared sample were measured under the same conditions as in Experimental Example 1, the L value was 2.9 nH and the Q value was 30.

(Experimental Example 5)
Insulator part length (La) 275 μm, width (Wa) 200 μm, height (Ha) 290 μm, core part dimensions Y-axis direction (ld) 105 μm, X-axis direction (wd) 130 μm, Z-axis direction (hd) A sample was prepared under the same conditions as in Experimental Example 1 except that the thickness was 160 μm.
When the inductance (L value) and Q value of the prepared sample were measured under the same conditions as in Experimental Example 1, the L value was 2.6 nH and the Q value was 29.

(Experimental Example 6)
Insulator part length (La) 265 μm, width (Wa) 200 μm, height (Ha) 300 μm, core part dimensions Y-axis direction (ld) 95 μm, X-axis direction (wd) 130 μm, Z-axis direction (hd) A sample was prepared under the same conditions as in Experimental Example 1 except that the thickness was 170 μm.
When the inductance (L value) and Q value of the prepared sample were measured under the same conditions as in Experimental Example 1, the L value was 2.3 nH and the Q value was 28.

(Experimental Example 7)
A coil component sample having a resin insulator portion and a coil portion having the following dimensions of each portion was prepared.

-Insulator: Length (La) 410 μm, Width (Wa) 200 μm, Height (Ha) 195 μm
-Coil part: Conductor dimension (lc) 35 μm in the Y-axis direction, conductor dimension (wc) 24 μm in the X-axis direction, conductor dimension (hc) 35 μm in the Z-axis direction, distance between conductors (g) 10 μm, core in the Y-axis direction Part dimension (ld) 250 μm, core part dimension (wd) 160 μm in the X-axis direction, core part dimension (hd) 85 μm in the Z-axis direction
-Side margin: Y-axis direction dimension (lb) 45 μm, X-axis direction dimension (wb) 20 μm, Z-axis direction dimension (hb) 20 μm

When the inductance (L value) and Q value of the prepared sample were measured under the same conditions as in Experimental Example 1, the L value was 3.0 nH and the Q value was 31.

(Experimental Example 8)
Insulator part length (La) 380 μm, width (Wa) 200 μm, height (Ha) 210 μm, core part dimensions Y-axis direction (ld) 220 μm, X-axis direction (wd) 160 μm, Z-axis direction (hd) A sample was prepared under the same conditions as in Experimental Example 7 except that the thickness was 100 μm.
When the inductance (L value) and Q value of the prepared sample were measured under the same conditions as in Experimental Example 1, the L value was 3.2 nH and the Q value was 32.

(Experimental Example 9)
Insulator part length (La) 350 μm, width (Wa) 200 μm, height (Ha) 230 μm, core part dimensions Y-axis direction (ld) 190 μm, X-axis direction (wd) 160 μm, Z-axis direction (hd) A sample was prepared under the same conditions as in Experimental Example 7 except that the thickness was 120 μm.
When the inductance (L value) and Q value of the prepared sample were measured under the same conditions as in Experimental Example 1, the L value was 3.3 nH and the Q value was 33.

(Experimental Example 10)
Insulator part length (La) 320 μm, width (Wa) 200 μm, height (Ha) 250 μm, core part dimensions Y-axis direction (ld) 160 μm, X-axis direction (wd) 160 μm, Z-axis direction (hd) A sample was prepared under the same conditions as in Experimental Example 7 except that the thickness was 140 μm.
When the inductance (L value) and Q value of the prepared sample were measured under the same conditions as in Experimental Example 1, the L value was 3.4 nH and the Q value was 34.

(Experimental Example 11)
Insulator part length (La) 310 μm, width (Wa) 200 μm, height (Ha) 260 μm, core size Y-axis direction (ld) 150 μm, X-axis direction (wd) 160 μm, Z-axis direction (hd) A sample was prepared under the same conditions as in Experimental Example 7 except that the thickness was set to 150 μm.
When the inductance (L value) and Q value of the prepared sample were measured under the same conditions as in Experimental Example 1, the L value was 3.5 nH and the Q value was 34.

(Experimental Example 12)
Insulator part length (La) 275 μm, width (Wa) 200 μm, height (Ha) 290 μm, core part dimensions Y-axis direction (ld) 115 μm, X-axis direction (wd) 160 μm, Z-axis direction (hd) A sample was prepared under the same conditions as in Experimental Example 7 except that the thickness was 180 μm.
When the inductance (L value) and Q value of the prepared sample were measured under the same conditions as in Experimental Example 1, the L value was 3.3 nH and the Q value was 32.

(Experimental Example 13)
Insulator part length (La) 255 μm, width (Wa) 200 μm, height (Ha) 315 μm, core part dimensions Y-axis direction (ld) 95 μm, X-axis direction (wd) 160 μm, Z-axis direction (hd) A sample was prepared under the same conditions as in Experimental Example 7 except that the thickness was 205 μm.
When the inductance (L value) and Q value of the prepared sample were measured under the same conditions as in Experimental Example 1, the L value was 3.1 nH and the Q value was 31.

(Experimental Example 14)
The length (La) 310 μm, width (Wa) 200 μm, height (Ha) 260 μm, conductor dimension (lc) 30 μm in the Y-axis direction, conductor dimension (wc) 24 μm in the X-axis direction, Z-axis direction Samples were prepared under the same conditions as in Experimental Example 7 except that the conductor dimensions (hc) were 30 μm, the core dimensions were 160 μm in the Y-axis direction (ld), 160 μm in the X-axis direction (wd), and 160 μm in the Z-axis direction (hd). did.
When the inductance (L value) and Q value of the prepared sample were measured under the same conditions as in Experimental Example 1, the L value was 3.6 nH and the Q value was 36.

(Experimental Example 15)
The length (La) 310 μm, width (Wa) 200 μm, height (Ha) 260 μm, conductor dimension (lc) 25 μm in the Y-axis direction, conductor dimension (wc) 24 μm in the X-axis direction, Z-axis direction Samples were prepared under the same conditions as in Experimental Example 7 except that the conductor dimensions (hc) were 25 μm, the core dimensions were 170 μm in the Y-axis direction (ld), 160 μm in the X-axis direction (wd), and 170 μm in the Z-axis direction (hd). did.
When the inductance (L value) and Q value of the prepared sample were measured under the same conditions as in Experimental Example 1, the L value was 3.8 nH and the Q value was 37.

(Experimental Example 16)
Insulator part length (La) 310 μm, width (Wa) 200 μm, height (Ha) 260 μm, conductor dimension (lc) 20 μm in the Y-axis direction, conductor dimension (wc) 24 μm in the X-axis direction, Z-axis direction Samples were prepared under the same conditions as in Experimental Example 7 except that the conductor dimensions (hc) were 20 μm, the core dimensions were 180 μm in the Y-axis direction (ld), 160 μm in the X-axis direction (wd), and 180 μm in the Z-axis direction (hd). did.
When the inductance (L value) and Q value of the prepared sample were measured under the same conditions as in Experimental Example 1, the L value was 4.2 nH and the Q value was 37.

(Experimental Example 17)
Insulator part length (La) 310 μm, width (Wa) 200 μm, height (Ha) 260 μm, conductor dimension (lc) 15 μm in the Y-axis direction, conductor dimension (wc) 24 μm in the X-axis direction, Z-axis direction Samples were prepared under the same conditions as in Experimental Example 7 except that the conductor dimensions (hc) were 15 μm, the core dimensions were 190 μm in the Y-axis direction (ld), 160 μm in the X-axis direction (wd), and 190 μm in the Z-axis direction (hd). did.
When the inductance (L value) and Q value of the prepared sample were measured under the same conditions as in Experimental Example 1, the L value was 4.8 nH and the Q value was 36.

(Comparative Example 1)
Insulator part length (La) 400 μm, width (Wa) 200 μm, height (Ha) 200 μm, core part dimensions Y-axis direction (ld) 230 μm, X-axis direction (wd) 130 μm, Z-axis direction (hd) A sample was prepared under the same conditions as in Experimental Example 1 except that the thickness was 70 μm.
When the inductance (L value) and Q value of the prepared sample were measured under the same conditions as in Experimental Example 1, the L value was 2.2 nH and the Q value was 22.

(Comparative Example 2)
Insulator part length (La) 407 μm, width (Wa) 200 μm, height (Ha) 202 μm, core size Y-axis direction (ld) 237 μm, X-axis direction (wd) 130 μm, Z-axis direction (hd) A sample was prepared under the same conditions as in Experimental Example 1 except that the thickness was 72 μm.
When the inductance (L value) and Q value of the prepared sample were measured under the same conditions as in Experimental Example 1, the L value was 2.3 nH and the Q value was 23.

The conditions, dimensional ratios, areas of the insulator and core as seen from the coil axis direction (X-axis direction) and their area ratios, and coil characteristics of the above-mentioned parts of Experimental Examples 1 to 17 and Comparative Examples 1 and 2 are shown. It is shown collectively in 1 to 3.

As shown in Tables 2 and 3, according to Experimental Examples 1 to 17, in which the dimensional ratio (Ha / La) of the insulator portion is 1.5 times or less of the dimensional ratio (hd / ld) of the core portion, insulation is performed. It was confirmed that a higher Q value could be obtained than in Comparative Examples 1 and 2 in which the dimensional ratio (Ha / La) of the body portion exceeded 1.5 times the dimensional ratio (hd / ld) of the core portion.

Further, according to Experimental Examples 3 to 5 in which the dimensional ratio (hd / ld) of the core portion is 0.8 or more and 1.5 or less, the Q value (29 or more) higher than that of Experimental Examples 1, 2 and 6 is higher. It was confirmed that it could be obtained. Similarly, according to Experimental Examples 9 to 11, 14 to 17, in which the dimensional ratio (hd / ld) of the core portion is 0.6 or more and 1.0 or less, it is higher than that of Experimental Examples 7, 8, 12, and 13 ( It was confirmed that a Q value (more than 32) was obtained.

Further, according to Experimental Examples 2 to 4 in which the dimensional ratio (hd / ld) of the core portion is 0.6 or more and 1.0 or less, the L value is higher (2.7 nH or more) than Experimental Examples 1, 5 and 6. Was confirmed to be obtained.

Further, according to Experimental Examples 2 to 4, 7 to 17, in which the ratio (Sd / Sa) of the area (Sd) of the core portion to the area of the insulator portion (Sa) is 22% or more and 45% or less, 2.7 nH. It was confirmed that the above high inductance value can be obtained.

Looking at each of them individually, in Experimental Example 1, although the core area is almost the same as that of Comparative Example 2, the dimensional ratio (wd / ld) of the core portion is larger than that of Comparative Example 2, so that the comparison is made. A higher Q value than in Example 2 was obtained.

In Experimental Example 4, since the dimensional ratio (wd / ld) of the core portion was approximately 1, the highest Q value was obtained in Experimental Examples 1 to 6.

In Experimental Examples 7 to 17, as compared with Experimental Examples 1 to 6, the insulating property of the insulator portion is high, and the conductor size can be maximized, so that the inductance value can be increased. Along with this, the Q value can be increased to 31 or more.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications can be made.

For example, in the above embodiment, the method of sequentially laminating the insulating layer and the via conductor from the top surface side to the bottom surface side of the coil component has been described, but the present invention is not limited to this, and the insulating layer is not limited to this. And the via conductors may be sequentially laminated.

The present invention is also applicable to a method for manufacturing a coil component in which each peripheral portion of the coil portion is sequentially laminated in the coil axial direction.

Further, in the above embodiment, the circumferential portion viewed from the Z-axis direction is a quadrangle, but even if it is a polygon or has a part with R, it is the same as long as the orbital conductors are in a positional relationship facing each other. The effect of can be obtained.

Further, in the above embodiment, the coil axis of the coil component is in the X-axis direction (width direction), but the same effect can be obtained even if the coil axis direction is in the Z-axis direction (height direction).

Further, the insulator portion has the same effect as long as the magnetic permeability is 2 or less, regardless of whether the material used is glass or resin, for example, if ferrite powder or the like is partially contained. be able to. Further, if the dielectric constant of the insulator is 5 or less, the high frequency characteristics can be particularly improved, and if the dielectric constant is 4 or less, the stray capacitance generated between the insulator and the terminal electrode can be further reduced, and the Q value at high frequencies can be further reduced. Can be raised.

<Second embodiment>
In the first embodiment, the electronic component in which the comb tooth block portion is arranged has been described, but as shown in FIGS. 1 to 3 above, the electronic component in which the comb tooth block portion 24 is not arranged may be used. Hereinafter, a modified example will be described. In each of the following configuration examples, the ratio (Ha / La) of the height dimension (Ha) to the length dimension (La) of the insulator portion is the length between the inner peripheral portions of the peripheral portion Cn along the Y-axis direction. It is configured to be 1.5 times or less the ratio (hd / ld) of the height dimension (hd) between the inner peripheral portions of the peripheral portion Cn along the Z-axis direction with respect to the dimension (ld).

Further, the opening size ratio (hd / ld) of the peripheral portion Cn is not particularly limited, but in the present embodiment, it is 0.6 or more and 1.0 or less. As a result, a high inductance value and Q value can be secured more stably.

Further, the ratio (Sd / Sa) of the area (Sd) partitioned by the inner peripheral portion of the peripheral portion Cn to the area (Sa) of the insulator portion viewed from the coil axis direction (X-axis direction) is also not particularly limited. In the present embodiment, it is 0.22 or more and 0.65 or less (22% or more and 65% or less). As a result, the inductance value of the coil component can be efficiently increased.

(First configuration example)
The comb tooth block portion is not arranged in the electronic component according to the first configuration example. As a result, when the internal conductor portion is arranged in the insulator portion having the same volume, the design range of the coil portion becomes wider and the opening area of the coil portion can be expanded as compared with the case where the comb tooth block portion is arranged. This makes it possible to improve the L value and Q value.

Further, in this configuration example, since the comb tooth block portion is not arranged, a structure in which the external electrode is formed on only one surface of the rectangular parallelepiped-shaped insulator portion becomes possible, and the electronic component is a one-side mounting type. be able to. The coil component of the above embodiment is a three-sided mounting type electronic component in which external electrodes are formed on the three surfaces 102, 103, 104 of the rectangular parallelepiped-shaped insulator portion, but the present configuration example is not limited to this. As described above, it may be a one-sided mounting type electronic component in which an external electrode is formed on only one surface of the insulator portion.
Further, in the above embodiment, the coil portion and the external electrode are connected via the comb tooth block portion and the leader wire, but in this configuration example, the coil portion and the external electrode are connected by the connecting via conductor layer. It is done through.

Hereinafter, the electronic components according to the first configuration example will be described with reference to FIGS. 12 to 14.
12A is a schematic perspective perspective view of the coil component according to the first configuration example of the present embodiment, FIG. 12B is an external perspective view thereof, FIG. 13A is a schematic perspective side view thereof, and FIG. 13B is an external side view thereof. Is a schematic perspective top view thereof.
In each figure, the X-axis, Y-axis, and Z-axis directions indicate three axial directions that are orthogonal to each other.

The electronic component 1100 of this configuration example is configured as a coil component for surface mounting. The electronic component 1100 includes an insulator portion 1010, an internal conductor portion 1020, and an external electrode 1030.

The insulator portion 1010 has a top surface 1101, a bottom surface 1102, a first end surface 1103, a second end surface 1104, a first side surface 1105, and a second side surface 1106, and has a width direction in the X-axis direction and a Y-axis direction. It is formed in a rectangular shape having a length direction and a height direction in the Z-axis direction. The bottom surface 1102 is a mounting surface.

The insulator portion 1010 has a main body portion 1011 and a top surface portion 12. The main body portion 1011 incorporates an internal conductor portion 1020 and constitutes a main portion of the insulator portion 1010. The top surface portion 12 constitutes the top surface 1101 of the insulator portion 1010. The material used for the insulator portion 1010 is the same as that of the above embodiment.

The inner conductor portion 1020 is provided inside the insulator portion 1010. The inner conductor portion 1020 has a plurality of columnar conductors 1021, a plurality of connecting conductors 1022, and a connecting via conductor layer V1023, and the coil portion 1020L is composed of the plurality of columnar conductors 1021 and the connecting conductor 1022. Further, the connecting via conductor layer V1023 is connected to both ends of the coil portion 1020L.

The plurality of columnar conductors 1021 are formed in a substantially cylindrical shape having an axial center parallel to the Z-axis direction. The plurality of columnar conductors 1021 are composed of two conductor groups facing each other in the substantially Y-axis direction. Of these, the first columnar conductors 10211 constituting one of the conductor groups are arranged at predetermined intervals in the X-axis direction, and the second columnar conductors 10212 forming the other conductor group are also arranged in the X-axis direction. Are arranged at predetermined intervals.

The substantially cylindrical shape includes not only a pillar having a circular cross-sectional shape in the direction perpendicular to the axis (direction perpendicular to the axis) but also a pillar having an elliptical or oval cross-sectional shape. Alternatively, the oval means, for example, a major axis / minor axis ratio of 3 or less.

The first and second columnar conductors 10211 and 10212 are configured to have the same diameter and the same height, respectively. In the illustrated example, five first and second columnar conductors 10211 and 10212 are provided, respectively. As will be described later, the first and second columnar conductors 10211 and 10212 are configured by laminating a plurality of via conductors in the Z-axis direction.

It should be noted that the substantially same diameter is for suppressing an increase in resistance, and means that the variation in dimensions when viewed in the same direction is within, for example, 10%. Approximately the same height means the stacking accuracy of each layer. It means that the height variation is within the range of ± 10 μm, for example.

The plurality of connecting conductors 1022 are formed parallel to the XY plane and are composed of two conductor groups facing each other in the Z-axis direction. The first connecting conductor 10221 constituting one of the conductor groups extends along the Y-axis direction and is arranged at intervals in the X-axis direction, and is placed between the first and second columnar conductors 10211 and 10212. Connect individually. The second connecting conductors 10222 constituting the other conductor group extend at a predetermined angle with respect to the Y-axis direction and are arranged at intervals in the X-axis direction, and the first and second columnar conductors 10211, 10212 Connect individually between. In the illustrated example, the first connecting conductor 10221 is composed of five connecting conductors and the second connecting conductor 10222 is composed of four connecting conductors.

In FIG. 12, the first connecting conductor 10221 is connected to the upper end of a predetermined set of columnar conductors 10211, 10212, and the second connecting conductor 10222 is connected to the lower end of a predetermined set of columnar conductors 10211, 10212. Will be done. More specifically, the first and second columnar conductors 10211 and 10212 and the first and second connecting conductors 10221 and 10222 form the peripheral portions Cn (C1 to C5) of the coil portion 1020L, and these peripheral portions Cn. Are connected to each other in a rectangular spiral around the X-axis. As a result, inside the insulator portion 1010, a coil portion 1020L having an axial center (coil shaft) in the X-axis direction and having a rectangular opening shape is formed.

In the present embodiment, the peripheral portion Cn is composed of five peripheral portions C1 to C5. The opening shapes of the peripheral portions C1 to C5 are formed to have substantially the same shape.

The connecting via conductor layer V1023 has a first connecting via conductor layer V10231 and a second connecting via conductor layer V10232. The first connecting via conductor layer V10231 is connected by being connected to the lower end of the first columnar conductor 10211 forming one end of the coil portion 1020L, and the second connecting via conductor layer V10232 is connected to the other of the coil portion 1020L. It is connected and connected to the lower end of the second columnar conductor 10212 that constitutes the end. The first and second connecting via conductor layers V10231 and V10232 have a substantially circular cross-sectional shape perpendicular to the Z-axis direction, and have substantially the same size and shape as the cross-sectional shape perpendicular to the Z-axis direction of the columnar conductor 1021. doing.

The external electrode 1030 constitutes an external terminal for surface mounting, and has first and second external electrodes 1031 and 1032 facing each other in the Y-axis direction. The first and second external electrodes 1031, 1032 are formed only on the bottom surface 1102 as one surface of the insulator portion 1010. The external electrode 1030 is formed on the outside of the insulator portion 1010.

The columnar conductor 1021, the connecting conductor 1022, and the connecting via conductor layer V1023 are made of a metal material such as Cu (copper), Al (aluminum), and Ni (nickel), and in the present embodiment, all of them are copper or an alloy thereof. It is composed of the plating layer of. The first and second external electrodes 1031, 1032 are composed of, for example, Ni / Sn plating.

FIG. 15 is a schematic perspective side view showing the electronic component 1100 upside down. As shown in FIG. 15, the electronic component 1100 is composed of a film layer L1001 and a laminate of a plurality of electrode layers L1002 to L1006. In the present embodiment, the film layer L1001 and the electrode layers L1002 to L1006 are sequentially laminated in the Z-axis direction from the top surface 1101 to the bottom surface 1102. The number of layers is not particularly limited and will be described here as 6 layers.

The film layer L1001 and the electrode layers L1002 to L1006 include elements of an insulator portion 1010, an internal conductor portion 1020, and an external electrode 1030 that constitute the respective layers. 16A to 16F are schematic top views of the film layer L1001 and the electrode layers L1002 to L1006 in FIG. 15, respectively.

The film layer L1001 is composed of a top surface portion 12 forming a top surface 1101 of the insulator portion 1010 (FIG. 16A). The electrode layer L1002 includes an insulating layer 10110 (10112) forming a part of the insulating portion 1010 (main body portion 1011) and a first connecting conductor 10221 (FIG. 16B). The electrode layer L1003 includes an insulating layer 10110 (10113) and a via conductor V1001 forming a part of the columnar conductors 10211 and 10212 (FIG. 16C). The electrode layer L1004 includes an insulating layer 10110 (10114), a via conductor V1001, and a second connecting conductor 10222 (FIG. 16D). The electrode layer L1005 includes an insulating layer 10110 (10115) and a connecting via conductor layer V1023 (a first connecting via conductor layer V10231 and a second connecting via conductor layer V10232) (FIG. 16E). The electrode layer L1006 includes an external electrode 1030 (first external electrode 1031 and second external electrode 1032) (FIG. 16F).

The electrode layers L1002 to L1006 are laminated in the height direction via the joint surfaces S1 to S4 (FIG. 15). Therefore, each of the insulating layer 10110, the via conductor V1001, the connecting via conductor layer V1023, and the external electrode 1030 also have a boundary portion in the height direction. The electronic component 1100 is manufactured by the same build-up method as in the above embodiment, in which the electrode layers L1002 to L1006 are laminated in order from the electrode layer L1002.

As described above, in the electronic component 1100 in the first configuration example, since the comb tooth block portion is not arranged, the core portion dimension (ld) in the Y-axis direction can be expanded. As a result, the opening area of the coil portion 1020L can be expanded, and the L value and the Q value can be increased.

Further, in this configuration example, since the external electrode 1030, which is an external terminal for surface mounting, is formed on only one surface of the electronic component 1100, when the electronic component 1100 is mounted by soldering, the mounting surface is only one surface. Therefore, solder fillets are not formed, and high-density mounting is possible.

Further, since the coil portion 1020L and the external electrode 1030 are connected by the connecting via conductor layer V1023, the current path from the external electrode to the coil portion 1020 should be shortened as compared with the case where the comb tooth block portion is arranged. Can be done. As a result, it is possible to obtain an electronic component 1100 with less noise generation and less characteristic deterioration.

(Second configuration example)
In the first configuration example, the connecting via conductor layer V1023 has a substantially circular cross-sectional shape perpendicular to the Z-axis direction, but is not limited to this, and may have, for example, an oval shape. , Will be described as a second configuration example. A configuration different from the first configuration example will be mainly described, and a similar reference numeral may be added to the same configuration, and the description may be omitted. In this configuration example as well, as in the first configuration example, it is possible to increase the opening area of the coil portion, which makes it possible to increase the L value and the Q value.

Hereinafter, the coil parts according to the second configuration example will be described with reference to FIGS. 17 to 19.
FIG. 17 is a schematic perspective perspective view of the coil component. FIG. 18 is a schematic perspective side view thereof. FIG. 19 is a schematic perspective top view thereof.

The electronic component 2100 of this configuration example is configured as a coil component for surface mounting. The electronic component 2100 includes an insulator portion 2010, an internal conductor portion 2020, and an external electrode 1030.

The insulator portion 2010 has a main body portion 2011 and a top surface portion 12. The main body portion 2011 incorporates an internal conductor portion 2020 and constitutes a main portion of the insulator portion 2010.

The insulator portion 2010 has a top surface 2101, a bottom surface 2102, a first end surface 2103, a second end surface 2104, a first side surface 2105, and a second side surface 2106, and has a width direction in the X-axis direction and a Y-axis direction. It is formed in a rectangular shape having a length direction and a height direction in the Z-axis direction.

The inner conductor portion 2020 is provided inside the insulator portion 2010. The inner conductor portion 2020 has a plurality of columnar conductors 1021, a plurality of connecting conductors 1022, and a connecting via conductor layer V2023, and the coil portion 1020L is composed of the plurality of columnar conductors 1021 and the connecting conductor 1022. Further, the connecting via conductor layer V2023 is connected to both ends of the coil portion 1020L.

The connecting via conductor layer V2023 has a first connecting via conductor layer V20231 and a second connecting via conductor layer V20232. The first connecting via conductor layer V20231 is connected to the lower end of the first columnar conductor 10211 forming one end of the coil portion 1020L, and the second connecting via conductor layer V20232 constitutes the other end of the coil portion 1020L. It is connected to the lower end of the second columnar conductor 10212. The first and second connecting via conductor layers V20231 and V20232 have an oval cross-sectional shape perpendicular to the Z-axis direction, and have a cross-sectional shape larger than the cross-sectional shape perpendicular to the Z-axis direction of the columnar conductor 1021. There is. In other words, when the columnar conductor 1021 and the connecting via conductor layer V2023 are projected onto the XY plane, the substantially circular projection of the columnar conductor 1021 is included in the substantially oval projection of the connecting via conductor layer V2023. Is done.

The external electrode 1030 constitutes an external terminal for surface mounting, and has first and second external electrodes 1031 and 1032 facing each other in the Y-axis direction. The first and second external electrodes 1031 and 1032 are formed only on the bottom surface 2102 as one surface of the insulator portion 2010.

As described above, in this configuration example, the cross-sectional shape of the connecting via conductor layer V2023 is an ellipse, which is larger than the cross-sectional shape of the columnar conductor 1021 forming a part of the coil portion 1020L. The contact area between the 1020L and the external electrode 1030 can be increased.

(Third configuration example)
In each of the above configuration examples, a dummy via conductor layer may be provided which is the same layer as the connection via conductor layers V1023 and V2023 and does not electrically connect the coil portion 1020L and the external electrode 1030. Hereinafter, a third configuration example may be provided. It is explained as. A plurality of dummy via conductor layers are formed in the insulating body in contact with the external electrode 1030. By providing the dummy via conductor layer, the adhesion strength between the external electrode 1030 and the insulator portion 1010 can be improved. The installation of the dummy via conductor layer is applicable to the above configuration example and the above embodiment.

FIG. 20 is a schematic perspective perspective view of the coil component according to the third configuration example. FIG. 21 is a schematic perspective side view thereof. FIG. 22 is a schematic perspective top view thereof. In the third configuration example, a case where a dummy via conductor layer is provided in the first configuration example will be described as an example, and a configuration similar to that of the first configuration example will be described with the same reference numerals. Omit.

The electronic component 3100 of this configuration example is configured as a coil component for surface mounting. The electronic component 3100 includes an insulator portion 3010, an internal conductor portion 1020, and an external electrode 1030.

The insulator portion 3010 has a main body portion 3011 and a top surface portion 12. The main body portion 3011 incorporates an internal conductor portion 1020 and a dummy via conductor layer 3040, and constitutes a main portion of the insulator portion 3010.

The insulator portion 3010 has a top surface 3101, a bottom surface 3102, a first end surface 3103, a second end surface 3104, a first side surface 3105, and a second side surface 3106, and has a width direction in the X-axis direction and a Y-axis direction. It is formed in a rectangular parallelepiped shape having a length direction and a height direction in the Z-axis direction.

The dummy via conductor layer 3040 is composed of a plurality of protrusions provided on the inner surface portion of the external electrode 1030 facing the bottom surface 3102 of the rectangular parallelepiped insulator portion 3010, and as shown in FIG. 21, the bottom surface 3102 of the insulator portion 3010. Immerse yourself in the interior of. The tip of the dummy via conductor layer 3040 faces the inner conductor portion 1020 via the insulating material constituting the insulator portion 3010, and therefore does not contact the coil portion 1020L.

The dummy via conductor layer 3040 is formed in the same layer as the connecting via conductor layer V1023. The plurality of dummy via conductor layers 3040 are composed of two conductor layer groups facing each other in the Y-axis direction. One of the first dummy via conductor layers 3041 constituting one of the conductor layer groups is arranged corresponding to the four corners of the first external electrode 1031 having a substantially rectangular shape in the XY plane. The second dummy via conductor layer 3042 constituting the other conductor layer group is arranged one by one corresponding to the four corners of the second external electrode 1032 having a substantially rectangular shape in the XY plane. The dummy via conductor layer 3040 is electrically insulated from the internal conductor portion 1020 by an insulating layer constituting the insulator portion 3011.

In this modification, the adhesion strength between the external electrode 1030 and the insulator portion 3011 is improved by providing the dummy via conductor layer 3040.
That is, in the method of manufacturing the external electrode 1030, for example, as in the method of manufacturing the conductor pattern constituting the internal conductor portion of the above embodiment by the electroplating method, a resist having a seed layer for electroplating and an opening is provided. After the pattern is provided, a method of forming an external electrode by an electroplating method can be adopted. By producing the external electrode 1030 by such a method, strong adhesion between the dummy via conductor layer 3040 and the external electrode 1030 occurs, and the adhesion strength between the insulator portion 3011 and the external electrode 1030 is improved.

<Electronic component characteristics>
The electronic component of the present invention is not limited to each of the above embodiments, and may have the configurations shown in FIGS. 23 and 24, for example. 23 and 24 are schematic perspective views of the electronic components according to the above embodiment. Each figure of FIG. 23 shows a diagram of an electronic component in which the comb tooth block portion 24 is arranged as in the first embodiment, and each figure of FIG. 24 shows a comb tooth block portion as in the second embodiment. The figure of the electronic component which is not arranged is shown. Similar reference numerals are given to the same configurations as those in the above embodiments.

The external dimensions of each of the electronic components shown in FIGS. 23 and 24 are the same, and in each of the electronic components, the ratio of the height dimension (Ha) to the length dimension (La) of the insulator portion (Ha / La) is the ratio (hd) of the height dimension (hd) between the inner peripheral portions of the peripheral portion Cn along the Z-axis direction to the length dimension (ld) between the inner peripheral portions of the peripheral portion Cn along the Y-axis direction. It is configured to be 1.5 times or less of hd / ld).

FIG. 23A is a schematic perspective side view of the electronic component 100 of the first embodiment. In FIG. 23B, as compared with the electronic component 100, the drawer portion 23 is not provided, and the external electrode 30 and the coil portion 1020L are connected via the connecting via conductor layer V1023 as in the second embodiment. It is a schematic perspective side view of the electronic component 4100 of the form. 23C shows the electronic component 5100 when the length of the comb tooth block portion 24 in the Y-axis direction is shorter and the distance between the coil portion 1020L and the comb tooth block portion 24 is longer than that of the electronic component 3100 of FIG. 23B. In each view of FIG. 23, which is a schematic perspective side view, the dimension (1b) of the side margin between the coil portion 20L and the end face of the insulator portion in the Y-axis direction (left-right direction in the drawing) is 45 μm.

Each figure of FIG. 24 corresponds to the electronic component 1100 according to the second embodiment (first configuration example), and has a basic configuration except that the side margin dimension (1b) in the Y-axis direction is different. Is the same. The side margin 1b of the electronic component 1100A shown in FIG. 24A is 45 μm, the side margin 1b of the electronic component 1100B shown in FIG. 24B is 20 μm, and the side margin 1b of the electronic component 1100C shown in FIG. 24C is 10 μm.

FIG. 25 shows the inductance (L value) characteristics of each electronic component shown in FIGS. 23 and 24. FIG. 26 shows the Q value characteristics of each of the electronic components shown in FIGS. 23 and 24. In FIGS. 25 and 26, 23A on the horizontal axis corresponds to the electronic component shown in FIG. 23A, and similarly, 23B, 23C, 24A, 24B and 24C are FIGS. 23B, 23C, 24A, 24B and 24B, respectively. Corresponding to the electronic components shown in FIG. 24C, the inductance and Q value of each electronic component are plotted.

As shown in FIGS. 25 and 26, the L value is 3.0 hn or more and the Q value is 30 or more in any of the electronic components, and a high inductance value and a Q value can be obtained. Further, by enlarging the opening (core) of the coil portion, the inductance characteristic and the Q value characteristic can be further improved.

FIG. 27 is a diagram comparing the formable regions of the internal conductor portion due to the difference in the configuration of the electronic component. In each figure of FIG. 27, each dimension is described by taking as an example an electronic component having an outer shape of 200 μm (width) × 400 μm (width) × 200 μm (height).
FIG. 27B is a schematic external side view of the one-side mounting type electronic component 1100 shown in the second embodiment (first configuration example). FIG. 27C shows a schematic perspective side view of the three-sided mounting type electronic component 100 shown in the first embodiment. FIG. 27D shows a schematic external side view of the conventional five-sided mounting type electronic component 7100, and reference numeral 7030 indicates an external electrode. The thickness of the external electrode of each electronic component was 10 μm. FIG. 27A shows an example in which the outer shape of the insulator portion and the outer shape of the electronic component are assumed to be the same. The volume of the insulator portion 6010 at this time is 100%, and the electronic components shown in FIGS. 27B to 27D are shown. The ratio of the insulator part in the above was calculated.

In the one-sided mounting type electronic component 1100 of FIG. 27B, the proportion of the insulator portion 1010 is 95%, and in the three-sided mounting type electronic component 100 of FIG. 27C, the proportion of the insulator portion 10 is 84%. In the 5-sided mounting type electronic component 7100 shown in FIG. 27D, the proportion of the insulator portion is 76.95%. The higher the proportion of the insulator portion in the electronic component, the larger the formable region of the internal conductor portion arranged inside the insulator portion. Therefore, in both the one-sided mounting type electronic component 1100 and the three-sided mounting type electronic component 100, the formable region of the internal conductor portion is larger than that of the conventional five-sided mounting type electronic component 7100, and the coil. The opening (core) of the portion can be enlarged. This makes it possible to increase the L value and the Q value.

10, 1010, 2010, 3010 ... Insulator part 20, 1020, 2020 ... Internal conductor part 20L, 1020L ... Coil part 21,21,212, 1021,10211,10212 ... Columnar conductor 22,221,222, 1022, 10221, 10222 ... Connecting conductors 100, 1100, 1100A, 1100B, 1100C, 2100, 3100, 4100, 5100 ... Electronic parts (coil parts)
1102, 2102, 3102 ... Bottom surface V1023, V10231, V10232, V2023, V20231, V20232 ... Connection via conductor layer 3040, 3041, 3042 ... Dummy via conductor layer Cn ... Circulation

Claims (7)

An insulator portion made of a non-magnetic material having a width direction in the first axial direction, a length direction in the second axial direction, and a height direction in the third axial direction.
It has a circumferential portion wound around the first axial direction, and includes a coil portion arranged inside the insulator portion.
The length dimension of the insulator portion is longer than the width dimension and the height dimension.
The length dimension of the insulator portion is 410 μm or less.
The ratio of the height dimension to the length dimension of the insulator portion is the ratio of the height dimension along the second axial direction to the length dimension between the inner peripheral portions of the peripheral portion along the second axial direction. It is less than 1.5 times the ratio of the height dimension between the inner circumferences of
The ratio of the area which is defined by the inner periphery of the rounding part to the area of the insulator portion as seen from the first axial state, and are 0.22 to 0.65,
The ratio of the height dimension between the inner peripheral portions of the peripheral portion along the third axial direction to the length dimension between the inner peripheral portions of the peripheral portion along the second axial direction is 0.6. Coil parts that are 1.0 or less . The coil component according to claim 1 .
A coil component in which the ratio of the area partitioned by the inner peripheral portion of the peripheral portion to the area of the insulating portion viewed from the first axial direction is 0.22 or more and 0.45 or less. The coil component according to claim 1 or 2 .
The insulator portion is a coil component made of ceramics or a resin material. The coil component according to any one of claims 1 to 3 .
The insulator portion has a rectangular parallelepiped shape and has a rectangular parallelepiped shape.
The coil component is a coil component further including an external electrode arranged only on one surface of the insulator portion, which is electrically connected to the coil portion. The coil component according to claim 4 .
A coil component in which the coil portion and the external electrode are electrically connected by a connecting via conductor connected to an end portion of the coil portion. The coil component according to claim 5 .
A coil component having a cross-sectional shape orthogonal to the third axis of the via conductor, which is larger than a cross-section orthogonal to the third axis at the end of the coil portion. The coil component according to any one of claims 4 to 6 .
The external electrode is a coil component having an inner surface portion of the insulator portion facing the one surface and a plurality of protrusions provided on the inner surface portion and immersed in the one surface.